DESCRIPTION
HyperX HX316LS9IBK2/8 is a kit of two 512M x 64-bit (4GB)
DDR3L-1600 CL9 SDRAM (Synchronous DRAM) 1Rx8, low
voltage, memory modules, based on eight 512M x 8-bit DDR3
FBGA components per module. Total kit capacity is 8GB. Each
module kit has been tested to run at DDR3L-1600 at a low
latency timing of 9-9-9 at 1.35V or 1.5V. Additional timing
parameters are shown in the PnP Timing Parameters section
below. The JEDEC standard electrical and mechanical specifi-
cations are as follows:
Document No. 4807047-001.A00 05/20/14 Page 1
SPECIFICATIONS
CL(IDD) 9 cycles
Row Cycle Time (tRCmin) 48.125ns (min.)
Refresh to Active/Refresh 260ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 33.75ns (min.)
Maximum Operating Power TBD W* @1.35V
UL Rating 94 V - 0
Operating Temperature 0o C to 85o C
Storage Temperature -55o C to +100o C
*Power will vary depending on the SDRAM used.
HX316LS9IBK2/8
8GB (4GB 512M x 64-Bit x 2 pcs.) DDR3L-1600
CL9 204-Pin SODIMM Kit
Continued >>
kingston.com/hyperx
PnP JEDEC TIMING PARAMETERS:
•DDR3-1600 CL9-9-9 @1.35V or 1.5V
•DDR3-1333 CL8-8-8 @1.35V or 1.5V
•DDR3-1066 CL6-6-6 @1.35V or 1.5V
Note: The PnP feature offers a range of speed and timing options to support
the widest variety of processors and chipsets. Your maximum speed will
be determined by your BIOS.
HX318C10FB/4
FEATURES
•JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~
1.575V) Power Supply
•VDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V)
•800MHz fCK for 1600Mb/sec/pin
•8 independent internal bank
•Programmable CAS Latency: 11, 10, 9, 8, 7, 6
•Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
•8-bit pre-fetch
•Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
•Bi-directional Differential Data Strobe
•Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
•On Die Termination using ODT pin
•Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
•Asynchronous Reset
•PCB : Height 1.180” (30.00mm), double sided component
Document No. 4807047-001.A00 Page 2
continued HyperX
MODULE DIMENSIONS
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.
FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM/HYPERX
kingston.com/hyperx
(units = millimeters)
