Metallized Polyester Capacitors (MKT)
Series/Type: B32559
The following products presented in this data sheet are being withdrawn.
Ordering Code Substitute Product Date of
Withdrawal Deadline Last
Orders Last
Shipments
B32559C8102M489 2017-06-09 2017-09-15 2017-12-15
B32559C8102M389 2017-06-09 2017-09-15 2017-12-15
B32559C8102M289 2017-06-09 2017-09-15 2017-12-15
Ordering Code Substitute Product Date of
Withdrawal Deadline Last
Orders Last
Shipments
B32559C8102M189 2017-06-09 2017-09-15 2017-12-15
B32559C8102M001 2017-06-09 2017-09-15 2017-12-15
B32559C8102M000 2017-06-09 2017-09-15 2017-12-15
B32559C8102K489 2017-06-09 2017-09-15 2017-12-15
B32559C8102K389 2017-06-09 2017-09-15 2017-12-15
B32559C8102K289 2017-06-09 2017-09-15 2017-12-15
B32559C8102K189 2017-06-09 2017-09-15 2017-12-15
B32559C8102K001 2017-06-09 2017-09-15 2017-12-15
B32559C8102K000 2017-06-09 2017-09-15 2017-12-15
B32559C8102J489 2017-06-09 2017-09-15 2017-12-15
B32559C8102J389 2017-06-09 2017-09-15 2017-12-15
B32559C8102J289 2017-06-09 2017-09-15 2017-12-15
B32559C8102J189 2017-06-09 2017-09-15 2017-12-15
B32559C8102J001 2017-06-09 2017-09-15 2017-12-15
B32559C8102J000 2017-06-09 2017-09-15 2017-12-15
For further information please contact your nearest EPCOS sales office, which will also support
you in selecting a suitable substitute. The addresses of our worldwide sales network are
presented at www.epcos.com/sales.
Typical applications
Energy saving lamps
Climatic
Max. operating temperature: 125 °C
Climatic category (IEC 60068-1): 55/125/56
Construction
Dielectric: polyethylene terephthalate
(polyester, PET)
Stacked-film technology
Heat shrinkable tube
standard types B32559C*:
polyester 100 µm, 125 °C
Features
Very small dimensions
Self-healing properties
High pulse strength
Terminals
Lead spacing 5.0 mm
Crimped wire leads, lead-free tinned,
lead length (6 1) mm
Straight wire leads, lead-free tinned,
lead length (6 1) mm
Special lead length available on request
Marking
Manufacturer's logo, rated capacitance (coded),
capacitance tolerance (code letter),
rated AC voltage, date of manufacture (coded)
Delivery mode
Bulk (untaped)
Taped (Ammo pack or reel)
For notes on taping, refer to chapter
"Taping and packing".
Detail specifications
Homologated to IEC 60384-2
Dimensional drawing
Dimensions in mm
Lead spacing
±0.4
Lead diameter d1
5.0 0.5
Metallized polyester film capacitors (MKT) B32559C
Compact design (stacked)
Page 2 of 23Please read Cautions and warnings and
Important notes at the end of this document.
Overview of available types
Lead spacing 5.0 mm
Type B32559C
Lead
configuration
straight / crimped
Page 4
VR(V DC) 63 100 250 400 630
VRMS (V AC) 40 63 160 200 400
CR(µF)
0.0010
0.0015
0.0022
0.0027
0.0033
0.0047
0.0068
0.0082
0.010
0.012
0.015
0.022
0.027
0.033
0.047
0.056
0.068
0.10
0.12
0.15
0.22
0.33
0.47
0.68
1.0
B32559C
Compact design (stacked)
Page 3 of 23Please read Cautions and warnings and
Important notes at the end of this document.
Ordering codes and packing units
VR
V DC
VRMS
f≤60 Hz
V AC
CR
µF
Max. dimensions
w×h×l
mm
Ordering code
(composition see
below)
Ammo
pack
pcs./MOQ
Reel
pcs./MOQ
Untaped
pcs./MOQ
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Further E series and intermediate capacitance values on request.
Composition of ordering code
+ = Capacitance tolerance code: *** = Packaging code:
M = ±20%
K = ±10%
J = ±5%
489 = Ammo pack straight
389 = Reel straight
289 = Ammo pack crimped
189 = Reel crimped
000 = Untaped crimped (lead length 6 1 mm)
001 = Untaped (lead length 6 1 mm)
63 40 0.22 3.0 ×6.5 ×7.0 B32559C0224+*** 11200 9600 10000
0.33 3.0 ×6.5 ×7.0 B32559C0334+*** 12000 10400 10000
0.47 3.5 ×7.0 ×7.0 B32559C0474+*** 12000 10400 10000
0.68 3.5 ×8.5 ×7.0 B32559C0684+*** 9200 7600 8000
1.0 4.0 ×10.5 ×7.0 B32559C0105+*** 9200 7600 8000
100 63 0.033 3.0 ×6.5 ×7.0 B32559C1333+*** 12000 10400 12000
0.047 3.0 ×6.5 ×7.0 B32559C1473+*** 12800 11200 12000
0.056 3.0 ×7.0 ×7.0 B32559C1563+*** 12000 10400 12000
0.068 3.0 ×7.0 ×7.0 B32559C1683+*** 12800 11200 12000
0.10 3.0 ×7.0 ×7.0 B32559C1104+*** 12800 11200 12000
0.12 3.0 ×7.0 ×7.0 B32559C1124+*** 12800 11200 12000
0.15 3.0 ×7.0 ×7.0 B32559C1154+*** 12800 11200 12000
0.22 3.5 ×8.5 ×7.0 B32559C1224+*** 11600 10000 12000
0.33 3.5 ×8.5 ×7.0 B32559C1334+*** 11600 10000 12000
0.47 3.5 ×9.0 ×7.0 B32559C1474+*** 10000 8400 10000
250 160 0.022 3.0 ×7.0 ×7.0 B32559C3223+*** 12800 11200 12000
0.027 3.0 ×7.0 ×7.0 B32559C3273+*** 12800 11200 12000
0.033 3.0 ×7.0 ×7.0 B32559C3333+*** 12000 10400 12000
0.047 3.0 ×7.0 ×7.0 B32559C3473+*** 12800 11200 12000
0.056 3.0 ×7.0 ×7.0 B32559C3563+*** 10800 9200 1000
0.068 3.5 ×7.0 ×7.0 B32559C3683+*** 10800 9200 1000
0.10 3.5 ×9.0 ×7.0 B32559C3104+*** 12000 10400 8000
0.12 4.5 ×9.0 ×7.0 B32559C3124+*** 7200 5800 8000
0.15 4.5 ×10.0 ×7.0 B32559C3154+*** 7200 5600 8000
B32559C
Compact design (stacked)
Page 4 of 23Please read Cautions and warnings and
Important notes at the end of this document.
Ordering codes and packing units
VR
V DC
VRMS
f≤60 Hz
V AC
CR
µF
Max. dimensions
w×h×l
mm
Ordering code
(composition see
below)
Ammo
pack
pcs./MOQ
Reel
pcs./MOQ
Untaped
pcs./MOQ
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Further E series and intermediate capacitance values on request.
Composition of ordering code
+ = Capacitance tolerance code: *** = Packaging code:
M = ±20%
K = ±10%
J = ±5%
489 = Ammo pack straight
389 = Reel straight
289 = Ammo pack crimped
189 = Reel crimped
000 = Untaped crimped (lead length 6 1 mm)
001 = Untaped (lead length 6 1 mm)
400 200 0.0068 3.0 ×7.0 ×7.0 B32559C6682+*** 12800 11200 12000
0.0082 3.0 ×7.0 ×7.0 B32559C6822+*** 12800 11200 12000
0.010 3.0 ×7.5 ×7.0 B32559C6103+*** 12800 11200 12000
0.012 3.0 ×7.5 ×7.0 B32559C6123+*** 12000 10400 12000
0.015 3.0 ×7.5 ×7.0 B32559C6153+*** 11200 9600 12000
0.022 3.0 ×8.0 ×7.0 B32559C6223+*** 12800 11200 12000
0.027 3.0 ×8.0 ×7.0 B32559C6273+*** 10800 9200 11200
0.033 3.5 ×8.0 ×7.0 B32559C6333+*** 9200 7600 10000
0.047 3.5 ×9.5 ×7.0 B32559C6473+*** 9200 7600 8000
0.056 4.0 ×10.0 ×7.0 B32559C6563+*** 8000 6400 6000
0.068 5.0 ×10.0 ×7.0 B32559C6683+*** 7200 5600 7200
0.10 5.5 ×12.5 ×7.0 B32559C6104+*** 6000 4400 7200
0.12 5.5 ×13.0 ×7.0 B32559C6124+*** 6000 4400 4800
630 400 0.0010 3.0 ×7.0 ×7.0 B32559C8102+*** 12800 11200 12000
0.0015 3.0 ×7.0 ×7.0 B32559C8152+*** 12800 11200 12000
0.0022 3.0 ×8.0 ×7.0 B32559C8222+*** 12800 11200 12000
0.0027 3.0 ×8.0 ×7.0 B32559C8272+*** 12800 11200 12000
0.0033 3.5 ×8.0 ×7.0 B32559C8332+*** 10000 8400 8000
0.0047 3.5 ×8.0 ×7.0 B32559C8472+*** 12000 10400 8000
0.0068 3.5 ×10.5 ×7.0 B32559C8682+*** 12000 10400 8000
0.0082 3.5 ×10.5 ×7.0 B32559C8822+*** 12000 10400 8000
0.010 4.0 ×10.5 ×7.0 B32559C8103+*** 9200 7600 8800
B32559C
Compact design (stacked)
Page 5 of 23Please read Cautions and warnings and
Important notes at the end of this document.
Technical data
Operating temperature range Max. operating temperature Top,max +125 °C
Upper category temperature Tmax +125 °C
Lower category temperature Tmin 55 °C
Rated temperature TR+85 °C
Dissipation factor tan δ(in 10-3) at CR≤0.1 µF 0.1 µF<CR≤1µF
at 20 °C1 kHz 8 10
(upper limit values) 10 kHz 15 20
100 kHz 30
Insulation resistance Rins VRCR≤0.33 µF CR> 0.33 µF
or time constant τ= CRRins ≤100 V DC 3750 MΩ1250 s
at 20 °C, rel. humidity ≤65%
(minimum as-delivered values) ≥250 V DC 7500 MΩ2500 s
DC test voltage 1.4 VR,2s
Category voltage VCTA(°C) DC voltage derating AC voltage derating
(continuous operation with VDC TA≤85 VC= VRVC,RMS = VRMS
or VAC atf≤60 Hz) 85<TA≤125 VC= VR(165TA)/80 VC,RMS=VRMS (165TA)/80
Operating voltage Vop for TA(°C) DC voltage (max. hours) AC voltage (max. hours)
short operating periods TA≤100 Vop = 1.25 VC(2000 h) Vop = 1.0 VC,RMS (2000 h)
(VDC or VAC atf≤60 Hz) 100<TA≤125 Vop = 1.25 VC(1000 h) Vop = 1.0 VC,RMS (1000 h)
Damp heat test 56 days/40 °C/93% relative humidity
Limit values after damp Capacitance change ∆C/C≤5%
heat test Dissipation factor change ∆tan δ ≤ 510-3 (at 1 kHz)
Insulation resistance Rins ≥50% of minimum
or time constant τ= CRRins as-delivered values
Reliability:
Failure rate λ1 fit (≤110-9/h) at 0.5 VR,40°C
Service life tSL 200 000 h at 1.0 VR,85°C
For conversion to other operating conditions and temperatures,
refer to chapter "Quality, 2 Reliability".
Failure criteria:
Total failure Short circuit or open circuit
Failure due to variation Capacitance change ∆C/C> 10%
of parameters Dissipation factor tan δ>2upper limit value
Insulation resistance Rins < 150 MΩ(CR≤0.33 µF)
or time constant τ= CRRins < 50 s (CR> 0.33 µF)
Soldering conditions Maximum solder bath temperature
Maximum soldering time
260 °C
4 s
B32559C
Compact design (stacked)
Page 6 of 23Please read Cautions and warnings and
Important notes at the end of this document.
Pulse handling capability
"dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal
voltages, expressed in V/µs.
"k0" represents the maximum permissible pulse characteristic of the waveform applied to the
capacitor, expressed in V2/µs.
Note:
The values of dV/dt and k0provided below must not be exceeded in order to avoid damaging the
capacitor.
dV/dt and k0values
VR(V DC) VRMS (V AC) dV/dt in V/µs k0in V2/µs
63 40 250 30 000
100 63 300 60 000
250 160 400 200 000
400 200 600 500 000
630 400 800 1 000 000
B32559C
Compact design (stacked)
Page 7 of 23Please read Cautions and warnings and
Important notes at the end of this document.
Impedance Z versus frequency f
(typical values)
B32559C
Compact design (stacked)
Page 8 of 23Please read Cautions and warnings and
Important notes at the end of this document.
Permissible AC voltage VRMS versus frequency f (for sinusoidal waveforms, TA≤55 °C)
For TA>55 °C, please refer to "General technical information", section 3.2.3.
Lead spacing 5 mm
63 V DC/40 V AC 100 V DC/63 V AC
250 V DC/160 V AC 400 V DC/200 V AC
B32559C
Compact design (stacked)
Page 9 of 23Please read Cautions and warnings and
Important notes at the end of this document.
Permissible AC voltage VRMS versus frequency f (for sinusoidal waveforms, TA≤55 °C)
For TA>55 °C, please refer to "General technical information", section 3.2.3.
Lead spacing 5 mm
630 V DC/400 V AC
B32559C
Compact design (stacked)
Page 10 of 23Please read Cautions and warnings and
Important notes at the end of this document.
Permissible AC current IRMS versus frequency f
Lead spacing 5 mm
63 V DC/40 V AC 100 V DC/63 V AC
250 V DC/160 V AC 400 V DC/200 V AC
B32559C
Compact design (stacked)
Page 11 of 23Please read Cautions and warnings and
Important notes at the end of this document.
Permissible AC current IRMS versus frequency f
Lead spacing 5 mm
630 V DC/400 V AC
B32559C
Compact design (stacked)
Page 12 of 23Please read Cautions and warnings and
Important notes at the end of this document.
Mounting guidelines
1 Soldering
1.1 Solderability of leads
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1.
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 °C). Since the ageing temperature is far
higher than the upper category temperature of the capacitors, the terminal wires should be cut off
from the capacitor before the ageing procedure to prevent the solderability being impaired by the
products of any capacitor decomposition that might occur.
Solder bath temperature 235 ±5°C
Soldering time 2.0 ±0.5 s
Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane
Evaluation criteria:
Visual inspection Wetting of wire surface by new solder ≥90%, free-flowing solder
1.2 Resistance to soldering heat
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A.
Conditions:
Series Solder bath temperature Soldering time
MKT boxed (except 2.5 ×6.5 ×7.2 mm)
coated
uncoated (lead spacing > 10 mm)
260 ±5°C 10 ±1 s
MFP
MKP (lead spacing > 7.5 mm)
MKT boxed (case 2.5 ×6.5 ×7.2 mm) 5±1 s
MKP
MKT
(lead spacing ≤7.5 mm)
uncoated (lead spacing ≤10 mm)
insulated (B32559)
<4s
recommended soldering
profile for MKT uncoated
(lead spacing ≤10 mm) and
insulated (B32559)
B32559C
Compact design (stacked)
Page 13 of 23Please read Cautions and warnings and
Important notes at the end of this document.
Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane
Shield Heat-absorbing board, (1.5 ±0.5) mm thick, between capacitor
body and liquid solder
Evaluation criteria:
Visual inspection No visible damage
∆C/C0
2% for MKT/MKP/MFP
5% for EMI suppression capacitors
tan δAs specified in sectional specification
B32559C
Compact design (stacked)
Page 14 of 23Please read Cautions and warnings and
Important notes at the end of this document.
1.3 General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature Tmax. Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 °C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 °C
MKT 160 °C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 °C in the preheater phase
rapid cooling after soldering
B32559C
Compact design (stacked)
Page 15 of 23Please read Cautions and warnings and
Important notes at the end of this document.
2 Cleaning
To determine whether the following solvents, often used to remove flux residues and other sub-
stances, are suitable for the capacitors described, refer to the table below:
Type Ethanol,
isopropanol,
n-propanol
n-propanol-water
mixtures,
water with surface
tension-reducing
tensides (neutral)
Solvent from
table A (see
next page)
Solvent from
table B (see
next page)
MKT
(uncoated)
Suitable Unsuitable In part suitable Unsuitable
MKT, MKP, MFP
(coated/boxed)
Suitable Suitable
Even when suitable solvents are used, a reversible change of the electrical characteristics may
occur in uncoated capacitors immediately after they are washed. Thus it is always recommended
to dry the components (e.g. 4 h at 70 °C) before they are subjected to subsequent electrical test-
ing.
Table A
Manufacturers' designations for trifluoro-trichloro-ethane-based cleaning solvents (selection)
Trifluoro-trichloro-
ethane
Mixtures of trifluoro-trichloro-ethane with ethanol and
isopropanol
Manufacturer
Freon TF Freon TE 35; Freon TP 35; Freon TES Du Pont
Frigen 113 TR Frigen 113 TR-E; Frigen 113 TR-P; Frigen TR-E 35 Hoechst
Arklone P Arklone A; Arklone L; Arklone K ICI
Kaltron 113 MDR Kaltron 113 MDA; Kaltron 113 MDI; Kaltron 113 MDI 35 Kali-Chemie
Flugene 113 Flugene 113 E; Flugene 113 IPA Rhone-Progil
Table B (worldwide banned substances)
Manufacturers' designations for unsuitable cleaning solvents (selection)
Mixtures of chlorinated hydrocarbons and ketones with fluorated hydrocarbons Manufacturer
Freon TMC; Freon TA; Freon TC Du Pont
Arklone E ICI
Kaltron 113 MDD; Kaltron 113 MDK Kali-Chemie
Flugene 113 CM Rhone-Progil
B32559C
Compact design (stacked)
Page 16 of 23Please read Cautions and warnings and
Important notes at the end of this document.
3 Embedding of capacitors in finished assemblies
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 °C.
Caution:
Consult us first if you wish to embed uncoated types!
B32559C
Compact design (stacked)
Page 17 of 23Please read Cautions and warnings and
Important notes at the end of this document.
Cautions and warnings
Do not exceed the upper category temperature (UCT).
Do not apply any mechanical stress to the capacitor terminals.
Avoid any compressive, tensile or flexural stress.
Do not move the capacitor after it has been soldered to the PC board.
Do not pick up the PC board by the soldered capacitor.
Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified
lead spacing.
Do not exceed the specified time or temperature limits during soldering.
Avoid external energy inputs, such as fire or electricity.
Avoid overload of the capacitors.
The table below summarizes the safety instructions that must always be observed. A detailed de-
scription can be found in the relevant sections of the chapters "General technical information" and
"Mounting guidelines".
Topic Safety information Reference chapter
"General technical
information"
Storage conditions Make sure that capacitors are stored within the
specified range of time, temperature and humidity
conditions.
4.5
"Storage conditions"
Flammability Avoid external energy, such as fire or electricity
(passive flammability), avoid overload of the
capacitors (active flammability) and consider the
flammability of materials.
5.3
"Flammability"
Resistance to
vibration
Do not exceed the tested ability to withstand
vibration. The capacitors are tested to
IEC 60068-2-6.
EPCOS offers film capacitors specially designed
for operation under more severe vibration regimes
such as those found in automotive applications.
Consult our catalog "Film Capacitors for
Automotive Electronics".
5.2
"Resistance to vibration"
B32559C
Compact design (stacked)
Page 18 of 23Please read Cautions and warnings and
Important notes at the end of this document.
Topic Safety information Reference chapter
"Mounting guidelines"
Soldering Do not exceed the specified time or temperature
limits during soldering.
1 "Soldering"
Cleaning Use only suitable solvents for cleaning capacitors. 2 "Cleaning"
Embedding of
capacitors in
finished assemblies
When embedding finished circuit assemblies in
plastic resins, chemical and thermal influences
must be taken into account.
Caution: Consult us first, if you also wish to
embed other uncoated component types!
3 "Embedding of
capacitors in finished
assemblies"
B32559C
Compact design (stacked)
Page 19 of 23Please read Cautions and warnings and
Important notes at the end of this document.
Symbols and terms
Symbol English German
αHeat transfer coefficient Wärmeübergangszahl
αCTemperature coefficient of capacitance Temperaturkoeffizient der Kapazität
A Capacitor surface area Kondensatoroberfläche
βCHumidity coefficient of capacitance Feuchtekoeffizient der Kapazität
C Capacitance Kapazität
CRRated capacitance Nennkapazität
∆C Absolute capacitance change Absolute Kapazitätsänderung
∆C/C Relative capacitance change (relative
deviation of actual value)
Relative Kapazitätsänderung (relative
Abweichung vom Ist-Wert)
∆C/CRCapacitance tolerance (relative deviation
from rated capacitance)
Kapazitätstoleranz (relative Abweichung
vom Nennwert)
dt Time differential Differentielle Zeit
∆t Time interval Zeitintervall
∆T Absolute temperature change
(self-heating)
Absolute Temperaturänderung
(Selbsterwärmung)
∆tan δAbsolute change of dissipation factor Absolute Änderung des Verlustfaktors
∆V Absolute voltage change Absolute Spannungsänderung
dV/dt Time differential of voltage function (rate
of voltage rise)
Differentielle Spannungsänderung
(Spannungsflankensteilheit)
∆V/∆t Voltage change per time interval Spannungsänderung pro Zeitintervall
E Activation energy for diffusion Aktivierungsenergie zur Diffusion
ESL Self-inductance Eigeninduktivität
ESR Equivalent series resistance Ersatz-Serienwiderstand
f Frequency Frequenz
f1Frequency limit for reducing permissible
AC voltage due to thermal limits
Grenzfrequenz für thermisch bedingte
Reduzierung der zulässigen
Wechselspannung
f2Frequency limit for reducing permissible
AC voltage due to current limit
Grenzfrequenz für strombedingte
Reduzierung der zulässigen
Wechselspannung
frResonant frequency Resonanzfrequenz
FDThermal acceleration factor for diffusion Therm. Beschleunigungsfaktor zur
Diffusion
FTDerating factor Deratingfaktor
i Current (peak) Stromspitze
ICCategory current (max. continuous
current)
Kategoriestrom (max. Dauerstrom)
B32559C
Compact design (stacked)
Page 20 of 23Please read Cautions and warnings and
Important notes at the end of this document.
Symbol English German
IRMS (Sinusoidal) alternating current,
root-mean-square value
(Sinusförmiger) Wechselstrom
izCapacitance drift Inkonstanz der Kapazität
k0Pulse characteristic Impulskennwert
LSSeries inductance Serieninduktivität
λFailure rate Ausfallrate
λ0Constant failure rate during useful
service life
Konstante Ausfallrate in der
Nutzungsphase
λtest Failure rate, determined by tests Experimentell ermittelte Ausfallrate
Pdiss Dissipated power Abgegebene Verlustleistung
Pgen Generated power Erzeugte Verlustleistung
Q Heat energy Wärmeenergie
ρDensity of water vapor in air Dichte von Wasserdampf in Luft
R Universal molar constant for gases Allg. Molarkonstante für Gas
R Ohmic resistance of discharge circuit Ohmscher Widerstand des
Entladekreises
RiInternal resistance Innenwiderstand
Rins Insulation resistance Isolationswiderstand
RPParallel resistance Parallelwiderstand
RSSeries resistance Serienwiderstand
S severity (humidity test) Schärfegrad (Feuchtetest)
t Time Zeit
T Temperature Temperatur
τTime constant Zeitkonstante
tan δDissipation factor Verlustfaktor
tan δDDielectric component of dissipation
factor
Dielektrischer Anteil des Verlustfaktors
tan δPParallel component of dissipation factor Parallelanteil des Verlfustfaktors
tan δSSeries component of dissipation factor Serienanteil des Verlustfaktors
TAAmbient temperature Umgebungstemperatur
Tmax Upper category temperature Obere Kategorietemperatur
Tmin Lower category temperature Untere Kategorietemperatur
tOL Operating life at operating temperature
and voltage
Betriebszeit bei Betriebstemperatur und
-spannung
Top Operating temperature Beriebstemperatur
TRRated temperature Nenntemperatur
Tref Reference temperature Referenztemperatur
tSL Reference service life Referenz-Lebensdauer
VAC AC voltage Wechselspannung
B32559C
Compact design (stacked)
Page 21 of 23Please read Cautions and warnings and
Important notes at the end of this document.
Symbol English German
VCCategory voltage Kategoriespannung
VC,RMS Category AC voltage (Sinusförmige)
Kategorie-Wechselspannung
VCD Corona-discharge onset voltage Teilentlade-Einsatzspannung
Vch Charging voltage Ladespannung
VDC DC voltage Gleichspannung
VFB Fly-back capacitor voltage Spannung (Flyback)
ViInput voltage Eingangsspannung
VoOutput voltage Ausgangssspannung
Vop Operating voltage Betriebsspannung
VpPeak pulse voltage Impuls-Spitzenspannung
Vpp Peak-to-peak voltage Impedance Spannungshub
VRRated voltage Nennspannung
RAmplitude of rated AC voltage Amplitude der Nenn-Wechselspannung
VRMS (Sinusoidal) alternating voltage,
root-mean-square value
(Sinusförmige) Wechselspannung
VSC S-correction voltage Spannung bei Anwendung "S-correction"
Vsn Snubber capacitor voltage Spannung bei Anwendung
"Beschaltung"
Z Impedance Scheinwiderstand
Lead spacing Rastermaß
B32559C
Compact design (stacked)
Page 22 of 23Please read Cautions and warnings and
Important notes at the end of this document.
Page 23 of 23
Important notes
The following applies to all products named in this publication:
1.
Some parts of this publication contain
statements about the suitability of our products for certain
areas of application
. These statements are based on our knowledge of typical requirements that are
often placed on our products in the areas of application concerned. We nevertheless expressly point
out
that such statements cannot be regarded as binding statements about the suitability of our
products for a particular customer application.
As a rule we are either unfamiliar with individual
customer applications or less familiar with them than the customers themselves. For these reasons, it is
always ultimately incumbent on the customer to check and decide whether a product with the properties
described in the product specification is suitable for use in a particular customer application.
2.
We also point out that
in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current state of the
art, even if they are operated as specified.
In customer applications requiring a very high level of
operational safety and especially in customer applications in which the malfunction or failure of an
electronic component could endanger human life or health (e.g. in accident prevention or life-saving
systems), it must therefore be ensured by means of suitable design of the customer application or other
action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or
damage is sustained by third parties in the event of malfunction or failure of an electronic component.
3.
The warnings, cautions and product-specific notes must be observed.
4.
In order to satisfy certain technical requirements,
some of the products described in this publication
may contain substances subject to restrictions in certain jurisdictions (e.g. because they are
classed as hazardous)
. Useful information on this will be found in our Material Data Sheets on the
Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please
contact our sales offices.
5.
We constantly strive to improve our products. Consequently,
the products described in this
publication may change from time to time
. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications contained
in this publication are still applicable before or when you place an order.
We also
reserve the right to discontinue production and delivery of products
. Consequently, we
cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the foregoing for
customer-specific products.
6.
Unless otherwise agreed in individual contracts,
all orders are subject to our General Terms and
Conditions of Supply.
7.
Our manufacturing sites serving the automotive business apply the IATF 16949 standard.
The
IATF certifications confirm our compliance with requirements regarding the quality management system
in the automotive industry. Referring to customer requirements and customer specific requirements
(“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even
if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to
emphasize that
only requirements mutually agreed upon can and will be implemented in our
Quality Management System.
For clarification purposes we like to point out that obligations from IATF
16949 shall only become legally binding if individually agreed upon.
8.
The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,
DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap,
PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI,
SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are
trademarks registered or pending
in Europe and in other countries. Further information will be found
on the Internet at www.tdk-electronics.tdk.com/trademarks.
Release 2018-10
