3-Axis, ±1g/±2g/±4g/±8g
Digital Accelerometer
Data Sheet ADXL350
Rev. 0 Document Feedback
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Tel: 781.329.4700 ©2012 Analog Devices, Inc. All rights reserved.
Technical Support www.analog.com
FEATURES
Excellent zero-g bias accuracy and stability with
minimum/maximum specifications
Ultralow power: as low as 45 μA in measurement mode and
0.1 μA in standby mode at VS = 2.5 V (typical)
Power consumption scales automatically with bandwidth
User-selectable resolution
Fixed 10-bit resolution
Full resolution, where resolution increases with g range,
up to 13-bit resolution at ±8 g (maintains 2 mg/LSB scale
factor in all g ranges)
Embedded, 32-level FIFO buffer minimizes host processor
load
Tap/double tap detection and free-fall detection
Activity/inactivity monitoring
Supply voltage range: 2.0 V to 3.6 V
I/O voltage range: 1.7 V to VS
SPI (3- and 4-wire) and I2C digital interfaces
Flexible interrupt modes mappable to either interrupt pin
Measurement ranges selectable via serial command
Bandwidth selectable via serial command
Wide temperature range (−40°C to +85°C)
10,000 g shock survival
Pb-free/RoHS compliant
Small and thin: 4 mm × 3 mm × 1.2 mm cavity LGA package
APPLICATIONS
Portable consumer devices
High performance medical and industrial applications
GENERAL DESCRIPTION
The high performance ADXL350 is a small, thin, low power,
3-axis accelerometer with high resolution (13-bit) and selectable
measurement ranges up to ±8 g. The ADXL350 offers industry-
leading noise and temperature performance for application
robustness with minimal calibration. Digital output data is
formatted as 16-bit twos complement and is accessible through
either a SPI (3- or 4-wire) or I2C digital interface.
The ADXL350 is well suited for high performance portable
applications. It measures the static acceleration of gravity in tilt-
sensing applications, as well as dynamic acceleration resulting
from motion or shock. Its high resolution (2 mg/LSB) enables
measurement of inclination changes of less than 1.0°.
Several special sensing functions are provided. Activity and
inactivity sensing detect the presence or lack of motion and if
the acceleration on any axis exceeds a user-set level. Tap sensing
detects single and double taps. Free-fall sensing detects if the
device is falling. These functions can be mapped to one of two
interrupt output pins.
Low power modes enable intelligent motion-based power
management with threshold sensing and active acceleration
measurement at extremely low power dissipation.
The ADXL350 is supplied in a small, thin, 3 mm × 4 mm ×
1.2 mm, 16-lead cavity laminate package.
FUNCTIONAL BLOCK DIAGRAM
3-AXIS
SENSOR
SENSE
ELECTRONICS DIGITAL
FILTER
ADXL350
POWER
MANAGEMENT
CONTROL
AND
INTERRUPT
LOGIC
SERIAL I/O
INT1
V
S
V
DD I/O
INT2
SDA/SDI/SDIO
SDO/ALT
ADDRESS
SCL/SCLK
GND
ADC
32 LEVEL
FIFO
CS
10271-001
Figure 1.
ADXL350 Data Sheet
Rev. 0 | Page 2 of 36
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 4
Thermal Resistance ...................................................................... 4
Package Information .................................................................... 4
ESD Caution .................................................................................. 4
Pin Configuration and Function Descriptions ............................. 5
Typical Performance Characteristics ............................................. 6
Theory of Operation ...................................................................... 14
Power Sequencing ...................................................................... 14
Power Savings.............................................................................. 15
Serial Communications ................................................................. 16
SPI ................................................................................................. 16
I2C ................................................................................................. 19
Interrupts ..................................................................................... 21
FIFO ............................................................................................. 21
Self-Test ....................................................................................... 22
Register Map ................................................................................... 23
Register Definitions ................................................................... 24
Applications Information .............................................................. 28
Power Supply Decoupling ......................................................... 28
Mechanical Considerations for Mounting .............................. 28
Tap Detection .............................................................................. 28
Threshold .................................................................................... 29
Link Mode ................................................................................... 29
Sleep Mode vs. Low Power Mode............................................. 29
Offset Calibration ....................................................................... 29
Using Self-Test ............................................................................ 30
Axes of Acceleration Sensitivity ............................................... 32
Layout and Design Recommendations ................................... 33
Outline Dimensions ....................................................................... 34
Ordering Guide .......................................................................... 34
REVISION HISTORY
9/12—Revision 0: Initial Version
Data Sheet ADXL350
Rev. 0 | Page 3 of 36
SPECIFICATIONS
TA = 25°C, VS = 2.5 V, VDD I/O = 2.5 V, acceleration = 0 g, and CIO = 0.1 μF, unless otherwise noted. All minimum and maximum
specifications are guaranteed. Typical specifications are not guaranteed.
Table 1.
Parameter Test Conditions Min Typ Max Unit
SENSOR INPUT Each axis
Measurement Range User selectable ±1, ±2, ±4, ±8 g
Nonlinearity Percentage of full scale ±0.5 %
Inter-Axis Alignment Error ±0.1 Degrees
Cross-Axis Sensitivity
1
±3 %
OUTPUT RESOLUTION Each axis
All g Ranges 10-bit resolution 10 Bits
±1 g Range Full resolution 10 Bits
±2
g
Range
Full resolution
11
Bits
±4 g Range
Full resolution
12
Bits
±8 g Range Full resolution 13 Bits
SENSITIVITY
Each axis
Sensitivity at XOUT, YOUT, ZOUT
Any g-range, full resolution
473.6
512
550.4
LSB/g
Scale Factor at X
OUT
, Y
OUT
, Z
OUT
Any g-range, full resolution 1.80 1.95 2.10 mg/LSB
Sensitivity at X
OUT
, Y
OUT
, Z
OUT
±1 g, 10-bit resolution 473.6 512 550.4 LSB/g
Scale Factor at X
OUT
, Y
OUT
, Z
OUT
±1 g, 10-bit resolution 1.80 1.95 2.10 mg/LSB
Sensitivity at X
OUT
, Y
OUT
, Z
OUT
±2 g, 10-bit resolution 236.8 256 275.2 LSB/g
Scale Factor at X
OUT
, Y
OUT
, Z
OUT
±2 g, 10-bit resolution 3.61 3.91 4.21 mg/LSB
Sensitivity at X
OUT
, Y
OUT
, Z
OUT
±4 g, 10-bit resolution
118.4
128
137.6
LSB/g
Scale Factor at XOUT, YOUT, ZOUT
±4 g, 10-bit resolution
7.22
7.81
8.40
mg/LSB
Sensitivity at X
OUT
, Y
OUT
, Z
OUT
±8 g, 10-bit resolution 59.2 64 68.8 LSB/g
Scale Factor at X
OUT
, Y
OUT
, Z
OUT
±8 g, 10-bit resolution 14.45 15.63 16.80 mg/LSB
Sensitivity Change Due to Temperature ±0.01 %/°C
0 g BIAS LEVEL Each axis
0 g Output for X
OUT
, Y
OUT
−150 ±50 +150 Mg
0 g Output for Z
OUT
−250 ±75 +250 Mg
0 g Offset vs. Temperature (X Axis and Y Axis)
2
−0.31 ±0.17 +0.31 mg/°C
0 g Offset vs. Temperature (Z Axis)
2
−0.49 ±0.24 +0.49 mg/°C
NOISE PERFORMANCE
Noise (X-Axis and Y-Axis) 100 Hz data rate, full resolution 1.1 LSB rms
Noise (Z-Axis) 100 Hz data rate, full resolution 1.7 LSB rms
OUTPUT DATA RATE AND BANDWIDTH User selectable
Measurement Rate3 6.25 3200 Hz
SELF-TEST4
Data rate ≥ 100 Hz, 2.0 V ≤ VS ≤ 3.6 V
Output Change in X-Axis 0.2 2.1 g
Output Change in Y-Axis −2.1 −0.2 g
Output Change in Z-Axis 0.3 3.4 g
POWER SUPPLY
Operating Voltage Range (V
S
) 2.0 2.5 3.6 V
Interface Voltage Range (V
DD I/O
) 1.7 1.8 V
S
V
Supply Current Data rate > 100 Hz 166 µA
Data rate < 10 Hz 45 µA
Standby Mode Leakage Current
0.1
2
µA
Turn-On Time5
Data rate = 3200 Hz
1.4
ms
OPERATING TEMPERATURE RANGE −40 +85
o
C
1 Cross-axis sensitivity is defined as coupling between any two axes.
2 Offset vs. temperature minimum/maximum specifications are guaranteed by characterization and represent a mean ±3σ distribution.
3 Bandwidth is half the output data rate.
4 Self-test change is defined as the output (g) when the SELF_TEST bit = 1 (in the DATA_FORMAT register) minus the output (g) when the SELF_TEST bit = 0 (in the
DATA_FORMAT register). Due to device filtering, the output reaches its final value after 4 × τ when enabling or disabling self-test, where τ = 1/(data rate).
5 Turn-on and wake-up times are determined by the user-defined bandwidth. At a 100 Hz data rate, the turn-on and wake-up times are each approximately 11.1 ms.
For other data rates, the turn-on and wake-up times are each approximately τ + 1.1 in milliseconds, where τ = 1/(data rate).
ADXL350 Data Sheet
Rev. 0 | Page 4 of 36
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Acceleration
Any Axis, Unpowered 10,000 g
Any Axis, Powered 10,000 g
V
S
−0.3 V to +3.6 V
V
DD I/O
−0.3 V to +3.6 V
Digital Pins −0.3 V to VDD I/O + 0.3 V or
3.6 V, whichever is less
All Other Pins −0.3 V to +3.6 V
Output Short-Circuit Duration
(Any Pin to Ground)
Indefinite
Temperature Range
Powered −40°C to +105°C
Storage
−40°C to +105°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 3. Package Characteristics
Package Type
θJA
θJC
Device Weight
16-Terminal LGA_CAV 150°C/W 85°C/W 20 mg
PACKAGE INFORMATION
The information in Figure 2 and Table 4 provide details about
the package branding for the ADXL350. For a complete listing
of product availability, see the Ordering Guide section.
XL350B
ywVVVV
10271-202
Figure 2. Product Information on Package (Top View)
Table 4. Package Branding Information
Branding Key Field Description
XL350B Part identifier for ADXL350
yw Date code
VVVV Factory lot code
ESD CAUTION
Data Sheet ADXL350
Rev. 0 | Page 5 of 36
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
RESERVED
GND
VS
SDO/
ALT ADDRESS
SDA/SDI/SDIO
CS
NC = NO INTERNAL
CONNECTION
NC
VDD I/O
NC
SCL/SCLK
NC
RESERVED
GND
INT1
RESERVED
INT2
TOP VI EW
ADXL350
(No t t o Scal e)
1
2
3
4
5
13
12
11
10
9
678
16 15 14
+Z
+X
+Y
10271-002
Figure 3. Pin Configuration
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
1 V
DD I/O
Digital Interface Supply Voltage.
2 NC Not Internally Connected.
3 NC Not Internally Connected.
4 SCL/SCLK Serial Communications Clock.
5 NC Not Internally Connected.
6 SDA/SDI/SDIO Serial Data (I
2
C)/Serial Data Input (SPI 4-Wire)/Serial Data Input and Output (SPI 3-Wire).
7 SDO/ALT ADDRESS Serial Data Output/Alternate I
2
C Address Select.
8 CS Chip Select.
9 INT2 Interrupt 2 Output.
10 RESERVED Reserved. This pin must be connected to ground or left open.
11
INT1
Interrupt 1 Output.
12 RESERVED Reserved. This pin must be connected to ground.
13 GND This pin must be connected to ground.
14 V
S
Supply Voltage.
15 RESERVED Reserved. This pin must be connected to V
S
or left open.
16
GND
This pin must be connected to ground.
ADXL350 Data Sheet
Rev. 0 | Page 6 of 36
TYPICAL PERFORMANCE CHARACTERISTICS
N = 460 for all typical performance characteristics plots, unless otherwise noted.
0
–100 –80 –60 –40 –20 0
ZERO g OFFSET (mg)
20 40 60 80 100
10
20
30
40
PERCENT OF POPULATION (%)
10271-103
Figure 4. X-Axis Zero g Offset at 25°C, VS = 2.5 V
0
–100 –80 –60 –40 –20 0
ZERO g OFFSET (mg)
20 40 60 80 100
10
20
30
40
PERCENT OF POPULATION (%)
10271-104
Figure 5. Y-Axis Zero g Offset at 25°C, VS = 2.5 V
ZERO g OFFSET (mg)
0
20
10
30
–125
–105
–85
–65
–45
–25
–5
15
35
55
75
95
115
PERCENT O F PO PULATION (%)
10271-105
Figure 6. Z-Axis Zero g Offset at 25°C, VS = 2.5 V
0
–100 –80 –60 –40 –20 0
ZERO g OFFSET (mg)
20 40 60 80 100
10
20
30
PERCENT OF POPULATION (%)
10271-106
Figure 7. X-Axis Zero g Offset at 25°C, VS = 3.0 V
0
–100 –80 –60 –40 –20 0
ZERO g OFFSET (mg)
20 40 60 80 100
10
20
30
PERCENT OF POPULATION (%)
10271-107
Figure 8. Y-Axis Zero g Offset at 25°C, VS = 3.0 V
0
10
20
30
–150
–130
–110
–90
–70
–50
–30
–10
10
30
50
70
–230
–210
–190
–170
PERCENT O F PO PULATION (%)
ZERO g OFFSET (mg)
10271-108
Figure 9. Z-Axis Zero g Offset at 25°C, VS = 3.0 V
Data Sheet ADXL350
Rev. 0 | Page 7 of 36
0
10
20
30
–0.5
–0.4
–0.3
–0.2
–0.1
0
0.1
0.2
0.3
0.4
0.5
PERCENT O F PO PULATION (%)
ZERO g OFFSET T EMPERATURE COEFFICIENT (mg/°C)
–40°C TO +25°C
+25°C TO +85°C
10271-109
Figure 10. X-Axis Zero g Offset Temperature Coefficient, VS = 2.5 V
0
10
20
30
–0.5
–0.4
–0.3
–0.2
–0.1
0
0.1
0.2
0.3
0.4
0.5
PERCENT O F PO PULATION (%)
ZERO g OFFSET T EMPERATURE COEFFICIENT (mg/°C)
–40°C TO +25°C
+25°C TO +85°C
10271-110
Figure 11. Y-Axis Zero g Offset Temperature Coefficient, VS = 2.5 V
0
10
5
15
20
–0.5
–0.4
–0.3
–0.2
–0.1
0
0.1
0.2
0.3
0.4
0.5
PERCENT O F PO PULATION (%)
ZERO g OFFSET T EMPERATURE COEFFICIENT (mg/°C)
–40°C TO +25°C
+25°C TO +85°C
10271-111
Figure 12. Z-Axis Zero g Offset Temperature Coefficient, VS = 2.5 V
–100
–50
–25
–75
0
50
75
25
100
–60 –40 –20 020 40 60 80 100
OUTPUT (mg)
TEMPERATURE ( °C)
N = 16
V
S
= V
DD I/O
= 2.5V
10271-112
Figure 13. X-Axis Zero g Offset vs. Temperature—
16 Parts Soldered to PCB, VS = 2.5 V
–60 –40 –20 020 40 60 80 100
–100
–50
–25
–75
50
75
25
0
100
OUTPUT (mg)
TEMPERATURE ( °C)
N = 16
VS= VDD I/ O
= 2.5V
10271-113
Figure 14. Y-Axis Zero g Offset vs. Temperature—
16 Parts Soldered to PCB, VS = 2.5 V
–60 –40 –20 020 40 60 80 100
–150
–100
–50
0
50
100
150
OUTPUT (mg)
TEMPERATURE ( °C)
N = 16
VS= VDD I/ O
= 2.5V
10271-114
Figure 15. Z-Axis Zero g Offset vs. Temperature—
16 Parts Soldered to PCB, VS = 2.5 V
ADXL350 Data Sheet
Rev. 0 | Page 8 of 36
0
10
20
30
PERCENT O F PO PULATION (%)
ZERO g OFFSET T EMPERATURE COEFFICIENT (mg/°C)
–40°C TO +25°C
+25°C TO +85°C
10271-115
–0.6
–0.5
–0.4
–0.3
–0.2
–0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
Figure 16. X-Axis Zero g Offset Temperature Coefficient, VS = 3.0 V
0
10
20
30
PERCENT O F PO PULATION (%)
ZERO g OFFSET T EMPERATURE COEFFICIENT (mg/°C)
–40°C TO +25°C
+25°C TO +85°C
10271-116
–0.6
–0.5
–0.4
–0.3
–0.2
–0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
Figure 17. Y-Axis Zero g Offset Temperature Coefficient, VS = 3.0 V
0
5
15
10
20
PERCENT O F PO PULATION (%)
ZERO g OFFSET T EMPERATURE COEFFICIENT (mg/°C)
–40°C TO +25°C
+25°C TO +85°C
10271-117
–0.6
–0.5
–0.4
–0.3
–0.2
–0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
Figure 18. Z-Axis Zero g Offset Temperature Coefficient, VS = 3.0 V
–100
–50
–25
–75
50
75
25
0
100
–20–40–60 020 40 60 80 100
OUTPUT (mg)
TEMPERATURE ( °C)
N = 16
V
S
= V
DD I/O
= 3.0V
10271-118
Figure 19. X-Axis Zero g Offset vs. Temperature—
16 Parts Soldered to PCB, VS = 3.0 V
–20–40–60 020 40 60 80 100
–100
–50
–25
–75
50
75
25
100
0
OUTPUT (mg)
TEMPERATURE ( °C)
10271-119
N = 16
VS= VDD I/ O
= 3.0V
Figure 20. Y-Axis Zero g Offset vs. Temperature—
16 Parts Soldered to PCB, VS = 3.0 V
–150
–100
–50
0
50
100
150
–20–40–60 020 40 60 80
TEMPERATURE ( °C)
10271-120
OUTPUT (mg)
N = 16
VS= VDD I/ O
= 3.0V
Figure 21. Z-Axis Zero g Offset vs. Temperature—
16 Parts Soldered to PCB, VS = 3.0 V
Data Sheet ADXL350
Rev. 0 | Page 9 of 36
0
20
40
60
470
475
480
485
490
495
500
505
510
515
520
525
530
535
540
545
550
PERCENT O F PO PULATION (%)
SENSITIVITY (LSB/g)
10721-121
Figure 22. X-Axis Sensitivity at 25°C, VS = 2.5 V, Full Resolution
0
20
40
60
470
475
480
485
490
495
500
505
510
515
520
525
530
535
540
545
550
PERCENT O F PO PULATION (%)
SENSITIVITY (LSB/g)
10721-122
Figure 23. Y-Axis Sensitivity at 25°C, VS = 2.5 V, Full Resolution
0
20
40
60
470
475
480
485
490
495
500
505
510
515
520
525
530
535
540
545
550
PERCENT O F PO PULATION (%)
SENSITIVITY (LSB/g)
10721-123
Figure 24. Z-Axis Sensitivity at 25°C, VS = 2.5 V, Full Resolution
PERCENT O F PO PULATION (%)
SENSITIVITY TEMPERATURE COEFFICIENT (%/°C)
–40°C TO +25°C
+25°C TO +85°C
10271-124
0
20
40
60
80
–0.010
–0.008
–0.006
–0.004
–0.002
0
0.002
0.004
0.006
0.008
0.010
Figure 25. X-Axis Sensitivity Temperature Coefficient, VS = 2.5 V
PERCENT O F PO PULATION (%)
SENSITIVITY TEMPERATURE COEFFICIENT (%/°C)
–40°C TO +25°C
+25°C TO +85°C
10271-125
0
20
40
60
80
–0.010
–0.008
–0.006
–0.004
–0.002
0
0.002
0.004
0.006
0.008
0.010
Figure 26. Y-Axis Sensitivity Temperature Coefficient, VS = 2.5 V
PERCENT O F PO PULATION (%)
SENSITIVITY TEMPERATURE COEFFICIENT (%/°C)
–40°C TO +25°C
+25°C TO +85°C
10271-126
0
10
20
30
40
–0.010
–0.008
–0.006
–0.004
–0.002
0
0.002
0.004
0.006
0.008
0.010
Figure 27. Z-Axis Sensitivity Temperature Coefficient, VS = 2.5 V
ADXL350 Data Sheet
Rev. 0 | Page 10 of 36
0
20
40
10
30
555
560
565
570
575
495
500
505
510
515
520
525
530
535
540
545
550
PERCENT O F PO PULATION (%)
SENSITIVITY (LSB/g)
10721-127
Figure 28. X-Axis Sensitivity, VS = 3.0 V, Full Resolution
555
560
565
570
575
495
500
505
510
515
520
525
530
535
540
545
550
0
60
20
40
PERCENT O F PO PULATION (%)
SENSITIVITY (LSB/g)
10721-128
Figure 29. Y-Axis Sensitivity, VS = 3.0 V, Full Resolution
0
60
20
40
470
475
480
485
490
495
500
505
510
515
520
525
530
535
540
545
550
PERCENT O F PO PULATION (%)
SENSITIVITY (LSB/g)
10721-129
Figure 30. Z-Axis Sensitivity, VS = 3.0 V, Full Resolution
PERCENT O F PO PULATION (%)
SENSITIVITY TEMPERATURE COEFFICIENT (%/°C)
–40°C TO +25°C
+25°C TO +85°C
10271-130
0
20
40
60
80
–0.010
–0.008
–0.006
–0.004
–0.002
0
0.002
0.004
0.006
0.008
0.010
Figure 31. X-Axis Sensitivity Temperature Coefficient, VS = 3.0 V
PERCENT O F PO PULATION (%)
SENSITIVITY TEMPERATURE COEFFICIENT (%/°C)
–40°C TO +25°C
+25°C TO +85°C
10271-131
0
20
40
60
10
30
50
70
–0.010
–0.008
–0.006
–0.004
–0.002
0
0.002
0.004
0.006
0.008
0.010
Figure 32. Y-Axis Sensitivity Temperature Coefficient, VS = 3.0 V
PERCENT O F PO PULATION (%)
SENSITIVITY TEMPERATURE COEFFICIENT (%/°C)
–40°C TO +25°C
+25°C TO +85°C
10271-132
0
20
40
10
30
50
–0.010
–0.008
–0.006
–0.004
–0.002
0
0.002
0.004
0.006
0.008
0.010
Figure 33. Z-Axis Sensitivity Temperature Coefficient, VS = 3.0 V
Data Sheet ADXL350
Rev. 0 | Page 11 of 36
490
495
500
505
510
515
520
525
530
535
540
–60 –40 –20 020 40 60 80 100
SENSITIVI T Y (L SB/g)
TEMPERATURE (°C)
N = 16
V
S
= V
DD I/O
= 2.5V
10271-133
Figure 34. X-Axis Sensitivity vs. Temperature—
16 Parts Soldered to PCB, VS = 2.5 V, Full Resolution
–60 –40 –20 020 40 60 80 100
490
495
500
505
510
515
520
525
530
535
540
SENSITIVI T Y (L SB/g)
TEMPERATURE (°C)
10271-134
N = 16
V
S
= V
DD I/O
= 2.5V
Figure 35. Y-Axis Sensitivity vs. Temperature—
16 Parts Soldered to PCB, VS = 2.5 V, Full Resolution
–60 –40 –20 020 40 60 80 100
490
495
500
505
510
515
520
525
530
535
540
SENSITIVI T Y (L SB/g)
TEMPERATURE (°C)
10271-135
N = 16
V
S
= V
DD I/O
= 2.5V
Figure 36. Z-Axis Sensitivity vs. Temperature—
16 Parts Soldered to PCB, VS = 2.5 V, Full Resolution
500
505
510
515
520
525
530
535
540
545
550
–60 –40 –20 020 40 60 80 100
SENSITIVI T Y (L SB/g)
TEMPERATURE (°C)
10271-136
N = 16
V
S
= V
DD I/O
= 3.0V
Figure 37. X-Axis Sensitivity vs. Temperature—
16 Parts Soldered to PCB, VS = 3.0 V, Full Resolution
–60 –40 –20 020 40 60 80 100
500
505
510
515
520
525
530
535
540
545
550
SENSITIVI T Y (L SB/g)
TEMPERATURE (°C)
10271-137
N = 16
V
S
= V
DD I/O
= 3.0V
Figure 38. Y-Axis Sensitivity vs. Temperature—
16 Parts Soldered to PCB, VS = 3.0 V, Full Resolution
–60 –40 –20 020 40 60 80 100
SENSITIVI T Y (L SB/g)
TEMPERATURE (°C)
10271-138
490
495
500
505
510
515
520
525
530
540
550
535
545
N = 16
V
S
= V
DD I/O
= 3.0V
Figure 39. Z-Axis Sensitivity vs. Temperature—
16 Parts Soldered to PCB, VS = 3.0 V, Full Resolution
ADXL350 Data Sheet
Rev. 0 | Page 12 of 36
0
20
40
60
80
0.60 0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00
PERCENT O F PO PULATION (%)
OUTPUT (g)
10271-139
Figure 40. X-Axis Self-Test Response at 25°C, VS = 2.5 V
0
20
40
60
PERCENTAGE OF POPULATION (%)
OUTPUT (g)
–1.00 –0.95 –0.90 –0.85 –0.80 –0.75 –0.70 –0.65 –0.60
10271-140
Figure 41. Y-Axis Self-Test Response at 25°C, VS = 2.5 V
1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 1.60
PERCENT O F PO PULATION (%)
OUTPUT (g)
10271-141
0
20
40
60
Figure 42. Z-Axis Self-Test Response at 25°C, VS = 2.5 V
0
20
40
60
80
0.80 0.85 0.90 0.95 1.00 1.05 1.10 1.15 1.20
PERCENT O F PO PULATION (%)
OUTPUT (g)
10271-142
Figure 43. X-Axis Self-Test Response at 25°C, VS = 3.0 V
0
20
40
80
60
100
–1.20 –1.15 –1.10 –1.05 –1.00 –0.95 –0.90 –0.85 –0.80
PERCENT O F PO PULATION (%)
OUTPUT (g)
10271-143
Figure 44. Y-Axis Self-Test Response at 25°C, VS = 3.0 V
0
10
20
40
30
50
1.70 1.75 1.80 1.85 1.90 1.95 2.00 2.05 2.10 2.15 2.20
PERCENT O F PO PULATION (%)
OUTPUT (g)
10271-144
Figure 45. Z-Axis Self-Test Response at 25°C, VS = 3.0 V
Data Sheet ADXL350
Rev. 0 | Page 13 of 36
0
20
40
60
PERCENT O F PO PULATION (%)
CURRENT CONSUMP TI ON (µ A)
100 110 120 130 140 150 160 170 180 190 200
10271-145
Figure 46. Current Consumption at 25°C, 100 Hz Output Data Rate,
VS = 2.5 V, 31 Parts
0
20
40
60
80
100
120
140
160
180
110 100 1k 10k
CURRENT ( µ A)
OUTPUT DATA RATE (Hz)
10271-146
Figure 47. Current Consumption vs. Output Data Rate at 25°C
VS = 2.5 V, 10 Parts
100
120
140
160
180
200
220
234
CURRENT ( µ A)
SUPPLY VOLTAGE (V)
10271-147
Figure 48. Supply Current vs. Supply Voltage, VS at 25°C, 10 Parts
ADXL350 Data Sheet
Rev. 0 | Page 14 of 36
THEORY OF OPERATION
The ADXL350 is a complete 3-axis acceleration measurement
system with a selectable measurement range of ±1 g, ±2 g, ±4 g,
or ±8 g. It measures both dynamic acceleration resulting from
motion or shock and static acceleration, such as gravity, which
allows the device to be used as a tilt sensor.
The sensor is a polysilicon surface-micromachined structure
built on top of a silicon wafer. Polysilicon springs suspend the
structure over the surface of the wafer and provide a resistance
against acceleration forces.
Deflection of the structure is measured using differential capacitors
that consist of independent fixed plates and plates attached to the
moving mass. Acceleration deflects the beam and unbalances the
differential capacitor, resulting in a sensor output whose amplitude
is proportional to acceleration. Phase-sensitive demodulation is
used to determine the magnitude and polarity of the acceleration.
POWER SEQUENCING
Power can be applied to VS or VDD I/O in any sequence without
damaging the ADXL350. All possible power-on modes are
summarized in Table 6.
The interface voltage level is set with the interface supply volt-
age, VDD I/O, which must be present to ensure that the ADXL350
does not create a conflict on the communication bus. For
single-supply operation, VDD I/O can be the same as the main
supply, VS. In a dual-supply application, however, VDD I/O can
differ from VS to accommodate the desired interface voltage, as
long as VS is greater than VDD I/O.
After VS is applied, the device enters standby mode, where power
consumption is minimized and the device waits for VDD I/O to be
applied and for the command to enter measurement mode to be
received. (This command can be initiated by setting the measure
bit in the POWER_CTL register (Address 0x2D).) In addition, any
register can be written to or read from to configure the part while
the device is in standby mode. It is recommended to configure the
device in standby mode and then to enable measurement mode.
Clearing the measure bit returns the device to the standby mode.
Table 6. Power Sequencing
Condition V
S
V
DD I/O
Description
Power Off Off Off The device is completely off, but there is the potential for a communication
bus conflict.
Bus Disabled On Off The device is on in standby mode, but communication is unavailable and
creates a conflict on the communication bus. The duration of this state should
be minimized during power-up to prevent a conflict.
Bus Enabled Off On No functions are available, but the device does not create a conflict on the
communication bus.
Standby or Measurement On On At power-up, the device is in standby mode, awaiting a command to enter
measurement mode, and all sensor functions are off. After the device is
instructed to enter measurement mode, all sensor functions are available.
Data Sheet ADXL350
Rev. 0 | Page 15 of 36
POWER SAVINGS
Power Modes
The ADXL350 automatically modulates its power consumption
in proportion to its output data rate, as outlined in Table 7. If
additional power savings is desired, a lower power mode is
available. In this mode, the internal sampling rate is reduced,
allowing for power savings in the 12.5 Hz to 400 Hz data rate
range but at the expense of slightly greater noise.
To enter lower power mode, set the LOW_POWER bit (Bit 4) in
the BW_RATE register (Address 0x2C). The current consumption
in low power mode is shown in Table 8 for cases where there is
an advantage for using low power mode. The current consump-
tion values shown in Table 7 and Table 8 are for a VS of 2.5 V.
Current scales linearly with VS.
Table 7. Current Consumption vs. Data Rate
(TA = 25°C, VS = 2.5 V, VDD I/O = 1.8 V)
Output Data
Rate (Hz) Bandwidth (Hz) Rate Code I
DD
(µA)
3200 1600 1111 145
1600 800 1110 100
800 400 1101 145
400 200 1100 145
200 100 1011 145
100 50 1010 145
50 25 1001 100
25 12.5 1000 65
12.5 6.25 0111 55
6.25 3.125 0110 40
Table 8. Current Consumption vs. Data Rate, Low Power
Mode (TA = 25°C, VS = 2.5 V, VDD I/O = 1.8 V)
Output Data
Rate (Hz) Bandwidth (Hz) Rate Code I
DD
(µA)
400 200 1100 100
200 100 1011 65
100 50 1010 55
50 25 1001 50
25 12.5 1000 40
12.5 6.25 0111 40
Auto Sleep Mode
Additional power can be saved if the ADXL350 automatically
switches to sleep mode during periods of inactivity. To enable
this feature, set the THRESH_INACT register (Address 0x25)
and the TIME_INACT register (Address 0x26) each to a value
that signifies inactivity (the appropriate value depends on the
application), and then set the AUTO_SLEEP bit and the link bit in
the POWER_CTL register (Address 0x2D). Current consumption
at the sub-8 Hz data rates used in this mode is typically 40 µA
for a VS of 2.5 V.
Standby Mode
For even lower power operation, standby mode can be used. In
standby mode, current consumption is reduced to 0.1 µA (typical).
In this mode, no measurements are made. Standby mode is entered
by clearing the measure bit (Bit 3) in the POWER_CTL register
(Address 0x2D). Placing the device into standby mode preserves
the contents of FIFO.
ADXL350 Data Sheet
Rev. 0 | Page 16 of 36
SERIAL COMMUNICATIONS
I2C and SPI digital communications are possible and regardless,
the ADXL350 always operates as a slave. I2C mode is enabled if
the CS pin is tied high to VDD I/O. The CS pin should always be
tied high to VDD I/O or be driven by an external controller
because there is no default mode if the CS pin is left
unconnected. Not taking this precaution may result in an inability
to communicate with the part. In SPI mode, the CS pin is
controlled by the bus master.
In both SPI and I2C modes of operation, data transmitted from the
ADXL350 to the master device should be ignored during writes to
the ADXL350.
SPI
For SPI, either 3- or 4-wire configuration is possible, as shown
in the connection diagrams in Figure 49 and Figure 50. Clearing
the SPI bit in the DATA_FORMAT register (Address 0x31) selects
4-wire mode, whereas setting the SPI bit selects 3-wire mode.
The maximum SPI clock speed is 5 MHz with 100 pF maximum
loading, and the timing scheme follows clock polarity (CPOL) = 1
and clock phase (CPHA) = 1.
CS is the serial port enable line and is controlled by the SPI master.
This line must go low at the start of a transmission and high at
the end of a transmission, as shown in Figure 52. SCLK is the
serial port clock and is supplied by the SPI master. It is stopped
high when CS is high during a period of no transmission. SDI
and SDO are the serial data input and output, respectively. Data
should be sampled at the rising edge of SCLK.
PROCESSOR
D OUT
D IN/OUT
D OUT
ADXL350
CS
SDIO
SDO
SCLK
10271-004
Figure 49. 3-Wire SPI Connection Diagram
PROCESSOR
D OUT
D OUT
D IN
D OUT
ADXL350
CS
SDI
SDO
SCLK
10271-003
Figure 50. 4-Wire SPI Connection Diagram
To read or write multiple bytes in a single transmission, the
multiple-byte bit, located after the R/W bit in the first byte
transfer (MB in Figure 52 to Figure 54), must be set. After the
register addressing and the first byte of data, each subsequent
set of clock pulses (eight clock pulses) causes the ADXL350 to
point to the next register for a read or write. This shifting continues
until the clock pulses cease and CS is deasserted. To perform
reads or writes on different, nonsequential registers, CS must
be deasserted between transmissions and the new register must
be addressed separately. The timing diagram for 3-wire SPI
reads or writes is shown in Figure 54. The 4-wire equivalents
for SPI writes and reads are shown in Figure 52 and Figure 53,
respectively.
Preventing Bus Traffic Errors
The ADXL350 CS pin is used both for initiating SPI transact-
tions, and for enabling I2C mode. When the ADXL350 is used
on an SPI bus with multiple devices, its CS pin is held high
while the master communicates with the other devices. There
may be conditions where an SPI command transmitted to
another device looks like a valid I2C command. In this case, the
ADXL350 would interpret this as an attempt to communicate in
I2C mode, and could interfere with other bus traffic. Unless bus
traffic can be adequately controlled to assure such a condition
never occurs, it is recommended to add a logic gate in front of
the SDI pin as shown in Figure 51. This OR gate will hold the
SDA line high when CS is high to prevent SPI bus traffic at the
ADXL350 from appearing as an I2C start command.
PROCESSOR
D OUT
D IN/OUT
D OUT
ADXL350
CS
SDIO
SDO
SCLK
10271-151
Figure 51. Recommended SPI Connection Diagram when Using Multiple SPI
Devices on a Single Bus
ADXL350
ADXL350
ADXL350
Data Sheet ADXL350
Rev. 0 | Page 17 of 36
Table 9. SPI Digital Input/Output Voltage
Limit1
Parameter Test Conditions Min Max Unit
Digital Input
Low Level Input Voltage (V
IL
) 0.3 × V
DD I/O
V
High Level Input Voltage (V
IH
) 0.7 × V
DD I/O
V
Low Level Input Current (I
IL
) V
IN
= V
DD I/O
0.1 µA
High Level Input Current (I
IH
) V
IN
= 0 V −0.1 µA
Digital Output
Low Level Output Voltage (V
OL
) I
OL
= 10 mA 0.2 × V
DD I/O
V
High Level Output Voltage (VOH)
IOH = −4 mA
0.8 × VDD I/O
V
Low Level Output Current (I
OL
) V
OL
= V
OL, max
10 mA
High Level Output Current (I
OH
) V
OH
= V
OH, min
−4 mA
Pin Capacitance f
IN
= 1 MHz, V
IN
= 2.5 V 8 pF
1 Limits based on characterization results, not production tested.
Table 10. SPI Timing (TA = 25°C, VS = 2.5 V, VDD I/O = 1.8 V)1
Limit
2, 3
Parameter Min Max Unit Description
f
SCLK
5 MHz SPI clock frequency
t
SCLK
200 ns 1/(SPI clock frequency) mark-space ratio for the SCLK input is 40/60 to 60/40
tDELAY 10 ns CS falling edge to SCLK falling edge
t
QUIET
10
ns
SCLK rising edge to
CS
rising edge
tDIS 100 ns CS rising edge to SDO disabled
tCS,DIS 250 ns CS deassertion between SPI communications
t
S
0.4 × t
SCLK
ns SCLK low pulse width (space)
t
M
0.4 × t
SCLK
ns SCLK high pulse width (mark)
t
SDO
95 ns SCLK falling edge to SDO transition
t
SETUP
10 ns SDI valid before SCLK rising edge
t
HOLD
10 ns SDI valid after SCLK rising edge
1 The CS, SCLK, SDI, and SDO pins are not internally pulled up or down; they must be driven for proper operation.
2 Limits are based on characterization results, characterized with fSCLK = 5 MHz and bus load capacitance of 100 pF; not production tested.
3 The timing values are measured corresponding to the input thresholds (VIL and VIH) given in Table 9.
ADXL350 Data Sheet
Rev. 0 | Page 18 of 36
tDELAY
tSETUP tHOLD
tSDO
X X X
WMB A5 A0 D7 D0
X X X
ADDRESS BITS DATA BITS
tSCLK tMtStQUIET
tDIS
tCS,DIS
SCLK
SDI
SDO
CS
10271-017
Figure 52. SPI 4-Wire Write
CS
X X X
R MB A5 A0
D7 D0
X
XX
ADDRESS BITS
DATA BITS
t
DIS
SCLK
SDI
SDO
t
QUIET
t
CS,DIS
t
SDO
t
SETUP
t
HOLD
t
DELAY
t
SCLK
t
M
t
S
10271-018
Figure 53. SPI 4-Wire Read
CS
t
DELAY
t
SETUP
t
HOLD
t
SDO
R/W MB A5 A0 D7 D0
ADDRESS BITS DATA BITS
t
SCLK
t
M
t
S
t
QUIET
t
CS,DIS
SCLK
SDIO
SDO
NOTES
1.
t
SDO
IS ONLY P RE S E NT DURI NG READS.
10271-019
Figure 54. SPI 3-Wire Read/Write
Data Sheet ADXL350
Rev. 0 | Page 19 of 36
I2C
With CS tied high to VDD I/O, the ADXL350 is in I2C mode,
requiring a simple 2-wire connection as shown in Figure 55.
The ADXL350 conforms to the UM10204 I2C-Bus Specification
and User Manual, Rev. 03—19 June 2007, available from NXP
Semiconductor. It supports standard (100 kHz) and fast (400 kHz)
data transfer modes if the timing parameters given in Table 12
and Figure 57 are met.
Single-byte or multiple-byte reads/writes are supported,
as shown in Figure 56. With the SDO/ALT ADDRESS pin
(Pin 7) high, the 7-bit I2C address for the device is 0x1D, followed
by the R/W bit. This translates to 0x3A for a write and 0x3B for a
read. An alternate I2C address of 0x53 (followed by the R/W bit)
can be chosen by grounding the SDO/ALT ADDRESS pin
(Pin 7). This translates to 0xA6 for a write and 0xA7 for a read.
If other devices are connected to the same I2C bus, the nominal
operating voltage level of these other devices cannot exceed VDD I/O
by more than 0.3 V. External pull-up resistors, RP, are necessary
for proper I2C operation. Refer to the UM10204 I2C-Bus
Specification and User Manual, Rev. 03—19 June 2007, when
selecting pull-up resistor values to ensure proper operation.
Table 11. I2C Digital Input/Output Voltage
Parameter Limit
1
Unit
Digital Input Voltage
Low Level Input Voltage (VIL)
0.25 × VDD I/O
V max
High Level Input Voltage (VIH)
0.75 × VDD I/O
V min
Digital Output Voltage
Low Level Output Voltage (VOL)2
0.2 × VDD I/O
V max
1 Limits are based on characterization results; not production tested.
2 The limit given is only for VDD I/O < 2 V. When VDD I/O > 2 V, the limit is 0.4 V maximum.
PROCESSOR
D IN/OUT
D OUT
R
P
V
DD I/O
R
P
ADXL350
CS
SDA
ALT ADDRESS
SCL
10271-008
Figure 55. I2C Connection Diagram (Address 0x53)
10271-009
NOTES
1. THIS START IS EITHER A RESTART OR A STOP FOLLOWED BY A START.
2. THE SHADE D ARE AS RE P RE S E NT W HE N THE DEV ICE IS LIS TENING.
MASTER START SLAVE ADDRESS + WRI TE REG ISTER ADDRESS
SLAVE ACK ACK ACK
MASTER START SLAVE ADDRESS + WRI TE REG ISTER ADDRESS
SLAVE ACK ACK ACK ACK
MASTER START SLAVE ADDRESS + WRI TE REG ISTER ADDRESS STOP
SLAVE ACK ACK
MASTER START
START
1
START
1
SLAVE ADDRESS + WRI T E REGISTER ADDRESS NACK STOP
SLAVE ACK ACK DATA
STOP
ACK
SINGLE-BYTE W RITE
MULTI PLE-BYTE WRI TE
DATA
DATA
MULTIPLE-BYTE READ
SLAVE ADDRESS + READ
SLAVE ADDRESS + READ
ACK
DATA
DATA
DATA
STOP
NACK
ACK
SINGLE-BYTE READ
Figure 56. I2C Device Addressing
ADXL350
ADXL350 Data Sheet
Rev. 0 | Page 20 of 36
Table 12. I2C Timing (TA = 25°C, VS = 2.5 V, VDD I/O = 1.8 V)
Limit1, 2
Parameter Min Max Unit Description
f
SCL
400 kHz SCL clock frequency
t
1
2.5 µs SCL cycle time
t
2
0.6 µs t
HIGH
, SCL high time
t
3
1.3 µs t
LOW
, SCL low time
t
4
0.6 µs t
HD, STA
, start/repeated start condition hold time
t
5
350 ns t
SU, DAT
, data setup time
t
6
3, 4, 5, 6 0 0.65 µs t
HD, DAT
, data hold time
t7
0.6
µs
tSU, STA, setup time for repeated start
t
8
0.6 µs t
SU, STO
, stop condition setup time
t
9
1.3 µs t
BUF
, bus-free time between a stop condition and a start condition
t
10
300 ns t
R
, rise time of both SCL and SDA when receiving
0 ns t
R
, rise time of both SCL and SDA when receiving or transmitting
t11
250
ns
tF, fall time of SDA when receiving
300 ns t
F
, fall time of both SCL and SDA when transmitting
20 + 0.1 C
b
7
ns t
F
, fall time of both SCL and SDA when transmitting or receiveing
C
b
400 pF Capacitive load for each bus line
1 Limits are based on characterization results, with fSCL = 400 kHz and a 3 mA sink current; not production tested.
2 All values are referred to the VIH and the VIL levels given in Table 11.
3 t6 is the data hold time that is measured from the falling edge of SCL. It applies to data in transmission and acknowledge times.
4 A transmitting device must internally provide an output hold time of at least 300 ns for the SDA signal (with respect to VIH(min) of the SCL signal) to bridge the undefined region of
the falling edge of SCL.
5 The maximum t6 value must be met only if the device does not stretch the low period (t3) of the SCL signal.
6 The maximum value for t6 is a function of the clock low time (t3), the clock rise time (t10), and the minimum data setup time (t5(min)). This value is calculated as t6(max) = t3 − t10 − t5(min).
7 Cb is the total capacitance of one bus line in picofarads.
SDA
t
9
SCL
t
3
t
10
t
11
t
4
t
4
t
6
t
2
t
5
t
7
t
1
t
8
START
CONDITION REPEATED
START
CONDITION
STOP
CONDITION
10271-020
Figure 57. I2C Timing Diagram
Data Sheet ADXL350
Rev. 0 | Page 21 of 36
INTERRUPTS
The ADXL350 provides two output pins for driving interrupts:
INT1 and INT2. Each interrupt function is described in detail
in this section. All functions can be used simultaneously, with
the only limiting feature being that some functions may need
to share interrupt pins. Interrupts are enabled by setting the
appropriate bit in the INT_ENABLE register (Address 0x2E)
and are mapped to either the INT1 or INT2 pin based on the
contents of the INT_MAP register (Address 0x2F). It is recom-
mended that interrupt bits be configured with the interrupts
disabled, preventing interrupts from being accidentally triggered
during configuration. This can be done by writing a value of 0x00
to the INT_ENABLE register.
Clearing interrupts is performed either by reading the data
registers (Address 0x32 to Address 0x37) until the interrupt
condition is no longer valid for the data-related interrupts or by
reading the INT_SOURCE register (Address 0x30) for the
remaining interrupts. This section describes the interrupts that can
be set in the INT_ENABLE register and monitored in the
INT_SOURCE register.
DATA_READY
The DATA_READY bit is set when new data is available and is
cleared when no new data is available.
SINGLE_TAP
The SINGLE_TAP bit is set when a single acceleration event
that is greater than the value in the THRESH_TAP register
(Address 0x1D) occurs for less time than is specified in
the DUR register (Address 0x21).
DOUBLE_TAP
The DOUBLE_TAP bit is set when two acceleration events
that are greater than the value in the THRESH_TAP register
(Address 0x1D) occur for less time than is specified in the
DUR register (Address 0x21), with the second tap starting after
the time specified by the latent register (Address 0x22) but within
the time specified in the window register (Address 0x23). See
the Tap Detection section for more details.
Activity
The activity bit is set when acceleration greater than the value
stored in the THRESH_ACT register (Address 0x24) is
experienced.
Inactivity
The inactivity bit is set when acceleration of less than the value
stored in the THRESH_INACT register (Address 0x25) is experi-
enced for more time than is specified in the TIME_INACT
register (Address 0x26). The maximum value for TIME_INACT
is 255 sec.
FREE_FALL
The FREE_FALL bit is set when acceleration of less than the
value stored in the THRESH_FF register (Address 0x28) is
experienced for more time than is specified in the TIME_FF
register (Address 0x29). The FREE_FALL interrupt differs from
the inactivity interrupt as follows: all axes always participate, the
timer period is much smaller (1.28 sec maximum), and the mode
of operation is always dc-coupled.
Watermark
The watermark bit is set when the number of samples in FIFO
equals the value stored in the samples bits (Register FIFO_CTL,
Address 0x38). The watermark bit is cleared automatically when
FIFO is read, and the content returns to a value below the value
stored in the samples bits.
Overrun
The overrun bit is set when new data replaces unread data.
The precise operation of the overrun function depends on the
FIFO mode. In bypass mode, the overrun bit is set when new data
replaces unread data in the DATAX, DATAY, and DATAZ registers
(Address 0x32 to Address 0x37). In all other modes, the overrun
bit is set when FIFO is filled. The overrun bit is automatically
cleared when the contents of FIFO are read.
FIFO
The ADXL350 contains patent pending technology for an
embedded 32-level FIFO that can be used to minimize host
processor burden. This buffer has four modes: bypass, FIFO,
stream, and trigger (see Table 20). Each mode is selected by
the settings of the FIFO_MODE bits in the FIFO_CTL register
(Address 0x38).
Bypass Mode
In bypass mode, FIFO is not operational and, therefore,
remains empty.
FIFO Mode
In FIFO mode, data from measurements of the x-, y-, and z-
axes are stored in FIFO. When the number of samples in FIFO
equals the level specified in the samples bits of the FIFO_CTL
register (Address 0x38), the watermark interrupt is set. FIFO
continues accumulating samples until it is full (32 samples from
measurements of the x-, y-, and z-axes) and then stops collecting
data. After FIFO stops collecting data, the device continues to
operate; therefore, features such as tap detection can be used
after FIFO is full. The watermark interrupt continues to occur
until the number of samples in FIFO is less than the value
stored in the samples bits of the FIFO_CTL register.
Stream Mode
In stream mode, data from measurements of the x-, y-, and
z-axes are stored in FIFO. When the number of samples in FIFO
equals the level specified in the samples bits of the FIFO_CTL
register (Address 0x38), the watermark interrupt is set. FIFO
continues accumulating samples and holds the latest 32 samples
from measurements of the x-, y-, and z-axes, discarding older
data as new data arrives. The watermark interrupt continues
occurring until the number of samples in FIFO is less than the
value stored in the samples bits of the FIFO_CTL register.
ADXL350 Data Sheet
Rev. 0 | Page 22 of 36
Trigger Mode
In trigger mode, FIFO accumulates samples, holding the latest
32 samples from measurements of the x-, y-, and z-axes. After
a trigger event occurs and an interrupt is sent to the INT1 or
INT2 pin (determined by the trigger bit in the FIFO_CTL register),
FIFO keeps the last n samples (where n is the value specified by
the samples bits in the FIFO_CTL register) and then operates in
FIFO mode, collecting new samples only when FIFO is not full.
A delay of at least 5 μs should be present between the trigger event
occurring and the start of reading data from the FIFO to allow
the FIFO to discard and retain the necessary samples. Additional
trigger events cannot be recognized until the trigger mode is
reset. To reset the trigger mode, set the device to bypass mode
and then set the device back to trigger mode. Note that the
FIFO data should be read first because placing the device into
bypass mode clears FIFO.
Retrieving Data from FIFO
The FIFO data is read through the DATAX, DATAY, and DATAZ
registers (Address 0x32 to Address 0x37). When the FIFO is in
FIFO, stream, or trigger mode, reads to the DATAX, DATAY,
and DATAZ registers read data stored in the FIFO. Each time
data is read from the FIFO, the oldest x-, y-, and z-axes data are
placed into the DATAX, DATAY, and DATAZ registers.
If a single-byte read operation is performed, the remaining
bytes of data for the current FIFO sample are lost. Therefore, all
axes of interest should be read in a burst (or multiple-byte) read
operation. To ensure that the FIFO has completely popped (that
is, that new data has completely moved into the DATAX, DATAY,
and DATAZ registers), there must be at least 5 μs between the
end of reading the data registers and the start of a new read of
the FIFO or a read of the FIFO_STATUS register (Address 0x39).
The end of reading a data register is signified by the transition
from Register 0x37 to Register 0x38 or by the CS pin going high.
For SPI operation at 1.6 MHz or less, the register addressing
portion of the transmission is a sufficient delay to ensure that
the FIFO has completely popped. For SPI operation greater than
1.6 MHz, it is necessary to deassert the CS pin to ensure a total
delay of 5 μs; otherwise, the delay will not be sufficient. The total
delay necessary for 5 MHz operation is at most 3.4 μs. This is
not a concern when using I2C mode because the communication
rate is low enough to ensure a sufficient delay between FIFO reads.
SELF-TEST
The ADXL350 incorporates a self-test feature that effectively
tests its mechanical and electronic systems simultaneously.
When the self-test function is enabled (via the SELF_TEST bit
in the DATA_FORMAT register, Address 0x31), an electrostatic
force is exerted on the mechanical sensor. This electrostatic force
moves the mechanical sensing element in the same manner as
acceleration, and it is additive to the acceleration experienced
by the device. This added electrostatic force results in an output
change in the x-, y-, and z-axes. Because the electrostatic force
is proportional to VS
2, the output change varies with VS.
The self-test feature of the ADXL350 also exhibits a bimodal
behavior that depends on which phase of the clock self-test is
enabled. However, the limits shown in Table 1 and Table 13
to Table 16 are valid for all potential self-test values across the
entire allowable voltage range. Use of the self-test feature at data
rates less than 100 Hz may yield values outside these limits.
Therefore, the part should be placed into a data rate of 100 Hz
or greater when using self-test.
Table 13. Self-Test Output in LSB for ±1 g, 10-bit Resolution
or any g-Range, Full Resolution
Axis Min Max Unit
X 100 1180 LSB
Y −1180 −100 LSB
Z 150 1850 LSB
Table 14. Self-Test Output in LSB for ±2 g, 10-Bit Resolution
Axis Min Max Unit
X 50 590 LSB
Y −590 −50 LSB
Z 75 925 LSB
Table 15. Self-Test Output in LSB for ±4 g, 10-Bit Resolution
Axis Min Max Unit
X 25 295 LSB
Y
−295
−25
LSB
Z 38 463 LSB
Table 16. Self-Test Output in LSB for ±8 g, 10-Bit Resolution
Axis Min Max Unit
X 12 148 LSB
Y −148 −12 LSB
Z 19 232 LSB
Data Sheet ADXL350
Rev. 0 | Page 23 of 36
REGISTER MAP
Table 17. Register Map
Address
Hex Dec Name Type Reset Value Description
0x00 0 DEVID R 11100101 Device ID.
0x01 to 0x01C 1 to 28 Reserved Reserved. Do not access.
0x1D 29 THRESH_TAP R/W 00000000 Tap threshold.
0x1E 30 OFSX R/W 00000000 X-axis offset.
0x1F 31 OFSY R/W 00000000 Y-axis offset.
0x20 32 OFSZ R/W 00000000 Z-axis offset.
0x21 33 DUR R/W 00000000 Tap duration.
0x22 34 Latent R/W 00000000 Tap latency.
0x23 35 Window R/W 00000000 Tap window.
0x24 36 THRESH_ACT R/W 00000000 Activity threshold.
0x25 37 THRESH_INACT R/W 00000000 Inactivity threshold.
0x26 38 TIME_INACT R/W 00000000 Inactivity time.
0x27 39 ACT_INACT_CTL R/W 00000000 Axis enable control for activity and inactivity detection.
0x28
40
THRESH_FF
R/
W
00000000
Free-fall threshold.
0x29 41 TIME_FF R/W 00000000 Free-fall time.
0x2A 42 TAP_AXES R/W 00000000 Axis control for tap/double tap.
0x2B 43 ACT_TAP_STATUS R 00000000 Source of tap/double tap.
0x2C 44 BW_RATE R/W 00001010 Data rate and power mode control.
0x2D 45 POWER_CTL R/W 00000000 Power-saving features control.
0x2E 46 INT_ENABLE R/W 00000000 Interrupt enable control.
0x2F 47 INT_MAP R/W 00000000 Interrupt mapping control.
0x30 48 INT_SOURCE R 00000010 Source of interrupts.
0x31 49 DATA_FORMAT R/W 00000000 Data format control.
0x32 50 DATAX0 R 00000000 X-Axis Data 0.
0x33
51
DATAX1
R
00000000
X-Axis Data 1.
0x34 52 DATAY0 R 00000000 Y-Axis Data 0.
0x35 53 DATAY1 R 00000000 Y-Axis Data 1.
0x36 54 DATAZ0 R 00000000 Z-Axis Data 0.
0x37 55 DATAZ1 R 00000000 Z-Axis Data 1.
0x38 56 FIFO_CTL R/W 00000000 FIFO control.
0x39
57
FIFO_STATUS
R
00000000
FIFO status.
ADXL350 Data Sheet
Rev. 0 | Page 24 of 36
REGISTER DEFINITIONS
Register 0x00—DEVID (Read Only)
D7 D6 D5 D4 D3 D2 D1 D0
1 1 1 0 0 1 0 1
The DEVID register holds a fixed device ID code of 0xE5
(345 octal).
Register 0x1D—THRESH_TAP (Read/Write)
The THRESH_TAP register is eight bits and holds the threshold
value for tap interrupts. The data format is unsigned, so the
magnitude of the tap event is compared with the value in
THRESH_TAP. The scale factor is 31.2 mg/LSB (that is, 0xFF
= +8 g). A value of 0 may result in undesirable behavior if tap/
double tap interrupts are enabled.
Register 0x1E, Register 0x1F, Register 0x20—OFSX,
OFSY, OFSZ (Read/Write)
The OFSX, OFSY, and OFSZ registers are each eight bits and
offer user-set offset adjustments in twos complement format
with a scale factor of 7.8 mg/LSB (that is, 0x7F = +1 g).
Register 0x21—DUR (Read/Write)
The DUR register is eight bits and contains an unsigned time
value representing the maximum time that an event must be
above the THRESH_TAP threshold to qualify as a tap event. The
scale factor is 625 µs/LSB. A value of 0 disables the tap/double
tap functions.
Register 0x22—Latent (Read/Write)
The latent register is eight bits and contains an unsigned time
value representing the wait time from the detection of a tap event
to the start of the time window (defined by the window register)
during which a possible second tap event can be detected. The scale
factor is 1.25 ms/LSB. A value of 0 disables the double tap function.
Register 0x23—Window (Read/Write)
The window register is eight bits and contains an unsigned time
value representing the amount of time after the expiration of the
latency time (determined by the latent register) during which a
second valid tap can begin. The scale factor is 1.25 ms/LSB. A
value of 0 disables the double tap function.
Register 0x24—THRESH_ACT (Read/Write)
The THRESH_ACT register is eight bits and holds the threshold
value for detecting activity. The data format is unsigned, so the
magnitude of the activity event is compared with the value in
the THRESH_ACT register. The scale factor is 31.2 mg/LSB.
A value of 0 may result in undesirable behavior if the activity
interrupt is enabled.
Register 0x25—THRESH_INACT (Read/Write)
The THRESH_INACT register is eight bits and holds the threshold
value for detecting inactivity. The data format is unsigned, so
the magnitude of the inactivity event is compared with the value
in the THRESH_INACT register. The scale factor is 31.2 mg/LSB.
A value of 0 mg may result in undesirable behavior if the inactivity
interrupt is enabled.
Register 0x26—TIME_INACT (Read/Write)
The TIME_INACT register is eight bits and contains an unsigned
time value representing the amount of time that acceleration
must be less than the value in the THRESH_INACT register for
inactivity to be declared. The scale factor is 1 sec/LSB. Unlike
the other interrupt functions, which use unfiltered data (see the
Threshold section), the inactivity function uses filtered output
data. At least one output sample must be generated for the
inactivity interrupt to be triggered. This results in the function
appearing unresponsive if the TIME_INACT register is set to a
value less than the time constant of the output data rate. A value
of 0 results in an interrupt when the output data is less than the
value in the THRESH_INACT register.
Register 0x27—ACT_INACT_CTL (Read/Write)
D7 D6 D5 D4
ACT ac/dc ACT_X enable ACT_Y enable ACT_Z enable
D3
D2
D1
D0
INACT ac/dc INACT_X enable INACT_Y enable INACT_Z enable
ACT AC/DC and INACT AC/DC Bits
A setting of 0 selects dc-coupled operation, and a setting of
1 enables ac-coupled operation. In dc-coupled operation, the
current acceleration magnitude is compared directly with
THRESH_ACT and THRESH_INACT to determine whether
activity or inactivity is detected.
In ac-coupled operation for activity detection, the acceleration
value at the start of activity detection is taken as a reference
value. New samples of acceleration are then compared to this
reference value, and if the magnitude of the difference exceeds
the THRESH_ACT value, the device triggers an activity
interrupt.
Similarly, in ac-coupled operation for inactivity detection, a
reference value is used for comparison and is updated whenever
the device exceeds the inactivity threshold. After the reference
value is selected, the device compares the magnitude of the
difference between the reference value and the current accel-
eration with THRESH_INACT. If the difference is less than the
value in THRESH_INACT for the time in TIME_INACT, the
device is considered inactive and the inactivity interrupt is
triggered.
ACT_x Enable Bits and INACT_x Enable Bits
A setting of 1 enables x-, y-, or z-axis participation in detecting
activity or inactivity. A setting of 0 excludes the selected axis from
participation. If all axes are excluded, the function is disabled.
Register 0x28—THRESH_FF (Read/Write)
The THRESH_FF register is eight bits and holds the threshold
value, in unsigned format, for free-fall detection. The root-sum-
square (RSS) value of all axes is calculated and compared with
the value in THRESH_FF to determine if a free-fall event occurred.
The scale factor is 31.2 mg/LSB. Note that a value of 0 mg may
Data Sheet ADXL350
Rev. 0 | Page 25 of 36
result in undesirable behavior if the free-fall interrupt is enabled.
Values between 300 mg and 600 mg (0x0A to 0x13) are
recommended.
Register 0x29—TIME_FF (Read/Write)
The TIME_FF register is eight bits and stores an unsigned time
value representing the minimum time that the RSS value of all axes
must be less than THRESH_FF to generate a free-fall interrupt.
The scale factor is 5 ms/LSB. A value of 0 may result in undesirable
behavior if the free-fall interrupt is enabled. Values between 100 ms
and 350 ms (0x14 to 0x46) are recommended.
Register 0x2A—TAP_AXES (Read/Write)
D7 D6 D5 D4 D3 D2 D1 D0
0 0 0 0 Suppress TAP_X
enable
TAP_Y
enable
TAP_Z
enable
Suppress Bit
Setting the suppress bit suppresses double tap detection if
acceleration greater than the value in THRESH_TAP is present
between taps. See the Tap Detection section for more details.
TAP_x Enable Bits
A setting of 1 in the TAP_X enable, TAP_Y enable, or TAP_Z
enable bit enables x-, y-, or z-axis participation in tap detection.
A setting of 0 excludes the selected axis from participation in
tap detection.
Register 0x2B—ACT_TAP_STATUS (Read Only)
D7 D6 D5 D4 D3 D2 D1 D0
0 ACT_X
source
ACT_Y
source
ACT_Z
source
Asleep TAP_X
source
TAP_Y
source
TAP_Z
source
ACT_x Source and TAP_x Source Bits
These bits indicate the first axis involved in a tap or activity
event. A setting of 1 corresponds to involvement in the event,
and a setting of 0 corresponds to no involvement. When new
data is available, these bits are not cleared but are overwritten by
the new data. The ACT_TAP_STATUS register should be read
before clearing the interrupt. Disabling an axis from participation
clears the corresponding source bit when the next activity or
tap/double tap event occurs.
Asleep Bit
A setting of 1 in the asleep bit indicates that the part is asleep,
and a setting of 0 indicates that the part is not asleep. See the
Register 0x2D—POWER_CTL (Read/Write) section for more
information on autosleep mode.
Register 0x2C—BW_RATE (Read/Write)
D7 D6 D5 D4 D3 D2 D1 D0
0 0 0 LOW_POWER Rate
LOW_POWER Bit
A setting of 0 in the LOW_POWER bit selects normal operation,
and a setting of 1 selects reduced power operation, which has
somewhat higher noise (see the Power Modes section for details).
Rate Bits
These bits select the device bandwidth and output data rate (see
Table 7 and Table 8 for details). The default value is 0x0A, which
translates to a 100 Hz output data rate. An output data rate
should be selected that is appropriate for the communication
protocol and frequency selected. Selecting too high of an output
data rate with a low communication speed results in samples
being discarded.
Register 0x2D—POWER_CTL (Read/Write)
D7 D6 D5 D4 D3 D2 D1 D0
0 0 Link AUTO_SLEEP Measure Sleep Wakeup
Link Bit
A setting of 1 in the link bit with both the activity and inactivity
functions enabled delays the start of the activity function until
inactivity is detected. After activity is detected, inactivity detection
begins, preventing the detection of activity. This bit serially links
the activity and inactivity functions. When this bit is set to 0,
the inactivity and activity functions are concurrent. Additional
information can be found in the Link Mode section.
When clearing the link bit, it is recommended that the part be
placed into standby mode and then set back to measurement
mode with a subsequent write. This is done to ensure that the
device is properly biased if sleep mode is manually disabled;
otherwise, the first few samples of data after the link bit is cleared
may have additional noise, especially if the device was asleep
when the bit was cleared.
AUTO_SLEEP Bit
If the link bit is set, a setting of 1 in the AUTO_SLEEP bit sets
the ADXL350 to switch to sleep mode when inactivity is detected
(that is, when acceleration has been below the THRESH_INACT
value for at least the time indicated by TIME_INACT). A setting
of 0 disables automatic switching to sleep mode. See the description
of the sleep bit in this section for more information.
When clearing the AUTO_SLEEP bit, it is recommended that the
part be placed into standby mode and then set back to measure-
ment mode with a subsequent write. This is done to ensure that
the device is properly biased if sleep mode is manually disabled;
otherwise, the first few samples of data after the AUTO_SLEEP
bit is cleared may have additional noise, especially if the device
was asleep when the bit was cleared.
Measure Bit
A setting of 0 in the measure bit places the part into standby mode,
and a setting of 1 places the part into measurement mode. The
ADXL350 powers up in standby mode with minimum power
consumption.
Sleep Bit
A setting of 0 in the sleep bit puts the part into the normal mode
of operation, and a setting of 1 places the part into sleep mode.
Sleep mode suppresses DATA_READY, stops transmission of data
ADXL350 Data Sheet
Rev. 0 | Page 26 of 36
to FIFO, and switches the sampling rate to one specified by the
wakeup bits. In sleep mode, only the activity function can be used.
When clearing the sleep bit, it is recommended that the part be
placed into standby mode and then set back to measurement
mode with a subsequent write. This is done to ensure that the
device is properly biased if sleep mode is manually disabled;
otherwise, the first few samples of data after the sleep bit is
cleared may have additional noise, especially if the device was
asleep when the bit was cleared.
Wakeup Bits
These bits control the frequency of readings in sleep mode as
described in Table 18.
Table 18. Frequency of Readings in Sleep Mode
Setting
D1 D0 Frequency (Hz)
0 0 8
0 1 4
1 0 2
1
1
1
Register 0x2E—INT_ENABLE (Read/Write)
D7 D6 D5 D4
DATA_READY SINGLE_TAP DOUBLE_TAP Activity
D3 D2 D1 D0
Inactivity FREE_FALL Watermark Overrun
Setting bits in this register to a value of 1 enables their respective
functions to generate interrupts, whereas a value of 0 prevents
the functions from generating interrupts. The DATA_READY,
watermark, and overrun bits enable only the interrupt output;
the functions are always enabled. It is recommended that interrupts
be configured before enabling their outputs.
Register 0x2F—INT_MAP (Read/Write)
D7 D6 D5 D4
DATA_READY SINGLE_TAP DOUBLE_TAP Activity
D3 D2 D1 D0
Inactivity FREE_FALL Watermark Overrun
Any bits set to 0 in this register send their respective interrupts to
the INT1 pin, whereas bits set to 1 send their respective interrupts
to the INT2 pin. All selected interrupts for a given pin are OR’ed.
Register 0x30—INT_SOURCE (Read Only)
D7 D6 D5 D4
DATA_READY SINGLE_TAP DOUBLE_TAP Activity
D3 D2 D1 D0
Inactivity FREE_FALL Watermark Overrun
Bits set to 1 in this register indicate that their respective functions
have triggered an event, whereas a value of 0 indicates that the
corresponding event has not occurred. The DATA_READY,
watermark, and overrun bits are always set if the corresponding
events occur, regardless of the INT_ENABLE register settings,
and are cleared by reading data from the DATAX, DATAY, and
DATAZ registers. The DATA_READY and watermark bits may
require multiple reads, as indicated in the FIFO mode descriptions
in the FIFO section. Other bits, and the corresponding interrupts,
are cleared by reading the INT_SOURCE register.
Register 0x31—DATA_FORMAT (Read/Write)
D7 D6 D5 D4 D3 D2 D1 D0
SELF_TEST SPI INT_INVERT 0 FULL_RES Justify Range
The DATA_FORMAT register controls the presentation of data
to Register 0x32 through Register 0x37. All data, except that for
the ±8 g range, is clipped internally to avoid rollover.
SELF_TEST Bit
A setting of 1 in the SELF_TEST bit applies a self-test force to
the sensor, causing a shift in the output data. A value of 0 disables
the self-test force.
SPI Bit
A value of 1 in the SPI bit sets the device to 3-wire SPI mode,
and a value of 0 sets the device to 4-wire SPI mode.
INT_INVERT Bit
A value of 0 in the INT_INVERT bit sets the interrupts to active
high, and a value of 1 sets the interrupts to active low.
FULL_RES Bit
When this bit is set to a value of 1, the device is in full resolution
mode, where the output resolution increases with the g range
set by the range bits to maintain a 2 mg/LSB scale factor. When
the FULL_RES bit is set to 0, the device is in 10-bit mode, and
the range bits determine the maximum g range and scale factor.
Justify Bit
A setting of 1 in the Justify bit selects left (MSB) justified mode,
and a setting of 0 selects right justified mode with sign extension.
Range Bits
These bits set the g range as described in Table 19.
Table 19. g Range Setting
Setting
D1 D0 g Range
0 0 ±1 g
0 1 ±2 g
1 0 ±4 g
1 1 ±8 g
Data Sheet ADXL350
Rev. 0 | Page 27 of 36
Register 0x32 to Register 0x37—DATAX0, DATAX1,
DATAY0, DATAY1, DATAZ0, DATAZ1 (Read Only)
These six bytes (Register 0x32 to Register 0x37) are eight bits
each and hold the output data for each axis. Register 0x32 and
Register 0x33 hold the output data for the x-axis, Register 0x34 and
Register 0x35 hold the output data for the y-axis, and Register 0x36
and Register 0x37 hold the output data for the z-axis. The output
data is twos complement, with DATAx0 as the least significant
byte and DATAx1 as the most significant byte, where x represent X,
Y, or Z. The DATA_FORMAT register (Address 0x31) controls
the format of the data. It is recommended that a multiple-byte
read of all registers be performed to prevent a change in data
between reads of sequential registers.
Register 0x38—FIFO_CTL (Read/Write)
D7 D6 D5 D4 D3 D2 D1 D0
FIFO_MODE Trigger Samples
FIFO_MODE Bits
These bits set the FIFO mode, as described in Table 20.
Table 20. FIFO Modes
Setting
D7 D6 Mode Function
0
0
Bypass
FIFO is bypassed.
0 1 FIFO FIFO collects up to 32 values and then
stops collecting data, collecting new data
only when FIFO is not full.
1 0 Stream FIFO holds the last 32 data values. When
FIFO is full, the oldest data is overwritten
with newer data.
1 1 Trigger When triggered by the trigger bit, FIFO
holds the last data samples before the
trigger event and then continues to collect
data until full. New data is collected only
when FIFO is not full.
Trigger Bit
A value of 0 in the trigger bit links the trigger event of trigger mode
to INT1, and a value of 1 links the trigger event to INT2.
Samples Bits
The function of these bits depends on the FIFO mode selected
(see Table 21). Entering a value of 0 in the samples bits immediately
sets the watermark status bit in the INT_SOURCE register,
regardless of which FIFO mode is selected. Undesirable operation
may occur if a value of 0 is used for the samples bits when trigger
mode is used.
Table 21. Samples Bits Functions
FIFO Mode Samples Bits Function
Bypass None.
FIFO Specifies how many FIFO entries are needed to
trigger a watermark interrupt.
Stream Specifies how many FIFO entries are needed to
trigger a watermark interrupt.
Trigger Specifies how many FIFO samples are retained in
the FIFO buffer before a trigger event.
0x39—FIFO_STATUS (Read Only)
D7 D6 D5 D4 D3 D2 D1 D0
FIFO_TRIG 0 Entries
FIFO_TRIG Bit
A 1 in the FIFO_TRIG bit corresponds to a trigger event occurring,
and a 0 means that a FIFO trigger event has not occurred.
Entries Bits
These bits report how many data values are stored in FIFO.
Access to collect the data from FIFO is provided through the
DATAX, DATAY, and DATAZ registers. FIFO reads must be
done in burst or multiple-byte mode because each FIFO level is
cleared after any read (single- or multiple-byte) of FIFO. FIFO
stores a maximum of 32 entries, which equates to a maximum
of 33 entries available at any given time because an additional
entry is available at the output filter of the device.
ADXL350 Data Sheet
Rev. 0 | Page 28 of 36
APPLICATIONS INFORMATION
POWER SUPPLY DECOUPLING
A 1 μF tantalum capacitor (CS) at VS and a 0.1 μF ceramic capacitor
(CIO) at VDD I/O placed close to the ADXL350 supply pins is used
for testing and is recommended to adequately decouple the
accelerometer from noise on the power supply. If additional
decoupling is necessary, a resistor or ferrite bead, no larger than
100 Ω, in series with VS may be helpful. Additionally, increasing
the bypass capacitance on VS to a 10 μF tantalum capacitor in
parallel with a 0.1 μF ceramic capacitor may also improve noise.
Care should be taken to ensure that the connection from the
ADXL350 ground to the power supply ground has low impedance
because noise transmitted through ground has an effect similar
to noise transmitted through VS. It is recommended that VS and
VDD I/O be separate supplies to minimize digital clocking noise
on the VS supply. If this is not possible, additional filtering of
the supplies as previously mentioned may be necessary.
ADXL350
GND
INT1
INT2 CS
SCL/SCLK
SDO /ALT ADDRES S
SDA/SDI/SDIO 3- O R 4- WI RE
SPI OR I2C
INTERFACE
VS
VS
CS
VDD I/O
VDD I/O
CIO
INTERRUPT
CONTROL
10271-016
Figure 58. Application Diagram
MECHANICAL CONSIDERATIONS FOR MOUNTING
The ADXL350 should be mounted on the PCB in a location
close to a hard mounting point of the PCB to the case. Mounting
the ADXL350 at an unsupported PCB location, as shown in
Figure 59, may result in large, apparent measurement errors due
to undampened PCB vibration. Locating the accelerometer near
a hard mounting point ensures that any PCB vibration at the
accelerometer is above the accelerometer’s mechanical sensor
resonant frequency and, therefore, effectively invisible to the
accelerometer.
MOUNTING POINTS
PCB
ACCELEROMETERS
10271-010
Figure 59. Incorrectly Placed Accelerometers
TAP DETECTION
The tap interrupt function is capable of detecting either single
or double taps. The following parameters are shown in Figure 60
for a valid single and valid double tap event:
• The tap detection threshold is defined by the THRESH_TAP
register (Address 0x1D).
• The maximum tap duration time is defined by the DUR
register (Address 0x21).
• The tap latency time is defined by the latent register
(Address 0x22) and is the waiting period from the end of
the first tap until the start of the time window, when a
second tap can be detected, which is determined by the
value in the window register (Address 0x23).
• The interval after the latency time (set by the latent register) is
defined by the window register. Although a second tap must
begin after the latency time has expired, it need not finish
before the end of the time defined by the window register.
FIRST TAP
TIME LIMIT FOR
TAP S ( DUR)
LATENCY
TIME
(LATENT)
TIME WINDOW FOR
SECOND TAP ( WI NDOW)
SECOND TAP
SINGLE TAP
INTERRUPT DOUBL E TAP
INTERRUPT
THRESHOLD
(THRESH_TAP)
XHI BW
INTERRUPTS
10271-011
Figure 60. Tap Interrupt Function with Valid Single and Double Taps
If only the single tap function is in use, the single tap interrupt
is triggered when the acceleration goes below the threshold, as
long as DUR has not been exceeded. If both single and double
tap functions are in use, the single tap interrupt is triggered when
the double tap event has been either validated or invalidated.
Several events can occur to invalidate the second tap of a double
tap event. First, if the suppress bit in the TAP_AXES register
(Address 0x2A) is set, any acceleration spike above the threshold
during the latency time (set by the latent register) invalidates
the double tap detection, as shown in Figure 61.
INV ALIDATES DOUBLE TAP IF
SUPRESS BIT SET
TIME WINDOW FOR SECOND
TAP ( WINDOW )
LATENCY
TIME (LATENT)
TIME LIMIT
FOR TAPS
(DUR)
X
HI BW
10271-012
Figure 61. Double Tap Event Invalid Due to High g Event
When the Suppress Bit Is Set
Data Sheet ADXL350
Rev. 0 | Page 29 of 36
A double tap event can also be invalidated if acceleration above
the threshold is detected at the start of the time window for the
second tap (set by the window register). This results in an invalid
double tap at the start of this window, as shown in Figure 62.
Additionally, a double tap event can be invalidated if an accel-
eration exceeds the time limit for taps (set by the DUR register),
resulting in an invalid double tap at the end of the DUR time
limit for the second tap event, also shown in Figure 62.
INV ALIDATES DOUBLE TAP
AT START OF WINDOW
TIME WINDOW FOR
SECOND TAP ( WI NDOW)
LATENCY
TIME
(LATENT)
INVALIDATES
DOUBLE T AP AT
END O F DUR
TIME LIMIT
FOR TAPS
(DUR)
TIME LIMIT
FOR TAPS
(DUR)
TIME LIMIT
FOR TAPS
(DUR)
X
HI BW
X
HI BW
10271-013
Figure 62. Tap Interrupt Function with Invalid Double Taps
Single taps, double taps, or both can be detected by setting the
respective bits in the INT_ENABLE register (Address 0x2E).
Control over participation of each of the three axes in single tap/
double tap detection is exerted by setting the appropriate bits in
the TAP_AXES register (Address 0x2A). For the double tap
function to operate, both the latent and window registers must
be set to a nonzero value.
Every mechanical system has somewhat different single tap/double
tap responses based on the mechanical characteristics of the
system. Therefore, some experimentation with values for the
latent, window, and THRESH_TAP registers is required. In
general, a good starting point is to set the latent register to a
value greater than 0x10, to set the window register to a value
greater than 0x10, and to set the THRESH_TAP register to be
greater than 3 g. Setting a very low value in the latent, window, or
THRESH_TAP register may result in an unpredictable response
due to the accelerometer picking up echoes of the tap inputs.
After a tap interrupt has been received, the first axis to exceed
the THRESH_TAP level is reported in the ACT_TAP_STATUS
register (Address 0x2B). This register is never cleared, but is
overwritten with new data.
THRESHOLD
The lower output data rates are achieved by decimating a
common sampling frequency inside the device. The activity,
free-fall, and single tap/double tap detection functions are
performed using unfiltered data. Since the output data is
filtered, the high frequency and high g data that is used to
determine activity, free-fall, and single tap/double tap events may
not be present if the output of the accelerometer is examined.
This may result in trigger events being detected when acceleration
does not appear to trigger an event because the unfiltered data
may have exceeded a threshold or remained below a threshold
for a certain period of time while the filtered output data has
not exceeded such a threshold.
LINK MODE
The function of the link bit is to reduce the number of activity
interrupts that the processor must service by setting the device
to look for activity only after inactivity. For proper operation of
this feature, the processor must still respond to the activity and
inactivity interrupts by reading the INT_SOURCE register
(Address 0x30) and, therefore, clearing the interrupts. If an activity
interrupt is not cleared, the part cannot go into autosleep mode.
The asleep bit in the ACT_TAP_STATUS register (Address 0x2B)
indicates if the part is asleep.
SLEEP MODE VS. LOW POWER MODE
In applications where a low data rate is sufficient and low power
consumption is desired, it is recommended that the low power
mode be used in conjunction with the FIFO. The sleep mode, while
offering a low data rate and low average current consumption,
suppresses the DATA_READY interrupt, preventing the accelero-
meter from sending an interrupt signal to the host processor
when data is ready to be collected. In this application, setting
the part into low power mode (by setting the LOW_POWER bit
in the BW_RATE register) and enabling the FIFO in FIFO mode to
collect a large value of samples reduces the power consumption
of the ADXL350 and allows the host processor to go to sleep
while the FIFO is filling up.
OFFSET CALIBRATION
Accelerometers are mechanical structures containing elements
that are free to move. These moving parts can be very sensitive
to mechanical stresses, much more so than solid-state electronics.
The 0 g bias or offset is an important accelerometer metric because
it defines the baseline for measuring acceleration. Additional
stresses can be applied during assembly of a system containing
an accelerometer. These stresses can come from, but are not
limited to, component soldering, board stress during mounting,
and application of any compounds on or over the component. If
calibration is deemed necessary, it is recommended that calibration
be performed after system assembly to compensate for these effects.
A simple method of calibration is to measure the offset while
assuming that the sensitivity of the ADXL350 is as specified in
Table 1. The offset can then be automatically accounted for by
ADXL350 Data Sheet
Rev. 0 | Page 30 of 36
using the built-in offset registers. This results in the data acquired
from the DATA registers already compensating for any offset.
In a no-turn or single-point calibration scheme, the part is oriented
such that one axis, typically the z-axis, is in the 1 g field of gravity
and the remaining axes, typically the x-axis and y-axis, are in a
0 g field. The output is then measured by taking the average of a
series of samples. The number of samples averaged is a choice of
the system designer, but a recommended starting point is 0.1 sec
worth of data for data rates of 100 Hz or greater. This corresponds
to 10 samples at the 100 Hz data rate. For data rates less than
100 Hz, it is recommended that at least 10 samples be averaged
together. These values are stored as X0g, Y0g, and Z+1g for the 0 g
measurements on the x-axis and y-axis and the 1 g measure-
ment on the z-axis, respectively.
The values measured for X0g and Y0g correspond to the x- and y-axis
offset, and compensation is done by subtracting those values from
the output of the accelerometer to obtain the actual acceleration.
XACTUAL = XMEAS − X0g
YACTUAL = YMEAS − Y0g
Because the z-axis measurement was done in a +1 g field, a no-turn
or single-point calibration scheme assumes an ideal sensitivity,
SZ for the z-axis. This is subtracted from Z+1g to attain the z-axis
offset, which is then subtracted from future measured values to
obtain the actual value:
Z0g = Z+1g − SZ
ZACTUAL = ZMEAS − Z0g
The ADXL350 can automatically compensate the output for offset
by using the offset registers (Register 0x1E, Register 0x1F, and
Register 0x20). These registers contain an 8-bit, twos complement
value that is automatically added to all measured acceleration
values, and the result is then placed into the DATA registers.
Because the value placed in an offset register is additive, a negative
value is placed into the register to eliminate a positive offset and
vice versa for a negative offset. The register has a scale factor of
7.8 mg/LSB and is independent of the selected g-range.
As an example, assume that the ADXL350 is placed into full-
resolution mode with a sensitivity of typically 512 LSB/g. The
part is oriented such that the z-axis is in the field of gravity and
x-, y-, and z-axis outputs are measured as +10 LSB, −13 LSB,
and +9 LSB, respectively. Using the previous equations, X0g is
+10 LSB, Y0g is −13 LSB, and Z0g is +9 LSB. Each LSB of output
in full-resolution is 1.95 mg or one-quarter of an LSB of the
offset register. Because the offset register is additive, the 0 g
values are negated and rounded to the nearest LSB of the offset
register:
XOFFSET = −Round(10/4) = −3 LSB
YOFFSET = −Round(−13/4) = 3 LSB
ZOFFSET = −Round(9/4) = −2 LSB
These values are programmed into the OFSX, OFSY, and OFXZ
registers, respectively, as 0xFD, 0x03, and 0xFE. As with all
registers in the ADXL350, the offset registers do not retain the
value written into them when power is removed from the part.
Power cycling the ADXL350 returns the offset registers to their
default value of 0x00.
Because the no-turn or single-point calibration method assumes an
ideal sensitivity in the z-axis, any error in the sensitivity results in
offset error. To help minimize this error, an additional measure-
ment point can be used with the z-axis in a 0 g field and the 0 g
measurement can be used in the ZACTUAL equation.
USING SELF-TEST
The self-test change is defined as the difference between the
acceleration output of an axis with self-test enabled and the
acceleration output of the same axis with self-test disabled (see
Endnote 4 of Table 1). This definition assumes that the sensor
does not move between these two measurements, because if the
sensor moves, a non-self-test related shift corrupts the test.
Proper configuration of the ADXL350 is also necessary for an
accurate self-test measurement. The part should be set with a
data rate that is greater than or equal to 100 Hz. This is done by
ensuring that a value greater than or equal to 0x0A is written
into the rate bits (Bit D3 through Bit D0) in the BW_RATE
register (Address 0x2C).
It is also recommended that the part be set to ±8 g mode to
ensure that there is sufficient dynamic range for the entire self-test
shift. This is done by setting Bit D3 of the DATA_FORMAT
register (Address 0x31) and writing a value of 0x03 to the range
bits (Bit D1 and Bit D0) of the DATA_FORMAT register (Address
0x31). This results in a high dynamic range for measurement and
a 2 mg/LSB scale factor.
After the part is configured for accurate self-test measurement,
several samples of x-, y-, and z-axis acceleration data should be
retrieved from the sensor and averaged together. The number of
samples averaged is a choice of the system designer, but a recom-
mended starting point is 0.1 sec worth of data, which corresponds
to 10 samples at 100 Hz data rate. The averaged values should
be stored and labeled appropriately as the self-test disabled data,
that is, XST_OFF, YST_OFF, and ZST_OFF.
Next, self-test should be enabled by setting Bit D7 of the
DATA_FORMAT register (Address 0x31). The output needs
some time (about four samples) to settle after enabling self-test.
After allowing the output to settle, several samples of the x-, y-,
and z-axis acceleration data should be taken again and averaged. It
is recommended that the same number of samples be taken for
this average as was previously taken. These averaged values should
again be stored and labeled appropriately as the value with self-
test enabled, that is, XST_ON, YST_ON, and ZST_ON. Self-test can then
be disabled by clearing Bit D7 of the DATA_FORMAT register
(Address 0x31).
Data Sheet ADXL350
Rev. 0 | Page 31 of 36
With the stored values for self-test enabled and disabled, the
self-test change is as follows:
XST = XST_ON − XST_OFF
YST = YST_ON − YST_OFF
ZST = ZST_ON − ZST_OFF
Because the measured output for each axis is expressed in LSBs,
XST, YST, and ZST are also expressed in LSBs. These values can be
converted to g’s of acceleration by multiplying each value by the
2 mg/LSB scale factor, if configured for full-resolution, 8 g mode.
Additionally, Table 13 through Table 16 correspond to the self-
test range converted to LSBs and can be compared with the
measured self-test change. If the part was placed into full-
resolution, 8 g mode, the values listed in Table 13 should be used.
Although the fixed 10-bit mode or a range other than 8 g can be
used, a different set of values, as indicated in Table 14 through
Table 16, would need to be used. Using a range below 8 g may
result in insufficient dynamic range and should be considered
when selecting the range of operation for measuring self-test. In
addition, note that the range in Table 1 and the values in Table 13
through Table 16 take into account all possible supply voltages, VS,
and no additional conversion due to VS is necessary.
If the self-test change is within the valid range, the test is considered
successful. Generally, a part is considered to pass if the minimum
magnitude of change is achieved. However, a part that changes
by more than the maximum magnitude is not necessarily a failure.
ADXL350 Data Sheet
Rev. 0 | Page 32 of 36
AXES OF ACCELERATION SENSITIVITY
AZ
AY
AX
10271-021
Figure 63. Axes of Acceleration Sensitivity (Corresponding Output Voltage Increases When Accelerated Along the Sensitive Axis)
GRAVITY
X
OUT
= 0g
Y
OUT
= 1g
Z
OUT
= 0g
X
OUT
= 0g
Y
OUT
= –1g
Z
OUT
= 0g
X
OUT
= –1g
Y
OUT
= 0g
Z
OUT
= 0g
X
OUT
= 1g
Y
OUT
= 0g
Z
OUT
= 0g
X
OUT
= 0g
Y
OUT
= 0g
Z
OUT
= 1g
X
OUT
= 0g
Y
OUT
= 0g
Z
OUT
= –1g
10271-022
Figure 64. Output Response vs. Orientation to Gravity
Data Sheet ADXL350
Rev. 0 | Page 33 of 36
LAYOUT AND DESIGN RECOMMENDATIONS
Figure 65 shows the recommended printed wiring board land pattern. Figure 66 and Table 22 provide details about the recommended
soldering profile.
3.53mm
0.3mm
0.8mm
0.5mm 3.35mm
10271-044
Figure 65. Recommended Printed Wiring Board Land Pattern
(Dimensions shown in millimeters)
t
P
t
L
t25°C TO P E AK
t
S
PREHEAT
CRITICAL ZONE
T
L
TO T
P
TEMPERATURE
TIME
RAMP-DOWN
RAMP-UP
T
SMIN
T
SMAX
T
P
T
L
10271-015
Figure 66. Recommended Soldering Profile
Table 22. Recommended Soldering Profile1, 2
Condition
Profile Feature Sn63/Pb37 Pb-Free
Average Ramp Rate from Liquid Temperature (T
L
) to Peak Temperature (T
P
) 3°C/sec max 3°C/sec max
Preheat
Minimum Temperature (T
SMIN
) 100°C 150°C
Maximum Temperature (T
SMAX
) 150°C 200°C
Time from T
SMIN
to T
SMAX
(t
S
) 60 sec to 120 sec 60 sec to 180 sec
T
SMAX
to T
L
Ramp-Up Rate 3°C/sec max 3°C/sec max
Liquid Temperature (TL)
183°C
217°C
Time Maintained Above T
L
(t
L
) 60 sec to 150 sec 60 sec to 150 sec
Peak Temperature (T
P
) 240 + 0/−5°C 260 + 0/−5°C
Time of Actual T
P
− 5°C (t
P
) 10 sec to 30 sec 20 sec to 40 sec
Ramp-Down Rate 6°C/sec max 6°C/sec max
Time 25°C to Peak Temperature 6 minutes max 8 minutes max
1 Based on JEDEC Standard J-STD-020D.1.
2 For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used.
ADXL350 Data Sheet
Rev. 0 | Page 34 of 36
OUTLINE DIMENSIONS
07-13-2012-B
4.10
4.00
3.90
3.10
3.00
2.90
1.30
1.20
1.10
BOTTOM VIEW
TOP VI EW
SIDE VIEW
0.50 BS C
0.25 RE F
0.24 RE F
2.40
REF
3.40 RE F
0.25 × 0.35
(PINS 6-8, 14-16)
0.10 DIA.
(Vent Hole)
0.62 × 0.25
(PINS 1-5, 9-13)
9
13
5
68
1614 1
0.50
BSC
0.86
BSC
0.50
REF
0.13 0.64
REF
0.25
REF
0.22 BS C
R 0.60
REF
R 0.18 RE F
R 0.10
REF
REFERENCE
CORNER
Figure 67. 16-Terminal Chip Array, Small Outline, No Lead Cavity [LGA_CAV]
4.00 mm × 3.00 mm × 1.2 mm Body
(CE-16-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Measurement
Range (g)
Specified
Voltage (V)
Temperature
Range Package Description
Package
Option
ADXL350BCEZ-RL ±1, ±2, ±4, ±8 2.5 −40°C to +85°C 16-Terminal [LGA_CAV] CE-16-3
ADXL350BCEZ-RL7 ±1, ±2, ±4, ±8 2.5 −40°C to +85°C 16-Terminal [LGA_CAV] CE-16-3
EVAL-ADXL350Z Evaluation Board
EVAL-ADXL350Z-M
Analog Devices Inertial Sensor Evaluation
System, Includes ADXL350 Satellite
EVAL-ADXL350Z-S ADXL350 Satellite, Standalone
1 Z = RoHS Compliant Part.
Data Sheet ADXL350
Rev. 0 | Page 35 of 36
NOTES
ADXL350 Data Sheet
Rev. 0 | Page 36 of 36
NOTES
©2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D10271-0-9/12(0)
