19-3383; Rev 0; 8/04 Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch The MAX9995 dual, high-linearity, downconversion mixer provides 6.1dB gain, +25.6dBm IIP3, and 9.8dB NF for UMTS/WCDMA, DCS, and PCS base-station applications. The MAX9995 is ideal for low-side LO injection. (For a mixer variant optimized for high-side LO injection, contact the factory.) This device integrates baluns in the RF and LO ports, a dual-input LO selectable switch, an LO buffer, two doublebalanced mixers, and a pair of differential IF output amplifiers. The MAX9995 requires a typical LO drive of 0dBm and supply current is guaranteed to be below 380mA. These devices are available in a compact 36-pin thin QFN package (6mm x 6mm) with an exposed paddle. Electrical performance is guaranteed over the extended temperature range, from TC = -40C to +85C. Applications UMTS/WCDMA and cdma2000(R) 3G Base Stations PHS/PAS Base Stations DCS1800 and EDGE Base Stations Wireless Local Loop PCS1900 and EDGE Base Stations Military Systems Fixed Broadband Wireless Access Private Mobile Radio Features 1700MHz to 2200MHz RF Frequency Range 1400MHz to 2000MHz LO Frequency Range (MAX9995) 1900MHz to 2400MHz LO Frequency Range (Contact Factory) 40MHz to 350MHz IF Frequency Range 6.1dB Conversion Gain +25.6dBm Input IP3 9.8dB Noise Figure 66dBc 2RF-2LO Spurious Rejection at PRF = -10dBm Dual Channels Ideal for Diversity Receiver Applications Integrated LO Buffer Integrated RF and LO Baluns for Single-Ended Inputs Low -3dBm to +3dBm LO Drive Built-In SPDT LO Switch with 50dB LO1-LO2 Isolation and 50ns Switching Time 44dB Channel-to-Channel Isolation 29 LO_ADJ_M MAX9995ETX 27 LO2 26 GND 25 GND 4 24 GND GND 5 23 LOSEL VCC 6 22 GND 21 VCC 20 GND 19 LO1 15 16 17 18 IND_EXTD VCC LO_ADJ_D N.C. 9 13 RFDIV EXPOSED PADDLE 14 8 IFD- 7 IFD+ GND TAPDIV 11 VCC 12 GND 3 MAX9995 GND 2 IFD_SET TAPMAIN 10 1 VCC RFMAIN 6mm x 6mm THIN QFN (EXPOSED PADDLE) EXPOSED PADDLE ON THE BOTTOM OF THE PACKAGE Ordering Information PART 28 N.C. 31 IND_EXTM 30 VCC 33 IFM+ 32 IFM- 35 IFM_SET 36 VCC TOP VIEW 34 GND Pin Configuration/ Functional Diagram TEMP RANGE PIN-PACKAGE TC** = -40C to +85C 36 Thin QFN-EP* MAX9995ETX-T TC = -40C to +85C 36 Thin QFN-EP* MAX9995ETX+D TC = -40C to +85C 36 Thin QFN-EP* lead free, bulk MAX9995ETX+TD TC = -40C to +85C 36 Thin QFN-EP* lead free, T/R *EP = Exposed pad. **TC = Case temperature. cdma2000 is a registered trademark of Telecommunications Industry Association. ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com. 1 MAX9995 General Description MAX9995 Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch ABSOLUTE MAXIMUM RATINGS VCC ........................................................................-0.3V to +5.5V LO1, LO2 to GND ...............................................................0.3V IFM_, IFD_, IFM_SET, IFD_SET, LOSEL, LO_ADJ_M, LO_ADJ_D to GND.............-0.3V to (VCC + 0.3V) RFMAIN, RFDIV, and LO_ Input Power ..........................+20dBm RFMAIN, RFDIV Current (RF is DC shorted to GND through balun) ..................................................................................50mA Continuous Power Dissipation (TA = +70C) 36-Lead Thin QFN (derate 26mW/C above +70C).............................................................2100mW JA .................................................................................+38C/W JC ................................................................................+7.4C/W Operating Temperature Range (Note A) ....TC = -40C to +85C Maximum Junction Temperature Range..........................+150C Storage Temperature Range .............................-65C to +150C Lead Temperature (soldering, 10s) .................................+300C Note A: TC is the temperature on the exposed paddle of the package. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, no input RF or LO signals applied, VCC = 4.75V to 5.25V, TC = -40C to +85C. Typical values are at VCC = 5.0V, TC = +25C, unless otherwise noted.) PARAMETER Supply Voltage SYMBOL CONDITIONS VCC MIN TYP MAX UNITS 4.75 5 5.25 V 332 380 Total supply current Supply Current LOSEL Input High Voltage LOSEL Input Low Voltage LOSEL Input Current ICC VCC (pin 16) 82 90 VCC (pin 30) 97 110 IFM+/IFM- (total of both) 70 90 IFD+/IFD- (total of both) 70 90 VIH 2 V VIL IIL and IIH mA -10 0.8 V +10 A AC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, VCC = 4.75V to 5.25V, RF and LO ports are driven from 50 sources, PLO = -3dBm to +3dBm, fRF = 1700MHz to 2200MHz, fLO = 1400MHz to 2000MHz, fIF = 200MHz, with fRF > fLO, TC = -40C to +85C. Typical values are at VCC = 5.0V, PLO = 0dBm, fRF = 1900MHz, fLO = 1700MHz, fIF = 200MHz, and TC = +25C, unless otherwise noted.) (Notes 1, 2) PARAMETER RF Frequency SYMBOL fRF LO Frequency fLO IF Frequency fIF Conversion Gain 2 GC CONDITIONS MIN TYP MAX UNITS (Note 7) 1700 2200 MHz (Note 7) 1400 2000 MHz (Contact factory) (Note 7) 1900 2400 MHz 40 350 MHz Meeting RF and LO frequency ranges; IF matching components affect the IF frequency range (Note 7) fRF = 1710MHz to 1875MHz 6 fRF = 1850MHz to 1910MHz 6.2 fRF = 2110MHz to 2170MHz 6.1 _______________________________________________________________________________________ dB Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch (Typical Application Circuit, VCC = 4.75V to 5.25V, RF and LO ports are driven from 50 sources, PLO = -3dBm to +3dBm, fRF = 1700MHz to 2200MHz, fLO = 1400MHz to 2000MHz, fIF = 200MHz, with fRF > fLO, TC = -40C to +85C. Typical values are at VCC = 5.0V, PLO = 0dBm, fRF = 1900MHz, fLO = 1700MHz, fIF = 200MHz, and TC = +25C, unless otherwise noted.) (Notes 1, 2) PARAMETER SYMBOL CONDITIONS VCC = 5.0V, TC = +25C, PLO = 0dBm, PRF = -10dBm (Note 3) Gain Variation from Nominal MIN TYP MAX fRF = 1710MHz to 1875MHz 0.5 1 fRF = 1850MHz to 1910MHz 0.5 1 fRF = 2110MHz to 2170MHz 0.5 1 0.75 Gain Variation with Temperature Noise Figure NF No blockers present fRF = 1710MHz to 1875MHz 9.7 fRF = 1850MHz to 1910MHz 9.8 fRF = 2110MHz to 2170MHz 9.9 8dBm blocker tone applied to RF port at 2000MHz, fRF = 1900MHz, fLO = 1710MHz, PLO = -3dBm Noise Figure (with Blocker) 22 UNITS dB dB dB dB Input 1dB Compression Point P1dB (Note 3) 9.5 12.6 dBm Input Third-Order Intercept Point IIP3 (Notes 3, 4) 23 25.6 dBm 66 2x2 fRF = 1900MHz, fLO = 1700MHz, fSPUR = 1800MHz (Note 3) PRF = -10dBm 2RF-2LO Spur Rejection PRF = -5dBm 61 fRF = 1900MHz, fLO = 1700MHz, fSPUR = 1766.7MHz (Note 3) PRF = -10dBm 70 88 PRF = -5dBm 60 78 3RF-3LO Spur Rejection 3x3 dBc dBc Maximum LO Leakage at RF Port fLO = 1400MHz to 2000MHz -29 dBm Maximum 2LO Leakage at RF Port fLO = 1400MHz to 2000MHz -17 dBm Maximum LO Leakage at IF Port fLO = 1400MHz to 2000MHz -25 dBm Minimum RF to IF Isolation fRF = 1700MHz to 2200MHz, fIF = 200MHz 37 dB LO1-LO2 Isolation PLO1 = 0dBm, PLO2 = 0dBm (Note 5) 40 50.5 dB Minimum Channel-to-Channel Isolation PRF = -10dBm, RFMAIN (RFDIV) power measured at IFDIV (IFMAIN), relative to IFMAIN (IFDIV), all unused parts terminated at 50 40 44 dB LO Switching Time 50% of LOSEL to IF settled to within 2 50 ns 14 dB RF Return Loss LO Return Loss LO port selected 18 LO port unselected 21 dB IF Return Loss LO driven at 0dBm, RF terminated into 50 21 dB Note 1: Guaranteed by design and characterization. Note 2: All limits reflect losses of external components. Output measurements taken at IF outputs of Typical Application Circuit. Note 3: Production tested. Note 4: Two tones 3MHz spacing, -5dBm per tone at RF port. Note 5: Measured at IF port at IF frequency. fLO1 and fLO2 are offset by 1MHz. Note 6: IF return loss can be optimized by external matching components. Note 7: Operation outside this frequency band is possible but has not been characterized. See the Typical Operating Characteristics. _______________________________________________________________________________________ 3 MAX9995 AC ELECTRICAL CHARACTERISTICS (continued) Typical Operating Characteristics (Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC = +25C.) 5.0 TC = +85C 4.5 6.2 6.1 6.0 5.9 5.8 5.9 5.7 5.6 5.5 2000 2100 2200 1800 1900 2100 2200 1700 26.6 MAX9995 toc04 TC = +85C 26.4 PLO = 0dBm 26.4 26.2 25.6 TC = -20C TC = +25C PLO = +3dBm 25.8 2000 2100 1800 2RF - 2LO vs. FUNDAMENTAL FREQUENCY 1900 2000 2100 2200 1700 TC = +85C 65 2RF - 2LO vs. FUNDAMENTAL FREQUENCY PRF = -5dBm PLO = -3dBm 64 TC = -20C 50 45 60 PLO = 0dBm 58 PLO = +3dBm 56 52 50 FREQUENCY (MHz) 2100 2200 VCC = 5.0V 56 52 2000 VCC = 5.25V 58 35 1900 VCC = 4.75V 60 54 1800 2200 62 54 1700 2100 PRF = -5dBm 64 40 30 2000 2RF - 2LO vs. FUNDAMENTAL FREQUENCY 2RF - 2LO (dBc) 2RF - 2LO (dBc) TC = +25C 1900 66 62 60 55 1800 FREQUENCY (MHz) 66 MAX9995 toc07 PRF = -5dBm VCC = 5.0V 25.0 FREQUENCY (MHz) FREQUENCY (MHz) 70 VCC = 4.75V 24.6 1700 2200 25.8 25.4 25.2 1900 2200 26.2 26.0 25.4 24.4 2100 VCC = 5.25V 26.6 25.6 24.8 2000 INPUT IP3 vs. RF FREQUENCY PLO = -3dBm 1800 1900 27.0 IIP3 (dBm) IIP3 (dBm) 26.0 1700 1800 FREQUENCY (MHz) INPUT IP3 vs. RF FREQUENCY INPUT IP3 vs. RF FREQUENCY 75 2000 FREQUENCY (MHz) 26.8 25.2 VCC = 5.25V 5.5 1700 MAX9995 toc05 1900 VCC = 5.0V 5.8 5.6 1800 MAX9995 toc03 6.0 5.7 FREQUENCY (MHz) IIP3 (dBm) 6.1 3.5 1700 4 6.2 4.0 3.0 VCC = 4.75V 6.3 MAX9995 toc06 TC = +25C 6.4 CONVERSION GAIN (dB) 6.0 5.5 6.3 MAX9995 toc08 CONVERSION GAIN (dB) 6.5 PLO = -3dBm to +3dBm 6.4 CONVERSION GAIN (dB) TC = -20C CONVERSION GAIN vs. RF FREQUENCY 6.5 MAX9995 toc09 MAX9995 toc01 7.5 7.0 CONVERSION GAIN vs. RF FREQUENCY 6.5 MAX9995 toc02 CONVERSION GAIN vs. RF FREQUENCY 8.0 2RF - 2LO (dBc) MAX9995 Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch 50 1700 1800 1900 2000 FREQUENCY (MHz) 2100 2200 1700 1800 1900 2000 FREQUENCY (MHz) _______________________________________________________________________________________ 2100 2200 Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch PLO = -3dBm 80 78 TC = +85C 74 72 70 82 PLO = +3dBm 80 78 1900 2000 2100 74 2200 72 1700 1800 1900 2000 2100 2200 1700 14.0 13.8 MAX9995 toc13 TC = +85C PLO = 0dBm 13.7 13.6 13.2 14.0 13.3 2100 1900 LO SWITCH ISOLATION vs. LO FREQUENCY 2100 2200 1700 1800 LO SWITCH ISOLATION vs. LO FREQUENCY 53 PLO = -3dBm 50 TC = +25C 48 VCC = 4.75V TO 5.25V 53 2200 52 ISOLATION (dB) ISOLATION (dB) 51 2100 LO SWITCH ISOLATION vs. LO FREQUENCY 52 52 2000 54 MAX9995 toc17 TC = -20C 1900 FREQUENCY (MHz) 54 MAX9995 toc16 54 ISOLATION (dB) 2000 FREQUENCY (MHz) 55 49 VCC = 4.75V 12.4 1800 FREQUENCY (MHz) 53 13.2 12.6 1700 2200 13.4 12.8 12.9 2000 13.6 13.0 PLO = +3dBm 13.0 12.4 2200 VCC = 5.0V 13.8 13.4 13.1 TC = -20C 2100 VCC = 5.25V 14.2 13.2 12.8 2000 INPUT P1dB vs. RF FREQUENCY P1dB (dBm) P1dB (dBm) 13.6 1900 14.4 PLO = -3dBm 13.5 1900 1800 FREQUENCY (MHz) INPUT P1dB vs. RF FREQUENCY INPUT P1dB vs. RF FREQUENCY 1800 VCC = 4.75V FREQUENCY (MHz) 14.4 1700 VCC = 5.25V 78 74 FREQUENCY (MHz) TC = +25C 80 76 MAX9995 toc14 1800 82 76 72 1700 PRF = -5dBm VCC = 5.0V 84 3RF - 3LO (dBc) 82 76 P1dB (dBm) 86 MAX9995 toc12 PLO = 0dBm 84 TC = +25C 3RF - 3LO (dBc) 3RF - 3LO (dBc) PRF = -5dBm 86 MAX9995 toc15 TC = -20C 3RF - 3LO vs. FUNDAMENTAL FREQUENCY 88 MAX9995 toc18 PRF = -5dBm 86 84 MAX9995 toc10 88 3RF - 3LO vs. FUNDAMENTAL FREQUENCY 88 MAX9995 toc11 3RF - 3LO vs. FUNDAMENTAL FREQUENCY 90 PLO = 0dBm 51 PLO = +3dBm 50 51 50 49 49 48 48 TC = +85C 47 46 45 47 1400 1500 1600 1700 1800 FREQUENCY (MHz) 1900 2000 47 1400 1500 1600 1700 1800 FREQUENCY (MHz) 1900 2000 1400 1500 1600 1700 1800 1900 2000 FREQUENCY (MHz) _______________________________________________________________________________________ 5 MAX9995 Typical Operating Characteristics (continued) (Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC = +25C.) Typical Operating Characteristics (continued) (Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC = +25C.) 80 60 PLO = -3dBm 50 30 40 40 30 1900 2000 2100 2200 30 1700 1800 2100 2200 1700 1800 -40 -45 -40 -45 TC = +25C -30 PLO = +3dBm -35 VCC = 4.75V -40 PLO = 0dBm -45 -50 -55 2200 VCC = 5.25V PLO = -3dBm -35 2100 LO LEAKAGE AT IF PORT vs. LO FREQUENCY LEAKAGE (dBm) -35 2000 -25 MAX9995 toc23 -30 LEAKAGE (dBm) TC = -20C 1900 FREQUENCY (MHz) -25 MAX9995 toc22 -25 -50 2000 LO LEAKAGE AT IF PORT vs. LO FREQUENCY LO LEAKAGE AT IF PORT vs. LO FREQUENCY TC = +85C 1900 FREQUENCY (MHz) -20 -30 VCC = 5.25V MAX9995 toc24 1800 FREQUENCY (MHz) VCC = 5.0V -55 1400 1500 1600 1700 1800 1900 -50 1400 2000 1500 1600 1700 1800 1900 2000 1400 1500 FREQUENCY (MHz) FREQUENCY (MHz) 1800 1900 2000 LO LEAKAGE AT RF PORT vs. LO FREQUENCY -20 MAX9995 toc26 -20 MAX9995 toc25 -25 1700 FREQUENCY (MHz) LO LEAKAGE AT RF PORT vs. LO FREQUENCY LO LEAKAGE AT RF PORT vs. LO FREQUENCY -20 1600 -25 MAX9995 toc27 -60 VCC = 4.75V TO 5.25V -25 -30 -30 LEAKAGE (dBm) TC = -20C -35 -40 -30 LEAKAGE (dBm) LEAKAGE (dBm) 60 50 1700 VCC = 5.0V 70 40 20 PLO = +3dBm -35 -40 -45 TC = +25C -45 PLO = -3dBm 1500 1600 -40 -45 -55 PLO = 0dBm -50 -55 1400 -35 -50 TC = +85C -50 1700 1800 FREQUENCY (MHz) 6 VCC = 4.75V 70 ISOLATION (dB) ISOLATION (dB) ISOLATION (dB) TC = -20C 50 80 PLO = 0dBm PLO = +3dBm 60 CHANNEL ISOLATION vs. RF FREQUENCY 90 MAX9995 toc20 TC = +25C MAX9995 toc19 TC = +85C 70 CHANNEL ISOLATION vs. RF FREQUENCY 90 MAX9995 toc21 CHANNEL ISOLATION vs. RF FREQUENCY 80 LEAKAGE (dBm) MAX9995 Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch 1900 2000 -60 1400 1500 1600 1700 1800 FREQUENCY (MHz) 1900 2000 1400 1500 1600 1700 1800 FREQUENCY (MHz) _______________________________________________________________________________________ 1900 2000 Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch 44 41 TC = +25C 42 41 40 39 TC = -20C 38 2100 2200 1800 FREQUENCY (MHz) NOISE FIGURE vs. RF FREQUENCY 2200 1700 1800 MAX9995 toc31 9 PLO = 0dBm 10.4 10.0 9.9 PLO = +3dBm 10.2 VCC = 5.0V 10.1 10.0 9.9 9.8 9.7 9.7 VCC = 4.75V 9.6 9.5 9.6 1800 1900 2000 2100 2200 2200 VCC = 5.25V 10.3 TC = -20C 6 2100 NOISE FIGURE vs. RF FREQUENCY PLO = -3dBm 9.8 2000 10.5 NOISE FIGURE (dB) 10 1700 1900 FREQUENCY (MHz) 10.1 7 1700 1800 1900 2000 2100 1700 2200 1800 1900 2000 2100 2200 FREQUENCY (MHz) FREQUENCY (MHz) FREQUENCY (MHz) RF RETURN LOSS vs. RF FREQUENCY IF RETURN LOSS vs. IF FREQUENCY LO RETURN LOSS vs. LO FREQUENCY (LO INPUT SELECTED) 10 15 20 15 20 25 30 35 25 0 MAX9995 toc36 10 RETURN LOSS (dB) 5 5 5 RETURN LOSS (dB) PLO = -3dBm TO +3dBm MAX9995 toc35 0 MAX9995 toc34 0 RETURN LOSS (dB) 2100 10.2 NOISE FIGURE (dB) NOISE FIGURE (dB) TC = +25C 11 8 2000 NOISE FIGURE vs. RF FREQUENCY 13 TC = +85C 1900 FREQUENCY (MHz) 14 12 VCC = 5.0V 39.5 1700 MAX9995 toc32 2000 VCC = 4.75V 40.0 36 1900 41.0 40.5 37 1800 41.5 38 39 1700 VCC = 5.25V 42.0 43 MAX9995 toc33 40 42.5 ISOLATION (dB) ISOLATION (dB) ISOLATION (dB) 43 42 PLO = -3dBm TO +3dBm 45 RF TO IF ISOLATION vs. RF FREQUENCY 43.0 MAX9995 toc30 MAX9995 toc28 TC = +85C 44 RF TO IF ISOLATION vs. RF FREQUENCY 46 MAX9995 toc29 RF TO IF ISOLATION vs. RF FREQUENCY 45 10 PLO = +3dBm PLO = 0dBm 15 20 PLO = -3dBm 40 45 30 1700 1800 1900 2000 FREQUENCY (MHz) 2100 2200 25 40 80 120 160 200 240 280 320 360 FREQUENCY (MHz) 1400 1500 1600 1700 1800 1900 2000 FREQUENCY (MHz) _______________________________________________________________________________________ 7 MAX9995 Typical Operating Characteristics (continued) (Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC = +25C.) Typical Operating Characteristics (continued) (Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC = +25C.) LO RETURN LOSS vs. LO FREQUENCY (LO INPUT UN SELECTED) SUPPLY CURRENT vs. TEMPERATURE (TC) PLO = -3dBm TO +3dBm 360 355 SUPPLY CURRENT (mA) 5 10 15 20 25 MAX9995 toc38 365 MAX9995 toc37 0 RETURN LOSS (dB) MAX9995 Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch 350 VCC = 5.25V 345 340 VCC = 5.0V 335 330 325 VCC = 4.75V 320 30 315 35 310 1400 1500 1600 1700 1800 1900 2000 -20 -5 FREQUENCY (MHz) 10 25 40 55 TEMPERATURE (C) 70 85 Pin Description PIN NAME 1 RFMAIN 2 TAPMAIN 3, 5, 7, 12, 20, 22, 24, 25, 26, 34 GND Ground 4, 6, 10, 16, 21, 30, 36 VCC Power Supply. Connect bypass capacitors as close to the pin as possible (see the Typical Application Circuit). 8 TAPDIV 9 RFDIV 11 IFD_SET IF Diversity Amplifier Bias Control. Connect a 1.2k resistor from this pin to ground to set the bias current for the diversity IF amplifier. 13, 14 IFD+, IFD- Diversity Mixer Differential IF Output. Connect pullup inductors from each of these pins to VCC (see the Typical Application Circuit). 15 IND_EXTD Connect a 10nH inductor from this pin to ground to increase the RF-IF and LO-IF isolation. 17 LO_ADJ_D LO Diversity Amplifier Bias Control. Connect a 392 resistor from this pin to ground to set the bias current for the diversity LO amplifier. 18, 28 N.C. No Connection. Not internally connected. 19 LO1 Local Oscillator 1 Input. This input is internally matched to 50. Requires an input DC-blocking capacitor. 23 LOSEL 8 FUNCTION Main Channel RF Input. Internally matched to 50. Requires an input DC-blocking capacitor. Main Channel Balun Center Tap. Connect a 0.033F capacitor from this pin to the board ground. Diversity Channel Balun Center Tap. Connect a 0.033F capacitor from this pin to the ground. Diversity Channel RF Input. Internally matched to 50. Requires an input DC-blocking capacitor. Local Oscillator Select. Set this pin to high to select LO1. Set to low to select LO2. _______________________________________________________________________________________ Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch PIN NAME DESCRIPTION 27 LO2 Local Oscillator 2 Input. This input is internally matched to 50. Requires an input DC-blocking capacitor. 29 LO_ADJ_M LO Main Amplifier Bias Control. Connect a 392 resistor from this pin to ground to set the bias current for the main LO amplifier. 31 IND_EXTM Connect a 10nH inductor from this pin to ground to increase the RF-IF and LO-IF isolation. 32, 33 IFM-, IFM+ Main Mixer Differential IF Output. Connect pullup inductors from each of these pins to VCC (see the Typical Application Circuit). 35 IFM_SET Exposed Paddle GND IF Main Amplifier Bias Control. Connect a 1.2k resistor from this pin to ground to set the bias current for the main IF amplifier. Exposed Ground Plane. This paddle affects RF performance and provides heat dissipation. The paddle must be connected to ground. Detailed Description The MAX9995 dual, high-linearity, downconversion mixer provides 6.1dB gain and +25.6dBm IIP3, with a 9.8dB noise figure. Integrated baluns and matching circuitry allow 50 single-ended interfaces to the RF and LO ports. A single-pole, double-throw (SPDT) LO switch provides 50ns switching time between LO inputs, with 50dB LO-to-LO isolation. Furthermore, the Table 1. Component Values COMPONENT VALUE C1, C8 4pF DESCRIPTION Microwave capacitors (0402) C2, C7 10pF Microwave capacitors (0402) C3, C6 0.033F Microwave capacitors (0603) C4, C5, C14, C16 22pF Microwave capacitors (0402) C9, C13, C15, C17, C18 0.01F Microwave capacitors (0402) C10, C11, C12, C19, C20, C21 150pF Microwave capacitors (0603) L1, L2, L4, L5 330nH Wire-wound high-Q inductors (0805) L3, L6 10nH Wire-wound high-Q inductors (0603) R1, R4 1.21k integrated LO buffer provides a high drive level to the mixer core, reducing the LO drive required at the MAX9995's inputs to -3dBm. The IF port incorporates a differential output, which is ideal for providing enhanced 2RF-2LO performance. Specifications are guaranteed over broad frequency ranges to allow for use in UMTS/WCDMA and 2G/2.5G/3G DCS1800, PCS1900, and cdma2000 base stations. The MAX9995 is specified to operate over an RF input range of 1700MHz to 2200MHz, an LO range of 1400MHz to 2000MHz, and an IF range of 40MHz to 350MHz. Operation beyond this is possible; however, performance is not characterized. This device can operate in high-side LO injection applications with an extended LO range, but performance degrades as fLO continues to increase. For a device with better highside performance, contact the factory. This device is available in a compact 6mm x 6mm, 36-pin thin QFN package with an exposed paddle. RF Input and Balun The MAX9995's two RF inputs (RFMAIN and RFDIV) are internally matched to 50, requiring no external matching components. DC-blocking capacitors are required as the inputs are internally DC shorted to ground through the on-chip baluns. Input return loss is typically 14dB over the entire RF frequency range of 1700MHz to 2200MHz. 1% resistors (0402) LO Input, Switch, Buffer, and Balun The mixers can be used for either high-side or low-side injection applications with an LO frequency range of 1400MHz to 2000MHz. For a device with an LO frequency range of 1900MHz to 2400MHz, contact the factory. As an added feature, the MAX9995 includes an R2, R5 392 1% resistors (0402) R3, R6 10 1% resistors (1206) T1, T2 4:1 (200:50) IF baluns _______________________________________________________________________________________ 9 MAX9995 Pin Description (continued) Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX9995 Typical Application Circuit C19 T1 L1 VCC IF MAIN OUTPUT C21 R3 L2 4:1 R1 C20 VCC C1 RFMAIN TAPMAIN C3 C2 GND VCC VCC C4 GND VCC VCC C5 GND C6 C7 TAPDIV RFDIV RF DIV INPUT C17 28 N.C. LO_ADJ_M R2 29 30 VCC IND_EXTM 31 IFM32 IFM+ 33 GND 34 IFM_SET 35 36 VCC C18 RF MAIN INPUT VCC L3 C16 1 27 MAX9995 2 26 3 25 4 24 5 23 6 22 7 21 EXPOSED PADDLE 8 20 9 19 LO2 LO2 GND GND GND LOSEL LO SELECT GND VCC VCC C15 GND LO1 LO1 C14 18 N.C. 17 LO_ADJ_D VCC 16 15 14 IFD- 13 IFD+ 12 GND 11 R4 IND_EXTD C9 IFD_SET VCC VCC 10 C8 R5 VCC C13 L6 C11 T2 L5 VCC C12 R6 IF DIV OUTPUT L4 4:1 C10 10 ______________________________________________________________________________________ Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch The IF output impedance is 200 (differential). For evaluation, an external low-loss 4:1 (impedance ratio) balun transforms this impedance down to a 50 singleended output (see the Typical Application Circuit). A two-stage internal LO buffer allows a wide input power range for the LO drive. All guaranteed specifications are for an LO signal power from -3dBm to +3dBm. The on-chip low-loss balun, along with an LO buffer, drives the double-balanced mixer. All interfacing and matching components from the LO inputs to the IF outputs are integrated on-chip. A properly designed PC board is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, radiation, and inductance. For the best performance, route the ground pin traces directly to the exposed pad under the package. The PC board exposed pad MUST be connected to the ground plane of the PC board. It is suggested that multiple vias be used to connect this pad to the lower-level ground planes. This method provides a good RF/thermal-conduction path for the device. Solder the exposed pad on the bottom of the device package to the PC board. The MAX9995 Evaluation Kit can be used as a reference for board layout. Gerber files are available upon request at www.maxim-ic.com. High Linearity Mixers The core of the MAX9995 is a pair of double-balanced, high-performance passive mixers. Exceptional linearity is provided by the large LO swing from the on-chip LO buffer. When combined with the integrated IF amplifiers, the cascaded IIP3, 2RF-2LO rejection, and NF performance is typically +25.6dBm, 66dBc, and 9.8dB, respectively. Differential IF Output Amplifiers The MAX9995 mixers have an IF frequency range of 40MHz to 350MHz. The differential, open-collector IF output ports require external pullup inductors to VCC. Note that these differential outputs are ideal for providing enhanced 2RF-2LO rejection performance. Singleended IF applications require a 4:1 balun to transform the 200 differential output impedance to a 50 singleended output. After the balun, VSWR is typically 1.5:1. Applications Information Input and Output Matching The RF and LO inputs are internally matched to 50. No matching components are required. Return loss at each RF port is typically 14dB over the entire input range (1700MHz to 2200MHz), and return loss at the LO ports is typically 18dB (1400MHz to 2000MHz). RF and LO inputs require only DC-blocking capacitors for interfacing. Bias Resistors Bias currents for the LO buffer and the IF amplifier are optimized by fine tuning the resistors R1, R2, R4, and R5. If reduced current is required at the expense of performance, contact factory. If the 1% bias resistor values are not readily available, substitute standard 5% values. Layout Considerations Power-Supply Bypassing Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass each VCC pin with a capacitor as close to the pin as possible (Typical Application Circuit). Exposed Pad RF/Thermal Considerations The exposed paddle (EP) of the MAX9995's 36-pin thin QFN-EP package provides a low thermal-resistance path to the die. It is important that the PC board on which the MAX9995 is mounted be designed to conduct heat from the EP. In addition, provide the EP with a low-inductance path to electrical ground. The EP MUST be soldered to a ground plane on the PC board, either directly or through an array of plated via holes. Chip Information TRANSISTOR COUNT: 1414 PROCESS: SiGe BiCMOS ______________________________________________________________________________________ 11 MAX9995 internal LO SPDT switch that can be used for frequency-hopping applications. The switch selects one of the two single-ended LO ports, allowing the external oscillator to settle on a particular frequency before it is switched in. LO switching time is typically less than 50ns, which is more than adequate for virtually all GSM applications. If frequency hopping is not employed, set the switch to either of the LO inputs. The switch is controlled by a digital input (LOSEL): logic high selects LO1, and logic low selects LO2. LO1 and LO2 inputs are internally matched to 50, requiring only a 22pF DC-blocking capacitor. Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) QFN THIN 6x6x0.8.EPS MAX9995 Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch D2 D CL D/2 b D2/2 k E/2 E2/2 (NE-1) X e E CL E2 k e L (ND-1) X e e L CL CL L1 L L e A1 A2 e A PACKAGE OUTLINE 36, 40, 48L THIN QFN, 6x6x0.8mm 21-0141 12 ______________________________________________________________________________________ E 1 2 Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch NOTES: 1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES. 3. N IS THE TOTAL NUMBER OF TERMINALS. 4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE. 5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP. 6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY. 7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION. 8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS. 9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT FOR 0.4mm LEAD PITCH PACKAGE T4866-1. PACKAGE OUTLINE 36, 40, 48L THIN QFN, 6x6x0.8mm 10. WARPAGE SHALL NOT EXCEED 0.10 mm. 21-0141 E 2 2 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 13 (c) 2004 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products. MAX9995 Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.)