AMS402Y - PANASONIC - Datasheet.Live

Light sensors

Light Sensor (AMS1, 3, 4)

TYPES

Standard packing: Tape and reel package SMD type: Carton: 3,000 pcs.; Case: 3,000 pcs.

Tape and reel package Through-hole type: Carton: 2,000 pcs.; Case: 2,000 pcs.

Baggage package Through-hole type: Carton: 500 pcs.; Case: 1,000 pcs.

Tape and reel package Chip type: Carton: 3,000 pcs.; Case: 3,000 pcs.

Notes: *Ev = 100 lx (Ev: Brightness, Fluorescent lamp is used as light source)

Tape and reel package is standard packaging style for SMD and chip types. (“Y” and “T” at end of part number indicate packaging type.)

RATINGS

1. Absolute maximum ratings (Measuring condition: ambient temperature: 25°C 77°F)

2. Recommended operating condition

Photo IC type

high sensitive light sensor SENSOR

Type (shape) Photo current Part No.

Tape and reel package Baggage package

SMD type 260 µA* AMS104Y —

Through-hole type AMS302T AMS302

Chip type 20 µA* AMS402Y —

Item Symbol AMS104/AMS302 AMS402 Remarks

Reverse voltage VR–0.5 to 8 V –0.5 to 6 V —

Photocurrent IL5 mA 1 mA —

Power dissipation P 40 mW 6 mW —

Operating temperature Topr –30 to +85°C –22 to +185°F–30 to +85°C –22 to +185°FNon-condensing at low temperatures

Storage temperature Tstg –40 to +100°C –40 to +176°F–40 to +100°C –40 to +176°FNon-condensing at low temperatures

Item Symbol AMS104/AMS302 AMS402 Remarks

Reverse voltage Minimum VR

1.5 V 1.5 V —

Maximum 6 V 5.5 V

FEATURES

1. Built-in optical ﬁlter for spectral

response similar to that of the human

eye.

2. Photocurrent is proportional to

illumination. (linear output)

3. Uses environmentally friendly

silicon chips.

TYPICAL APPLICATIONS

1. Brightness detection for LCD

backlight control for LCD devices

(LCD TVs, car navigation systems, and

mobile PCs).

2. Brightness detection for circuits in

residential lighting, lighting for

security, and automatic lighting for

bicycle.

3. Household applicances (day/night

energy savings for air conditioners

and electric hot water pots, etc.)

4. Brightness detection for wall clocks

(radio clocks).

1. Brightness detection for LCD

backlight control for compact mobile

devices (mobile phones and PDAs).

2. Brightness detection for controlling

the keypad backlight in mobile

phones.

SMD type Through-hole type

Chip type

(2.0 × 1.25 × 0.55 mm)

(.079 × .049 × .022 inch)

SMD and Through-hole types

Chip type

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RoHS compliant

Light sensors

Light Sensor (AMS1, 3, 4)

3. Electrical and optical characteristics (Measuring condition: ambient temperature: 25°C 77°F)

Notes: *1. Fluorescent lamp is used as light source. Ev = Brightness

*2. CIE standard illuminant ‘A’ is used as light source.

*3. Measuring method for switching time.

REFERENCE DATA

Item Symbol AMS104/AMS302 AMS402 Condition

Peak sensitivity wavelength — λp 580 nm 560 nm —

Photocurrent 1

Minimum

IL1

9.1 µA 0.7 µAAMS104/AMS302: VR = 5 V, EV = 5 lx*1

AMS402: VR = 3 V, EV = 5 lx*1

Typical 13 µA1 µA

Maximum 16.9 µA 1.3 µA

Photocurrent 2

Minimum

IL2

182 µA 14 µAAMS104/AMS302: VR = 5 V, EV = 100 lx*1

AMS402: VR = 3 V, EV = 100 lx*1

Typical 260 µA 20 µA

Maximum 338 µA 26 µA

Photocurrent 3 Typical IL3 500 µA 35 µAAMS104/AMS302: VR = 5 V, EV = 100 lx*2

AMS402: VR = 3 V, EV = 100 lx*2

Dark current Maximum ID0.3 µA 0.05 µAAMS104/AMS302: VR = 5 V, EV = 0 lx

AMS402: VR = 3 V, EV = 0 lx

Switching time Rise time Typical tr8.5 ms 1.2 ms AMS104/AMS302: VCC = 5.0 V, VO = 2.5 V, RL = 5 kΩ

AMS104/AMS302: VCC = 3.0 V, VO = 1.5 V, RL = 5 kΩ

Fall time Typical tf8.5 ms 1.2 ms

90%

10%

White LED

VCC

AMS∗∗∗

VRAMS104/AMS302: 2.5V

AMS402: 1.5V

Anode

Cathode

1. Power dissipation vs. ambient temperature

characteristics

2. Relative sensitivity vs. wavelength

characteristics

Reverse voltage: 3V (AMS402), 5V (AMS104,

AMS302)

Ambient temperature: 25°C 77°F

3. Dark current vs. ambient temperature

characteristics

Reverse voltage: 3V (AMS402), 5V (AMS104,

AMS302)

020406080100

AMS402

AMS104·AMS302

Ambient temperature, °C

Power dissipation, mW

500 600 700 800 900

1000 1100

400300

0.2

0.1

0.4

0.6

0.8

0.3

0.5

0.7

0.9

1.0

AMS402

AMS104·AMS302

Human spectral

Relative sensitivity

Wavelength, nm

40 60 1008020

0.01

0.1

0.001

0.0001

AMS402

AMS104·AMS302

Ambient temperature, °C

Dark current, µA

4. Photocurrent vs. brightness characteristics

Light source: Fluorescent lamp

Reverse voltage: 3V (AMS402), 5V (AMS104,

AMS302)

Ambient temperature: 25°C 77°F

5. Relative photocurrent vs. ambient

temperature characteristics

Light source: Fluorescent lamp, Brightness: 100 lx

Reverse voltage: 3V (AMS402), 5V (AMS104,

AMS302)

6. Relative photocurrent vs. reverse voltage

characteristics

Light source: Fluorescent lamp, Brightness: 100 lx

Ambient temperature: 25°C 77°F

100

100001000

100

1000

10000

0.1

AMS402

AMS104·AMS302

Brightness, lx

Photocurrent, µA

0-20-40 20 40 60 80 100

0.6

0.8

1.0

1.2

1.4

AMS402

AMS104·AMS302

Ambient temperature, °C

Relative photocurrent

3201 45678

0.2

0.4

0.6

0.8

1.0

1.2

AMS402

AMS104·AMS302

Reverse voltage, V

Relative photocurrent

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Light sensors

Light Sensor (AMS1, 3, 4)

DIMENSIONS (mm inch)

7. Switching time vs. resistive load

characteristics

Light source: White LED

Power voltage: 3V (AMS402), 5V (AMS104, AMS302)

Resistive load voltage: 1.5V (AMS402),

2.5V (AMS104, AMS302)

Ambient temperature: 25°C 77°F

1001010.1

1000

0.1

100

AMS402 tr

AMS402 tf

AMS104·AMS302 tr

AMS104·AMS302 tf

Switching time, ms

Resistive load, kΩ

1. SMD type

Amplifier

34 Cathode

12 Anode

2.0

1.27

0.3

1.0

0.05

2.2 3.2

0.25

(0.1)

(0.2)

1 Anode: –

2 Anode: –

3 Cathode: +

4 Cathode: +

DETECTION AREA

(.008)

(.004)

.087

.010

.126

.010

.079

.039

.002

.012

.050

Te r minal thickness: t=0.125

General Tolerance: ±0.1 ±.004

Recommended mounting pad

(Top view)

2.8

0.8

0.6

1.27

.031 .110

.024

.050

CAD Data

2. Through-hole type

Amplifier

2 Cathode

1 Anode

1 Anode: –

2 Cathode: +

DETECTION AREA

5.0±0.2 dia.

5.8 dia.

(0.17)

(1.0)

(2.5)

2-0.5

(2.54)

(1.0)

4.3±0.2

34±3

9.1

Max. 1.5

Max. 1.0

1.0

(.007)

.197±.008 dia.

.228 dia.

(.039)

.169±.008

Max. .059

.358

.039

Max. .039

1.339±.118

(.039)

(.098)

2-.020

(.100) General Tolerance: ±0.5 ±.020

CAD Data

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The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e

Light sensors

Light Sensor (AMS1, 3, 4)

SAFETY PRECAUTIONS

CAUTIONS FOR USE

3. Chip type

2 Cathode (+)

1 Anode (–)

Amplifier

1.45

Mark for indicating orientation

(0.30)

2.0

.057

.079

1.2

.047

(0.23)

(.012)

(.009)

1.25

.049

(0.58)

(.023)

0.55

.022

(0.17)

(.007)

1 Anode

2 Cathode

DETECTION AREA

General Tolerance: ±0.1 ±.004

Recommended mounting pad

(Top view)

(.024) (.024)

(0.6) (0.6)

(2.4)

(.094)

(1.2)

(.047)

CAD Data

Be sure to obey the following in order to

prevent injuries and accidents.

• Do not use the sensors under

conditions that exceed the range of its

speciﬁcations. It may cause

overheating, smoke, or ﬁre.

•Connect terminals correctly by verifying

the pin layout with the speciﬁcations

diagram or other instructions.

Erroneous connections may lead to

unexpected operating errors,

overheating, smoke, or ﬁre.

•For an impotant and serious application

in terms of safety, add protection circuit

or any other protection method.

1. Applying stress that exceeds the

absolute maximum rating

If the voltage or current value for any of

the terminals exceeds the absolute

maximum rating, internal elements will

deteriorate because of the excessive

voltage or current. In extreme cases,

wiring may melt, or silicon P/N junctions

may be destroyed.

Therefore the design should ensure that

the absolute maximum ratings will never

be exceeded, even momentarily.

2. Deterioration and destruction

caused by discharge of static

electricity

This phenomenon is generally called

static electricity destruction. Static

electricity generated by various factors

ﬂows through the terminal and occurs to

destroy internal elements. To prevent

problems from static electricity, the

following precautions and measures

should be taken when using your device.

1) Person handling sensor should wear

anti-static clothing and should be

grounded through protective resistance

of 500 kΩ to 1 MΩ.

2) A conductive metal sheet should be

placed over the work table. Measuring

instruments and jigs should be grounded.

3) When using soldering irons, either use

irons with low leakage current, or ground

the tip of the soldering iron. (Use of low-

voltage soldering irons is also

recommended.)

4) Devices and equipment used in

assembly should also be grounded.

5) When packing printed circuit boards

and equipment, avoid using high-polymer

materials such as foam styrene, plastic,

and other materials which carry an

electrostatic charge.

6) When storing or transporting sensor,

the environment should not be generated

static electricity (for instance, the

humidity should be between 45 and

60%), and sensor should be protected

using conductive packing materials.

3. Just after supplying voltage, please

note that current in the sensor will be

not constant until internal circuit

stability.

4. Storage

The sensors are transparent plastic

packages. They are sensitive to moisture

and come in moisture-proof packages.

Observe the following cautions when

storing.

1) After the moisture-proof package is

unsealed, take the sensors out of storage

as soon as possible (within 1 week

30°C 86°F/60% R.H.).

2) If the devices are to be left in storage

for a considerable period after the

moisture-proof package has been

unsealed, it is recommended to keep

them in another moisture-proof bag

containing silica gel (within 3 months at

the most).

3) Storage under extreme conditions will

cause soldering degradation, external

appearance defects, and deterioration of

the characteristics. The following storage

conditions are recommended:

•Temperature: 0 to 30°C 32 to 86°F

• Humidity: Less than 60% R.H.

(Avoid freezing and condensing)

• Atomosphere: No harmful gasses such

as sulfurous acid gas, minimal dust.

*When mounting with solder, if thermal

stress is applied to sensors that have

absorbed moisture, the moisture will

vaporize, swelling will occur, and the

inside of the package will become

stressed. This may cause the package

surface to blister or crack. Therefore,

please take caution and observe the

soldering conditions in the following

section.

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Light sensors

Light Sensor (AMS1, 3, 4)

11. The following shows the packaging format

1) SMD type tape and reel (mm inch)

Type Tape dimensions Dimensions of tape reel

Light sensor

NaPiCa

SMD type

AMS104Y

Note) When picked from 1 and 4-pin side

(Please inquire for tape and reel packaging with 2-pin and 3-pin on the

pull-out side.)

5. Recommended soldering

conditions

1) Recommended condition

(1) IR (Infrared reﬂow) soldering method

T1 = 150 to 180°C 302 to 356°F

T2 = 230°C 446°F

T3 = 250°C 482°F or less

t1 = 60 to 120 s or less

t2 = 30 s or less

(2) Soldering iron method

Tip temperature: 350 to 400°C 662 to

752°F

Wattage: 30 to 60 W

Soldering time: within 3 s

*We don’t recommend soldering iron

method for chip type.

2) Do not do ﬂow soldering.

<Through-hole type>

1) Recommended condition

(1) Double wave soldering method

T1 = 120°C 248°F

T2 = 260°C 500°F or less

t1 = 120 s or less

t2+t3= 6 s or less

(2) Soldering iron method

Tip temperature: 350 to 400°C 662 to

752°F

Wattage: 30 to 60 W

Soldering time: within 3 s

2) The soldered position on leads should

not be closer than 3mm .118inch to the

molding resin of this sensor.

6. Notes for mounting

1) Temperature rise in the lead portion is

highly dependent on package size.

If multiple different packages are

mounted on the same board, please

check your board beforehand in an actual

product, ensuring that the temperature of

the solder area of the sensor terminals

falls within the temperature conditions of

item 5.

2) If the mounting conditions exceed the

recommended solder conditions in item

5, resin strength will fall and the

mismatching of the heat expansion

coefﬁcient of each constituent material

will increase markedly, possibly causing

cracks in the package, disconnections of

bonding wires, and the like. For this

reason, please inquire with us about

whether this use is possible.

7. Cleaning solvents compatibility

We recommend dip cleaning with an

organic solvent for removal of solder ﬂux

etc. If you cannot avoid using ultrasonic

cleansing, please ensure that the

following conditions are met, and check

beforehand for defects.

•Frequency: 27 to 29 kHz

• Ultrasonic power: No greater than

0.25W/cm2

• Cleaning time: No longer than 30 s

• Cleanser used: Asahiklin AK-225

• Other:

Submerge in solvent in order to prevent

the PCB and sensors from being

contacted directly by the ultrasonic

vibrations.

Note: Applies to unit area ultrasonic power for

ultrasonic baths.

8. Transportation

Extreme vibration during transport will

warp the lead or damage the sensor.

Handle the outer and inner boxes with

care.

9. Avoid using the sensor in

environments containing excessive

amounts of steam, dust, corrosive

gas, or where organic solvents are

present.

10. Lead forming and cutting of

through-hole type

1) Lead forming must be done at normal

temperature before soldering

2) The bent and cut position on leads

should not be closer than 3mm .118inch

to the base of leads.

3) Lead forming and cutting must be

done while ﬁxing the base of leads.

4) Avoid mounting with stress at the base

of leads.

t1t2

t1t2t3

Device

mounted

on tape

Direction of

picking

8.0±0.2

1.0±0.1 dia.

1.5 dia.

4.0±0.1 2.0±0.1

2.4±0.1

4.0±0.1

1.75±0.1

3.5±0.1

3.6±0.1

1.5±0.3

0.2±0.05

+0.1

−0

.059 dia.

+.004

−0

Cathode side

Anode side

.008±.002

.059±.012

.142±.004

.094±.004

.157±.004

.079±.004

.039±.004 dia.

.069±.004

.315±.008

.138±.004

60±0.5 dia.

2.0±0.5 178±2 dia.

11.4±1.0

9.0±0.3

21.0±0.8 dia.

13.0±0.5 dia.

.079±.020

.827±.031 dia.

.512±.020 dia.

.449±.039

7.008±.079 dia.

2.362±.020 dia.

.354±.012

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Light sensors

Light Sensor (AMS1, 3, 4)

2) Through-hole type tape and reel (mm inch)

3) Chip type tape and reel (mm inch)

Light Sensor NaPiCa terminology

Type Tape dimensions

Light sensor

NaPiCa

Through-hole

type

AMS302T

Note: Zigzag tape style is used.

Symbol Symbol Dimensions Remarks

Feed hole pitch P012.7±0.3

.500±.012

Product interval pitch P 12.7±1.0

.500±.039

Product distance P26.35±1.3

.250±.051

Product bottom

distance H20.5±1.0

.807±.039

Lead interval F 2.54±0.5

.100±.020

Product slant ∆h0±1.0

0±.039

Product tilt ∆p0±1.0

0±.039

Tape width W 18.0

.709

Holding tape width W013.0±0.3

.512±.012

Feed hole position W19.0

.354

Holding tape distance W20 to 0.5

0 to .020

Feed hole diameter D03.8±0.2

.150±.008

Tape thickness t 0.5±0.2

.020±.008

Included holding

tape thickness

Defective product

cutoff position LMax.: 11.0 .433

Type Tape dimensions Dimensions of tape reel

Light sensor

NaPiCa

Chip type

AMS402Y

Te rm Symbol Explanation

Reverse voltage VRThe applied voltage between the cathode and anode.

Photocurrent ILThe current that ﬂows between the cathode and anode when light is applied.

Power dissipation P The electric power loss that occurs between the cathode and anode.

Operating temperature Topr The workable ambient temperature range at which normal operation is possible under the condition of a

prescribed allowable loss.

Storage temperature Tstg The ambient temperature range at which the sensor can be left or stored without applying voltage.

Peak sensitivity wavelength λpThe wavelength of light at which sensitivity is at its maximum.

Dark current IDThe current between the cathode and anode when reverse voltage is applied during darkness.

Rise time trTime required for the output waveform to rise from 10% to 90% when light is applied.

Fall time tfTime required for the output waveform to fall from 90% to 10% when light is cut.

∆p∆h

P2P

W0W2

Anode side Cathode side

+1.0

−0.5

+.039

−.020

+0.75

−0.5

+.030

−.020

Device

mounted

on tape

Cathode side

Anode side

Direction of

picking

0.2±0.05

.008±.002

0.9±0.3

.035±.012

2.25±0.1

.089±.004

4.0±0.1

.157±.004

1.5±0.1

.059±.004

4.0±0.1

.157±.004

2.0±0.1

.079±.004

1.5 dia.

+0.1

−0

.059 dia.

+.004

−0

1.75±0.1

.069±.004

3.5±0.1

.138±.004

0.8±0.1 dia.

.031±.004 dia.

8.0±0.2

.315±.008

2.0±0.5

.079±.020

11.4±1.0

.449±.039

178±2 dia.

7.008±.079 dia.

60±0.5 dia.

2.362±.020 dia.

9.0±0.3

.354±.012

21.0±0.8 dia.

.827±.031 dia.

13.0±0.5 dia.

.512±.020 dia.

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Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e