U6805B
TELEFUNKEN Semiconductors
Rev . A3, 28-Apr-97 1 (5)
Hex-Driver with Thermal Monitoring
Description
The hex-driver IC includes 6 non-inverted and current
limited output stages with an open collector. Common
thermal shutdown protects outputs against critical
junction temperature.
Each output can sink 20 mA, parallel output operation is
possible. The digital inputs have Schmitt-trigger function
with pull-up current sources to 5 V.
Features
D
Six input comparators with Schmitt-trigger
characteristic
D
Input clamping current capability to
"
10 mA
D
Integrated protection cells (EMC, ESD, RF)
dedicated to all input stages
D
Common shutdown by junction temperature monitor
D
Low voltage reset with hysteresis
D
ESD protection to human body model:
"
2000 V (C = 100 pF, R = 1.5 k
W
)
D
Output stages:
Short circuit protected with diode
Load-dump protected @ 1 k
W
No crosstalk on adjacent channels
Clamping current @ –2 mA
Jump start possible
Ordering Information
Extended Type Number Package Remarks
U6805B–FP SO14
Block Diagram
Under
voltage
detection VS=5 V
11
1 2
VO1
7
14
4
VO2 VO6
VS
VS
VI1 VI2 VI6
GND
13334
Thermal
shutdown
3
VO3
5
VO4
6
VO5
VI3 VI4 VI5
13 12 10 9 8
Figure 1.
U6805B
TELEFUNKEN Semiconductors
Rev . A3, 28-Apr-97
2 (5)
Pin Description
1
2
3
4
14
13
12
11
VO1
VO3
VI1
VI2
VI3
VS
13335
5
6
7
GND
VO5
VO6
10
9
8
VI4
VI5
VI6
VO2
VO4
Figure 2. Pinning
Pin Symbol Function
1 VO1 Output 1
2 VO2 Output 2
3 VO3 Output 3
4 GND Ground
5 VO4 Output 4
6 VO5 Output 5
7 VO6 Output 6
8 VI6 Input 6
9 VI5 Input 5
10 VI4 Input 4
11 VSSupply voltage, 5 V
12 VI3 Input 3
13 VI2 Input 2
14 VI1 Input 1
Basic Circuitry
Integrated circuit, U6805B, requires a stabilized supply
voltage (VS = 5 V
"
5%) to comply with its electrical
characteristics. An external buf fer capacitor of C = 100 nF
value is recommended. An integrated 14-V Z-diode
between VS and ground protects the supply pin.
All input stages are provided with an integrated 250 k
W
pull–up resistor and can be directly connected to a micro-
controller.
All output stages are open collectors each capable of
sinking 20 mA. Recommended external components:
Pull–up resistor, R = 1 k
W
Capacitor to GND, C = 470 pF, see figure 3
Functional Description
General
ON state: Low level at the input stage activates the
corresponding output stage.
OFF state: The internal pull-up resistor gives high level
to the input comparator and deactivates the output stage.
7-V Z-diodes between each input pin and GND are
capable of
"
10 mA clamping currents without crosstalk
on adjacent input stages.
A total clamping current of
"
30 mA should be observed
with respect to the power dissipation.
Current Limitation of the Output
Stages and Overtemperature
Shut-down
A temperature dependent current limitation between
25 and 100 mA protects the stages during a short.
Additionally the chip temperature is monitored. For Tchip
> 148
_
C all outputs are disabled and automatically
enabled with a hysteresis of
D
TChip > 5 K.
Refer to hexdriver U6807B if the temperature shut down
is not required.
Transients and Load-Dump
An integrated 28-V Z-diode protects each output stage
against transients and load-dump (Schaffner pulses).
With the help of external 1-k
W
resistor , the output
transistor is capable of the corresponding current which
flows during each of these conditions. Apart from that,
outputs are short circuit and overload protected.
Low Voltage Detection
When supply voltage is switched on, a power-on reset
pulse is generated internally, which disables all output
stages until a defined supply voltage level is reached. The
low voltage detection is provided with a hysteresis of
Vhyst = 0.5 V typically.
U6805B
TELEFUNKEN Semiconductors
Rev . A3, 28-Apr-97 3 (5)
Absolute Maximum Ratings
Parameters Symbol Value Unit
Supply voltage VS7.0 V
Ambient temperature range Tamb –40 to
+125
_
C
Storage temperature range Tstg –50 to
+150
_
C
Maximum junction temperature Tj+150
_
C
Thermal Resistance
Parameters Symbol Value Unit
Junction ambient RthJA 120 K/W
Electrical Characteristics
VS = 5 V
"
5%, Tamb = 25
_
C, reference point pin 4 (GND), unless otherwise specified, see figure 1.
Parameters Test Conditions / Pins Symbol Min. Typ. Max. Unit
Supply Pin 11
Supply voltage VS4.75 5.25 V
Supply current Inputs open
Inputs closed to GND IS
IS
0.8
73.2
13 mA
mA
Low voltage detection
threshold ON
OFF VTH(ON)
VTH(OFF)
3.7
3.0 4.6
3.8 V
V
Low voltage hysteresis Vhyst 0.55 1.05 V
Temperature shut down TChip 140 149
_
C
Temperature shut-down
hysteresis Thyst 5
_
C
Inputs Pins 8, 9, 10, 12, 13 and 14
Z-diode protection voltage VI6.7 8.5 V
Z-diode clamping current II
"
10 mA
Pull-up resistor RI170 250 305 k
W
Switching threshold OFF
ON VI
VI
3.3
1.8 V
V
Hysteresis Vhyst 1.5 V
Outputs Pins 1, 2, 3, 5, 6 and 7
Z-diode protection voltage VO26.5 V
Integrated capacitor 5 pF
Leakage current ILeak 2.5
m
A
Saturation voltage (I = 20 mA) VSat 0.7 V
Current limitation Ilimit 25 mA
Propagation delay
(470 pF, 1 k
W
, 20 V) td5
m
s
U6805B
TELEFUNKEN Semiconductors
Rev . A3, 28-Apr-97
4 (5)
Application Circuit
VS=5 V
VI1
VI2
VI3
Hexdriver IC
U6805B
VO1
VO2
VO3
C C C
RRR
V
Batt
6x 1k
Load
100 nF
Micro
controller VI4
VI5
VI6
VO4
VO5
VO6
RRR
C
6x 470 pF
C C
13336
Figure 3. Application schematic
Package Information
13035
technical drawings
according to DIN
specifications
Package SO14
Dimensions in mm
0.25
0.10
8.75
0.4
1.27 7.62
1.4
5.2
4.8
3.7
3.8
6.15
5.85
0.2
14 8
14 8
U6805B
TELEFUNKEN Semiconductors
Rev . A3, 28-Apr-97 5 (5)
Ozone Depleting Substances Policy Statement
It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of
continuous improvements to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain
such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or
unauthorized use.
TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423