LM60
2.7V, SOT-23 or TO-92 Temperature Sensor
General Description
The LM60 is a precision integrated-circuit temperature sen-
sor that can sense a −40˚C to +125˚C temperature range
while operating from a single +2.7V supply. The LM60’s
output voltage is linearly proportional to Celsius (Centigrade)
temperature (+6.25 mV/˚C) and has a DC offset of +424 mV.
The offset allows reading negative temperatures without the
need for a negative supply. The nominal output voltage of the
LM60 ranges from +174 mV to +1205 mV for a −40˚C to
+125˚C temperature range. The LM60 is calibrated to pro-
vide accuracies of ±2.0˚C at room temperature and ±3˚C
over the full −25˚C to +125˚C temperature range.
The LM60’s linear output, +424 mV offset, and factory cali-
bration simplify external circuitry required in a single supply
environment where reading negative temperatures is re-
quired. Because the LM60’s quiescent current is less than
110 µA, self-heating is limited to a very low 0.1˚C in still air in
the SOT-23 package. Shutdown capability for the LM60 is
intrinsic because its inherent low power consumption allows
it to be powered directly from the output of many logic gates.
Features
nCalibrated linear scale factor of +6.25 mV/˚C
nRated for full −40˚ to +125˚C range
nSuitable for remote applications
nAvailable in SOT-23 and TO-92 packages
Applications
nCellular Phones
nComputers
nPower Supply Modules
nBattery Management
nFAX Machines
nPrinters
nHVAC
nDisk Drives
nAppliances
Key Specifications
nAccuracy at 25˚C: ±2.0 and ±3.0˚C (max)
nAccuracy for −40˚C to +125˚C: ±4.0˚C (max)
nAccuracy for −25˚C to +125˚C: ±3.0˚C (max)
nTemperature Slope: +6.25mV/˚C
nPower Supply Voltage Range: +2.7V to +10V
nCurrent Drain @25˚C: 110µA (max)
nNonlinearity: ±0.8˚C (max)
nOutput Impedance: 800Ω(max)
Typical Application
Connection Diagrams
SOT-23
01268101
Top View
See NS Package Number mf03a
TO-92
01268123
See NS Package Number Z03A
01268102
VO= (+6.25 mV/˚C x T ˚C) + 424 mV
Temperature (T) Typical V
O
+125˚C +1205 mV
+100˚C +1049 mV
+25˚C +580 mV
0˚C +424 mV
−25˚C +268 mV
−40˚C +174 mV
FIGURE 1. Full-Range Centigrade Temperature Sensor
(−40˚C to +125˚C) Operating from a Single Li-Ion
Battery Cell
August 2005
LM60 2.7V, SOT-23 or TO-92 Temperature Sensor
© 2005 National Semiconductor Corporation DS012681 www.national.com
Ordering Information
Order
Number
Device
Top Mark Supplied In
Accuracy Over
Specified
Temperature
Range
Specified
Temperature
Range
Package
Type
LM60BIM3 T6B 1000 Units, Tape and Reel ±3−25˚C ≤T
A
≤
+125˚C SOT-23
LM60BIM3X T6B 3000 Units, Tape and Reel
LM60CIM3 T6C 1000 Units, Tape and Reel ±4−40˚C ≤T
A
≤
+125˚C
LM60CIM3X T6C 3000 Units, Tape and Reel
LM60BIZ LM60BIZ Bulk ±3−25˚C ≤T
A
≤
+125˚C TO-92
LM60CIZ LM60CIZ Bulk ±4−40˚C ≤T
A
≤
+125˚C
LM60
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Absolute Maximum Ratings (Note 1)
Supply Voltage +12V to −0.2V
Output Voltage (+V
S
+ 0.6V)
to −0.6V
Output Current 10 mA
Input Current at any pin (Note 2) 5 mA
ESD Susceptibility (Note 3) :
Human Body Model 2500V
Machine Model
SOT-23
TO-92
250V
200V
Storage Temperature −65˚C to
+150˚C
Maximum Junction Temperature (T
JMAX
) +125˚C
Operating Ratings(Note 1)
Specified Temperature Range: T
MIN
≤T
A
≤T
MAX
LM60B −25˚C ≤T
A
≤+125˚C
LM60C −40˚C ≤T
A
≤+125˚C
Supply Voltage Range (+V
S
) +2.7V to +10V
Thermal Resistance, θ
JA
(Note
5)
SOT-23
TO-92
450˚C/W
180˚C/W
Soldering process must comply with National Semiconduc-
tor’s Reflow Temperature Profile specifications. Refer to
www.national.com/packaging. (Note 4)
Electrical Characteristics
Unless otherwise noted, these specifications apply for +V
S
= +3.0 V
DC
and I
LOAD
= 1 µA. Boldface limits apply for T
A
=T
J
=
T
MIN
to T
MAX
; all other limits T
A
=T
J
= 25˚C.
Parameter Conditions Typical
(Note 6)
LM60B LM60C Units
(Limit)
Limits Limits
(Note 7) (Note 7)
Accuracy (Note 8) ±2.0 ±3.0 ˚C (max)
±3.0 ±4.0 ˚C (max)
Output Voltage at 0˚C +424 mV
Nonlinearity (Note 9) ±0.6 ±0.8 ˚C (max)
Sensor Gain +6.25 +6.06 +6.00 mV/˚C (min)
(Average Slope) +6.44 +6.50 mV/˚C (max)
Output Impedance 800 800 Ω(max)
Line Regulation (Note 10) +3.0V ≤+V
S
≤+10V ±0.3 ±0.3 mV/V (max)
+2.7V ≤+V
S
≤+3.3V ±2.3 ±2.3 mV (max)
Quiescent Current +2.7V ≤+V
S
≤+10V 82 110 110 µA (max)
125 125 µA (max)
Change of Quiescent Current +2.7V ≤+V
S
≤+10V ±5.0 µA (max)
Temperature Coefficient of 0.2 µA/˚C
Quiescent Current
Long Term Stability (Note 11) T
J
=T
MAX
=+125˚C, for ±0.2 ˚C
1000 hours
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
Note 2: When the input voltage (VI) at any pin exceeds power supplies (VI<GND or VI>+VS), the current at that pin should be limited to 5 mA.
Note 3: The human body model is a 100 pF capacitor discharged through a 1.5 kΩresistor into each pin. The machine model is a 200 pF capacitor discharged
directly into each pin.
Note 4: Reflow temperature profiles are different for lead-free and non-lead-free packages.
Note 5: The junction to ambient thermal resistance (θJA) is specified without a heat sink in still air.
Note 6: Typicals are at TJ=T
A= 25˚C and represent most likely parametric norm.
Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 8: Accuracy is defined as the error between the output voltage and +6.25 mV/˚C times the device’s case temperature plus 424 mV, at specified conditions of
voltage, current, and temperature (expressed in ˚C).
Note 9: Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device’s rated temperature
range.
Note 10: Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be
computed by multiplying the internal dissipation by the thermal resistance.
Note 11: For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, and/or temperature cycled for at least 46
hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered; allow time for stress relaxation to occur. The
majority of the drift will occur in the first 1000 hours at elevated temperatures. The drift after 1000 hours will not continue at the first 1000 hour rate.
LM60
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Typical Performance Characteristics To generate these curves the LM60 was mounted to a
printed circuit board as shown in Figure 2.
Thermal Resistance
Junction to Air Thermal Time Constant
01268103 01268104
Thermal Response in
Still Air with Heat Sink
Thermal Response
in Stirred Oil Bath
with Heat Sink
01268105 01268106
Start-Up Voltage
vs. Temperature
Thermal Response in Still
Air without a Heat Sink
01268107 01268108
LM60
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Typical Performance Characteristics To generate these curves the LM60 was mounted to a printed
circuit board as shown in Figure 2. (Continued)
Quiescent Current
vs. Temperature Accuracy vs Temperature
01268109 01268110
Noise Voltage
Supply Voltage
vs Supply Current
01268111 01268112
Start-Up Response
01268122
LM60
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Typical Performance Characteristics To generate these curves the LM60 was mounted to a printed
circuit board as shown in Figure 2. (Continued)
1.0 Mounting
The LM60 can be applied easily in the same way as other
integrated-circuit temperature sensors. It can be glued or
cemented to a surface. The temperature that the LM60 is
sensing will be within about +0.1˚C of the surface tempera-
ture that LM60’s leads are attached to.
This presumes that the ambient air temperature is almost the
same as the surface temperature; if the air temperature were
much higher or lower than the surface temperature, the
actual temperature of the LM60 die would be at an interme-
diate temperature between the surface temperature and the
air temperature.
To ensure good thermal conductivity the backside of the
LM60 die is directly attached to the GND pin. The lands and
traces to the LM60 will, of course, be part of the printed
circuit board, which is the object whose temperature is being
measured. These printed circuit board lands and traces will
not cause the LM60’s temperature to deviate from the de-
sired temperature.
Alternatively, the LM60 can be mounted inside a sealed-end
metal tube, and can then be dipped into a bath or screwed
into a threaded hole in a tank. As with any IC, the LM60 and
accompanying wiring and circuits must be kept insulated and
dry, to avoid leakage and corrosion. This is especially true if
the circuit may operate at cold temperatures where conden-
sation can occur. Printed-circuit coatings and varnishes such
as Humiseal and epoxy paints or dips are often used to
ensure that moisture cannot corrode the LM60 or its connec-
tions.
The thermal resistance junction to ambient (θ
JA
)isthe
parameter used to calculate the rise of a device junction
temperature due to the device power dissipation. For the
LM60 the equation used to calculate the rise in the die
temperature is as follows:
T
J
=T
A
+θ
JA
[(+V
S
I
Q
) + (+V
S
−V
O
)I
L
]
where I
Q
is the quiescent current and I
L
is the load current on
the output.
The table shown in Figure 3 summarizes the rise in die
temperature of the LM60 without any loading, and the ther-
mal resistance for different conditions.
01268114
FIGURE 2. Printed Circuit Board Used
for Heat Sink to Generate All Curves.
1
⁄
2
" Square Printed Circuit Board
with 2 oz. Copper Foil or Similar.
LM60
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1.0 Mounting (Continued)
2.0 Capacitive Loads
The LM60 handles capacitive loading well. Without any spe-
cial precautions, the LM60 can drive any capacitive load as
shown in Figure 4. Over the specified temperature range the
LM60 has a maximum output impedance of 800Ω.Inan
extremely noisy environment it may be necessary to add
some filtering to minimize noise pickup. It is recommended
that 0.1 µF be added from +V
S
to GND to bypass the power
supply voltage, as shown in Figure 5. In a noisy environment
it may be necessary to add a capacitor from the output to
ground. A 1 µF output capacitor with the 800Ωoutput imped-
ance will form a 199 Hz lowpass filter. Since the thermal time
constant of the LM60 is much slower than the 6.3 ms time
constant formed by the RC, the overall response time of the
LM60 will not be significantly affected. For much larger ca-
pacitors this additional time lag will increase the overall
response time of the LM60.
SOT-23* SOT-23** TO-92* TO-92***
no heat sink small heat fin no heat fin small heat fin
θ
JA
T
J
−T
A
θ
JA
T
J
−T
A
θ
JA
T
J
−T
A
θ
JA
T
J
−T
A
(˚C/W) (˚C) (˚C/W) (˚C)
Still air 450 0.17 260 0.1 180 0.07 140 0.05
Moving air 180 0.07 90 0.034 70 0.026
*-Part soldered to 30 gauge wire.
**-Heat sink used is
1
⁄
2
" square printed circuit board with 2 oz. foil with part attached as shown in Figure 2 .
***-Part glued or leads soldered to 1” square of 1/16” printed circuit board with 2 oz. foil or similar.
FIGURE 3. Temperature Rise of LM60 Due to
Self-Heating and Thermal Resistance (θ
JA
)
01268115
FIGURE 4. LM60 No Decoupling Required for
Capacitive Load
01268116
FIGURE 5. LM60 with Filter for Noisy Environment
LM60
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2.0 Capacitive Loads (Continued)
01268117
FIGURE 6. Simplified Schematic
LM60
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3.0 Applications Circuits
01268118
FIGURE 7. Centigrade Thermostat
01268119
FIGURE 8. Conserving Power Dissipation with Shutdown
LM60
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Physical Dimensions inches (millimeters) unless otherwise noted
SOT-23 Molded Small Outline Transistor Package (M3)
Order Number LM60BIM3 or LM60CIM3
NS Package Number mf03a
LM60
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
TO-92 Molded Plastic Package (Z)
Order Number LM60BIZ or LM60CIZ
Package Number Z03A
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
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WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and whose failure to perform when
properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to result
in a significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or
system, or to affect its safety or effectiveness.
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LM60 2.7V, SOT-23 or TO-92 Temperature Sensor
