t2cExpress-BT2-E3826 - ADLINK Technology

cExpress-BT2

COM Express

Compact Size Type 2 Module with

Intel

Atom™ E3800 series or Celeron

Processor SoC

Features

●

Single, dual, quad-core Intel

Atom™ or Celeron

Processor SoC

●

Up to 8GB Dual Channel DDR3L at 1333MHz

●

VGA and dual channel 18/24-bit LVDS

●

Two PCIe x1, and 32-bit PCI bus

●

GbE, one SATA 3Gb/s, one PATA IDE, seven USB 2.0

●

Supports Smart Embedded Management Agent (SEMA

) functions

●

Extreme Rugged operating temperature: -40°C to +85°C

(build option)

Specications

● Core System

CPU

Single, dual, quad-core Intel® Atom™ or Celeron® Processor

Atom™ E3845 1.91 GHz 542/792 Gfx (Turbo) 10W

Atom™ E3827 1.75 GHz 542/792 Gfx (Turbo) 8W

Atom™ E3826 1.46 GHz 533/667 Gfx (Turbo) 7W

Atom™ E3825 1.33 GHz 533 Gfx (No Turbo) 6W

Atom™ E3815 1.46 GHz 400 Gfx (No Turbo) 5W

Celeron® N2930 1.83 GHz, 400/756 Gfx (Turbo) 7.5W

Celeron® J1900 2 GHz, 688/792 Gfx (Turbo) 10W

Supports: Single, dual or quad Out-of-Order Execution (OOE) processor

cores, Intel® VT-x, Intel® SSE4.1 and SSE4.2, Intel® 64 architecture, IA 32-bit ,

PCLMULQDQ Instruction DRNG, Intel® Thermal Monitor (TM1 & TM2)

Note: Availability of features may vary between processor SKUs.

Memory

Dual channel non-ECC 1333/1066 MHz DDR3L memory up to 8GB in dual

stacked SODIMM sockets

Embedded BIOS

AMI EFI with CMOS backup in 8MB SPI BIOS

Cache

Primary 32 KB, 8-way L1 instruction cache and 24 KB, 6-way L1 write-back data

cache

2MB for E3845, N2920 and J1900

1MB for E3827, E3826 and E3825

512K for E3815

Expansion Busses

2 PCI Express x1 Gen 2 (AB): lanes 0/1

PCI Bus 33 MHz Rev. 2.3

LPC bus, SMBus (system) , I2C (user)

SEMA Board Controller

Supports: Voltage/Current monitoring, Power sequence debug support, AT/

ATX mode control, Logistics and Forensic information, Flat Panel Control,

General Purpose I2C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan

Control

Debug Headers

40-pin multipurpose at cable connector

Use in combination with DB-40 debug module providing BIOS POST code LED,

BMC access, SPI BIOS ashing, power test points, debug LEDs

60-pin XDP header for ICE debug of CPU/chipset

● Video

GPU Feature Support

7th Gen Intel® graphics core architecture with four execution units supporting

two independent displays

3D graphics hardware acceleration

Supports for DirectX 11, OpenCL 1.1, OpenGL ES Halti/2.0/1.1, OGL 3.2

Video decode hardware acceleration including support for H.264, MPEG2,

MVC, VC-1, WMV9 and VP8 formats

Video encode hardware acceleration including support for H.264, MPEG2 and

MVC formats

VGA

Analog VGA supporting resolutions of up to

2560 x 1600 x 24bpp @60

LVDS

Single/dual channel 18/24-bit LVDS from eDP (two lanes)

● Audio

Chipset

Intel® HD Audio integrated in SOC

Audio Codec

Located on carrier Express-BASE

● Ethernet

Intel® MAC/PHY: Intel® i210LM (MAC/PHY) Ethernet controller

Interface: 10/100/1000 GbE connection

Note: “build option” indicates an alternative BOM conguration to support additional or alternative functions that are not available on the standard product.

Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

Specications

● I/O Interfaces

USB: 7x USB 1.1/2.0 (port 3~6 from USB hub)

SATA: One SATA 3 Gb/s ports (build option 2 ports: lose PATA)

PATA: Single PATA IDE (Master only) through SATA to PATA IC.

eMMC: Build option soldered on-module bootable eMMC ash storage

8 to 32GB, eMMC feature may vary between OS

GPIO: 4 GPO and 4 GPI

● Super I/O

On carrier if needed (standard support for W83627DHG-P)

● TPM

Chipset: Atmel AT97SC3204 (build option)

Type: TPM 1.2

● Power

Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%

Wide Input: ATX = 5~20 V / 5Vsb ±5% or AT = 5 ~20V

Management: ACPI 4.0 compliant, Smart Battery support

Power States: C0, C1, C1E, C4, C6 S0, S3, S4, S5 (Wake on USB S3/S4, WOL S3/

S4/S5

ECO mode: Supports deep S5 (ECO mode) for power saving

● Mechanical and Environmental

Specication: PICMG COM.0: Rev 2.1 Type 2

Form Factor: Compact size: 95 mm x 95 mm

Operating Temperature

Standard: 0°C to +60°C

Extreme Rugged™: -40°C to +85°C (build option, Atom™ E38xx series only)

Humidity

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

Shock and Vibration

IEC 60068-2-64 and IEC-60068-2-27

MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table

214-I, Condition D

HALT

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

● Operating Systems

Standard Support

Windows 7/8 32/64-bit, Linux 32/64-bit

Extended Support (BSP)

WES7/8, Linux, VxWorks 32/64-bit, WEC7 32-bit

Note: “build option” indicates an alternative BOM conguration to support additional or alternative functions that are not available on the standard product.

Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

Functional Diagram

GbE

i210

LVDS

eDP to LVDS

Realtek

Intel® Atom™

E3845

E3827

E3826

E3825

E3815

Intel® Celeron®

N2930

J1900

“Baytrail”

SODIMM

1~4 GB DDR3L

non ECC

Analog VGA

HD Audio

1x SATA 3Gb/s

(port 0)

XDP

2 PCIe x1 Gen2

(port 0, 1)

PCIe x1 Gen2

(port 3)

UART0, UART1

eMMC

8/16/32GB

LM73

TPM

ATMEL

AT97SC3204

GPIO

PCA9535

SEMA

BMC

SMBus

4x GP0

GP I2C

SPI 0

BIOS

LPC bus

SPI

4x GPI

SPI 1

BIOS

DDC I2C

SPI

SPI_CS#

SODIMM

1~4 GB DDR3L

non ECC

SATA to

PATA

1x SATA 3Gb/s

(port 1)

PCIe to

PCI

PCIe x 1

(port 2)

DDI0

eDP 2 lanes

3x USB 1.1/2.0

(port 0~2)

1xSATA 3Gb/s

(port 1)

SMBus

USB

Hub

1x USB 1.1/2.0

4x USB1.1/2.0

(port 3~6)

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All products and company name listed are trademarks or trade names of their respective companies.

All specifications are subject to change without further notice.

Ordering Information

●

cExpress-BT2-E3845

COM Express