typically, fTRI should be set close to 1kHz. Resistor
RDITHER connected from DITHER/SYNC to RT deter-
mines the amount of dither as follows:
RT
DITHER
%DITHER R
=
where %DITHER is the amount of dither expressed as a
percentage of the switching frequency. Setting RDITHER
to 10 x RRT generates Q10% dither.
Synchronization (SYNC)
The internal oscillator can be synchronized to an external
clock by applying the clock to the DITHER/SYNC pin
directly. The external clock frequency can be set any-
where between 1.1x and 1.8x times the programmable
switching frequency for the MAX17595/MAX17596. The
synchronization feature is not available in the MAX17597.
An external clock increases the maximum duty cycle by a
factor of (fSYNC / fSW).
Error Amplier and Loop Compensation
The MAX17595/MAX17596/MAX17597 include an inter-
nal transconductance error amplifier. The noninverting
input of the error amplifier is internally connected to the
internal reference and the inverting input is brought out
at the FB pin to apply the feedback signal. The internal
reference is linearly ramped up from 0V to 1.21V (typ)
when the device is enabled at turn-on. After soft-start, the
internal reference is connected to the bandgap.
In isolated applications, where an optocoupler is used to
transmit the control signal from the secondary side, the
emitter current of the optocoupler flows through a resistor
to ground to set up the feedback voltage. A shunt regulator
is usually employed as a secondary-side error amplifier to
drive the optocoupler photodiode to couple the control sig-
nal to the primary. The loop compensation is applied in the
secondary side as an R-C network on the shunt regulator.
The MAX17595/MAX17596/MAX17597 error amp can be
set up as a proportional gain amplifier, or used to imple-
ment additional poles or zeros. The Typical Application
Circuits for the MAX17595/MAX17596 use the internal
error amplifier as a proportional gain amplifier.
In nonisolated applications, the output voltage is divided
down with a voltage-divider to ground and is applied to the
FB pin. Loop compensation is applied at the COMP pin
as an R-C network from COMP to GND that implements
the required poles and zeros, as shown in Figure 8. The
boost converter application circuit of Figure 11 for the
MAX17597 uses this approach.
Layout, Grounding and Bypassing
All connections carrying pulsed currents must be very
short and as wide as possible. The inductance of these
connections must be kept to an absolute minimum due to
the high di/dt of the currents in high-frequency-switching
power converters. This implies that the loop areas for
forward and return pulsed currents in various parts of the
circuit should be minimized. Additionally, small current
loop areas reduce radiated EMI. Similarly, the heatsink
of the MOSFET presents a dV/dt source; therefore,
the surface area of the MOSFET heatsink should be
minimized as much as possible.
Ground planes must be kept as intact as possible. The
ground plane for the power section of the converter
should be kept separate from the analog ground plane,
except for a connection at the least noisy section of the
power ground plane, typically the return of the input filter
capacitor. The negative terminal of the filter capacitor, the
ground return of the power switch and current-sensing
resistor, must be close together. PCB layout also affects
the thermal performance of the design. A number of
thermal vias that connect to a large ground plane should
be provided under the exposed pad of the part for
efficient heat dissipation. For a sample layout that ensures
first-pass success, refer to the MAX17595 evaluation kit
layout available at www.maximintegrated.com. For univer-
sal AC input designs, follow all applicable safety regula-
tions. Offline power supplies can require UL, VDE, and
other similar agency approvals.
Figure 8. Error-Amplifier Compensation Network
COMP
RZ
CZ
CP
MAX17595
MAX17596
MAX17597
MAX17595/MAX17596/
MAX17597
Peak-Current-Mode Controllers
for Flyback and Boost Regulators
www.maximintegrated.com Maxim Integrated
│
17