SDFS040A − MARCH 1987 − REVISED OCTOBER 1993
Copyright 1993, Texas Instruments Incorporated
2−1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
•Package Options Include Plastic
Small-Outline Packages, Ceramic Chip
Carriers, and Standard Plastic and Ceramic
300-mil DIPs
description
These devices contain three independent 3-input
AND gates. They perform the Boolean functions
Y = A • B • C or Y = A + B + C in positive logic.
The SN54F11 is characterized for operation over
the full military temperature range of −55°C to
125°C. The SN74F11 is characterized for
operation from 0°C to 70°C.
FUNCTION TABLE
(each gate)
INPUTS
OUTPUT
A B C
OUTPUT
Y
H H H H
LXX L
XLX L
X X L L
logic symbol†
&
Y
1
1A 2
1B 13
1C
1Y
12
3
2A 4
2B 5
2C
2Y
6
9
3A 10
3B 11
3C
3Y
8
A
B
C
logic diagram, each gate (positive logic)
†This symbol is in accordance with ANSI/IEEE Std 91-1984 and
IEC Publication 617-12.
Pin numbers shown are for the D, J, and N packages.
SN54F11 ...J PACKAGE
SN74F11 ...D OR N PACKAGE
(TOP VIEW)
SN54F11 . . . FK PACKAGE
(TOP VIEW)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
1Y
NC
3C
NC
3B
2A
NC
2B
NC
2C
1B
1A
NC
3Y
3A V
1C
2Y
GND
NC CC
NC − No internal connection
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1A
1B
2A
2B
2C
2Y
GND
VCC
1C
1Y
3C
3B
3A
3Y
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SDFS040A − MARCH 1987 − REVISED OCTOBER 1993
2−2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) −1.2 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input current range −30 mA to 5 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high state −0.5 V to VCC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current into any output in the low state 40 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range: SN54F11 −55°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74F11 0°C to 70°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input voltage ratings may be exceeded provided the input current ratings are observed.
recommended operating conditions
SN54F11 SN74F11
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 4.5 5 5.5 4.5 5 5.5 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
IIK Input clamp current −18 −18 mA
IOH High-level output current −1 −1 mA
IOL Low-level output current 20 20 mA
TAOperating free-air temperature −55 125 0 70 °C
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
SN54F11 SN74F11
UNIT
PARAMETER
TEST CONDITIONS
MIN TYP‡MAX MIN TYP‡MAX
UNIT
VIK VCC = 4.5 V, II = −18 mA −1.2 −1.2 V
VOH
VCC = 4.5 V, IOH = − 1 mA 2.5 3.4 2.5 3.4
V
VOH VCC = 4.75 V, IOH = − 1 mA 2.7 V
VOL VCC = 4.5 V, IOL = 20 mA 0.3 0.5 0.3 0.5 V
IIVCC = 5.5 V, VI = 7 V 0.1 0.1 mA
IIH VCC = 5.5 V, VI = 2.7 V 20 20 µA
IIL VCC = 5.5 V, VI = 0.5 V − 0.6 − 0.6 mA
IOS§VCC = 5.5 V, VO = 0 −60 −150 −60 −150 mA
ICCH VCC = 5.5 V, VI = 4.5 V 4.1 6.2 4.1 6.2 mA
ICCL VCC = 5.5 V, VI = 0 6.5 9.7 6.5 9.7 mA
‡All typical values are at VCC = 5 V, TA = 25°C.
§Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second.
SDFS040A − MARCH 1987 − REVISED OCTOBER 1993
2−3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics
PARAMETER FROM
(INPUT)
TO
(OUTPUT)
VCC = 5 V,
CL = 50 pF,
RL = 500 Ω,
TA = 25°C
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
RL = 500Ω,
TA = MIN to MAX†UNIT
(INPUT)
(OUTPUT)
′F11 SN54F11 SN74F11
MIN TYP MAX MIN MAX MIN MAX
tPLH
A, B, or C
Y
2.2 3.8 5.6 1.7 7.5 2.2 6.6
ns
tPHL
A, B, or C
Y
1.7 3.7 5.5 1.2 7.5 1.7 6.5
ns
†For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-9758101Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9758101Q2A
SNJ54F
11FK
5962-9758101QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9758101QC
A
SNJ54F11J
5962-9758101QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9758101QD
A
SNJ54F11W
JM38510/34002B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
34002B2A
JM38510/34002BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
34002BCA
JM38510/34002BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
34002BDA
M38510/34002B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
34002B2A
M38510/34002BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
34002BCA
M38510/34002BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
34002BDA
SN54F11J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54F11J
SN74F11D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F11
SN74F11DE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F11
SN74F11DG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F11
SN74F11DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F11
SN74F11DRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F11
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74F11DRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F11
SN74F11N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74F11N
SN74F11N3 OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70
SN74F11NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74F11N
SN74F11NSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74F11
SN74F11NSRE4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74F11
SN74F11NSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74F11
SNJ54F11FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9758101Q2A
SNJ54F
11FK
SNJ54F11J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9758101QC
A
SNJ54F11J
SNJ54F11W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9758101QD
A
SNJ54F11W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 3
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54F11, SN74F11 :
•Catalog: SN74F11
•Military: SN54F11
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74F11DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74F11NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74F11DR SOIC D 14 2500 367.0 367.0 38.0
SN74F11NSR SO NS 14 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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