IPN80R2K0P7 MOSFET 800VCoolMOSP7PowerTransistor PG-SOT223 Thelatest800VCoolMOSTMP7seriessetsanewbenchmarkin800V superjunctiontechnologiesandcombinesbest-in-classperformancewith stateoftheartease-of-use,resultingfromInfineon'sover18years pioneeringsuperjunctiontechnologyinnovation. Features *Best-in-classFOMRDS(on)*Eoss;reducedQg,Ciss,andCoss *Best-in-classDPAKRDS(on) *Best-in-classV(GS)thof3VandsmallestV(GS)thvariationof0.5V *IntegratedZenerDiodeESDprotection *Best-in-classCoolMOSTMqualityandreliability;qualifiedforindustrial gradeapplicationsaccordingtoJEDEC(J-STD20andJESD22) *Fullyoptimizedportfolio Benefits Drain Pin 2, Tab Gate Pin 1 *Best-in-classperformance *Enablinghigherpowerdensitydesigns,BOMsavingsandlower assemblycosts *Easytodriveandtoparallel *BetterproductionyieldbyreducingESDrelatedfailures *Lessproductionissuesandreducedfieldreturns *Easytoselectrightpartsforfinetuningofdesigns Source Pin 3 Potentialapplications RecommendedforhardandsoftswitchingflybacktopologiesforLED Lighting,lowpowerChargersandAdapters,Audio,AUXpowerand Industrialpower.AlsosuitableforPFCstageinConsumerapplications andSolar. Pleasenote:ForMOSFETparallelingtheuseofferritebeadsonthegate orseperatetotempolesisgenerallyrecommended. Table1KeyPerformanceParameters Parameter Value Unit VDS @ Tj=25C 800 V RDS(on),max 2.0 Qg,typ 9 nC ID 3 A Eoss @ 500V 0.85 J VGS(th),typ 3 V ESD class (HBM) 1C - Type/OrderingCode Package Marking IPN80R2K0P7 PG-SOT223 80R2K0 Final Data Sheet 1 RelatedLinks see Appendix A Rev.2.0,2017-06-23 800VCoolMOSP7PowerTransistor IPN80R2K0P7 TableofContents Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Final Data Sheet 2 Rev.2.0,2017-06-23 800VCoolMOSP7PowerTransistor IPN80R2K0P7 1Maximumratings atTj=25C,unlessotherwisespecified Table2Maximumratings Parameter Symbol Continuous drain current1) Values Unit Note/TestCondition 3 1.9 A TC=25C TC=100C - 6.0 A TC=25C - - 6 mJ ID=0.4A; VDD=50V EAR - - 0.05 mJ ID=0.4A; VDD=50V Avalanche current, repetitive IAR - - 0.4 A - MOSFET dv/dt ruggedness dv/dt - - 100 V/ns VDS=0to400V Gate source voltage VGS -20 -30 - 20 30 V static; AC (f>1 Hz) Power dissipation Ptot - - 6 W TC=25C Operating and storage temperature Tj,Tstg -55 - 150 C - Continuous diode forward current IS - - 1.1 A TC=25C IS,pulse - - 6.0 A TC=25C dv/dt - - 1 V/ns VDS=0to400V,ISD<=0.47A,Tj=25C dif/dt - - 50 A/s VDS=0to400V,ISD<=0.47A,Tj=25C Min. Typ. Max. ID - - Pulsed drain current2) ID,pulse - Avalanche energy, single pulse EAS Avalanche energy, repetitive 2) Diode pulse current 3) Reverse diode dv/dt 3) Maximum diode commutation speed 2Thermalcharacteristics Table3Thermalcharacteristics Parameter Symbol Thermal resistance, junction - solder point Values Unit Note/TestCondition Min. Typ. Max. RthJS - - 19.5 C/W - Thermal resistance, junction - ambient RthJA - - 160 C/W Device on PCB, minimal footprint Thermal resistance, junction - ambient RthJA soldered on copper area - - 75 Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer 70m thickness) copper area C/W for drain connection and cooling. PCB is vertical without air stream cooling. Soldering temperature, wave- & reflow Tsold soldering allowed - - 260 C reflow MSL1 1) DPAK equivalent. Limited by Tj max. Maximum duty cycle D=0.5 Pulse width tp limited by Tj,max 3) VDClink=400V;VDS,peak