TC426/TC427/TC428 1.5A Dual High-Speed Power MOSFET Drivers Package Type Features: * High-Speed Switching (CL = 1000 pF): 30 nsec * High Peak Output Current: 1.5A * High Output Voltage Swing: - VDD -25 mV - GND +25 mV * Low Input Current (Logic `0' or `1'): 1 A * TTL/CMOS Input Compatible * Available in Inverting and Noninverting Configurations * Wide Operating Supply Voltage: - 4.5V to 18V * Current Consumption: - Inputs Low - 0.4 mA - Inputs High - 8 mA * Single Supply Operation * Low Output Impedance: 6 * Pinout Equivalent of DS0026 and MMH0026 * Latch-Up Resistant: Withstands > 500 mA Reverse Current * ESD Protected: 2 kV Switch Mode Power Supplies Pulse Transformer Drive Clock Line Driver Coax Cable Driver Device Selection Table Part Number Package Configuration Temp. Range TC426COA TC426CPA TC426EOA TC426EPA TC426IJA TC426MJA 8-Pin SOIC 8-Pin PDIP 8-Pin SOIC 8-Pin PDIP 8-Pin CERDIP 8-Pin CERDIP Inverting Inverting Inverting Inverting Inverting Inverting 0C to +70C 0C to +70C -40C to +85C -40C to +85C -25C to +85C -55C to +125C TC427COA TC427CPA TC427EOA TC427EPA TC427IJA TC427MJA 8-Pin SOIC 8-Pin PDIP 8-Pin SOIC 8-Pin PDIP 8-Pin CERDIP 8-Pin CERDIP Noninverting Noninverting Noninverting Noninverting Noninverting Noninverting 0C to +70C 0C to +70C -40C to +85C -40C to +85C -25C to +85C -55C to +125C TC428COA TC428CPA TC428EOA TC428EPA TC428IJA TC428MJA 8-Pin SOIC 8-Pin PDIP 8-Pin SOIC 8-Pin PDIP 8-Pin CERDIP 8-Pin CERDIP Complementary Complementary Complementary Complementary Complementary Complementary 0C to +70C 0C to +70C -40C to +85C -40C to +85C -25C to +85C -55C to +125C 2002-2012 Microchip Technology Inc. 8 NC NC 1 IN A 2 GND 3 7 OUT A TC426 IN B 4 NC 1 7 OUT A TC427 Inverting 6 VDD 2, 4 7, 5 Noninverting 5 OUT B 8 NC NC 1 IN A 2 IN B 4 7, 5 8 NC IN B 4 GND 3 2, 4 5 OUT B IN A 2 GND 3 6 VDD 2 7 4 5 7 OUT A TC428 6 VDD 5 OUT B Complementary NC = No internal connection General Description: The TC426/TC427/TC428 are dual CMOS high-speed drivers. A TTL/CMOS input voltage level is translated into a rail-to-rail output voltage level swing. The CMOS output is within 25 mV of ground or positive supply. The low-impedance, high-current driver outputs swing a 1000 pF load 18V in 30 nsec. The unique current and voltage drive qualities make the TC426/TC427/TC428 ideal power MOSFET drivers, line drivers, and DC-toDC converter building blocks. Applications: * * * * 8-Pin PDIP/SOIC/CERDIP Input logic signals may equal the power supply voltage. Input current is a low 1 A, making direct interface to CMOS/bipolar switch-mode power supply control ICs possible, as well as open-collector analog comparators. Quiescent power supply current is 8 mA maximum. The TC426 requires 1/5 the current of the pin-compatible bipolar DS0026 device. This is important in DC-to-DC converter applications with power efficiency constraints and high-frequency switch-mode power supply applications. Quiescent current is typically 6 mA when driving a 1000 pF load 18V at 100 kHz. The inverting TC426 driver is pin-compatible with the bipolar DS0026 and MMH0026 devices. The TC427 is noninverting; the TC428 contains an inverting and noninverting driver. Other pin compatible driver families are the TC1426/ TC1427/TC1428, TC4426/TC4427/TC4428 and TC4426A/TC4427A/TC4428A. DS21415D-page 1 TC426/TC427/TC428 Functional Block Diagram V+ 500 A 2.5 A TC426 TC427 TC428 Noninverting Output Inverting Output (TC427) (TC426) Input GND NOTE: TC428 has one inverting and one noninverting driver. Ground any unused driver input. DS21415D-page 2 2002-2012 Microchip Technology Inc. TC426/TC427/TC428 1.0 ELECTRICAL CHARACTERISTICS *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings* Supply Voltage ..................................................... +20V Input Voltage, Any Terminal ................................... VDD + 0.3V to GND - 0.3V Power Dissipation (TA 70C) PDIP........................................................ 730 mW CERDIP .................................................. 800 mW SOIC ....................................................... 470 mW Derating Factor PDIP....................................................... 8 mW/C CERDIP .............................................. 6.4 mW/C SOIC ...................................................... 4 mW/C Operating Temperature Range C Version ........................................ 0C to +70C I Version ....................................... -25C to +85C E Version...................................... -40C to +85C M Version ................................... -55C to +125C Storage Temperature Range.............. -65C to +150C TC426/TC427/TC428 ELECTRICAL SPECIFICATIONS Electrical Characteristics: TA = +25C with 4.5V VDD18V, unless otherwise noted. Symbol Parameter Min Typ Max Units Test Conditions Input VIH Logic 1, High Input Voltage 2.4 -- -- V VIL Logic 0, Low Input Voltage -- -- 0.8 V IIN Input Current -1 -- 1 A 0VVINVDD Output VOH High Output Voltage VDD - 0.025 -- -- V VOL Low Output Voltage -- -- 0.025 V ROH High Output Resistance -- 10 15 IOUT = 10 mA, VDD = 18V ROL Low Output Resistance -- 6 10 IOUT = 10 mA, VDD = 18V IPK Peak Output Current -- 1.5 -- A Switching Time (Note 1) tR Rise Time -- -- 30 nsec Figure 3-1, Figure 3-2 tF Fall Time -- -- 30 nsec Figure 3-1, Figure 3-2 tD1 Delay Time -- -- 50 nsec Figure 3-1, Figure 3-2 tD2 Delay Time -- -- 75 nsec Figure 3-1, Figure 3-2 -- -- -- -- 8 0.4 mA VIN = 3V (Both Inputs) VIN = 0V (Both Inputs) Power Supply Power Supply Current IS Note 1: Switching times ensured by design. 2002-2012 Microchip Technology Inc. DS21415D-page 3 TC426/TC427/TC428 TC426/TC427/TC428 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Over operating temperature range with 4.5V VDD18V, unless otherwise noted. Input VIH Logic 1, High Input Voltage 2.4 -- -- VIL Logic 0, Low Input Voltage -- -- 0.8 V V IIN Input Current -10 -- 10 A 0VVINVDD Output VOH High Output Voltage VDD - 0.025 -- -- V VOL Low Output Voltage -- -- 0.025 V ROH High Output Resistance -- 13 20 IOUT = 10 mA, VDD = 18V ROL Low Output Resistance -- 8 15 IOUT = 10 mA, VDD = 18V Switching Time (Note 1) tR Rise Time -- -- 60 nsec Figure 3-1, Figure 3-2 tF Fall Time -- -- 60 nsec Figure 3-1, Figure 3-2 tD1 Delay Time -- -- 75 nsec Figure 3-1, Figure 3-2 tD2 Delay Time -- -- 120 nsec Figure 3-1, Figure 3-2 -- -- -- -- 12 0.6 mA VIN = 3V (Both Inputs) VIN = 0V (Both Inputs) Power Supply Power Supply Current IS Note 1: Switching times ensured by design. DS21415D-page 4 2002-2012 Microchip Technology Inc. TC426/TC427/TC428 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin PDIP, SOIC, CERDIP) Symbol 1 NC Description No Internal Connection. 2 IN A Control Input A, TTL/CMOS compatible logic input. 3 GND Ground. 4 IN B 5 OUT B CMOS totem-pole output. 6 VDD Supply input, 4.5V to 18V. 7 OUT A CMOS totem-pole output. 8 NC 2002-2012 Microchip Technology Inc. Control Input B, TTL/CMOS compatible logic input. No internal Connection. DS21415D-page 5 TC426/TC427/TC428 3.0 APPLICATIONS INFORMATION 3.4 3.1 Supply Bypassing The supply current vs frequency and supply current vs capacitive load characteristic curves will aid in determining power dissipation calculations. Charging and discharging large capacitive loads quickly requires large currents. For example, charging a 1000 pF load to 18V in 25 nsec requires an 0.72A current from the device power supply. To ensure low supply impedance over a wide frequency range, a parallel capacitor combination is recommended for supply bypassing. Low-inductance ceramic disk capacitors with short lead lengths (< 0.5 in.) should be used. A 1 F film capacitor in parallel with one or two 0.1 F ceramic disk capacitors normally provides adequate bypassing. 3.2 Grounding The TC426 and TC428 contain inverting drivers. Ground potential drops developed in common ground impedances from input to output will appear as negative feedback and degrade switching speed characteristics. Individual ground returns for the input and output circuits or a ground plane should be used. 3.3 Input Stage The input voltage level changes the no-load or quiescent supply current. The N-channel MOSFET input stage transistor drives a 2.5 mA current source load. With a logic `1' input, the maximum quiescent supply current is 8 mA. Logic `0' input level signals reduce quiescent current to 0.4 mA maximum. Minimum power dissipation occurs for logic `0' inputs for the TC426/TC427/TC428. Unused driver inputs must be connected to VDD or GND. The drivers are designed with 100 mV of hysteresis. This provides clean transitions and minimizes output stage current spiking when changing states. Input voltage thresholds are approximately 1.5V, making the device TTL compatible over the 4.5V to 18V supply operating range. Input current is less than 1 A over this range. The TC426/TC427/TC428 may be directly driven by the TL494, SG1526/1527, SG1524, SE5560, and similar switch-mode power supply integrated circuits. DS21415D-page 6 Power Dissipation The TC426/TC427/TC428 CMOS drivers have greatly reduced quiescent DC power consumption. Maximum quiescent current is 8 mA compared to the DS0026 40 mA specification. For a 15V supply, power dissipation is typically 40 mW. Two other power dissipation components are: * Output stage AC and DC load power. * Transition state power. Output stage power is: Po = PDC + PAC = Vo (IDC) + f CL VS2 Where: Vo IDC f Vs = DC output voltage = DC output load current = Switching frequency = Supply voltage In power MOSFET drive applications the PDC term is negligible. MOSFET power transistors are high-impedance, capacitive input devices. In applications where resistive loads or relays are driven, the PDC component will normally dominate. The magnitude of PAC is readily estimated for several cases: A. B. 1. f 2. CL 3. Vs 4. PAC = 200 kHZ =1000 pf = 18V = 65 mW 1. f 2. CL 3. Vs 4. PAC = 200 kHz =1000 pf = 15V = 45 mW During output level state changes, a current surge will flow through the series connected N and P channel output MOSFETS as one device is turning "ON" while the other is turning "OFF". The current spike flows only during output transitions. The input levels should not be maintained between the logic `0' and logic `1' levels. Unused driver inputs must be tied to ground and not be allowed to float. Average power dissipation will be reduced by minimizing input rise times. As shown in the characteristic curves, average supply current is frequency dependent. 2002-2012 Microchip Technology Inc. TC426/TC427/TC428 VDD = 18V VDD = 18V 1 F Input 0.1 F 1 1 F Output Input 0.1 F 1 Output CL = 1000 pF CL = 1000 pF 2 Input: 100 kHz, square wave, tRISE = tFALL 10 nsec 2 Input: 100 kHz, square wave, tRISE = tFALL 10 nsec TC426 (1/2 TC428) TC427 (1/2 TC428) +5V 90% +5V Input 90% Input 10% 0V tD1 tD2 tF 18V 0V tR 10% 18V 90% 90% tD1 90% 10% 10% 0V FIGURE 3-1: Time Test Circuit 90% tD2 tR Output Output tF 10% 0V 10% FIGURE 3-2: Noninverting Driver Switching Time Test Circuit Inverting Driver Switching +15V 30. 29. 28. 4.7 F 1N4001 6 2 fIN = 10 kHz 1/2 TC426 - 7 FIGURE 3-3: + 1N4001 26. 25. 24. VOUT 23. 10 F 3 27. VOUT (V) + - 0.1 F + - 47 F 22. 0 10 20 30 40 50 60 70 80 90 100 IOUT (mA) 0 10 20 30 40 50 60 70 80 90 100 Voltage Doubler +15V -5 -6 + -7 4.7 F -8 VOUT (V) 0.1 F - 2 fIN = 10 kHz 6 1/2 TC426 3 + 7 - VOUT 1N4001 -9 -10 -11 -12 10 F 1N4001 - + 47 F -13 -14 IOUT (mA) FIGURE 3-4: Voltage Inverter 2002-2012 Microchip Technology Inc. DS21415D-page 7 TC426/TC427/TC428 4.0 TYPICAL CHARACTERISTICS The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Rise and Fall Times vs. Supply Voltage 70 DELAY TIME (ns) tR tF tD2 70 50 tD1 0 5 10 15 SUPPLY VOLTAGE (V) 20 5 0 70 60 50 tD1 Rise and Fall Times vs. Capacitive Load 400 kHz TA = +25C VDD = 18V 100 50 40 200 kHz 30 10 20 kHz 0 1 10 Supply Current vs. Frequency 100 1000 CAPACITIVE LOAD (pF) 10 10K High Output vs. Voltage VDD = 18V TA = +25C 5V 10 VDD - VOUT (V) 1.76 10V 10K 1.20 TA = +25C 20 100 1000 CAPACITIVE LOAD (pF) Low Output vs. Voltage 2.20 TA = +25C CL = 1000 pF tF 20 50 25 75 100 125 150 TEMPERATURE (C) 30 tR 60 10 0 25 50 75 100 125 150 TEMPERATURE (C) TIME (ns) 80 30 -25 0 1K TA = +25C VDD = 18V 70 SUPPLY CURRENT (mA) DELAY TIME (ns) 0 -25 20 80 tD2 40 SUPPLY CURRENT (mA) 10 15 SUPPLY VOLTAGE (V) Supply Current vs. Capacitive Load 100 90 tF 20 10 Delay Times vs. Temperature CL = 1000 pF VDD = 18V 25 15 30 10 tR 30 60 40 CL = 1000 pF VDD = 18V 35 VDD = 8V 1.32 13V 0.88 18V 0.44 OUTPUT VOLTAGE (V) TIME (ns) 40 20 CL = 1000 pF TA = +25C 80 50 30 40 90 CL = 1000 pF TA = +25C 60 Rise and Fall Times vs. Temperature Delay Times vs. Supply Voltage TIME (ns) Note: VDD = 5V 0.96 0.72 10V 0.48 15V 0.24 0 1 10 100 FREQUENCY (kHz) DS21415D-page 8 1000 0 10 20 30 40 50 60 70 80 90 100 CURRENT SOURCED (mA) 0 10 20 30 40 50 60 70 80 90 100 CURRENT SUNK (mA) 2002-2012 Microchip Technology Inc. TC426/TC427/TC428 TYPICAL CHARACTERISTICS (CONTINUED) Supply Voltage vs. Quiescent Supply Current Supply Voltage vs. Quiescent Supply Current 20 No Load Both Inputs Logic `1' TA = +25C 15 SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V) 20 10 5 0 15 10 5 0 1 2 3 4 5 SUPPLY CURRENT (mA) No Load Both Inputs Logic `0' TA = +25C 6 0 50 100 150 200 250 SUPPLY CURRENT (mA) 300 Thermal Derating Curves 1600 MAX. POWER (mW) 1400 8-Pin DIP 1200 8-Pin CERDIP 1000 800 8-Pin SOIC 600 400 200 0 0 10 20 30 40 50 60 70 80 90 100 110 120 AMBIENT TEMPERATURE (C) 2002-2012 Microchip Technology Inc. DS21415D-page 9 TC426/TC427/TC428 5.0 PACKAGING INFORMATION 5.1 Package Marking Information Package marking data not available at this time. 5.2 Taping Form Component Taping Orientation for 8-Pin MSOP Devices User Direction of Feed Pin 1 W P Standard Reel Component Orientation for 713 Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package 8-Pin MSOP Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in Component Taping Orientation for 8-Pin SOIC (Narrow) Devices User Direction of Feed Pin 1 W P Standard Reel Component Orientation for 713 Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package 8-Pin SOIC (N) DS21415D-page 10 Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in 2002-2012 Microchip Technology Inc. TC426/TC427/TC428 5.3 Package Dimensions Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin Plastic DIP Pin 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .310 (7.87) .290 (7.37) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .040 (1.02) .020 (0.51) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) .022 (0.56) .015 (0.38) .015 (0.38) .008 (0.20) 3 Min. .400 (10.16) .310 (7.87) Dimensions: inches (mm) 2002-2012 Microchip Technology Inc. DS21415D-page 11 TC426/TC427/TC428 Package Dimensions (Continued) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin CERDIP (Narrow) .110 (2.79) .090 (2.29) Pin 1 .300 (7.62) .230 (5.84) .020 (0.51) Min. .055 (1.40) Max. .320 (8.13) .290 (7.37) .400 (10.16) .370 (9.40) .200 (5.08) .160 (4.06) .040 (1.02) .020 (0.51) .150 (3.81) Min. .200 (5.08) .125 (3.18) .015 (0.38) .008 (0.20) 3 Min. .400 (10.16) .320 (8.13) .065 (1.65) .020 (0.51) .045 (1.14) .016 (0.41) Dimensions: inches (mm) DS21415D-page 12 2002-2012 Microchip Technology Inc. TC426/TC427/TC428 Package Dimensions (Continued) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin SOIC Pin 1 .157 (3.99) .150 (3.81) .244 (6.20) .228 (5.79) .050 (1.27) Typ. .197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .010 (0.25) .007 (0.18) 8 Max. .050 (1.27) .016 (0.40) Dimensions: inches (mm) 2002-2012 Microchip Technology Inc. DS21415D-page 13 TC426/TC427/TC428 6.0 REVISION HISTORY Revision D (December 2012) Added a note to each package outline drawing. DS21415D-page 14 2002-2012 Microchip Technology Inc. TC426/TC427/TC428 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under "Support", click on "Customer Change Notification" and follow the registration instructions. 2002-2012 Microchip Technology Inc. DS21415D-page 15 TC426/TC427/TC428 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y N Device: TC426/TC427/TC428 Literature Number: DS21415D Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21415D-page 16 2002-2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2002-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620767900 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2002-2012 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS21415D-page 17 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Japan - Osaka Tel: 81-66-152-7160 Fax: 81-66-152-9310 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 China - Hangzhou Tel: 86-571-2819-3187 Fax: 86-571-2819-3189 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 Taiwan - Kaohsiung Tel: 886-7-213-7828 Fax: 886-7-330-9305 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 DS21415D-page 18 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 11/27/12 2002-2012 Microchip Technology Inc.