W29N02GW/Z W29N02GW/Z 2G-BIT 1.8V NAND FLASH MEMORY 1 Release Date: May 10th, 2016 Revision D W29N02GW/Z Table of Contents 1. 2. 3. GENERAL DESCRIPTION ............................................................................................................... 7 FEATURES ....................................................................................................................................... 7 PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 8 3.1 Pin assignment 48-pin TSOP ............................................................................................... 8 3.2 Pin assignment 63 ball VFBGA (x8) ..................................................................................... 9 3.3 Pin assignment 63 ball VFBGA (x16) ................................................................................. 10 3.4 Pin Descriptions.................................................................................................................. 11 4. PIN DESCRITPIONS ...................................................................................................................... 12 4.1 Chip Enable (#CE).............................................................................................................. 12 4.2 Write Enable (#WE) ............................................................................................................ 12 4.3 Read Enable (#RE) ............................................................................................................ 12 4.4 Address Latch Enable (ALE) .............................................................................................. 12 4.5 Command Latch Enable (CLE) .......................................................................................... 12 4.6 Write Protect (#WP)............................................................................................................ 12 4.7 Ready/Busy (RY/#BY) ........................................................................................................ 12 4.8 Input and Output (I/Ox) ....................................................................................................... 12 5. 6. BLOCK DIAGRAM .......................................................................................................................... 13 MEMORY ARRAY ORGANIZATION .............................................................................................. 14 6.1 Array Organization (x8) ...................................................................................................... 14 6.2 Array Organization (x16) .................................................................................................... 15 7. 8. 9. MODE SELECTION TABLE ........................................................................................................... 16 COMMAND TABLE ........................................................................................................................ 17 DEVICE OPERATIONS .................................................................................................................. 18 9.1 READ operation.................................................................................................................. 18 9.2 9.3 9.4 9.1.1 PAGE READ (00h-30h)......................................................................................................... 18 9.1.2 TWO PLANE READ (00h-00h-30h) ...................................................................................... 18 9.1.3 RANDOM DATA OUTPUT (05h-E0h) ................................................................................... 20 9.1.4 READ ID (90h) ...................................................................................................................... 21 9.1.5 READ PARAMETER PAGE (ECh) ....................................................................................... 22 9.1.6 READ STATUS (70h) ........................................................................................................... 24 9.1.7 READ STATUS ENHANCED (78h) ...................................................................................... 25 9.1.8 READ UNIQUE ID (EDh) ...................................................................................................... 27 PROGRAM operation ......................................................................................................... 28 9.2.1 PAGE PROGRAM (80h-10h) ................................................................................................ 28 9.2.2 SERIAL DATA INPUT (80h).................................................................................................. 28 9.2.3 RANDOM DATA INPUT (85h) .............................................................................................. 29 9.2.4 TWO PLANE PAGE PROGRAM .......................................................................................... 29 COPY BACK operation....................................................................................................... 31 9.3.1 READ for COPY BACK (00h-35h) ........................................................................................ 31 9.3.2 PROGRAM for COPY BACK (85h-10h) ................................................................................ 31 9.3.3 TWO PLANE READ for COPY BACK ................................................................................... 32 9.3.4 TWO PLANE PROGRAM for COPY BACK .......................................................................... 32 BLOCK ERASE operation .................................................................................................. 36 Release Date: May 10th, 2016 2 Revision D W29N02GW/Z 9.4.1 BLOCK ERASE (60h-D0h).................................................................................................... 36 9.4.2 TWO PLANE BLOCK ERASE ..................................................................................................37 9.5 RESET operation................................................................................................................ 38 9.5.1 9.6 9.7 9.8 9.9 RESET (FFh) ........................................................................................................................ 38 FEATURE OPERATION..................................................................................................... 39 9.6.1 GET FEATURES (EEh) ........................................................................................................ 42 9.6.2 SET FEATURES (EFh) ......................................................................................................... 43 ONE TIME PROGRAMMABLE (OTP) area ....................................................................... 44 WRITE PROTECT .............................................................................................................. 45 BLOCK LOCK..................................................................................................................... 47 10. ELECTRICAL CHARACTERISTICS............................................................................................... 48 10.1 Absolute Maximum Ratings (1.8V) ..................................................................................... 48 10.2 Operating Ranges (1.8V) ................................................................................................... 48 10.3 Device power-up timing ...................................................................................................... 49 10.4 DC Electrical Characteristics (1.8V) ................................................................................... 50 10.5 AC Measurement Conditions (1.8V)................................................................................... 51 10.6 AC timing characteristics for Command, Address and Data Input (1.8V) .......................... 52 10.7 AC timing characteristics for Operation (1.8V) ................................................................... 53 10.8 Program and Erase Characteristics ................................................................................... 54 11. TIMING DIAGRAMS ....................................................................................................................... 55 12. INVALID BLOCK MANAGEMENT .................................................................................................. 64 12.1 Invalid blocks ...................................................................................................................... 64 12.2 Initial invalid blocks ............................................................................................................. 64 12.3 Error in operation ................................................................................................................ 65 12.4 Addressing in program operation ....................................................................................... 66 13. PACKAGE DIMENSIONS ............................................................................................................... 67 13.1 TSOP 48-pin 12x20 ............................................................................................................ 67 13.2 Fine-Pitch Ball Grid Array 63-ball ....................................................................................... 68 14. 15. 16. ORDERING INFORMATION .......................................................................................................... 69 VALID PART NUMBERS ................................................................................................................ 70 REVISION HISTORY ...................................................................................................................... 71 3 Release Date: May 10th, 2016 Revision D W29N02GW/Z List of Tables Table 3-1 Pin Descriptions .......................................................................................................................... 11 Table 6-1 Addressing .................................................................................................................................. 14 Table 6-2 Addressing .................................................................................................................................. 15 Table 7-1 Mode Selection ........................................................................................................................... 16 Table 8-1 Command Table ......................................................................................................................... 17 Table 9-1 Device ID and configuration codes for Address 00h .................................................................. 21 Table 9-2 ONFI identifying codes for Address 20h ..................................................................................... 21 Table 9-3 Parameter Page Output Value.................................................................................................... 24 Table 9-4 Status Register Bit Definition ...................................................................................................... 25 Table 9-5 Features ...................................................................................................................................... 39 Table 9-6 Feature Address 80h .................................................................................................................. 40 Table 9-7 Feature Address 81h .................................................................................................................. 41 Table 10-1 Absolute Maximum Ratings ...................................................................................................... 48 Table 10-2 Operating Ranges ..................................................................................................................... 48 Table 10-3 DC Electrical Characteristics .................................................................................................... 50 Table 10-4 AC Measurement Conditions .................................................................................................... 51 Table 10-5 AC timing characteristics for Command, Address and Data Input ........................................... 52 Table 10-6 AC timing characteristics for Operation .................................................................................... 53 Table 10-7 Program and Erase Characteristics .......................................................................................... 54 Table 12-1 Valid Block Number .................................................................................................................. 64 Table 12-2 Block failure .............................................................................................................................. 65 Table 15-1 Part Numbers for Industrial Temperature ................................................................................. 70 Table 16-1 History Table ............................................................................................................................. 71 4 Release Date: May 10th, 2016 Revision D W29N02GW/Z List of Figures Figure 3-1 Pin Assignment 48-pin TSOP1 (Package code S) ...................................................................... 8 Figure 3-2 Pin Assignment 63-ball VFBGA (Package code B) ..................................................................... 9 Figure 3-3 Pin Assignment 63-ball VFBGA (Package code B) ................................................................... 10 Figure 5-1 NAND Flash Memory Block Diagram ........................................................................................ 13 Figure 6-1 Array Organization ..................................................................................................................... 14 Figure 6-2 Array Organization ..................................................................................................................... 15 Figure 9-1 Page Read Operations .............................................................................................................. 18 Figure 9-2 Two Plane Read Page (00h-00h-30h) Operation ...................................................................... 19 Figure 9-3 Random Data Output ................................................................................................................. 20 Figure 9-4 Two Plane Random Data Read (06h-E0h) Operation ............................................................... 20 Figure 9-5 Read ID...................................................................................................................................... 21 Figure 9-6 Read Parameter Page ............................................................................................................... 22 Figure 9-7 Read Status Operation .............................................................................................................. 24 Figure 9-8 Read Status Enhanced (78h) Operation ................................................................................... 26 Figure 9-9 Read Unique ID ......................................................................................................................... 27 Figure 9-10 Page Program.......................................................................................................................... 28 Figure 9-11 Random Data Input ................................................................................................................. 29 Figure 9-12 Two Plane Page Program ....................................................................................................... 30 Figure 9-13 Program for copy back Operation............................................................................................ 33 Figure 9-14 Copy Back Operation with Random Data Input....................................................................... 33 Figure 9-15 Two Plane Copy Back ............................................................................................................. 34 Figure 9-16 Two Plane Copy Back with Random Data Input ..................................................................... 34 Figure 9-17 Two Plane Program for copy back .......................................................................................... 35 Figure 9-18 Block Erase Operation............................................................................................................. 36 Figure 9-19 Two Plane Block Erase Operation........................................................................................... 37 Figure 9-20 Reset Operation ...................................................................................................................... 38 Figure 9-21 Get Feature Operation............................................................................................................. 42 Figure 9-22 Set Feature Operation ............................................................................................................. 43 Figure 9-23 Erase Enable ........................................................................................................................... 45 Figure 9-24 Erase Disable .......................................................................................................................... 45 Figure 9-25 Program Enable ....................................................................................................................... 45 Figure 9-26 Program Disable ...................................................................................................................... 46 Figure 9-27 Program for Copy Back Enable ............................................................................................... 46 Figure 9-28 Program for Copy Back Disable .............................................................................................. 46 Figure 10-1 Power ON/OFF sequence ....................................................................................................... 49 Figure 11-1 Command Latch Cycle ............................................................................................................ 55 Figure 11-2 Address Latch Cycle ................................................................................................................ 55 Figure 11-3 Data Latch Cycle ..................................................................................................................... 56 Figure 11-4 Serial Access Cycle after Read ............................................................................................... 56 Figure 11-5 Serial Access Cycle after Read (EDO) .................................................................................... 57 Figure 11-6 Read Status Operation ............................................................................................................ 57 Figure 11-7 Page Read Operation .............................................................................................................. 58 Figure 11-8 #CE Don't Care Read Operation ............................................................................................. 58 Figure 11-9 Random Data Output Operation .............................................................................................. 59 5 Release Date: May 10th, 2016 Revision D W29N02GW/Z Figure 11-10 Read ID.................................................................................................................................. 60 Figure 11-11 Page Program........................................................................................................................ 60 Figure 11-12 #CE Don't Care Page Program Operation ............................................................................ 61 Figure 11-13 Page Program with Random Data Input ................................................................................ 62 Figure 11-14 Copy Back ............................................................................................................................. 62 Figure 11-15 Block Erase............................................................................................................................ 63 Figure 11-16 Reset ..................................................................................................................................... 63 Figure 12-1 Flow chart of create initial invalid block table .......................................................................... 65 Figure 12-2 Bad block Replacement........................................................................................................... 66 Figure 13-1 TSOP 48-pin 12x20mm ........................................................................................................... 67 Figure 13-2 Fine-Pitch Ball Grid Array 63-Ball ............................................................................................ 68 Figure 14-1 Ordering Part Number Description .......................................................................................... 69 6 Release Date: May 10th, 2016 Revision D W29N02GW/Z 1. GENERAL DESCRIPTION The W29N02GW/Z (2G-bit) NAND Flash memory provides a storage solution for embedded systems with limited space, pins and power. It is ideal for code shadowing to RAM, solid state applications and storing media data such as, voice, video, text and photos. The device operates on a single 1.7V to 1.95V power supply with active current consumption as low as 13mA at 1.8V and 10uA for CMOS standby current. The memory array totals 276,824,064bytes, and organized into 2,048 erasable blocks of 135,168 bytes (135,168 words). Each block consists of 64 programmable pages of 2,112-bytes (1056 words) each. Each page consists of 2,048-bytes (1024 words) for the main data storage area and 64-bytes (32words) for the spare data area (The spare area is typically used for error management functions). The W29N02GW/Z supports the standard NAND flash memory interface using the multiplexed 8-bit (16bit) bus to transfer data, addresses, and command instructions. The five control signals, CLE, ALE, #CE, #RE and #WE handle the bus interface protocol. Also, the device has two other signal pins, the #WP (Write Protect) and the RY/#BY (Ready/Busy) for monitoring the device status. 2. FEATURES * Basic Features - Density : 2Gbit (Single chip solution) - Vcc : 1.7V to 1.95V - Bus width : x8 x16 - Operating temperature Industrial: -40C to 85C * Single-Level Cell (SLC) technology. * Organization - Density: 2G-bit/256M-byte - Page size 2,112 bytes (2048 + 64 bytes) 1,056 words (1024 + 32 words) - Block size 64 pages (128K + 4K bytes) 64 pages (64K + 2K words) * Highest Performance - Read performance (Max.) Random read: 25us Sequential read cycle: 25ns - Write Erase performance Page program time: 250us(typ.) Block erase time: 2ms(typ.) - Endurance 100,000 Erase/Program Cycles(2) - 10-years data retention * Command set - Standard NAND command set - Additional command support Copy Back Two-plane operation - Contact Winbond for OTP feature - Contact Winbond for block Lock feature * Lowest power consumption - Read: 25mA(typ.3V),T.B.D(typ.1.8V) - Program/Erase: 10mA(typ.1.8V) - CMOS standby: 10uA(typ.) * Space Efficient Packaging - 63-ball VFBGA - Contact Winbond for stacked packages/KGD Note: 1. Endurance specification is based on 1bit/528 byte ECC (Error Correcting Code). 7 Release Date: May 10th, 2016 Revision D W29N02GW/Z 3. PACKAGE TYPES AND PIN CONFIGURATIONS W29N02GW/Z is offered in a 48-pin TSOP1 package (Code S) and 63-ball VFBGA package (Code B) as shown in Figure 3-1 to 3-3, respectively. Package diagrams and dimensions are illustrated in Section: Package Dimensions. 3.1 X16 Pin assignment 48-pin TSOP Top View X8 N.C N.C N.C N.C N.C N.C N.C N.C N.C N.C N.C N.C RY/#BY RY/#BY #RE #RE #CE #CE N.C N.C N.C N.C Vcc Vcc Vss Vss N.C N.C N.C N.C CLE CLE ALE ALE #WE #WE #WP #WP DNU DNU N.C N.C N.C N.C N.C N.C N.C N.C 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 48pin TSOP1 Standard package 12mm x 20mm X8 X16 N.C N.C N.C N.C IO7 IO6 IO5 IO4 N.C N.C N.C Vcc Vss N.C N.C N.C IO3 IO2 IO1 IO0 N.C N.C N.C N.C N.C IO15 IO14 IO13 IO7 IO6 IO5 IO4 IO12 N.C N.C Vcc Vss N.C N.C IO11 IO3 IO2 IO1 IO0 IO10 IO9 IO8 N.C Figure 3-1 Pin Assignment 48-pin TSOP1 (Package code S) 8 Release Date: May 10th, 2016 Revision D W29N02GW/Z 3.2 Pin assignment 63 ball VFBGA (x8) Top View, ball down 1 2 A N.C N.C B N.C 3 4 5 6 7 8 C #WP ALE Vss #CE #WE RY/#BY D N.C #RE CLE N.C N.C N.C E N.C N.C N.C N.C N.C N.C F N.C N.C N.C N.C N.C N.C G DNU N.C DNU N.C N.C N.C H N.C IO0 N.C N.C N.C Vcc J N.C IO1 N.C Vcc IO5 IO7 K Vss IO2 IO3 IO4 IO6 Vss 9 10 N.C N.C N.C N.C L N.C N.C N.C N.C M N.C N.C N.C N.C Figure 3-2 Pin Assignment 63-ball VFBGA (Package code B) 9 Release Date: May 10th, 2016 Revision D W29N02GW/Z 3.3 Pin assignment 63 ball VFBGA (x16) Top View, ball down 1 2 A N.C N.C B N.C 3 4 5 6 7 8 C #WP ALE Vss #CE #WE RY/#BY D N.C #RE CLE N.C N.C N.C E N.C N.C N.C N.C N.C N.C F N.C N.C N.C N.C N.C N.C G DNU N.C DNU IO13 IO15 N.C H IO8 IO0 IO10 IO12 IO14 Vcc J IO9 IO1 IO11 Vcc IO5 IO7 K Vss IO2 IO3 IO4 IO6 Vss 9 10 N.C N.C N.C N.C L N.C N.C N.C N.C M N.C N.C N.C N.C Figure 3-3 Pin Assignment 63-ball VFBGA (Package code B) 10 Release Date: May 10th, 2016 Revision D W29N02GW/Z 3.4 Pin Descriptions PIN NAME I/O FUNCTION #WP I Write Protect ALE I Address Latch Enable #CE I Chip Enable #WE I Write Enable RY/#BY O Ready/Busy #RE I Read Enable CLE I Command Latch Enable I/O[0-7] I/O[0-15] I/O Data Input/Output (x8,x16) Vcc Supply Power supply Vss Supply Ground DNU - Do Not Use. N.C - No Connect Table 3-1 Pin Descriptions Note: 1. Connect all Vcc and Vss pins to power supply or ground. Do not leave Vcc or Vss disconnected. 11 Release Date: May 10th, 2016 Revision D W29N02GW/Z 4. PIN DESCRITPIONS 4.1 Chip Enable (#CE) #CE pin enables and disables device operation. When #CE is high the device is disabled and the I/O pins are set to high impedance and enters into standby mode if not busy. When #CE is set low the device will be enabled, power consumption will increase to active levels and the device is ready for Read and Write operations. 4.2 Write Enable (#WE) #WE pin enables the device to control write operations to input pins of the device. Such as, command instructions, addresses and data that are latched on the rising edge of #WE. 4.3 Read Enable (#RE) #RE pin controls serial data output from the pre-loaded Data Register. Valid data is present on the I/O bus after the tREA period from the falling edge of #RE. Column addresses are incremented for each #RE pulse. 4.4 Address Latch Enable (ALE) ALE pin controls address input to the address register of the device. When ALE is active high, addresses are latched via the I/O pins on the rising edge of #WE. 4.5 Command Latch Enable (CLE) CLE pin controls command input to the command register of the device. When CLE is active high, commands are latched into the command register via I/O pins on the rising edge of #WE. 4.6 Write Protect (#WP) #WP pin can be used to prevent the inadvertent program/erase to the device. When #WP pin is active low, all program/erase operations are disabled. 4.7 Ready/Busy (RY/#BY) RY/#BY pin indicates the device status. When RY/#BY output is low, it indicates that the device is processing either a program, erase or read operations. When it returns to high, those operations have completed. RY/#BY pin is an open drain. 4.8 Input and Output (I/Ox) I/Ox bi-directional pins are used for the following; command, address and data operations. 12 Release Date: May 10th, 2016 Revision D W29N02GW/Z 5. BLOCK DIAGRAM Figure 5-1 NAND Flash Memory Block Diagram 13 Release Date: May 10th, 2016 Revision D W29N02GW/Z 6. MEMORY ARRAY ORGANIZATION 6.1 Array Organization (x8) 2112 bytes 2112 bytes DQ7 Cache Register 2048 64 2048 64 Data Register 2048 64 2048 64 DQ0 1page = (2k+64bytes) 1block = (2k+64bytesx64 pages = (128k+4k)byte 1plane = (128k+4k)bytex1024blocks = 1056Mb 1device = 1056M x2planes = 2112Mb 1024 blocks Per plane 1 block 1 block 2048 blocks Per device Plane of even numbered blocks Plane of odd numbered blocks Figure 6-1 Array Organization I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0 A7 A6 A5 A4 A3 A2 A1 A0 2nd cycle L L L L A11 A10 A9 A8 3rd cycle A19 A18 A17 A16 A15 A14 A13 A12 4th cycle A27 A26 A25 A24 A23 A22 A21 A20 5th cycle L L L L L L L A28 1st cycle Table 6-1 Addressing Notes: 1. "L" indicates a low condition, which must be held during the address cycle to insure correct processing. 2. A0 to A11 during the 1st and 2nd cycles are column addresses. A12 to A28 during the 3rd, 4th and 5th cycles are row addresses. 3. A18 is plane address 4. The device ignores any additional address inputs that exceed the device's requirement. 14 Release Date: May 10th, 2016 Revision D W29N02GW/Z 6.2 Array Organization (x16) 1056 words 1056 words DQ15 Cache Register 1024 32 1024 32 Data Register 1024 32 1024 32 DQ0 1page = (1k+32words) 1block = (1k+32wordsx64 pages = (64k+2k)words 1plane = (64k+2k)wordsx1024blocks = 1056Mb 1device= 1056M x2planes = 2112Mb 1024 blocks Per plane 1 block 1 block 2048 blocks Per device Plane of even numbered blocks (0,2,4,6...,1020,1022) Plane of odd numbered blocks (1,3,5,7...,1021,1023) Figure 6-2 Array Organization I/O[15:8] I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0 cycle L A7 A6 A5 A4 A3 A2 A1 A0 2ndcycle L L L L L L A10 A9 A8 3rd cycle L A18 A17 A16 A15 A14 A13 A12 A11 4th cycle L A26 A25 A24 A23 A22 A21 A20 A19 5th cycle L L L L L L L L A27 1st Table 6-2 Addressing Notes: 1. "L" indicates a low condition, which must be held during the address cycle to insure correct processing. 2. A0 to A10 during the 1st and 2nd cycles are column addresses. A11 to A27 during the 3rd, 4th and 5th cycles are row addresses. 3. A17 is plane address 4. The device ignores any additional address inputs that exceed the device's requirement. 15 Release Date: May 10th, 2016 Revision D W29N02GW/Z 7. MODE SELECTION TABLE MODE CLE ALE #CE #WE #RE #WP Read mode Command input H L L H X Address input L H L H X Program Command input H L L H H Erase mode Address input L H L H H Data input L L L H H Sequential Read and Data output L L L H During read (busy) X X X X H X During program (busy) X X X X X H During erase (busy) X X X X X H Write protect X X X X X L Standby X X H X X 0V/Vcc X Table 7-1 Mode Selection Notes: 1. "H" indicates a HIGH input level, "L" indicates a LOW input level, and "X" indicates a Don't Care Level. 2. #WP should be biased to CMOS HIGH or LOW for standby. 16 Release Date: May 10th, 2016 Revision D W29N02GW/Z 8. COMMAND TABLE 1ST CYCLE 2ND CYCLE PAGE READ 00h 30h READ for COPY BACK 00h 35h READ ID 90h READ STATUS 70h Yes RESET FFh Yes PAGE PROGRAM 80h 10h PROGRAM for COPY BACK 85h 10h BLOCK ERASE 60h D0h RANDOM DATA INPUT*1 85h RANDOM DATA OUTPUT*1 05h READ PARAMETER PAGE ECh READ UNIQUE ID EDh GET FEATURES EEh SET FEATURES EFh READ STATUS ENHANCED 78h TWO PLANE READ PAGE 00h 00h 30h TWO PLANE READ FOR COPY BACK 00h 00h 35h TWO PLANE RANDOM DATA READ 06h E0h TWO PLANE PROGRAM(TRADITIONAL) 80h 11h 81h 10h TWO PLANE PROGRAM(ONFI) 80h 11h 80h 10h COMMAND 3rd CYCLE 4th CYCLE E0h Yes TWO PLANE PROGRAM BACK(TRADITIONAL) FOR COPY 85h 11h 81h 10h TWO PLANE BACK(ONFI) FOR COPY 85h 11h 85h 10h TWO PLANE BLOCK ERASE(TRADITIONAL) 60h 60h D0h TWO PLANE BLOCK ERASE(ONFI) 60h D1h 60h PROGRAM Acceptable during busy D0h Table 8-1 Command Table Notes: 1. RANDOM DATA INPUT and RANDOM DATA OUTPUT command is only to be used within a page. 2. Any commands that are not in the above table are considered as undefined and are prohibited as inputs. 3. Do not cross plane address boundaries when using Copy Back Read and Program for copy back. 17 Release Date: May 10th, 2016 Revision D W29N02GW/Z 9. DEVICE OPERATIONS 9.1 READ operation 9.1.1 PAGE READ (00h-30h) When the device powers on, 00h command is latched to command register. Therefore, system only issues five address cycles and 30h command for initial read from the device. This operation can also be entered by writing 00h command to the command register, and then write five address cycles, followed by writing 30h command. After writing 30h command, the data is transferred from NAND array to Data Register during tR. Data transfer progress can be done by monitoring the status of the RY/#BY signal output. RY/#BY signal will be LOW during data transfer. Also, there is an alternate method by using the READ STATUS (70h) command. If the READ STATUS command is issued during read operation, the Read (00h) command must be re-issued to read out the data from Data Register. When the data transfer is complete, RY/#BY signal goes HIGH, and the data can be read from Data Register by toggling #RE. Read is sequential from initial column address to the end of the page. (See Figure 9-1) CLE #CE #WE ALE #RE l/Ox 00h Data Output ( Serial Access ) 30h Address (5cycles) tR RY/#BY Don't care Figure 9-1 Page Read Operations 9.1.2 TWO PLANE READ (00h-00h-30h) TWO PLANE READ (00h-00h-30h) transfers two pages data from the NAND array to the data registers. Each page address have to be indicated different plane address. To set the TWO PLANE READ mode, write the 00h command to the command register, and then write five address cycles for plane 0. Secondly, write the 00h command to the command register, and five address cycles for plane 1. Finally, the 30h command is issued. The first-plane and second-plane addresses must be identical for all of issued address except plane address. After the 30h command is written, page data is transferred from both planes to their respective data registers in tR. RY/#BY goes LOW While these are transfered,. When the transfers are complete, RY/#BY goes HIGH. To read out the data, at first, system writes TWO PLANE RAMDOM DATA READ (06h-E0h) command to select a plane, next, repeatedly pulse #RE to read out the data from selected plane. To change the plane address, issues TWO PLANE RANDOM DATA READ (06h-E0h) 18 Release Date: May 10th, 2016 Revision D W29N02GW/Z command to select the another plane address, then repeatedly pulse #RE to read out the data from the selected plane data register. Alternatively, data transfers can be monitored by the READ STATUS (70h). When the transfers are complete, status register bit 6 is set to 1. To read data from the first of the two planes even when READ STATUS ENHANCED (78h) command is used, the system must issue the TWO PLANE RANDOM DATA READ (06h-E0h) command at first and pulse #RE repeatedly. Write a TWO PLANE RANDOM DATA READ (06h-E0h) command to select the other plane ,after the data cycle is complete. pulse #RE repeatedly to output the data beginning at the specified column address. During TWO PLANE READ operation,the READ STATUS ENHANCED (78h) command is prohibited . CLE #WE ALE #RE Plane address M Plane address M I/Ox 00h Col Add1 Col Add2 Column address J Row Add1 Row Add2 Row Add3 Col Add1 00h Plane 0 address Col Add2 Column address J Row Add1 Row Add2 Row Add3 30h Plane 1 address tR RY/#BY 1 CLE #WE ALE #RE I/Ox 06h Address (5cycles) Plane 0 or Plane 1 address E0h DOUT0 DOUT1 DOUTn Selected Plane data RY/#BY 1 Figure 9-2 Two Plane Read Page (00h-00h-30h) Operation 19 Release Date: May 10th, 2016 Revision D W29N02GW/Z 9.1.3 RANDOM DATA OUTPUT (05h-E0h) The RANDOM DATA OUTPUT allows the selection of random column addresses to read out data from a single or multiple of addresses. The use of the RANDOM DATA OUTPUT command is available after the PAGE READ (00h-30h) sequence by writing the 05h command following by the two cycle column address and then the E0h command. Toggling #RE will output data sequentially. The RANDOM DATA OUTPUT command can be issued multiple times, but limited to the current loaded page. tR RY/#BY #RE 00h I/Ox Address(5cycles) 30h Data out 05h Address(2cycles) E0h Data out Figure 9-3 Random Data Output 9.1.3.1. TWO PLANE RANDOM DATA OUTPUT (06h-E0h) TWO PLANE RANDOM DATA READ (06h-E0h) command can indicate to specified plane and column address on data register . This command is accepted by a device when it is ready. Issuing 06h to the command register, two column address cycles, three row address cycles, E0h are followed, this enables data output mode on the address device's data register at the specified column address. After the E0h command , the host have to wait at least tWHR before requesting data output. The selected device is in data output mode until another valid command is issued. The TWO PLANE RANDOM DATA READ (06h-E0h) command is used to select the data register to be enabled for data output. When the data output is complete on the selected plane, the command can be issued again to start data output on another plane. If there is a need to update the column address without selecting a new data register, the RANDOM DATA READ (05h-E0h) command can be used instead. CLE #CE #WE ALE #RE I/Ox Data Out 06h Address (5cycles) E0h Data Out Figure 9-4 Two Plane Random Data Read (06h-E0h) Operation 20 Release Date: May 10th, 2016 Revision D W29N02GW/Z 9.1.4 READ ID (90h) READ ID command is comprised of two modes determined by the input address, device (00h) or ONFI (20h) identification information. To enter the READ ID mode, write 90h to the Command Register followed by a 00h address cycle, then toggle #RE for 5 single byte cycles, W29N02GW/Z. The pre-programmed code includes the Manufacturer ID, Device ID, and Product-Specific Information (see Table 9.1). If the READ ID command is followed by 20h address, the output code includes 4 single byte cycles of ONFI identifying information (See Table 9.2). The device remains in the READ ID Mode until the next valid command is issued. CLE #CE #WE tAR ALE #RE tWHR I/Ox tREA Byte0 00h 90h Byte1 Byte2 Byte3 Byte4 (or 20h) Address 1 Cycle Figure 9-5 Read ID # of Byte/Cycles 1 Byte/Cycle 2 Byte/Cycle 3rd Byte/Cycle 4th Byte/Cycle 5th Byte/Cycle W29N02GZ EFh AAh 90h 15h 04h W29N02GW EFh BAh 90h 55h 04h Device ID Cache Programming not Supported Page Size:2KB Spare Area Size:64b BLK Size w/o Spare:128KB Organized:x8 or x16 Serial Access:25ns Description st MFR ID nd x16 device : the ID is outputted at word units, and defined lower-byte (IO0-7). ID table shows only lower-byte ID. Table 9-1 Device ID and configuration codes for Address 00h # of Byte/Cycles 1st Byte/Cycle 2nd Byte/Cycle 3rd Byte/Cycle 4th Byte/Cycle Code 4Fh 4Eh 46h 49h Table 9-2 ONFI identifying codes for Address 20h 21 Release Date: May 10th, 2016 Revision D W29N02GW/Z 9.1.5 READ PARAMETER PAGE (ECh) READ PARAMETER PAGE can read out the device's parameter data structure, such as, manufacturer information, device organization, timing parameters, key features, and other pertinent device parameters. The data structure is stored with at least three copies in the device's parameter page. Figure 9-9 shows the READ PARAMETER PAGE timing. The RANDOM DATA OUTPUT (05hE0h) command is supported during data output. Figure 9-6 Read Parameter Page Byte Description Value 0-3 Parameter page signature 4Fh, 4Eh, 46h, 49h 4-5 Revision number 02h, 00h 6-7 Features supported W29N02GZ 18h,00h W29N02GW 19h,00h Optional commands supported 3Fh,00h 10-31 Reserved 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h 32-43 Device manufacturer 57h, 49h, 4Eh, 42h, 4Fh, 4Eh, 44h, 20h, 20h, 20h, 20h, 20h 8-9 44-63 64 W29N02GZ 57h,32h,39h,4Eh,30h,32h,47h,5Ah,20h,20h,20h,20h,20 h,20h,20h,20h,20h,20h,20h,20h W29N02GW 57h,32h,39h,4Eh,30h,32h,47h,57h,20h,20h,20h,20h,20 h,20h,20h,20h,20h,20h,20h,20h Device model Manufacturer ID EFh 65-66 Date code 00h, 00h 67-79 Reserved 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h 80-83 # of data bytes per page 00h, 08h, 00h, 00h 22 Release Date: May 10th, 2016 Revision D W29N02GW/Z Byte Description Value 84-85 # of spare bytes per page 40h, 00h 86-89 # of data bytes per partial page 00h, 02h, 00h, 00h 90-91 # of spare bytes per partial page 10h, 00h 92-95 # of pages per block 40h, 00h, 00h, 00h 96-99 # of blocks per unit 00h, 08h, 00h, 00h 100 # of logical units 01h 101 # of address cycles 23h 102 # of bits per cell 01h 103-104 Bad blocks maximum per unit 28h, 00h 105-106 Block endurance 01h, 05h Guaranteed valid blocks at beginning of target 01h Block endurance for guaranteed valid blocks 00h, 00h 110 # of programs per page 04h 111 Partial programming attributes 00h 112 # of ECC bits 01h 113 # of interleaved address bits 01h 114 Interleaved operation attributes 0Ch Reserved 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h I/O pin capacitance 0Ah 129-130 Timing mode support 1Fh, 00h 131-132 Program cache timing 1Fh, 00h 133-134 Maximum page program time BCh, 02h 135-136 Maximum block erase time 10h, 27h 137-138 Maximum random read time 19h, 00h 139-140 tCCS minimum 46h, 00h 141-163 Reserved 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h, 00h 164-165 Vendor specific revision # 01h,00h 166-253 Vendor specific 00h 254-255 Integrity CRC Set at shipment 256-511 Value of bytes 0-255 107 108-109 115-127 128 23 Release Date: May 10th, 2016 Revision D W29N02GW/Z Byte 512-767 >767 Description Value Value of bytes 0-255 Additional redundant parameter pages x16 device : the ID is outputted at word units, and defined lower-byte (IO0-7). ID table shows only lower-byte ID. Table 9-3 Parameter Page Output Value 9.1.6 READ STATUS (70h) The W29N02GW/Z has an 8-bit Status Register which can be read during device operation. Refer to Table 9.3 for specific Status Register definitions. After writing 70h command to the Command Register, read cycles will only read from the Status Register. The status can be read from I/O[7:0] outputs, as long as #CE and #RE are LOW. Note; #RE does not need to be toggled for Status Register read. The Command Register remains in status read mode until another command is issued. To change to normal read mode, issue the PAGE READ (00h) command. After the PAGE READ command is issued, data output starts from the initial column address. Figure 9-7 Read Status Operation 24 Release Date: May 10th, 2016 Revision D W29N02GW/Z SR bit I/O 0 Page Read Page Program Block Erase Definition 0=Successful Program/Erase Not Use Pass/Fail Pass/Fail 1=Error in Program/Erase I/O 2 Not Use Not Use Not Use 0 I/O 3 Not Use Not Use Not Use 0 I/O 4 Not Use Not Use Not Use 0 I/O 5 Ready/Busy Ready/Busy Ready/Busy I/O 6 Ready/Busy Ready/Busy Ready/Busy I/O 7 Write Protect Write Protect Write Protect Ready = 1 Busy = 0 Ready = 1 Busy = 0 Unprotected = 1 Protected = 0 Table 9-4 Status Register Bit Definition 9.1.7 READ STATUS ENHANCED (78h) The READ STATUS ENHANCED (78h) command returns the status of the addressed plane on a target even when it is busy (SR BIT 6 = 0). Writing 78h to the command register, followed by three row address cycles containing the page, plane and block addresses that is same as executed addresses, puts the device into read status mode. The device stays in this mode until another valid command is issued The device status is returned when the host requests data output. The SR BIT 6 and SR bit 5 bits of the status register are shared for all planes on the device. The SR BIT 1 and SR BIT 0 (SR bit0) bits are specific to the plane specified in the row address. The READ STATUS ENHANCED (78h) command also enables the device for data output. To begin data output following a READ operation after the device is ready (SR BIT 6 = 1), issue the READ MODE (00h) command, then begin data output. If the host needs to change the data register that will output data, use the TWO PLANE RANDOMDATA READ (06h-E0h) command after the device is ready. Use of the READ STATUS ENHANCED (78h) command is prohibited when OTP mode is enabled. It is also prohibited following some of the other reset, identification. 25 Release Date: May 10th, 2016 Revision D W29N02GW/Z CLE #CE #WE ALE #RE I/Ox 78h Address (3cycles) Status Output Figure 9-8 Read Status Enhanced (78h) Operation 26 Release Date: May 10th, 2016 Revision D W29N02GW/Z 9.1.8 READ UNIQUE ID (EDh) The W29N02GW/Z NAND Flash device has a method to uniquely identify each NAND Flash device by using the READ UNIQUE ID command. The format of the ID is limitless, but the ID for every NAND Flash device manufactured, will be guaranteed to be unique. Numerous NAND controllers typically use proprietary error correction code (ECC) schemes. In these cases Winbond cannot protect unique ID data with factory programmed ECC. However, to ensure data reliability, Winbond will program the NAND Flash devices with 16 bytes of unique ID code, starting at byte 0 on the page, immediately followed by 16 bytes of the complement of that unique ID. The combination of these two actions is then repeated 16 times. This means the final copy of the unique ID will resides at location byte 511. At this point an XOR or exclusive operation can be performed on the first copy of the unique ID and its complement. If the unique ID is good, the results should yield all the bits as 1s. In the event that any of the bits are 0 after the XOR operation, the procedure can be repeated on a subsequent copy of the unique ID data. Figure 9-9 Read Unique ID 27 Release Date: May 10th, 2016 Revision D W29N02GW/Z 9.2 PROGRAM operation 9.2.1 PAGE PROGRAM (80h-10h) The W29N02GW/Z Page Program command will program pages sequentially within a block, from the lower order page address to higher order page address. Programming pages out of sequence is prohibited. The W29N02GW/Z supports partial-page programming operations up to 4 times before an erase is required if partitioning a page. Note; programming a single bit more than once without first erasing it is not supported. 9.2.2 SERIAL DATA INPUT (80h) Page Program operation starts with the execution of the Serial Data Input command (80h) to the Command Register, following next by inputting five address cycles and then the data is loaded. Serial data is loaded to Data Register with each #WE cycle. The Program command (10h) is written to the Command Register after the serial data input is finished. At this time the internal write state controller automatically executes the algorithms for program and verifies operations. Once the programming starts, determining the completion of the program process can be done by monitoring the RY/#BY output or the Status Register Bit 6, which will follow the RY/#BY signal. RY/#BY will stay LOW during the internal array programming operation during the period of (tPROG). During page program operation, only two commands are available, READ STATUS (70h) and RESET (FFh). When the device status goes to the ready state, Status Register Bit 0 (I/O0) indicates whether the program operation passed (Bit0=0) or failed (Bit0=1), (see Figure 9-13). The Command Register remains in read status mode until the next command is issued. tPROG RY/#BY I/Ox 80h Address (5cycles) Din 10h 70h Status I/O0=0pass I/O0=1fail Figure 9-10 Page Program 28 Release Date: May 10th, 2016 Revision D W29N02GW/Z 9.2.3 RANDOM DATA INPUT (85h) After the Page Program (80h) execution of the initial data has been loaded into the Data Register, if the need for additional writing of data is required, using the RANDOM DATA INPUT (85h) command can perform this function to a new column address prior to the Program (10h) command. The RANDOM DATA INPUT command can be issued multiple times in the same page (See Figure 9-14). CLE #CE #WE ALE #RE tPROG RY/#BY I/Ox 80h Address (5cycles) Din 85h Address (2cycles) Din 10h 70h Status Don't care Figure 9-11 Random Data Input 9.2.4 TWO PLANE PAGE PROGRAM TWO PLANE PAGE PROGRAM command make it possible for host to input data to the addressed plane's data register and queue the data register to be moved to the NAND Flash array. This command can be issued several times. Each time a new plane address is specified that plane is also queued for data transfer. To input data for the final plane and to begin the program operation for all previously queued planes, the PAGE PROGRAM command has to be issued. All of the queued planes will move the data to the NAND Flash array. when it is ready (SR BIT 6 = 1),this command is accepted. At the block and page address is specified, input a page to the data register and queue it to be moved to the NAND Flash array ,the 80h is issued to the command register. Unless this command has been preceded by a TWO PLANE PAGE PROGRAM command, issuing the 80h to the command register clears all of the data registers' contents on the selected target. Write five address cycles containing the column address and row address; data input cycles follow. Serial data is input beginning at the column address specified. At any time, while the data input cycle, the RANDOM DATA INPUT (85h) command can be issued. When data input is complete, write 11h to the command register. The device will go busy (SR BIT 6 = 0, SR BIT 5 = 0) for tDBSY. To ascertain the progress of tDBSY, the host can monitor the target's RY/#BY signal or, the status operations (70h, 78h) can be used alternatively,. When the device status shows that it is ready (SR BIT 6 = 1), additional TWO PLANE PAGE PROGRAM commands can be issued to queue additional planes for data transfer, then, the PAGE PROGRAM commands can be issued. When the PAGE PROGRAM command is used as the final command of a two plane program operation, data is transferred from the data registers to the NAND Flash array for all of the addressed 29 Release Date: May 10th, 2016 Revision D W29N02GW/Z planes during tPROG. When the device is ready (SR BIT 6 = 1, SR BIT 5 = 1), the host should check the status of the SR BIT 0 for each of the planes to verify that programming completed successfully. When system issues TWO PLANE PAGE PROGRAM and PAGE PROGRAM commands, READ STATUS (70h) command can confirm whether the operation(s) passed or failed. If the status after READ STATUS (70h) command indicates an error (SR BIT 0 = 1 and/or SR BIT 1 = 1), READ STATUS ENHANCED (78h) command can be determined which plane is failed. TWO PLANE PROGRAM commands require five-cycle addresses, one address indicates the operational plane. These addresses are subject to the following requirements: * The column address bits must be valid address for each plane * The plane select bit, A18, must be set to "L" for 1st address input, and set to "H" for 2nd address input. * The page address (A17-A12) and block address (A28-A19) of first input are don't care. It follows secondary inputted page address and block address. Two plane operations must be same type operation across the planes; for example, it is not possible to perform a PROGRAM operation on one plane with an ERASE operation on another. tPROG (Program busy time) tDBSY RY/#BY Busy l/Ox 80h Page program Setup code Address Inputs 11h Data Input A0A11=Valid A12A17=set to Low A18=set to Low A19A28=set to Low Confirm Code Busy 81h Multiplane Page Program setup code Data Input Address Inputs A0A11=Valid A12A17=Valid A18=set to High A19A28=Valid 10h Confirm Code 70h SR0 Read Status Register 1)The same row address, except for A18, is applied to the two blocks. 2)Any command between 11h and 81h is prohibited except 70h,78h,and FFh 81h:Traditional Protocol 80h:ONFI Protocol 80h 10h 81h 11h Data Input FirstPlane (1024 block) Second Plane (1024 block) Block 0 Block 1 Block 2 Block 3 : : Block 2044 Block 2045 Block 2046 Block 2047 Figure 9-12 Two Plane Page Program 30 Release Date: May 10th, 2016 Revision D W29N02GW/Z 9.3 COPY BACK operation Copy Back operations require two command sets. Issue a READ for COPY BACK (00h-35h) command first, then the PROGRAM for COPY BACK (85h-10h) command. Copy back operations are only supported within a same plane. 9.3.1 READ for COPY BACK (00h-35h) The READ for COPY BACK command is used together with the PROGRAM for COPY BACK (85h10h) command. To start execution, READ for COPY BACK (00h) command is written to the Command Register, followed by the five cycles of the source page address. To start the transfer of the selected page data from the memory array to the data register, write the 35h command to the Command Register. After execution of the READ for COPY BACK command sequence and RY/#BY returns to HIGH marking the completion of the operation, the transferred data from the source page into the Data Register may be read out by toggling #RE. Data is output sequentially from the column address that was originally specified with the READ for COPY BACK command. RANDOM DATA OUTPUT (05hE0h) commands can be issued multiple times without any limitation after READ for COPY BACK command has been executed (see Figures 9-19 and 9-20). At this point the device is in ready state to accept the PROGRAM for COPY BACK command. 9.3.2 PROGRAM for COPY BACK (85h-10h) After the READ for COPY BACK command operation has been completed and RY/#BY goes HIGH, the PROGRAM for COPY BACK command can be written to the Command Register. The command results in the transfer of data to the Data Register, then internal operations start programming of the new destination page. The sequence would be, write 85h to the Command Register, followed by the five cycle destination page address to the NAND array. Next write the 10h command to the Command Register; this will signal the internal controller to automatically start to program the data to new destination page. During this programming time, RY/#BY will LOW. The READ STATUS command can be used instead of the RY/#BY signal to determine when the program is complete. When Status Register Bit 6 (I/O6) equals to "1", Status Register Bit 0 (I/O0) will indicate if the operation was successful or not. The RANDOM DATA INPUT (85h) command can be used during the PROGRAM for COPY BACK command for modifying the original data. Once the data is copied into the Data Register using the READ for COPY BACK (00h-35h) command, follow by writing the RANDOM DATA INPUT (85h) command, along with the address of the data to be changed. The data to be changed is placed on the external data pins. This operation copies the data into the Data Register. Once the 10h command is written to the Command Register, the original data and the modified data are transferred to the Data Register, and programming of the new page commences. The RANDOM DATA INPUT command can be issued numerous times without limitation, as necessary before starting the programming sequence with 10h command. Since COPY BACK operations do not use external memory and the data of source page might include a bit errors, a competent ECC scheme should be developed to check the data before programming data to a new destination page. 31 Release Date: May 10th, 2016 Revision D W29N02GW/Z 9.3.3 TWO PLANE READ for COPY BACK To improve read through rate, TWO PLANE READ for COPY BACK operation is copied data concurrently from one or two plane to the specified data registers. TWO PLANE PROGRAM for COPY BACK command can move the data in two pages from the data registers to different pages. This operation improves system performance than PROGRAM for COPY BACK operation. 9.3.4 TWO PLANE PROGRAM for COPY BACK Function of TWO PLANE PROGRAM for COPY BACK command is equal to TWO-PLANE PAGE PROGRAM command, except that when 85h is written to the command register, then data register contents are not cleared. Refer to TWO-PLANE PAGE PROGRAM for more details features. 32 Release Date: May 10th, 2016 Revision D W29N02GW/Z CLE #CE #WE ALE #RE I/ Ox 00h Address (5cycles) Data output 35h 05h Address (2cycles) E0h Data Output 85h Address(5cycles) 10h 70h Status Output No limitation Optional tPROG tR RY / # BY Don't care Figure 9-13 Program for copy back Operation CLE #CE #WE ALE #RE tPROG tR RY/#BY I/Ox 00h Address(5Cycles) 35h DataOutput 85h Address(5cycles ) Data Input 85h Address (2cycles) Data Input 10h 70h Status Output No limitation Optional Don't care Figure 9-14 Copy Back Operation with Random Data Input 33 Release Date: May 10th, 2016 Revision D W29N02GW/Z tR RY/#BY #RE 00h I/Ox Address(5cycles) 35h Address(5cycles) 00h Plane 0 source Address(5cycles) 06h Plane 1 source E0h Plane 0 or Plane 1 source address 1 RY/#BY #RE Data Output I/Ox Address(2cycles) 06h E0h Data Output Selected Plane column address Data from selected Plane 1 Data from selected plane From new column address 2 Optional tDBSY tPROG RY/#BY #RE 85h I/Ox Address(5cycles) 85h 11h Address(5cycles) Plane 0 destination 10h 70h Status Plane 1 destination 2 Figure 9-15 Two Plane Copy Back tR RY/#BY I/Ox 00h Address(5cycles) Plane 0 source 00h Address(5cycles) 85h 35h data Address(5cycles) 85h Address(2cycles) Unlimited number of repetitions Plane 1 source Plane 0 destination optional Data 11h 1 tPROG tDBSY RY/#BY I/Ox 85h Address(5cycles) 10h 70h Status Plane 1 destination 1 Figure 9-16 Two Plane Copy Back with Random Data Input 34 Release Date: May 10th, 2016 Revision D W29N02GW/Z Read code Read code l/O 00h Address (5 cycles) 35h 00h Copy back code Address (5 cycles) Col Add1,2 Row Add1, 2,3 Source address on Plane1 Col Add1,2 Row Add1,2,3 Source address on Plane0 35h Copy back code Address (5 cycles) 85h Col Add.1,2 Row Add.1,2,3 Destination address on Plane0 A0 A11 = don't care A12A17 = don't care A18 = set to Low' A19 A28 = don't care 35h 11h Read Status Register 85h Address (5 cycles) 10h 70h SR0 Col Add.1,2 Row Add.1,2,3 Source address on Plane1 A0 A11 = set to Low' A12A17 = Valid A18 = set to High' A19A28 = Valid tR tR tDBSY tPROG Busy Busy Busy Busy RY/#BY Single plane copy back read can be used to two plane operation. First plane Second plane SourcePage TargetPage (1) (3) Main area SourcePage 85h:ONFI Protocol 81h:Traditional Protocol TargetPage (1):Read for copy back on first plane (2):Read for copy back on second plane (3):Twoplane copy back program (2) Spare area (3) Main area Spare area Figure 9-17 Two Plane Program for copy back 35 Release Date: May 10th, 2016 Revision D W29N02GW/Z 9.4 BLOCK ERASE operation 9.4.1 BLOCK ERASE (60h-D0h) Erase operations happen at the architectural block unit. This W29N02GW/Z has 2048 erase blocks. Each block is organized into 64 pages (x8:2112 bytes/page, x16:1056 words/page), 132K bytes (x8:128K + 4K bytes, x16:64 K+ 2Kwords)/block. The BLOCK ERASE command operates on a block by block basis. Erase Setup command (60h) is written to the Command Register. Next, the three cycle block address is written to the device. The page address bits are loaded during address block address cycle, but are ignored. The Erase Confirm command (D0h) is written to the Command Register at the rising edge of #WE, RY/#BY goes LOW and the internal controller automatically handles the block erase sequence of operation. RY/#BY goes LOW during Block Erase internal operations for a period of tBERS, The READ STATUS (70h) command can be used for confirm block erase status. When Status Register Bit6 (I/O6) becomes to "1", block erase operation is finished. Status Register Bit0 (I/O0) will indicate a pass/fail condition (see Figure 9-24). CLE #CE #WE ALE #RE I/Ox 60h Address Input (3cycles) 70h D0h tBERS Status Output I/ O 0 = 0 pass I/ O 0 = 1 fail RY/#BY Don't care Figure 9-18 Block Erase Operation 36 Release Date: May 10th, 2016 Revision D W29N02GW/Z 9.4.2 TWO PLANE BLOCK ERASE TWO PLANE BLOCK ERASE (60h-D1h) command indicates two blocks in the specified plane that is to be erased. To start ERASE operation for indicated blocks in the specified plane, write the BLOCK ERASE (60h-D0h) command. To indicate a block to be erased, writing 60h to the command register, then, write three address cycles containing the row address, the page address is ignored. By writing D1h command to command register, the device will go busy (SR BIT 6 = 0, SR BIT 5 = 0) for tDBSY. To confirm busy status during tDBSY, the host can monitor RY/#BY signal. Instead, system can use READ STATUS (70h) or READ STATUS ENHANCED (78h) commands. When the status shows ready (SR BIT 6 = 1, SR BIT 5 = 1), additional TWO PLANE BLOCK ERASE commands can be issued for erasing two blocks in a specified plane. When system issues TWO PLANE BLOCK ERASE (60h-D1h), and BLOCK ERASE (60h-D0h) commands, READ STATUS (70h) command can confirm whether the operation(s) passed or failed. If the status after READ STATUS (70h) command indicates an error (SR BIT 0 = 1), READ STATUS ENHANCED (78h) command can be determined which plane is failed. TWO PLANE BLOCK ERASE commands require three cycles of row addresses; one address indicates the operational plane. These addresses are subject to the following requirements: * The plane select bit, A18, must be different for each issued address. * Block address (A28-A19) of first input is don't care. It follows secondary inputted block address. Two plane operations must be same type operation across the planes; for example, it is not possible to perform a PROGRAM operation on one plane with an ERASE operation on another. CLE #CE #WE ALE #RE I/Ox 60h R1A R2A R3A D1h 60h R1B R2B R3B D0h tDBSY tBERS Busy Busy RY/#BY Don't care Figure 9-19 Two Plane Block Erase Operation 37 Release Date: May 10th, 2016 Revision D W29N02GW/Z 9.5 RESET operation 9.5.1 RESET (FFh) READ, PROGRAM, and ERASE commands can be aborted by the RESET (FFh) command during the time the W29N02GW/Z is in the busy state. The Reset operation puts the device into known status. The data that is processed in either the programming or erasing operations are no longer valid. This means the data can be partially programmed or erased and therefore data is invalid. The Command Register is cleared and is ready to accept next command. The Data Register contents are marked invalid. The Status Register indicates a value of E0h when #WP is HIGH; otherwise a value of 60h is written when #WP is LOW. After RESET command is written to the command register, RY/#BY goes LOW for a period of tRST (see Figure 9-26). Figure 9-20 Reset Operation 38 Release Date: May 10th, 2016 Revision D W29N02GW/Z 9.6 FEATURE OPERATION The GET FEATURES (EEh) and SET FEATURES (EFh) commands are used to change the NAND Flash device behavior from the default power on settings. These commands use a one-byte feature address to determine which feature is to be read or modified. A range of 0 to 255 defines all features; each is described in the features table (see Table 9.5 thru 9.7). The GET FEATURES (EEh) command reads 4-Byte parameter in the features table (See GET FEATURES function). The SET FEATURES (EFh) command places the 4-Byte parameter in the features table (See SET FEATURES function). When a feature is set, meaning it remains active by default until the device is powered off. The set feature remains the set even if a RESET (FFh) command is issued. Feature address 00h 02h-7Fh Description N.A Reserved 80h Vendor specific parameter : Programmable I/O drive strength 81h Vendor specific parameter : Programmable RY/#BY pull-down strength 82h-FFh Reserved Table 9-5 Features 39 Release Date: May 10th, 2016 Revision D W29N02GW/Z Feature Address 80h: Programmable I/O Drive Strength Sub feature Options I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0 Value Notes 1 parameter P1 I/O Full (default) Reserved (0) 0 0 00h drive strength Three-quarters Reserved (0) 0 1 01h One-half Reserved (0) 1 0 02h One-quarter Reserved (0) 1 1 03h P2 Reserved (0) 00h Reserved (0) 00h Reserved (0) 00h P3 P4 Table 9-6 Feature Address 80h Note: 1. The default drive strength setting is Full strength. The Programmable I/O Drive Strength mode is used to change from the default I/O drive strength. Drive strength should be selected based on expected loading of the memory bus. This table shows the four supported output drive-strength settings. The device returns to the default drive strength mode when a power cycle has occurred. AC timing parameters may need to be relaxed if I/O drive strength is not set to full. 40 Release Date: May 10th, 2016 Revision D W29N02GW/Z Feature Address 81h: Programmable RY/#BY Pull-down Strength Sub feature Options I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0 Value Notes 1 parameter P1 RY/#BY Full (default) Reserved (0) 0 0 00h pull-down Three-quarters Reserved (0) 0 1 01h One-half Reserved (0) 1 0 02h One-quarter Reserved (0) 1 1 03h strength P2 Reserved (0) 00h Reserved (0) 00h Reserved (0) 00h P3 P4 Table 9-7 Feature Address 81h Note: 1. The default programmable RY/#BY pull-down strength is set to Full strength. The pull-down strength is used to change the RY/#BY pull-down strength. RY/#BY pull-down strength should be selected based on expected loading of RY/#BY. The four supported pull-down strength settings are shown. The device returns to the default pull-down strength when a power cycle has occurred. 41 Release Date: May 10th, 2016 Revision D W29N02GW/Z 9.6.1 GET FEATURES (EEh) The GET FEATURES command returns the device feature settings including those previously set by the SET FEATURES command. To use the Get Feature mode write the command (EEh) to the Command Register followed by the single cycle byte Feature Address. RY/#BY will goes LOW for the period of tFEAT. If Read Status (70h) command is issued for monitoring the process completion status, Read Command (00h) has to be executed to re-establish data output mode. Once, RY/#BY goes HIGH, the device feature settings can be read by toggling #RE. The device remains in Feature Mode until another valid command is issued to Command Register. See Figure 9-27. Figure 9-21 Get Feature Operation 42 Release Date: May 10th, 2016 Revision D W29N02GW/Z 9.6.2 SET FEATURES (EFh) The SET FEATURES command sets the behavior parameters by selecting a specified feature address. To change device behavioral parameters, execute Set Feature command by writing EFh to the Command Register, followed by the single cycle feature address. Each feature parameter (P1P4) is latched at the rising edge of each #WE. The RY/#BY signal will go LOW during the period of tFEAT while the four feature parameters are stored. The Read Status (70h) command can be issued for monitoring the progress status of this operation. The parameters are stored in device until the device goes through a power on cycle. The device remains in feature mode until another valid command is issued to Command Register. Figure 9-22 Set Feature Operation 43 Release Date: May 10th, 2016 Revision D W29N02GW/Z 9.7 ONE TIME PROGRAMMABLE (OTP) area The device has One-Time Programmable (OTP) memory area comprised of a number of pages (2112 bytes/page) (1056words/page). This entire range of pages is functionally guaranteed. Only the OTP commands can access the OTP area. When the device ships from Winbond, the OTP area is in an erase state (all bits equal "1"). The OTP area cannot be erased, therefore protecting the area only prevent further programming. Contact to Winbond for using this feature. 44 Release Date: May 10th, 2016 Revision D W29N02GW/Z 9.8 WRITE PROTECT #WP pin can enable or disable program and erase commands preventing or allowing program and erase operations. Figure 9-29 to 9-34 shows the enabling or disabling timing with #WP setup time (tWW) that is from rising or falling edge of #WP to latch the first commands. After first command is latched, #WP pin must not toggle until the command operation is complete and the device is in the ready state. (Status Register Bit5 (I/O5) equal 1) # WE tWW I /Ox 60h D0h #WP RY/#BY Figure 9-23 Erase Enable #WE tWW I/Ox 60h D0h #WP RY/#BY Figure 9-24 Erase Disable #WE tWW I/Ox 80 h 10h ( or 15h) #WP RY/#BY Figure 9-25 Program Enable 45 Release Date: May 10th, 2016 Revision D W29N02GW/Z #WE tWW I/Ox 80 h 10h ( or 15h) #WP RY/#BY Figure 9-26 Program Disable #WE tWW I/Ox 85h 10h # WP RY/#BY Figure 9-27 Program for Copy Back Enable #WE tWW I/Ox 10 h 85h # WP RY/#BY Figure 9-28 Program for Copy Back Disable 46 Release Date: May 10th, 2016 Revision D W29N02GW/Z 9.9 BLOCK LOCK The device has block lock feature that can protect the entire device or user can indicate a ranges of blocks from program and erase operations. Using this feature offers increased functionality and flexibility data protection to prevent unexpected program and erase operations. Contact to Winbond for using this feature. 47 Release Date: May 10th, 2016 Revision D W29N02GW/Z 10. ELECTRICAL CHARACTERISTICS 10.1 Absolute Maximum Ratings (1.8V) PARAMETERS SYMBOL Supply Voltage CONDITIONS VCC Voltage Applied to Any Pin VIN Storage Temperature Relative to Ground TSTG RANGE UNIT -0.6 to +2.4 V -0.6 to +2.4 V -65 to +150 C 5 mA Short circuit output current, I/Os Table 10-1 Absolute Maximum Ratings Notes: 1. Minimum DC voltage is -0.6V on input/output pins. During transitions, this level may undershoot to -2.0V for periods <30ns. 2. Maximum DC voltage on input/output pins is Vcc+0.3V which, during transitions, may overshoot to Vcc+2.0V for periods <20ns. 3. This device has been designed and tested for the specified operation ranges. Proper operation outside of these levels is not guaranteed. Exposure to absolute maximum ratings may affect device reliability. Exposure beyond absolute maximum ratings may cause permanent damage. 10.2 Operating Ranges (1.8V) PARAMETER Supply Voltage Ambient Temperature, Operating SYMBOL CONDITIONS VCC TA Industrial SPEC UNIT MIN MAX 1.7 1.95 V -40 +85 C Table 10-2 Operating Ranges 48 Release Date: May 10th, 2016 Revision D W29N02GW/Z 10.3 Device power-up timing The device is designed to avoid unexpected program/erase operations during power transitions. When the device is powered on, an internal voltage detector disables all functions whenever Vcc is below about 1.1V at 1.8V device. Write Protect (#WP) pin provides hardware protection and is recommended to be kept at VIL during power up and power down. A recovery time of minimum 1ms is required before internal circuit gets ready for any command sequences (See Figure 10-1). Vcc #WP #WE 1ms (Min) RY/#BY 5 ms (Max) Undefined Figure 10-1 Power ON/OFF sequence 49 Release Date: May 10th, 2016 Revision D W29N02GW/Z 10.4 DC Electrical Characteristics (1.8V) SPEC PARAMETER SYMBOL CONDITIONS UNIT MIN TYP MAX - 13 20 mA tRC= tRC MIN Sequential Read current #CE=VIL Icc1 IOUT=0mA Program current Icc2 - - 10 20 mA Erase current Icc3 - - 10 20 mA Standby current (TTL) ISB1 - - 1 mA Standby current (CMOS) ISB2 - 10 50 A #CE=VIH #WP=0V/Vcc #CE=Vcc - 0.2V #WP=0V/Vcc Input leakage current ILI VIN= 0 V to Vcc - - 10 A Output leakage current ILO VOUT=0V to Vcc - - 10 A Input high voltage VIH I/O15~0, #CE,#WE,#RE, #WP,CLE,ALE 0.8 x Vcc - Vcc + 0.3 V Input low voltage VIL - -0.3 - 0.2 x Vcc V VOH IOH=-100A Vcc -0.1 - - V VOL IOL=+100A - - 0.1 V IOL(RY/#BY) VOL=0.2V 3 4 Output high voltage(1) Output low voltage Output low current (1) mA Table 10-3 DC Electrical Characteristics Note: 1. VOH and VOL may need to be relaxed if I/O drive strength is not set to full. 50 Release Date: May 10th, 2016 Revision D W29N02GW/Z 10.5 AC Measurement Conditions (1.8V) PARAMETER SYMBOL Input Capacitance(1), (2) SPEC UNIT MIN MAX CIN - 10 pF Input/Output Capacitance(1), (2) CIO - 10 pF Input Rise and Fall Times TR/TF - 2.5 ns Input Pulse Voltages - 0 to VCC V Input/Output timing Voltage - Vcc/2 V Output load (1) CL 1TTL GATE and CL=30pF - Table 10-4 AC Measurement Conditions Notes: 1. Verified on device characterization , not 100% tested 2. Test conditions TA=25'C, f=1MHz, VIN=0V 51 Release Date: May 10th, 2016 Revision D W29N02GW/Z 10.6 AC timing characteristics for Command, Address and Data Input (1.8V) SPEC PARAMETER SYMBOL UNIT MIN MAX ALE to Data Loading Time tADL 70 - ns ALE Hold Time tALH 5 - ns ALE setup Time tALS 10 - ns #CE Hold Time tCH 5 - ns CLE Hold Time tCLH 5 - ns CLE setup Time tCLS 10 - ns #CE setup Time tCS 20 - ns Data Hold Time tDH 5 - ns Data setup Time tDS 10 - ns Write Cycle Time tWC 35 - ns #WE High Hold Time tWH 10 - ns #WE Pulse Width tWP 12 - ns #WP setup Time tWW 100 - ns Table 10-5 AC timing characteristics for Command, Address and Data Input Note: 1. tADL is the time from the #WE rising edge of final address cycle to the #WE rising edge of first data cycle. 52 Release Date: May 10th, 2016 Revision D W29N02GW/Z 10.7 AC timing characteristics for Operation (1.8V) SPEC PARAMETER SYMBOL UNIT MIN MAX ALE to #RE Delay tAR 10 - ns #CE Access Time tCEA - 30 ns #CE HIGH to Output High-Z(1) tCHZ - 50 ns CLE to #RE Delay tCLR 10 - ns #CE HIGH to Output Hold tCOH 15 - ns Output High-Z to #RE LOW tIR 0 - ns Data Transfer from Cell to Data Register tR - 25 s READ Cycle Time tRC 35 - ns #RE Access Time tREA - 25 ns #RE HIGH Hold Time tREH 10 - ns #RE HIGH to Output Hold tRHOH 15 - ns #RE HIGH to #WE LOW tRHW 100 - ns #RE HIGH to Output High-Z(1) tRHZ - 100 ns tRLOH 3 - ns #RE Pulse Width tRP 12 - ns Ready to #RE LOW tRR 20 - ns Reset Time (READ/PROGRAM/ERASE)(2) tRST - 5/10/500 s tWB - 100 ns tWHR 80 - ns #RE LOW to output hold (3) #WE HIGH to Busy #WE HIGH to #RE LOW Table 10-6 AC timing characteristics for Operation Notes: AC characteristics may need to be relaxed if I/O drive strength is not set to "full." 1. Transition is measured 200mV from steady-state voltage with load. This parameter is sampled and not 2. Do not issue new command during tWB, even if RY/#BY is ready. 100 % tested 53 Release Date: May 10th, 2016 Revision D W29N02GW/Z 10.8 Program and Erase Characteristics SPEC PARAMETER SYMBOL UNIT TYP MAX NoP - 4 cycles Page Program time tPROG 250 700 s Busy Time for SET FEATURES /GET FEATURES tFEAT - 1 s Busy Time for program/erase at locked block tLBSY - 3 s Busy Time for OTP program when OTP is protected tOBSY - 30 s Block Erase Time tBERS 2 10 ms tLPROG - - - tDBSY 0.5 1 s Number of partial page programs Last Page Program time (1) Busy Time for Two Plane page program and Two Plane Block Erase Table 10-7 Program and Erase Characteristics Note: 1. tLPROG = Last Page program time (tPROG) + Last -1 Page program time (tPROG) - Last page Address, Command and Data load time. 54 Release Date: May 10th, 2016 Revision D W29N02GW/Z 11. TIMING DIAGRAMS Figure 11-1 Command Latch Cycle Figure 11-2 Address Latch Cycle 55 Release Date: May 10th, 2016 Revision D W29N02GW/Z Figure 11-3 Data Latch Cycle Note: 1. Din Final = 2,111(x8) Figure 11-4 Serial Access Cycle after Read 56 Release Date: May 10th, 2016 Revision D W29N02GW/Z #CE tCHZ tRC tRP tREH tCOH #RE tRHZ tREA tCEA I/Ox tREA tRLOH Dout tRHOH Dout Dout tRR RY/#BY Don't care Figure 11-5 Serial Access Cycle after Read (EDO) Figure 11-6 Read Status Operation 57 Release Date: May 10th, 2016 Revision D W29N02GW/Z Figure 11-7 Page Read Operation CLE #CE #RE ALE tR RY/#BY #WE I/Ox 00h Address (4 cycles) 30h Data output Don't care tCEA #CE tREA #RE I/Ox tCHZ tCOH Out Figure 11-8 #CE Don't Care Read Operation 58 Release Date: May 10th, 2016 Revision D W29N02GW/Z CLE tCLR #CE tWC #WE tWB tAR tWHR ALE tREA tRC #RE tRR I/Ox 00h 30h 05h Column address n tR RY/#BY E0h Colu mn address m Busy Don't care Figure 11-9 Random Data Output Operation 59 Release Date: May 10th, 2016 Revision D W29N02GW/Z CLE #CE #WE tAR ALE #RE tWHR I/Ox tREA 00h 90h Byte 0 Byte 1 Byte 2 Byte 3 Byte 4 (or 20h) Address, 1 cycle Figure 11-10 Read ID CLE #CE tWC tADL #WE tWB tWHR tPROG ALE #RE I/Ox 80h SERIAL DATA INPUT comman d Col add 1 Col add 2 Row add 1 Row add 2 10h 1 up to m Byte serial inpu t PROGRAM command 70h Status READ STATUS command RY/#BY x8 device:m = 2112 bytes Don't care Figure 11-11 Page Program 60 Release Date: May 10th, 2016 Revision D W29N02GW/Z CLE #CE #WE ALE I/Ox 80h Data input Address(4 cycles) tCS Data input 10h tCH #CE tWP #WE Don't care Figure 11-12 #CE Don't Care Page Program Operation 61 Release Date: May 10th, 2016 Revision D W29N02GW/Z CLE #CE tADL WC tADL #WE tWB ALE #RE I/Ox 80h Col add 1 Col add 2 Row add1 Row add2 Din N+1 Din Serial Data Inpu t Command Serial INPUT Command 85h Col add1 Col add2 Din N+1 Din Rand om Data Inpu t Colu mn address Command Serial INPUT 10h Program 70h Status tPROG Command RY/#BY Don't care Figure 11-13 Page Program with Random Data Input CLE #CE tADL WC #WE tWB tWB ALE #RE I/Ox Col 00h add 1 Serial data INPUT Command Col add 2 Row add1 Row add2 35h 85h Col add 1 Col add 2 Row add1 Row add2 Din 1 Din n 70h 10h Program tR Command Status tPROG RY/#BY Busy Don't care Figure 11-14 Copy Back 62 Release Date: May 10th, 2016 Revision D W29N02GW/Z Figure 11-15 Block Erase CLE #CE #WE tWB tRST RY/#BY I/Ox FFh RESET command Figure 11-16 Reset 63 Release Date: May 10th, 2016 Revision D W29N02GW/Z 12. INVALID BLOCK MANAGEMENT 12.1 Invalid blocks The W29N02GW/Z may have initial invalid blocks when it ships from factory. Also, additional invalid blocks may develop during the use of the device. Nvb represents the minimum number of valid blocks in the total number of available blocks (See Table 12.1). An invalid block is defined as blocks that contain one or more bad bits. Block 0, block address 00h is guaranteed to be a valid block at the time of shipment. Parameter Valid block number Symbol Min Max Unit Nvb 2008 2048 blocks Table 12-1 Valid Block Number 12.2 Initial invalid blocks Initial invalid blocks are defined as blocks that contain one or more invalid bits when shipped from factory. Although the device contains initial invalid blocks, a valid block of the device is of the same quality and reliability as all valid blocks in the device with reference to AC and DC specifications. The W29N02GW/Z has internal circuits to isolate each block from other blocks and therefore, the invalid blocks will not affect the performance of the entire device. Before the device is shipped from the factory, it will be erased and invalid blocks are marked. All initial invalid blocks are marked with non-FFh at the first byte of spare area on the 1st or 2nd page. The initial invalid block information cannot be recovered if inadvertently erased. Therefore, software should be created to initially check for invalid blocks by reading the marked locations before performing any program or erase operation, and create a table of initial invalid blocks as following flow chart 64 Release Date: May 10th, 2016 Revision D W29N02GW/Z Figure 12-1 Flow chart of create initial invalid block table 12.3 Error in operation Additional invalid blocks may develop in the device during its life cycle. Following the procedures herein is required to guarantee reliable data in the device. After each program and erase operation, check the status read to determine if the operation failed. In case of failure, a block replacement should be done with a bad-block management algorithm. The system has to use a minimum 1-bit ECC per 528 bytes of data to ensure data recovery. Operation Detection and recommended procedure Erase Status read after erase AE Block Replacement Program Status read after program AE Block Replacement Read Verify ECC AE ECC correction Table 12-2 Block failure 65 Release Date: May 10th, 2016 Revision D W29N02GW/Z Figure 12-2 Bad block Replacement Note: 1. An error happens in the nth page of block A during program or erase operation. 2. Copy the data in block A to the same location of block B which is valid block. 3. Copy the nth page data of block A in the buffer memory to the nth page of block B 4. Creating or updating bad block table for preventing further program or erase to block A . 12.4 Addressing in program operation The pages within the block have to be programmed sequentially from LSB (least significant bit) page to the MSB (most significant bit) within the block. The LSB is defined as the start page to program, does not need to be page 0 in the block. Random page programming is prohibited. 66 Release Date: May 10th, 2016 Revision D W29N02GW/Z 13. PACKAGE DIMENSIONS 13.1 TSOP 48-pin 12x20 1 48 e E b c D HD A2 A L A1 L1 Sy mbol A A1 A2 D HD E b c e L L1 Y MILLIMETER MIN. NOM. MAX. 1.20 0.05 0.95 1.00 1.05 18.4 18.5 18.3 19.8 20.0 20.2 11.9 12.0 12.1 0.002 0.037 0.720 0.780 0.468 0.17 0.10 0.22 0.27 0.21 0.007 0.004 0.50 0.60 0.80 0.70 0.020 MIN. INCH NOM. MAX. 0.047 0.039 0.724 0.787 0.472 0.009 0.041 0.728 0.795 0.476 0.011 0.008 0.020 0.50 5 0.024 0.031 0.028 0.004 0.10 0 Y 0 5 Figure 13-1 TSOP 48-pin 12x20mm 67 Release Date: May 10th, 2016 Revision D W29N02GW/Z 13.2 Fine-Pitch Ball Grid Array 63-ball Figure 13-2 Fine-Pitch Ball Grid Array 63-Ball 68 Release Date: May 10th, 2016 Revision D W29N02GW/Z 14. ORDERING INFORMATION W 29N 02 G W B I B A Winbond Standard Product W: Winbond Product Family ONFI compatible NAND Flash memory Density 02: 2 Gbit Product Version G Supply Voltage and Bus Width W: 1.7~1.95V and X16 device Z : 1.7~1.95V and X8 device Packages S: TSOP-48 B: VFBGA-63 Temparature Ranges I: -40 to 85'C Option Information B: OTP Command Supported (Contact Winbond for Option information) Reserved A: General Product Figure 14-1 Ordering Part Number Description 69 Release Date: May 10th, 2016 Revision D W29N02GW/Z 15. VALID PART NUMBERS The following table provides the valid part numbers for the W29N02GW/Z NAND Flash Memory. Please contact Winbond for specific availability by density and package type. Winbond NAND Flash memories use a 12-digit Product Number for ordering. Part Numbers for Industrial Temperature: PACKAGE TYPE DENSITY VCC BUS PRODUCT NUMBER TOP SIDE MARKING S TSOP-48 2G-bit 1.8V X8 W29N02GZSIBA W29N02GZSIBA S TSOP-48 2G-bit 1.8V X16 W29N02GWSIBA W29N02GWSIBA B VFBGA-63 2G-bit 1.8V X8 W29N02GZBIBA W29N02GZBIBA B VFBGA-63 2G-bit 1.8V X16 W29N02GWBIBA W29N02GWBIBA Table 15-1 Part Numbers for Industrial Temperature 70 Release Date: May 10th, 2016 Revision D W29N02GW/Z 16. REVISION HISTORY VERSION DATE PAGE 0.1 08/22/14 0.2 10/23/14 0.3 05/19/15 0.4 10/14/15 A 10/15/15 B 02/01/16 21, 22, 47 C 03/28/16 8, 67, 69, 70 D 05/10/16 52, 53 DESCRIPTION New Create as preliminary 77 79 Update POD Correct Valid Part Numbers Remove Cache operation mode 21 Update Read Parameter Page Remove "Preliminary" Update Parameter Page Output Value Update Notes of Absolute Maximum Ratings Add TSOP-48 package Update AC timing characteristics Table 16-1 History Table Trademarks Winbond is trademark of Winbond Electronics Corporation. All other marks are the property of their respective owner. Important Notice Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or sustain life. Furthermore, Winbond products are not intended for applications wherein failure of Winbond products could result or lead to a situation where in personal injury, death or severe property or environmental damage could occur. Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Winbond for any damages resulting from such improper use or sales. 71 Release Date: May 10th, 2016 Revision D