Products Learn & Develop Support USA (English) Type Here to Search Products ARK Menu Intel(R) 82571EB Gigabit Ethernet Controller Compare Specifications Specifications Essentials Networking Specifications Package Specifications Advanced Technologies Ordering / sSpecs / Steppings Download Drivers + Related Products - Essentials Intel(R) Gigabit Ethernet Network Connection Status End of Interactive Support Launch Date Q3'05 Expected Discontinuance See Published PCN for EOL Details Lithography 90 nm TDP 3.43 W Recommended Customer Price $35.57 Support Overview Datasheet Link Search Distributors Operating Temperature Range 0C to 55C Intel(R) 82571 Gigabit Ethernet Controller Products formerly Ophir Quick Links Export Full Specifications PCN/MDDS Information - Networking Specifications # of Ports Dual System Interface Type PCIe v1.0a (2.5GT/s) NC Sideband Interface No Jumbo Frames Supported Yes - Package Specifications Package Size 17x17mm Low Halogen Options Available See MDDS SLJB5 916836: PCN | MDDS SLJB4 916663: PCN | MDDS SL8UY 875296: PCN | MDDS SL8V2 875298: PCN | MDDS SLJAZ 916298: PCN | MDDS 875300: PCN | MDDS 875303: PCN | MDDS SLJAY 916297: PCN | MDDS - Advanced Technologies Fiber Channel over Ethernet No MACsec IEEE 802.1 AE No IEEE 1588 No Supported Under vPro No All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems. "Intel classifications" consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the correct classification of any item at the time of export. Refer to Datasheet for formal definitions of product properties and features. "Announced" SKUs are not yet available. Please refer to the Launch Date for market availability. "Conflict free" and "conflict-free" means "DRC conflict free", which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before January 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers. The Recommended Customer Price ("RCP") is pricing guidance for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation. System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used. Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment. Send us your feedback! Company Information Our Commitment Communities Investor Relations Contact Us Newsroom Jobs (c) Intel Corporation Terms of Use *Trademarks Privacy Cookies Supply Chain Transparency Site Map