GaAs MMIC CSH210P Target Datasheet * TX-RX and diversity switch for mobile communications * GaAs PHEMT Technology * Low Insertion Loss * High IP3 * No supply Voltage needed * Positive Operating voltage range: 2.7 to 5 V * SOT363 package (2mm x 2mm) ESD: Electrostatic discharge sensitive device Observe handling Precautions! Type Marking Ordering code (tape and reel) Package CSH210P TBD TBD SOT363 Maximum Ratings Symbol Control Voltage Range Value Unit min max -5 5 V RF Input Power Pin 4.5 W Thermal Resistance Rth tbd C/W Junction Temperature Tj 125 C Storage Temperature Tstg 150 C CSH210P - Target Datasheet (Rev 3, 02/01) -55 1 GaAs MMIC CSH210P Electrical Characteristics (T=25 C, Vcntrl=3.0V, Pin= 0dBm ) Parameter Symbol Test min typ max Unit DC-0.5GHz 0.35 0.4 dB DC-1.0GHz 0.35 0.5 DC-2.0GHz 0.4 0.7 0.55 0.75 Condition Insertion Loss RFC-RF1, RFC-RF2 ILRF DC-3.0GHz Isolation RF1-RF2 VSWR* (all ports) Harmonics (Pin = 30 dBm) Gate Leakage ISOL VSWR Pharm DC-0.5GHz 20 30 DC-1.0GHz 20 25 DC-2.0GHz 15 22.5 DC-3.0GHz 14 19 DC-2.5GHz 1.3:1 DC-3.0GHz 1.55:1 DC-3.0GHz -56 dB -60 IL dBc 0.1 mA Trise /Tfall (10% RF to 90%RF) tbd nS Ton/Toff (50% CNTRL -90%/10%RF) tbd nS Input Power for 0.1 dB compression P-0.1 DC-3.0GHz tbd dBm Input Power for 1 dB compression P1 DC-3.0GHz 33 dBm Intermodulation Intercept Point IP3 Pin=27dBm 56 dBm Freq.=1.0GHz * VSWR defined for Insertion Loss State only CSH210P - Target Datasheet (Rev 3, 02/01) 2 GaAs MMIC CSH210P Electrical Characteristics (T=25 C, Vcntrl=5.0V, Pin= 0dBm ) Parameter Symbol Test min typ max Unit DC-0.5GHz 0.35 0.4 dB DC-1.0GHz 0.35 0.5 DC-2.0GHz 0.4 0.7 0.55 0.75 Condition Insertion Loss RFC-RF1, RFC-RF2 ILRF DC-3.0GHz Isolation RF1-RF2 VSWR* (all ports) Harmonics (Pin = 30 dBm) Gate Leakage ISOL VSWR Pharm DC-0.5GHz 20 30 DC-1.0GHz 20 25 DC-2.0GHz 15 22.5 DC-3.0GHz 14 19 DC-2.5GHz 1.3:1 DC-3.0GHz 1.55:1 DC-3.0GHz -61 dB -62 IL dBc 0.1 mA Trise /Tfall (10% RF to 90%RF) tbd nS Ton/Toff (50% CNTRL -90%/10%RF) tbd nS Input Power for 0.1 dB compression P-0.1 DC-3.0GHz tbd dBm Input Power for 1 dB compression P1 DC-3.0GHz 34 dBm Intermodulation Intercept Point IP3 Pin=30dBm 57 dBm Freq.=1.0GHz * VSWR defined for Insertion Loss State only CSH210P - Target Datasheet (Rev 3, 02/01) 3 GaAs MMIC CSH210P PIN Assignments & Functional Block Diagram RF1 1 6 GND 2 5 RF2 3 4 V1 RFC V2 *external DC blocking capacitor required 100pF 3 places Standard Control Logic PIN 1 2 3 4 5 6 Symbol RF OUTPUT 1 GND RF OUTPUT 2 V_CONTROL 2 RF COMMON V_CONTROL 1 Abbreviation RF1 GND RF2 V2 RFC V1 Description RF OUTPUT Circuit common and DC return RF OUTPUT RF OUTPUT 2 control Common RF port RF OUTPUT 1 control V1 3V 0V CSH210P - Target Datasheet (Rev 3, 02/01) V2 0V 3V Through Path RFC - RF1 RFC - RF2 4 GaAs MMIC CSH210P Measured Results (All Ports connected to 50ohms, Pin=0dBm unless otherwise specified) Isolation vs. Frequency Insertion Loss vs. Frequency (RFC - RF1, RFC - RF2) (RF1 - RF2) 0 -5 -0.2 -10 -0.3 -15 Isolation (dB) Insertion Loss (dB) 0 -0.1 -0.4 -0.5 -0.6 -20 -25 -30 -0.7 -35 -0.8 -40 -0.9 -45 -1 0.00 0.50 1.00 1.50 2.00 2.50 -50 0.00 3.00 0.50 1.00 (RF1 or RF2) 2 1.9 1.8 1.8 1.7 1.7 1.6 1.6 VSWR VSWR Output VSWR vs. Frequency (RFC) 1.9 1.5 1.4 1.3 1.3 1.2 1.2 1.1 1.1 1.00 1.50 2.50 3.00 1.5 1.4 0.50 2.00 Input VSWR vs. Frequency 2 1 0.00 1.50 Frequency (GHz) Frequency (GHz) 2.00 2.50 3.00 1 0.00 Frequency (GHz) CSH210P - Target Datasheet (Rev 3, 02/01) 0.50 1.00 1.50 2.00 2.50 3.00 Frequency (GHz) 5 GaAs MMIC CSH210P Package Outline - SOT363 Recommended SOT363 Solder Footprint CSH210P - Target Datasheet (Rev 3, 02/01) 6 GaAs MMIC CSH210P Evaluation Board Layout Board Size 0.75" x 1.75" V1 V2 Board Thickness 0.047", Board Material FR4 Multi-Layer Infineon Technologies CSH210 V2.0 CSH210P - Target Datasheet (Rev 3, 02/01) 7 GaAs MMIC CSH210P Published by Infineon Technologies, Marketing-Communications 53 St.-Martin-Street, D-81541 Munich, Germany copyright Infineon Technologies 2000. All Rights Reserved. As far as patents or other rights of third parties are concerned, liability is only assumed for components per se, not for applications, processes and circuits implemented within components or assemblies. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. For questions on technology, delivery, and prices please contact the Offices of Infineon Technologies in Germany or the Siemens Companies and Representatives worldwide (see address list). Due to technical requirements components may contain dangerous substances. For information on the type in question please contact your nearest Siemens Office, Semiconductor Group. Infineon Technologies AG is an approved CECC manufacturer. CSH210P - Target Datasheet (Rev 3, 02/01) 8