SN65LBC179A SN75LBC179A SLLS377D - MAY 2000 - REVISED SEPTEMBER 2011 www.ti.com LOW-POWER DIFFERENTIAL LINE DRIVER AND RECEIVER PAIRS Check for Samples: SN65LBC179A, SN75LBC179A FEATURES 1 * 2 * * * * * * * High-Speed Low-Power LinBiCMOSTM Circuitry Designed for Signaling Rates(1) of up to 30 Mbps Bus-Pin ESD Protection Exceeds 12 kV HBM Very Low Disabled Supply-Current Requirements . . . 700 A Max Common-Mode Voltage Range of -7 V to 12 V Low Supply Current . . .15 mA Max Compatible With ANSI Standard TIA/EAI-485-A and ISO8482: 1987(E) Positive and Negative Output Current Limiting Driver Thermal Shutdown Protection SN65LBC179AD (Marked as BL179A) SN65LBC179AP (Marked as 65LBC179A) SN75LBC179AD (Marked as LB179A) SN75LBC179AP (Marked as 75LBC179A) (TOP VIEW) VCC R D GND 1 8 2 7 3 6 4 5 A B Z Y LOGIC DIAGRAM (POSITIVE LOGIC) R (1) Signaling rate by TIA/EIA-485-A definition restrict transition times to 30% of the bit length, and much higher signaling rates may be achieved without this requirement as displayed in the TYPICAL CHARACTERISTICS of this device. D 8 2 7 5 3 6 A B Y Z DESCRIPTION The SN65LBC179A and SN75LBC179A differential driver and receiver pairs are monolithic integrated circuits designed for bidirectional data communication over long cables that take on the characteristics of transmission lines. They are balanced, or differential, voltage mode devices that are compatible with ANSI standard TIA/EIA-485-A and ISO 8482:1987(E). The A version offers improved switching performance over its predecessors without sacrificing significantly more power. The SN65LBC179A and SN75LBC179A combine a differential line driver and differential input line receiver and operate from a single 5-V supply. The driver differential outputs and the receiver differential inputs are connected to separate terminals for full-duplex operation and are designed to present minimum loading to the bus when powered off (VCC = 0). These parts feature a wide positive and negative common-mode voltage range making them suitable for point-to-point or multipoint data bus applications. The devices also provide positive- and negative-current limiting and thermal shutdown for protection from line fault conditions. The SN65LBC179A is characterized over the industrial temperature range of -40C to 85C. The SN75LBC179A is characterized for operation over the commercial temperature range of 0C to 70C. FUNCTION TABLE (1) DRIVER INPUT D (1) RECEIVER DIFFERENTIAL INPUTS A-B OUTPUT R Z VID 0.2 V H ? OUTPUTS Y H H L -0.2 V < VID < 0.2 V L L H VID -0.2 V L OPEN H L Open circuit H H = high level, L = low level, ? = indeterminate 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. LinBiCMOS is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2000-2011, Texas Instruments Incorporated SN65LBC179A SN75LBC179A SLLS377D - MAY 2000 - REVISED SEPTEMBER 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. AVAILABLE OPTIONS PACKAGE TA SMALL OUTLINE (D) PLASTIC DUAL-IN-LINE 0C to 70C SN75LBC179AD SN75LBC179AP -40C to 85C SN65LBC179AD SN65LBC179AP SCHEMATICS OF INPUTS AND OUTPUTS D Inputs VCC 100 k 1 k Input 8V A Input B Input VCC 16 V 100 k VCC 16 V 4 k 4 k 18 k 18 k Input Input 100 k 16 V 16 V 4 k 4 k Y AND Z Outputs VCC R Output VCC 16 V Receiver 40 Output Output 8V 16 V Receiver 2 Submit Documentation Feedback Copyright (c) 2000-2011, Texas Instruments Incorporated Product Folder Link(s): SN65LBC179A SN75LBC179A SN65LBC179A SN75LBC179A SLLS377D - MAY 2000 - REVISED SEPTEMBER 2011 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) UNIT VCC Supply voltage range (2) Voltage range IO -0.3 V to 6 V A, B, Y, or Z (2) -10 V to 15 V D or R (2) -0.3 V to VCC + 0.5 V 20 mA Receiver output current (3) 12 kV Bus terminals and GND, Class 3, B (3) 400 V Bus terminals and GND, Class 3, A Electrostatic discharge All terminals, Class 3, A 3 kV All terminals, Class 3, B 400 V Continuous total power dissipation (4) Internally limited Total power dissipation (1) (2) (3) (4) See Dissipation Rating Table Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential I/O bus voltages, are with respect to GND. Tested in accordance with MIL-STD-883C, Method 3015.7 The maximum operating junction temperature is internally limited. Uses the dissipation rating table to operate below this temperature. DISSIPATION RATINGS (1) PACKAGE TA 25C POWER RATING DERATING FACTOR (1) ABOVE TA = 25C TA = 70C POWER RATING TA = 85C POWER RATING D 725 mW 5.8 mW/C 464 mW 377 mW P 1100 mW 8.08 mW/C 640 mW 520 mW This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow. RECOMMENDED OPERATING CONDITIONS VCC Supply voltage VIH High-level input voltage D VIL Low-level input voltage D VID Differential input voltage (1) MIN NOM MAX UNIT 4.75 5 5.25 V 2 VCC V 0 0.8 V -12 (2) 12 V -7 12 V VO VI Voltage at any bus terminal (separately or common-mode) A, B, Y, or Z VIC IOH High-level output current IOL Low-level output current TA Operating free-air temperature (1) (2) Y or Z R -60 mA -8 Y or Z 60 R 8 SN65LBC179A -40 85 SN75LBC179A 0 70 mA C Differential input/output bus voltage is measured at the noninverting terminal with respect to the inverting terminal. The algebraic convention, in which the least positive (most negative) limit is designated as minimum, is used in this data sheet. Copyright (c) 2000-2011, Texas Instruments Incorporated Product Folder Link(s): SN65LBC179A SN75LBC179A Submit Documentation Feedback 3 SN65LBC179A SN75LBC179A SLLS377D - MAY 2000 - REVISED SEPTEMBER 2011 www.ti.com DRIVER ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER VIK II = -18 mA Input clamp voltage Differential output voltage MAX -1.5 -0.8 SN65LBC179A 1 1.5 3 SN75LBC179A 1.1 1.5 3 RL = 60 , -7 <V(tot) < 12, SN65LBC179A See Figure 2 SN75LBC179A 1 1.5 3 1.1 1.5 3 RL = 54 , See Figure 1 |VOD| MIN TYP (1) TEST CONDITIONS | VOD | Change in magnitude of differential output See Figure 1 and Figure 2 voltage (2) VOC(SS) Steady-state common-mode output voltage -0.2 1.8 2.4 UNIT V V V 0.2 V 2.8 V 0.1 V 10 A See Figure 1 VOC(SS) Change in steady-state common-mode output voltage (2) IO Output current with power off VCC = 0, IIH High-level input current VI = 2.V -100 A IIL Low-level input current VI = 0.8 V -100 A IOS Short-circuit output current -7 V VO 12 V ICC Supply current No load, (1) (2) -0.1 VO = -7 V to 12 V -10 -250 VI = 0 or VCC 1 70 250 mA 8.5 15 mA All typical values are at VCC = 5 V, TA = 25C. | VOD | and | VOC | are the changes in the steady-state magnitude of VOD and VOC, respectively, that occur when the input is changed from a high level to a low level. DRIVER SWITCHING CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tPLH Propagation delay time, low-to-high-level output 2 6 12 ns tPHL Propagation delay time, high-to-low-level output 2 6 12 ns tsk(p) Pulse skew ( | tPHL - tPLH | ) 0.3 1 ns tr Differential output signal rise time 4 7.5 11 ns tf Differential output signal fall time 4 7.5 11 ns 4 Submit Documentation Feedback RL = 54 , CL = 50 pF, See Figure 3 Copyright (c) 2000-2011, Texas Instruments Incorporated Product Folder Link(s): SN65LBC179A SN75LBC179A SN65LBC179A SN75LBC179A SLLS377D - MAY 2000 - REVISED SEPTEMBER 2011 www.ti.com RECEIVER SECTION RECEIVER ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP IO = -8 mA MAX VIT+ Positive-going input threshold voltage VIT- Negative-going input threshold voltage Vhys Hysteresis voltage ( VIT+ - VIT-) VOH High-level output voltage VID = 200 mV, IOH = -8 mA, See Figure 1 VOL Low-level output voltage VID = -200 mV, IOL = 8 mA, See Figure 1 0.1 0.8 VIH = 12 V, VCC = 5 V 0.4 1 VIH = 12 V, VCC = 0 0.5 1 II 0.2 -0.2 IO = 8 mA Bus input current 50 4 Other input at 0 V VIH = -7 V, VCC = 5 V VIH = -7 V, VCC = 0 -0.4 -0.8 -0.3 V mV 4.9 -0.8 UNIT V V mA RECEIVER SWITCHING CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tPLH Propagation delay time, low-to-high-level output 7 13 20 ns tPHL Propagation delay time, high-to-low-level output 7 13 20 ns tsk(p) Pulse skew ( | tPLH - tPHL | ) 0.5 1.5 ns tr Rise time, output 2.1 3.3 ns tf Fall time, output 2.1 3.3 ns VID = -1.5 V to 1.5 V, See Figure 4 See Figure 4 PARAMETER MEASURMENT INFORMATION Y 27 D VOD 0 V or 3 V 27 VOC Z Figure 1. Driver VOD and VOC V(test ) R1 375 Y D RL = 60 0 V or 3 V VOD Z -7 V < V(test) < 12 V R2 375 V(test ) Figure 2. Driver VOD With Common-Mode Loading Copyright (c) 2000-2011, Texas Instruments Incorporated Product Folder Link(s): SN65LBC179A SN75LBC179A Submit Documentation Feedback 5 SN65LBC179A SN75LBC179A SLLS377D - MAY 2000 - REVISED SEPTEMBER 2011 www.ti.com PARAMETER MEASURMENT INFORMATION (continued) 3V Input Generator (see Note A) RL = 54 50 1.5 V CL = 50 pF (see Note B) 1.5 V 0V tPLH Output Output tPHL 50% 1.5 V 50% 90% 10% - 1.5 V tf tr TEST CIRCUIT VOLTAGE WAVEFORMS A. The input pulse is supplied by a generator having the following characteristics: PRR 1 MHz, 50% duty cycle, tr 6 ns, tf 6 ns, ZO = 50 . B. CL includes probe and jig capacitance. Figure 3. Driver Test Circuits and Voltage Waveforms 3V Input Generator (see Note A) 50 1.5 V 1.5 V A 0V Output B tPLH tPHL 1.5 V CL = 15 pF (see Note B) Output 90% 1.3 V 10% VOH 90% 1.3 V 10% tr TEST CIRCUIT VOL tf VOLTAGE WAVEFORMS A. The input pulse is supplied by a generator having the following characteristics: PRR 1 MHz, 50% duty cycle, tr 6 ns, tf 6 ns, ZO = 50 . B. CL includes probe and jig capacitance. Figure 4. Receiver Test Circuit and Voltage Waveforms 6 Submit Documentation Feedback Copyright (c) 2000-2011, Texas Instruments Incorporated Product Folder Link(s): SN65LBC179A SN75LBC179A SN65LBC179A SN75LBC179A SLLS377D - MAY 2000 - REVISED SEPTEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS Receiver Output Driver Input 120 120 Driver Input Receiver Output Figure 5. Typical Waveform of Non-Return-To-Zero (NRZ), Pseudorandom Binary Sequence (PRBS) Data at 100 Mbps Through 15m, of CAT 5 Unshielded Twisted Pair (UTP) Cable TIA/EIA-485-A defines a maximum signaling rate as that in which the transition time of the voltage transition of a logic-state change remains less than or equal to 30% of the bit length. Transition times of greater length perform quite well even though they do not meet the standard by definition. AVERAGE SUPPLY CURRENT vs FREQUENCY LOGIC INPUT CURRENT vs INPUT VOLTAGE -30 45 Driver -25 35 II - Logic Input Current - A I CC - Average Supply Current - mA 40 30 25 20 15 Receiver 10 -20 -15 -10 -5 5 0 0.05 0.5 1 2 5 10 20 30 0 0 1 f - Frequency - MHz Figure 6. 2 3 4 5 VI - Input Voltage - V Figure 7. Copyright (c) 2000-2011, Texas Instruments Incorporated Product Folder Link(s): SN65LBC179A SN75LBC179A Submit Documentation Feedback 7 SN65LBC179A SN75LBC179A SLLS377D - MAY 2000 - REVISED SEPTEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT 800 2.00 600 1.75 VOL - Low-Level Output Voltage - V II - Input Current - A INPUT CURRENT vs INPUT VOLTAGE 400 200 0 -200 Bus Input Current -400 VCC = 5 1.50 1.25 1.00 0.75 0.50 0.25 -600 -8 0.00 -6 -4 -2 0 2 4 6 8 10 12 0 10 VI - Input Voltage - V 50 60 70 DRIVER HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs AVERAGE CASE TEMPERATURE 80 2 VOD - Driver Differential Output Voltage - V VOH - Driver High-Level Output Voltage - V 40 Figure 9. 4.5 4 VCC = 5.25 V 3.5 3 2.5 VCC = 5 V 2 VCC = 4.75 V 1.5 1 0.5 1.5 1 0.5 0 0 -10 -20 -30 -40 -50 -60 -70 IOH - High-Level Output Current - (mA) -80 -40 0 Submit Documentation Feedback 25 70 85 Average Case Temperature - C Figure 10. 8 30 Figure 8. 5 0 20 IOL - Low-Level Output Current - mA Figure 11. Copyright (c) 2000-2011, Texas Instruments Incorporated Product Folder Link(s): SN65LBC179A SN75LBC179A SN65LBC179A SN75LBC179A SLLS377D - MAY 2000 - REVISED SEPTEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) RECEIVER PROPAGATION TIME vs CASE TEMPERATURE DRIVER PROPAGATION DELAY TIME vs CASE TEMPERATURE 13.8 7.4 TPHL - Driver Propagation Delay Time - ns T PHL - Receiver Propagation Time - ns 13.7 13.6 13.5 13.4 13.3 13.2 13.1 13 12.9 -40 0 25 70 80 7.2 7 6.8 6.6 6.4 6.2 6 5.8 5.6 Case Temperature C -40 0 25 70 85 Case Temperature - C Figure 12. Figure 13. DRIVER OUTPUT CURRENT vs SUPPLY VOLTAGE 90 IO - Driver Output Current - mA 65 40 15 IOH -10 -35 -60 -85 -110 -135 IOL -160 -185 -210 0 3 4 5 VCC - Supply Voltage - V Figure 14. 6 Copyright (c) 2000-2011, Texas Instruments Incorporated Product Folder Link(s): SN65LBC179A SN75LBC179A Submit Documentation Feedback 9 SN65LBC179A SN75LBC179A SLLS377D - MAY 2000 - REVISED SEPTEMBER 2011 www.ti.com REVISION HISTORY Changes from Revision C (June 2001) to Revision D Page * Changed the D Output and R Output schematins ................................................................................................................ 2 * Added Receiver output current to the Abs Max Table .......................................................................................................... 3 * Changed ESD - All terminals, Class 3, A From: 4 kV To: 3 kV ............................................................................................ 3 10 Submit Documentation Feedback Copyright (c) 2000-2011, Texas Instruments Incorporated Product Folder Link(s): SN65LBC179A SN75LBC179A PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN65LBC179AD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LBC179ADG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LBC179ADR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LBC179ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LBC179AP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN65LBC179APE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN75LBC179AD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75LBC179ADG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75LBC179ADR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75LBC179ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75LBC179AP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN75LBC179APE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 5-May-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN65LBC179ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 SN75LBC179ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-May-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN65LBC179ADR SOIC D 8 2500 340.5 338.1 20.6 SN75LBC179ADR SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated