2SA2151P - Allegro MicroSystems Europe Ltd.

2SA2151

Description

By adapting the Sanken unique wafer-thinner technique, these

PNP power transistors achieve power-up by decreasing thermal

resistance, and provide higher voltage avalanche breakdown

rating. The high power-handling capacity of the TO-3P package

allows a smaller footprint on the circuit board design. This

series of transistors is very well suited to not only multichannel

applications for AV (audio-visual) amplifiers and receivers,

but also parallel connection applications for PA (professional

audio system) amplifiers.

Applications include the following:

▪ Single transistors for audio amplifiers

▪ Home audio amplifiers

▪ Professional audio amplifiers

▪ Automobile audio amplifiers

▪ Audio market

▪ Single transistors for general purpose

Features and Benefits

▪ Small package (TO-3P)

▪ High power handling capacity, 160 W

▪ Improved sound output by reduced on-chip impedance

▪ For professional audio (PA) applications, VCEO = –200 V

versions available

▪ Complementary to 2SC6011

▪ Recommended output driver: 2SA1668

Audio Amplification T ransistor

Package: 3 Lead TO-3P

38100

Audio Amplification T ransistor

2SA2151

ABSOLUTE MAXIMUM RATINGS at TA = 25°C

Characteristic Symbol Rating Unit

Collector-Base Voltage VCBO –200 V

Collector-Emitter Voltage VCEO –200 V

Emitter-Base Voltage VEBO –6 V

Collector Current IC–15 A

Base Current IB–4 A

Collector Power Dissipation PC160 W

Junction Temperature TJ150 °C

Storage Temperature Tstg –55 to150 °C

SELECTION GUIDE

Part Number Type hFE Rating Packing

2SA2151* PNP

Range O: 50 to 100

Bulk, 100 piecesRange P: 70 tp 140

Range Y: 90 to 180

*Specify hFE range when ordering. If no hFE range is specified, order will be fulfilled with either or both range O and range Y,

depending upon availability.

ELECTRICAL CHARACTERISTICS at TA = 25°C

Characteristic Symbol Test Conditions Min. Typ. Max. Unit

Collector-Cutoff Current ICBO VCB = –200 V – – –10 μA

Emitter Cutoff Current IEBO VEB = –6 V – – –10 μA

Collector-Emitter Voltage V(BR)CEO IC = –50 mA –200 – – V

DC Current Transfer Ratio* hFE VCE = –4 V, IC = –3 A 50 – 180 –

Collector-Emitter Saturation Voltage VCE(sat) IC = –5 A, IB = –0.5 A – – –0.5 V

Cutoff Frequency fTVCE = –12 V, IE = 0.5 A – 20 – MHz

Output Capacitance COB VCB = –10 V, IE = 0 A, f = 1 MHz – 450 – pF

*hFE rating: 50 to 100 (O brand on package), 70 to 140 (P), 90 to 180 (Y).

Allegro MicroSystems, Inc.

115 Northeast Cutoff, Box 15036

Worcester, Massachusetts 01615-0036 (508) 853-5000

www.allegromicro.com

Audio Amplification T ransistor

2SA2151

Performance Characteristics

–V

(V)

–I

(A)

vs. V

CE(sat)

vs. I

vs. V

–V

= 4 V Continuous –V

= 4 V Continuous

–V

(V)

–I

=5A

–I

=10A

Typ.

–I

(A)

–I

(A)

–V

CE(sat)

(V)

0 0.5 1.0 1.5 2.0

02134

–IB= 20 mA

50 mA

100 mA

200 mA

300 mA

500 mA

700 mA

1 A

–I

(A)

0 0.5 1.0 1.5 2.0

0.01 0.1 1 10 100

100

1000

vs. I

–V

= 4 V Continuous

–I

(A)

0.01 0.1 1 10 100

100

1000

125°C

25°C

–30°C

25°C

125°C

0.01

0.10

1.00

10.00

10 100 1000

θJA

vs. t

θJA

(°C/W)

t(ms)

Allegro MicroSystems, Inc.

115 Northeast Cutoff, Box 15036

Worcester, Massachusetts 01615-0036 (508) 853-5000

www.allegromicro.com

Audio Amplification T ransistor

2SA2151

1 10 100 1000

10 ms

100 ms

–I

C(A)

0.1

0.01

1.0

10.0

100.0

–V

CE (V)

Safe Operating Area

= 25°C, single pulse, no heatsink, natural cooling

0.01 0.1 1 10 100

vs. I

–V

= 12 V Continuous

(MHz)

(A)

Typ.

PC vs. TA

100

150

200

0 25 50 75 100 125 150

(°C)

(W)

Without Heatsink

With Infinite Heatsink

3.5

Performance Characteristics, continued

Allegro MicroSystems, Inc.

115 Northeast Cutoff, Box 15036

Worcester, Massachusetts 01615-0036 (508) 853-5000

www.allegromicro.com

Audio Amplification T ransistor

2SA2151

9.6 ±0.3

15.8 ±0.2

5.0 MAX

2.1 MAX

Ø3.2 ±0.1

5.0 ±0.2

Terminal dimension at lead tips

2(2×)

+0.2

–0.1

3+0.2

–0.1

1.0 (3×)

+0.2

–0.1

0.6 +0.2

–0.1

1.7 +0.2

–0.3

20.0 MIN

6.0 ±0.2

3.5 NOM

Branding

XXXXXXXX

Terminal core material: Cu

Terminal treatment: Ni plating and solder dip

Heat sink core material: Cu

Heat sink treatment: Ni plating

Leadform number: 100

Dimensions in millimeters

Branding codes (exact appearance at manufacturer discretion):

1st line, type: A2151

2nd line, lot: YM H

Where: Y is the last digit of the year of manufacture

M is the month (1 to 9, O, N, D)

H is the hFE rating (O, P, or Y; for values see

footnote, Electrical Characteristics table)

Pin Assignments:

1. Base

2. Collector

3. Emitter

123

2×P5.45 ±0.1

13.6 ±0.2

14.0 ±0.3

15.6 ±0.3

19.9 ±0.3

2.0 ±0.2

1.8 ±0.3

PACKAGE OUTLINE DRAWING, TO-3P

Leadframe plating Pb-free. Device composition

includes high-temperature solder (Pb >85%),

which is exempted from the RoHS directive.

Allegro MicroSystems, Inc.

115 Northeast Cutoff, Box 15036

Worcester, Massachusetts 01615-0036 (508) 853-5000

www.allegromicro.com

Audio Amplification T ransistor

2SA2151

Because reliability can be affected adversely by improper storage

environments and handling methods, please observe the following

cautions.

Cautions for Storage

• Ensure that storage conditions comply with the standard

temperature (5°C to 35°C) and the standard relative humidity

(around 40 to 75%); avoid storage locations that experience

extreme changes in temperature or humidity.

• Avoid locations where dust or harmful gases are present and

avoid direct sunlight.

• Reinspect for rust on leads and solderability of products that have

been stored for a long time.

Cautions for Testing and Handling

When tests are carried out during inspection testing and other

standard test periods, protect the products from power surges

from the testing device, shorts between adjacent products, and

shorts to the heatsink.

Remarks About Using Silicone Grease with a Heatsink

• When silicone grease is used in mounting this product on a

heatsink, it shall be applied evenly and thinly. If more silicone

grease than required is applied, it may produce stress.

• Coat the back surface of the product and both surfaces of the

insulating plate to improve heat transfer between the product and

the heatsink.

• Volatile-type silicone greases may permeate the product and

produce cracks after long periods of time, resulting in reduced

heat radiation effect, and possibly shortening the lifetime of the

product.

• Our recommended silicone greases for heat radiation purposes,

which will not cause any adverse effect on the product life, are

indicated below:

Type Suppliers

G746 Shin-Etsu Chemical Co., Ltd.

YG6260 GE Toshiba Silicone Co., Ltd.

SC102 Dow Corning Toray Silicone Co., Ltd.

Heatsink Mounting Method

• Torque When Tightening Mounting Screws. Thermal resistance

increases when tightening torque is low, and radiation effects are

decreased. When the torque is too high, the screw can strip, the

heatsink can be deformed, and distortion can arise in the product frame.

To avoid these problems, observe the recommended tightening torques

for this product package type, TO-3P (MT-100): 0.686 to 0.882 N•m (7

to 9 kgf•cm).

• Diameter of Heatsink Hole: < 4 mm. The deﬂ ection of the press mold

when making the hole may cause the case material to crack at the joint

with the heatsink. Please pay special attention for this effect.

Soldering

• When soldering the products, please be sure to minimize the

working time, within the following limits:

260±5°C 10 s

350±5°C 3 s

• Soldering iron should be at a distance of at least 1.5 mm from the

body of the products

Electrostatic Discharge

• When handling the products, operator must be grounded.

Grounded wrist straps worn should have at least 1 MΩ of

resistance to ground to prevent shock hazard.

• Workbenches where the products are handled should be

grounded and be provided with conductive table and floor mats.

• When using measuring equipment such as a curve tracer, the

equipment should be grounded.

• When soldering the products, the head of soldering irons or the

solder bath must be grounded in other to prevent leak voltages

generated by them from being applied to the products.

• The products should always be stored and transported in our

shipping containers or conductive containers, or be wrapped in

aluminum foil.

WARNING — These devices are designed to be operated at lethal voltages and energy levels. Circuit designs

that embody these components must conform with applicable safety requirements. Pre cau tions must be

taken to prevent accidental contact with power-line potentials. Do not connect ground ed test equipment.

The use of an isolation transformer is recommended during circuit development and breadboarding.

Allegro MicroSystems, Inc.

115 Northeast Cutoff, Box 15036

Worcester, Massachusetts 01615-0036 (508) 853-5000

www.allegromicro.com

Audio Amplification T ransistor

2SA2151

The products described herein are manufactured in Ja pan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc.

Sanken and Allegro reserve the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be re quired to per mit im-

prove ments in the per for mance, reliability, or manufacturability of its prod ucts. Therefore, the user is cau tioned to verify that the in for ma tion in this

publication is current before placing any order.

When using the products described herein, the ap pli ca bil i ty and suit abil i ty of such products for the intended purpose shall be reviewed at the users

responsibility.

Although Sanken undertakes to enhance the quality and reliability of its prod ucts, the occurrence of failure and defect of semi con duc tor products

at a certain rate is in ev i ta ble.

Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems

against any possible injury, death, fires or damages to society due to device failure or malfunction.

Sanken products listed in this publication are designed and intended for use as components in general-purpose electronic equip ment or apparatus

(home ap pli anc es, office equipment, tele com mu ni ca tion equipment, measuring equipment, etc.). Their use in any application requiring radiation

hardness assurance (e.g., aero space equipment) is not supported.

When considering the use of Sanken products in ap pli ca tions where higher reliability is re quired (transportation equipment and its control systems

or equip ment, fire- or burglar-alarm systems, various safety devices, etc.), contact a company sales representative to discuss and obtain written

confirmation of your spec i fi ca tions.

The use of Sanken products without the written consent of Sanken in applications where ex treme ly high reliability is required (aerospace equip-

ment, nuclear power-control stations, life-support systems, etc.) is strictly prohibited.

The information in clud ed herein is believed to be accurate and reliable. Ap pli ca tion and operation examples described in this pub li ca tion are

given for reference only and Sanken and Allegro assume no re spon si bil i ty for any in fringe ment of in dus tri al property rights, intellectual property

rights, or any other rights of Sanken or Allegro or any third party that may result from its use.

Anti radioactive ray design is not considered for the products listed herein.

This datasheet is based on Sanken datasheet SSE-23012

Allegro MicroSystems, Inc.

115 Northeast Cutoff, Box 15036

Worcester, Massachusetts 01615-0036 (508) 853-5000