PC956L0NSZ0F
Series
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC956L)
2. Approved by VDE, DIN EN60747-5-2(∗) (as an
option), file No. 40008898 (as model No. PC956L)
3. Package resin : UL flammability grade (94V-0)
(∗)DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Features
■ Agency approvals/Compliance
1. Programmable controller
2. Inverter
■ Applications
High Speed 2Mb/s, High CMR
DIP 8 pin ∗OPIC Photocoupler
1. 8 pin DIP package
2. Double transfer mold package
(Ideal for Flow Soldering)
3. High noise immunity due to high instantaneous
common mode rejection voltage (CMH : MIN.
15kV/µs, CML : MIN. −15kV/µs)
4. High speed response
(tPHL : TYP. 210 ns, tPLH : TYP. 400 ns)
5. High isolation voltage between input and output
(Viso(rms) : 5.0 kV)
6. Lead-free and RoHS directive compliant
■ Description
PC956L0NSZ0F Series contains a LED optically
coupled to an OPIC chip.
It is packaged in a 8 pin DIP, available in SMT
gullwing lead form option.
Input-output isolation voltage(rms) is 5.0kV, High
speed response (TYP. 2Mb/s) and CMR is MIN.
15kV/µs.
1Sheet No.: D2-A05502EN
Date Jun. 30. 2005
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PC956L0NSZ0F Series
∗
"OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing
circuit integrated onto a single chip.
■ Internal Connection Diagram
8 7 6 5
1 2 3 4
1
2
3
4
5
6
7
8
Amp.
NC
Anode
Cathode
NC
VL
GND
VO
VCC
Voltage
regulator
2
Sheet No.: D2-A05502EN
■ Outline Dimensions (Unit : mm)
1. Through-Hole [ex. PC956L0NSZ0F] 2. Through-Hole (VDE option) [ex. PC956L0YSZ0F]
3. SMT Gullwing Lead-Form [ex. PC956L0NIP0F]4. SMT Gullwing Lead-Form (VDE option)
[ex. PC956L0YIP0F]
Product mass : approx. 0.55gProduct mass : approx. 0.55g
Product mass : approx. 0.51g
Plating material : SnCu (Cu : TYP. 2%)
Product mass : approx. 0.51g
PC956L
2.54±0.25
8 7 6 5
Primary side
mark
6.5±0.5
0.85±0.2
1.2±0.3
9.66±0.5
3.5
±0.5
0.5±0.1
0.5TYP.
1 2 3 4
3.05±0.5
3.4±0.5
θ θ
θ:0 to 13˚
7.62±0.3
0.26±0.1
Epoxy resin
Date code
PC956L
4
VDE Identification mark
2.54±0.25
8 7 6 5
Primary side
mark
6.5±0.5
0.85±0.2
1.2±0.3
9.66±0.5
3.5
±0.5
0.5±0.1
0.5TYP.
1 2 3 4
3.05±0.5
3.4±0.5
θ θ
θ:0 to 13˚
7.62±0.3
0.26±0.1
Epoxy resin
Date code
PC956L
0.85±0.2
1.2±0.3
Primary side
mark
78 6 5
4
6.5±0.5
1 2 3
2.54±0.25
3.5±0.5
1.0+0.4
−0
0.26±0.1
Epoxy resin
10.0+0
−0.5
1.0+0.4
−0
0.35±0.25
7.62±0.3
9.66±0.5
Date code
PC956L
4
0.85±0.2
1.2±0.3
78 6 5
4
6.5±0.5
VDE Identification mark
1 2 3
2.54±0.25
3.5±0.5
1.0+0.4
−0
0.26±0.1
Epoxy resin
10.0+0
−0.5
1.0+0.4
−0
0.35±0.25
7.62±0.3
9.66±0.5
Date code
Primary side
mark
PC956L0NSZ0F Series
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
C
D
E
F
H
J
K
L
M
N
Mark
P
R
S
T
U
V
W
X
A
B
C
Mark
1
2
3
4
5
6
7
8
9
O
N
D
Month
January
February
March
April
May
June
July
August
September
October
November
December
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
·
·
··
·
·
2nd digit
Month of production
1st digit
Year of production
3
repeats in a 20 year cycle
Sheet No.: D2-A05502EN
PC956L0NSZ0F Series
Country of origin
Japan
Rank mark
There is no rank mark indicator.
Sheet No.: D2-A05502EN
■ Electro-optical Characteristics*6
Parameter Symbol Unit
Input
V
µA
Operating supply voltage
Low level output current
High level supply current
Ta=25˚C, V=0, f=1MHz pF
Output
VOL
VCC
IOL
High level output current IOH
ICCH
Low level supply current ICCL
mA
mA
Transfer characteristics
"High→Low" input threshold current
Isolation resistance
Floating capacitance
Internal pull-up resistance
IFHL
RISO
Cf
RL
mA
Ω
pF
kΩ
tPLH
ns
tPHL
ns
Propagation delay skew
∆tw ns
Distortion of pulse width
TPSK ns
Instantaneous common mode rejection
voltage
(High level output)
Ta=25˚C, IF=10mA, VCC=15V,
CL=100pF, VCM=1.5kV(P-P), RL=20kΩ,
VO<1.0V, Short circuit between
pin and pin
Instantaneous common mode rejection
voltage
(Low level output)
CMLkV/µs
Ta=25˚C, IF=10mA
Ta=25˚C, VR=5V
MIN.
−
−
−
5×1010
−
14
30
270
−
−
−
−
−
−15
MAX.
10
250
1.3
1.3
5
−
1
25
450
450
−
1.95
400
550
Conditions
"Low→High" propagation delay time
"High→Low" propagation delay time
Response time
CMH
−
IF=10mA, Vo=0.6V
IF=0, VCC=Vo
IF=10mA, Io=2.4mA
IF=0, Vo=OPEN
IF=10mA, Vo=OPEN
Vo=0.8V, RL=20kΩ, VCC=15V
Short circuit between pin and pin
Ta=25˚C, DC500V, 40 to 60%RH
Ta=25˚C, V=0, f=1MHz
Ta=25˚C
IF=10mA (tpHL), IF=0 (tpLH),
VCC=15V, RL=20kΩ, CL=100pF
VTHLH=2.0V, VTHHL=1.5V
Short circuit between pin and
TYP.
−
V
4.5 35−
60
V
−0.60.3
0.6
mA4.4 −
9
µA−50
5
0.8
1.5
1011
0.6
20
190
200
1.6
210
400
kV/µs15 −30
−30
(unless otherwise specified Ta=−40 to +85˚C, VCC=4.5 to 35V)
Low level output voltage
Forward voltage
Reverse current
Terminal capacitance
VF
IR
Ct
*6 It shall connect a by-pass capacitor of 0.01µF or more between VCC (pin
8
) and GND (pin
5
)
near the device, when it measures the transfer characteristics and the output side
characteristics
*7 Distortion of pulse width ∆tw= | tPHL−tPLH |
7
7
8
7 8
Ta=25˚C, IF=0, VCC=15V,
CL=100pF, VCM=1.5kV(P-P), RL=20kΩ,
VO>3.0V, Short circuit between
pin and pin
7 8
8
pin
■ Absolute Maximum Ratings
Parameter Symbol Rating Unit
Forward current IF25 mA
mA
Reverse voltage
Input
Output
VR5V
V
Power dissipation
P45
Supply voltage
Output voltage
Output current
Power dissipation
100
15
mW
mW
VO
PO
IO
V
VCC
Viso (rms) kV
Operating temperature Topr
−55 to +125
−40 to +85
−0.5 to +35
−0.5 to +35
˚C
˚C
Storage temperature
Isolation voltage
Tstg
*4
*3
*2
*1
*5 Soldering temperature Tsol 270
5.0
˚C
(Ta=25˚C)
*1 When ambient temperature goes above 70˚C, the power dissipation goes down
at approx. 0.5mA/˚C.(Fig.3)
*2 When ambient temperature goes above 70˚C, the power dissipation goes down
at approx. 0.8mW/˚C.(Fig.4)
*3 When ambient temperature goes above 70˚C, the power dissipation goes down
at approx. 1.8mW/˚C.(Fig.4)
*4 40 to 60%RH, AC for 1minute, f=60Hz
*5 For 10s
4
PC956L0NSZ0F Series
Sheet No.: D2-A05502EN
■ Model Line-up
PC956L0NSZ0F PC956L0YSZ0F
−−−−−− Approved
PC956L0NIP0F PC956L0YIP0F
Lead Form
Package
Model No.
DIN EN60747-5-2
Sleeve Taping
Through-Hole
50pcs/sleeve 1 000pcs/reel
SMT Gullwing
−−−−−− Approved
5
Please contact a local SHARP sales representative to inquire about production status.
PC956L0NSZ0F Series
Sheet No.: D2-A05502EN
Fig.4 Power Dissipation vs. Ambient
Temperature
Fig.3 Forward Current vs. Ambient
Temperature
6
PC956L0NSZ0F Series
Fig.1 Test Circuit for Propagation Delay Time
Fig.2 Test Circuit for Common Mode Rejection Voltage
tPHL tPLH
tf
90%
10%
IF
RL
GND
CL
0.1µF
VOL
VTHLH
VTHHL
10mA
0mA
IF
VO
VO
VCC
47Ω
Amp.
Voltage
regulator
tr
1.5kV
0VVCM
CMH,VO
CML,VO
(IF=0)
(IF=10mA)
SW is A
SW is B
VCC
VO (MIN.)
VO (MAX.)
VOL
VCM
+−
AB
RL
GND
CL
0.1µF
IF
VO
VCC
Amp.
Voltage
regulator
Forward current IF (mA)
Ambient temperature Ta (˚C)
0
5
10
15
20
25
−40 0 25 50 75 100 125−25
8570
Power dissipation P, PO (mW)
Ambient temperature Ta (˚C)
0
20
40
45
60
80
100
−40 0 25 50 100 125−25
P
PO
75
8570
Sheet No.: D2-A05502EN
Fig.10 Supply Current vs. Ambient
Temperature
Fig.9 Low Level Output Voltage vs. Ambient
Temperature
Fig.7 Relative Output Current vs. Ambient
Temperature
Fig.8 Input Threshold Current vs. Ambient
Temperature
7
PC956L0NSZ0F Series
Fig.5 Output Current vs. Forward Current Fig.6 Forward Current vs. Forward Voltage
Output current IO (mA)
0
15
10
5
05 1510 20
Forward current IF (mA)
VO=0.6V
T
a
=−40˚C
Ta=25˚C
Ta=100˚C
Ta=75˚C
Forward voltage VF (V)
Forward current IF (mA)
1
10
100
0.1
1.0 1.2 1.4 1.6 1.8 2.0
Ta=75˚C
Ta=50˚C
Ta=25˚C
Ta=0˚C
Ta=−20˚C
Ta=−40˚C
−40 0−20 60 804020 100
Supply current ICCH, ICCL (mA)
0
1.6
0.6
0.4
0.2
1.2
1.4
0.8
1.0
Ambient temperature Ta (˚C)
VCC=35V
VO=Open
ICCH:IF=0
ICCL:IF=10mA
ICCL
ICCH
Relative output current IO (%)
60
120
70
100
110
80
90
−40 0−20 60 804020 100
Ambient temperature Ta (˚C)
IF=10mA
VO=0.6V
IO=100% at Ta=25˚C
−40 0−20 60 804020 100
Input threshold current IFHL (mA)
0
5
2
3
4
Ambient temperature Ta (˚C)
VCC=15V
VO=0.8V
RL=20kΩ
1
−40 0−20 60 804020 100
Low level output voltage VOL (V)
0
0.6
0.3
0.4
0.5
Ambient temperature Ta (˚C)
VCC=4.5V
IF=10mA
IO=2.4mA
0.2
0.1
Sheet No.: D2-A05502EN
Fig.13 Propagation Delay Time vs. Load
Capacitance
Fig.14 Propagation Delay Time vs. Supply
Voltage
Fig.15 Propagation Delay Time vs. Forward
Current
8
PC956L0NSZ0F Series
Fig.12 Propagation Delay Time vs. Load
Resistance
Fig.11 Propagation Delay Time vs. Ambient
Temperature
Remarks : Please be aware that all data in the graph
are just for reference and not for guarantee.
−40 0−20 60 804020 100
Propagation delay time tPHL, tPLH (µs)
0
2.0
0.2
0.4
1.8
0.6
0.8
1.0
1.2
1.4
1.6
Ambient temperature Ta (˚C)
tPLH
tPHL
IF=10mA
VCC=15V
CL=100pF
RL=20kΩ
Propagation delay time tPHL, tPLH (µs)
0
2.0
0.2
0.4
1.8
0.6
0.8
1.0
1.2
1.4
1.6
04210161814128620
Forward current IF (mA)
tPLH
tPHL
VCC=15V
CL=100pF
RL=20kΩ
Ta=25˚C
Propagation delay time tPHL, tPLH (µs)
0
2.0
0.2
0.4
1.8
0.6
0.8
1.0
1.2
1.4
1.6
Load resistance RL (kΩ)
IF=10mA
VCC=15V
CL=100pF
Ta=25˚C
tPLH
tPHL
051015 20 25 30 35 40 45 50
Propagation delay time tPHL, tPLH (µs)
0
2.0
0.2
0.4
1.8
0.6
0.8
1.0
1.2
1.4
1.6
0 10050 300 350 400 450250200150 500
Load capacitance CL (pF)
IF=10mA
VCC=15V
RL=20kΩ
Ta=25˚C
tPLH
tPHL
Propagation delay time tPHL, tPLH (µs)
0
2.0
0.2
0.4
1.8
0.6
0.8
1.0
1.2
1.4
1.6
010525302015 35
Supply voltage VCC (V)
IF=10mA
CL=100pF
RL=20kΩ
Ta=25˚C
tPLH
tPHL
Sheet No.: D2-A05502EN
9
PC956L0NSZ0F Series
■ Design Considerations
Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute
design.
When handling these devices, general countermeasure against static electricity should be taken to avoid
breakdown of devices or degradation of characteristics.
● Notes about static electricity
In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of
0.01µF or more between VCC and GND near the device.
In case that some sudden big noise caused by voltage variation is provided between primary and secondary
terminals of photocoupler some current caused by it is floating capacitance may be generated and result in
false operation since current may go through LED or current may change.
If the photocoupler may be used under the circumstances where noise will be generated we recommend to
use the bypass capacitors at the both ends of LED.
The detector which is used in this device, has parasitic diode between each pins and GND.
There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin
becomes below GND level even for instant.
Therefore it shall be recommended to design the circuit that electric potential of any pin does not become
below GND level.
This product is not designed against irradiation and incorporates non-coherent LED.
● Design guide
● Recommended operating conditions
Parameter
Forward current
Supply voltage
Output voltage
MIN. TYP.
−
−
−
−
MAX.
20
35
35
Unit
mA
V
V
Symbol
IF
VCC
VO
Operating temperature 70
10
4.5
0
−40 ˚CTopr
Sheet No.: D2-A05502EN
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
10
PC956L0NSZ0F Series
● Degradation
In general, the emission of the LED used in photocouplers will degrade over time.
In the case of long term operation, please take the general LED degradation (50% degradation over 5 years)
into the design consideration.
Please decide the input current which become 2 times of MAX. IFHL.
● Recommended Foot Print (reference)
2.542.54
1.7
2.2
8.2
2.54
(Unit : mm)
Sheet No.: D2-A05502EN
■ Manufacturing Guidelines
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
11
1234
300
200
100
00
(˚C)
Terminal : 260˚C peak
( package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
PC956L0NSZ0F Series
Sheet No.: D2-A05502EN
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Cleaning instructions
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
● Presence of ODC
12
PC956L0NSZ0F Series
Sheet No.: D2-A05502EN
■ Package specification
13
12.0
6.7
5.8
10.8
520
±2
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
(Unit : mm)
PC956L0NSZ0F Series
Sheet No.: D2-A05502EN
14
● Tape and Reel package
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
K
EI
DJ
G
B
H
H
A
C
Dimensions List (Unit : mm)
A
16.0±0.3
B
7.5±0.1
C
1.75±0.1
D
12.0±0.1
E
2.0±0.1
H
10.4±0.1
I
0.4±0.05
J
4.2±0.1
K
10.2±0.1
F
4.0±0.1
G
φ1.5+0.1
−0
5˚
MAX.
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
330
b
17.5±1.5
c
100±1.0
d
13±0.5
e
23±1.0
f
2.0±0.5
g
2.0±0.5
Pull-out direction
[Packing : 1 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PC956L0NSZ0F Series
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials,
structure, and other contents described herein at any
time without notice in order to improve design or
reliability. Manufacturing locations are also subject to
change without notice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in
whole or in part, without the express written permission
of SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this
publication.
15
Sheet No.: D2-A05502EN
■ Important Notices
PC956L0NSZ0F Series
[E231]
