SDLS095A - OCTOBER 1976 - REVISED MARCH 1988 description Copyright 1988, Texas Instruments Incorporated !"# $ %& '# "$ (&)*%"# +"#', +&%#$ % ! # $('%%"#$ (' #-' #' !$ '."$ $# &!'#$ $#"+" + /" "#0, +&%# ( %'$$1 +'$ # '%'$$" *0 %*&+' #'$#1 "** (" "!'#' $, POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SDLS095A - OCTOBER 1976 - REVISED MARCH 1988 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SDLS095A - OCTOBER 1976 - REVISED MARCH 1988 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SDLS095A - OCTOBER 1976 - REVISED MARCH 1988 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SDLS095A - OCTOBER 1976 - REVISED MARCH 1988 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 23-Mar-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE CDIP J 16 25 TBD A42 76043012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI 7604301EA ACTIVE CDIP J 16 1 TBD Call TI Call TI 7604301FA ACTIVE CFP W 16 1 TBD Call TI Call TI JM38510/31202B2A ACTIVE LCCC FK 20 1 TBD N / A for Pkg Type JM38510/31202BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type JM38510/31202BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type POST-PLATE N / A for Pkg Type M38510/31202B2A ACTIVE LCCC FK 20 1 TBD M38510/31202BEA ACTIVE CDIP J 16 1 TBD POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type M38510/31202BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type SN54LS283J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SN54S283J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SN74283N OBSOLETE PDIP N 16 TBD Call TI SN74LS283D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS283DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS283DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS283N ACTIVE PDIP N 16 25 Pb-Free (RoHS) Call TI CU NIPDAU N / A for Pkg Type SN74LS283N3 OBSOLETE PDIP N 16 SN74LS283NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) SN74LS283NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS283NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS283NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S283D OBSOLETE SOIC D 16 SN74S283N ACTIVE PDIP N 16 SN74S283N3 OBSOLETE PDIP N 16 TBD 25 Pb-Free (RoHS) TBD Addendum-Page 1 Call TI Call TI CU NIPDAU N / A for Pkg Type Call TI Call TI CU NIPDAU N / A for Pkg Type Call TI Samples (Requires Login) 5962-7604301VEA TBD (3) Call TI PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 23-Mar-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) SN74S283NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SNJ54LS283FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS283J ACTIVE CDIP J 16 1 TBD SNJ54LS283W ACTIVE CFP W 16 1 TBD SNJ54S283FK ACTIVE LCCC FK 20 1 TBD SNJ54S283J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SNJ54S283W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type A42 N / A for Pkg Type A42 N / A for Pkg Type POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54283, SN54LS283, SN54LS283-SP, SN54S283, SN74283, SN74LS283, SN74S283 : * Catalog: SN74283, SN74LS283, SN54LS283, SN74S283 Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 23-Mar-2012 * Military: SN54283, SN54LS283, SN54S283 * Space: SN54LS283-SP NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications * Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74LS283NSR Package Package Pins Type Drawing SO NS 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 16.4 Pack Materials-Page 1 8.2 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.5 2.5 12.0 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS283NSR SO NS 16 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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