KAD2708L Data Sheet April 14, 2011 8-Bit, 350/275/210/170/105MSPS A/D Converter Applications The Intersil KAD2708L is the industry's lowest power, 8-bit, 350MSPS, high performance Analog-to-Digital converter. It is designed with Intersil's proprietary FemtoChargeTM technology on a standard CMOS process. The KAD2708L offers high dynamic performance (48.8dBFS SNR @ fIN = 175MHz) while consuming less than 330mW. Features include an over-range indicator and a selectable divide-by-2 input clock divider. The KAD2708L is one member of a pin-compatible family offering 8- and 10-bit ADCs with sample rates from 105MSPS to 350MSPS and LVDS-compatible or LVCMOS outputs (Table 1). This family of products is available in 68 Ld RoHS-compliant QFN packages with exposed paddle. Performance is specified over the full industrial temperature range (-40C to +85C). * Portable Oscilloscope FN6813.1 * High-Performance Data Acquisition * Medical Imaging * Cable Head Ends * Power-Amplifier Linearization * Radar and Satellite Antenna Array Processing * Broadband Communications * Point-to-Point Microwave Systems * Communications Test Equipment Ordering Information TEMP. RANGE (C) PKG. DWG. # PART NUMBER (Notes 1, 2) SPEED (MSPS) * On-Chip Reference KAD2708L-35Q68 350 -40 to +85 68 Ld QFN L68.10x10B * Internal Track and Hold KAD2708L-27Q68 275 -40 to +85 68 Ld QFN L68.10x10B * 1.5VP-P Differential Input Voltage KAD2708L-21Q68 210 -40 to +85 68 Ld QFN L68.10x10B * 600mHz Analog Input Bandwidth KAD2708L-17Q68 170 -40 to +85 68 Ld QFN L68.10x10B * Two's Complement or Binary Output KAD2708L-10Q68 105 -40 to +85 68 Ld QFN L68.10x10B * Over-Range Indicator NOTES: Features 1. For Moisture Sensitivity Level (MSL), please see device information pages for KAD2708L-10, KAD2708L-17, KAD2708L-21, KAD2708L-27, and KAD2708L-35. For more information on MSL, please see Tech Brief TB363. * Selectable /2 Clock Divider * LVDS Compatible Outputs Key Specifications 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. * SNR = 48.8dBFS at fS = 350MSPS, fIN = 175MHz * SFDR = 64dBc at fS = 350MSPS, fIN = 175MHz OVDD CLKDIV AVDD2 AVDD3 * Power Consumption < 330mW at fS = 350MSPS CLK_P Pin-Compatible Family CLKOUTP Clock Generation CLK_N CLKOUTN D7P - D0P D7N - D0N 8-bit 350MSPS ADC INP S/H INN VREF VREFSEL + - PACKAGE 8 ORP LVDS Drivers ORN 1.21 V 2SC AVSS OVSS VCM 1 TABLE 1. PIN-COMPATIBLE PRODUCTS RESOLUTION, SPEED LVDS OUTPUTS LVCMOS OUTPUTS 8 Bits 350MSPS KAD2708L-35 10 Bits 275MSPS KAD2710L-27 KAD2710C-27 8 Bits 275MSPS KAD2708L-27 KAD2708C-27 10 Bits 210MSPS KAD2710L-21 KAD2710C-21 8 Bits 210MSPS KAD2708L-21 KAD2708C-21 10 Bits 170MSPS KAD2710L-17 KAD2710C-17 8 Bits 170MSPS KAD2708L-17 KAD2708C-17 10 Bits 105MSPS KAD2710L-10 KAD2710C-10 8 Bits 105MSPS KAD2708L-10 KAD2708C-10 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. FemtoCharge is a trademark of Kenet Inc. Copyright Intersil Americas Inc. 2008, 2011. All Rights Reserved All other trademarks mentioned are the property of their respective owners. KAD2708L Table of Contents Absolute Maximum Ratings ........................................ 3 Thermal Information ..................................................... 3 Electrical Specifications ............................................... 3 Digital Specifications .................................................... 5 Timing Diagram ............................................................. 6 Timing Specifications .................................................. 6 ESD ................................................................................ 6 Pin Description ............................................................. 7 Pin Configuration ......................................................... 8 Typical Performance Curves .........................................9 Functional Description .................................................12 Reset .........................................................................12 Voltage Reference .....................................................12 Analog Input ..............................................................12 Clock Input ................................................................13 Jitter ...........................................................................13 Digital Outputs ...........................................................14 Equivalent Circuits .......................................................14 Layout Considerations ................................................15 Split Ground and Power Planes ................................15 Clock Input Considerations.........................................15 Bypass and Filtering ..................................................15 LVDS Outputs ...........................................................15 Unused Inputs ...........................................................15 Definitions......................................................................15 Package Outline Drawing ............................................16 L68.10x10B ................................................................16 2 FN6813.1 April 14, 2011 KAD2708L Absolute Maximum Ratings Thermal Information AVDD2 to AVSS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.4V to 2.1V AVDD3 to AVSS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.4V to 3.7V OVDD2 to OVSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.4V to 2.1V Analog Inputs to AVSS. . . . . . . . . . . . . . . . . -0.4V to AVDD3 + 0.3V Clock Inputs to AVSS. . . . . . . . . . . . . . . . . . -0.4V to AVDD2 + 0.3V Logic Inputs to AVSS (VREFSEL, CLKDIV) -0.4V to AVDD3 + 0.3V Logic Inputs to OVSS (RST, 2SC) . . . . . . . . -0.4V to OVDD2 + 0.3V VREF to AVSS . . . . . . . . . . . . . . . . . . . . . . . -0.4V to AVDD3 + 0.3V Analog Output Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mA Logic Output Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mA LVDS Output Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA Thermal Resistance (Typical) JA (C/W) JC (C/W) 68 Ld QFN Package (Notes 3, 4). . . . . 23 1.8 Operating Temperature . . . . . . . . . . . . . . . . . . . . . . .-40C to +85C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65C to +150C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTE: 3. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with "direct attach" features. See Tech Brief TB379 for details. 4. For JC, the "case temp" location is the center of the exposed metal pad on the package underside. Electrical Specifications All specifications apply under the following conditions unless otherwise noted: AVDD2 = 1.8V, AVDD3 = 3.3V, OVDD = 1.8V, TA = -40C to +85C (typical specifications at +25C), fSAMPLE = 350MSPS, 270MSPS, 210MSPS, 170MSPS and 105MSPS, fIN = Nyquist at -0.5dBFS. Boldface limits apply over the operating temperature range, -40C to +85C. KAD2708L-35 PARAMETER MIN SYMBOL CONDITIONS (Note 5) TYP MAX KAD2708L-27 MIN (Note 5) (Note 5) KAD2708L-21 MAX TYP MIN (Note 5) (Note 5) MAX TYP KAD2708L-17 MIN (Note 5) (Note 5) MAX TYP KAD2708L-10 MIN (Note 5) (Note 5) MAX TYP (Note 5) UNITS DC SPECIFICATIONS Analog Input Full-Scale Analog Input Range VFS Full Scale Range Temp. Drift AVTC CommonMode Output Voltage VCM 1.4 Full Temp 1.5 1.6 1.4 1.5 1.6 1.4 1.5 1.6 1.4 1.5 1.6 1.4 1.5 1.6 VP-P 257 230 210 198 176 ppm /C 860 860 860 860 860 mV Power Requirements 1.8V Analog Supply Voltage AVDD2 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 V 3.3V Analog Supply Voltage AVDD3 3.15 3.3 3.45 3.15 3.3 3.45 3.15 3.3 3.45 3.15 3.3 3.45 3.15 3.3 3.45 V 1.8V Digital Supply Voltage OVDD 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 V 1.8V Analog Supply Current IAVDD2 51 60 44 51 38 42 35 39 29 33 mA 3.3V Analog Supply Current IAVDD3 50 54 41 45 33 37 28 32 21 24 mA 1.8V Digital Supply Current IOVDD 39 44 34 39 33 36 31 36 28 32 mA 3 FN6813.1 April 14, 2011 KAD2708L Electrical Specifications All specifications apply under the following conditions unless otherwise noted: AVDD2 = 1.8V, AVDD3 = 3.3V, OVDD = 1.8V, TA = -40C to +85C (typical specifications at +25C), fSAMPLE = 350MSPS, 270MSPS, 210MSPS, 170MSPS and 105MSPS, fIN = Nyquist at -0.5dBFS. Boldface limits apply over the operating temperature range, -40C to +85C. (Continued) KAD2708L-35 MIN PARAMETER Power Dissipation MAX SYMBOL CONDITIONS (Note 5) TYP PD 327 KAD2708L-27 MIN (Note 5) (Note 5) 365 KAD2708L-21 MAX TYP 275 MIN (Note 5) (Note 5) 310 MAX TYP 237 KAD2708L-17 MIN (Note 5) (Note 5) 263 MAX TYP 211 KAD2708L-10 MIN (Note 5) (Note 5) 241 MAX TYP 172 (Note 5) UNITS 196 mW AC SPECIFICATIONS Maximum Conversion Rate fS MAX Minimum Conversion Rate fS MIN Differential Nonlinearity DNL fIN = 10MHz (for -17 and -10 versions only) -0.3 0.2 0.4 -0.3 0.2 0.4 -0.3 0.2 0.4 -0.3 0.2 0.4 -0.3 Integral Nonlinearity INL fIN = 10MHz (for -17 and -10 versions only) -0.8 0.2 0.8 -0.8 0.2 0.8 -0.8 0.2 0.8 -0.8 0.2 0.8 -0.8 Signal-toNoise Ratio SNR fIN = 10MHz 49.0 fIN = Nyquist 46.5 48.8 fIN = 430MHz 48.0 49.0 49.1 48.9 49.2 49.5 Signal-toNoise and Distortion Effective Number of Bits SpuriousFree Dynamic Range Two-Tone SFDR 350 210 50 SINAD fIN = 10MHz 170 50 50 49.5 46.5 0.4 LSB 0.2 0.8 LSB 49.5 dBFS 49.2 dBFS 49.1 49.1 dBFS 49.5 49.5 dBFS 49.2 dBFS 49.2 49.0 48.9 dBFS 7.8 7.9 7.9 7.9 7.9 Bits 7.9 Bits 7.4 7.9 7.4 49.2 46.5 48.9 7.9 46.5 0.2 48.9 7.4 49.2 49.5 46.5 MSPS 47.7 7.9 46.5 49.2 50 fIN = 430MHz 7.4 49.2 50 49.5 46.5 MSPS 48.2 fIN = Nyquist 46.5 49.2 105 fIN = Nyquist 46.5 ENOB fIN = 10MHz SFDR 275 7.9 46.5 7.4 fIN = 430MHz 7.6 7.8 7.8 7.8 7.8 Bits fIN = 10MHz 65.0 67.6 69.1 69.1 69.1 dBc 69.1 dBc fIN = 430MHz fIN = Nyquist 61 64 62 61 66.1 66.6 61 69.1 69.0 61 69.1 69.0 61 68.9 dBc 2TSFDR fIN = 133MHz, 135MHz 61 63 65 65 65 dBc Word Error Rate WER 10-12 10-12 10-12 10-12 10-12 Full Power Bandwidth FPBW 600 600 600 600 600 MHz NOTE: 5. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design. 4 FN6813.1 April 14, 2011 KAD2708L Digital Specifications PARAMETER SYMBOL CONDITIONS MIN (Note 5) TYP MAX (Note 5) UNITS INPUTS High Input Voltage (VREFSEL) VREFSEL VIH Low Input Voltage (VREFSEL) VREFSEL VIL 0.8*AVDD3 V 0.2*AVDD3 V Input Current High (VREFSEL) VREFSEL IIH VIN = AVDD3 0 1 10 A Input Current Low (VREFSEL) VREFSEL IIL VIN = AVSS 25 65 75 A High Input Voltage (CLKDIV) CLKDIV VIH Low Input Voltage (CLKDIV) CLKDIV VIL Input Current High (CLKDIV) CLKDIV IIH VIN = AVDD3 CLKDIV IIL VIN = AVSS Input Current Low (CLKDIV) 0.8*AVDD3 V 0.2*AVDD3 V 25 65 75 A 0 1 10 A High Input Voltage (RST,2SC) RST,2SC VIH Low Input Voltage (RST,2SC) RST,2SC VIL Input Current High (RST,2SC) RST,2SC IIH VIN = OVDD 0 1 10 A Input Current Low (RST,2SC) RST,2SC IIL VIN = OVSS 25 50 75 A Input Capacitance 0.8*OVDD2 V 0.2*OVDD2 CDI 3 V pF CLKP, CLKN P-P Differential Input Voltage VCDI CLKP, CLKN Differential Input Resistance RCDI 10 M CLKP, CLKN Common-Mode Input Voltage VCCI 0.9 V VT 210 mV 0.5 3.6 VP-P LVDS OUTPUTS Differential Output Voltage VOS 1.15 V Output Rise Time tR 500 ps Output Fall Time tF 500 ps Output Offset Voltage 5 FN6813.1 April 14, 2011 KAD2708L Timing Diagram Sample N INP INN tA CLKN CLKP L CLKOUTN CLKOUTP tPID tPCD tPH D[7:0]P D[7:0]N Data N-L Data N-L+1 Data N invalid FIGURE 1. LVDS TIMING DIAGRAM Timing Specifications PARAMETER SYMBOL MIN TYP MAX UNITS Aperture Delay tA 1.7 ns RMS Aperture Jitter jA 200 fs Input Clock to Data Propagation Delay tPID 3.5 Data Hold Time tPH -300 Output Clock to Data Propagation Delay Latency (Pipeline Delay) Overvoltage Recovery 5.0 6.5 ns ps tPCD 2.8 3.7 ns L 28 cycles tOVR 1 cycle ESD Electrostatic charge accumulates on humans, tools and equipment and may discharge through any metallic package contacts (pins, balls, exposed paddle, etc.) of an integrated circuit. Industry-standard protection techniques have been utilized in the design of this product. However, reasonable care must be taken in the storage and handling of ESD sensitive products. Contact Intersil for the specific ESD sensitivity rating of this product. 6 FN6813.1 April 14, 2011 KAD2708L Pin Description PIN NUMBER NAME 1, 14, 18, 20 AVDD2 2, 7, 10, 19, 21, 24 AVSS Analog Supply Return 3 VREF Reference Voltage Out/In 4 VREFSEL 5 VCM 6, 15, 16, 25 AVDD3 3.3V Analog Supply 8, 9 INP, INN Analog Input Positive, Negative 11-13, 29-36, 62, 63, 67 DNC 17 CLKDIV 22, 23 CLKN, CLKP 26, 45, 61 OVSS 27, 41, 44, 60 OVDD2 28 RST 37, 38 D0N, D0P LVDS Bit 0 (LSB) Output Complement, True 39, 40 D1N, D1P LVDS Bit 1 Output Complement, True 42, 43 CLKOUTN, CLKOUTP LVDS Clock Output Complement, True 46, 47 D2N, D2P LVDS Bit 2 Output Complement, True 48, 49 D3N, D3P LVDS Bit 3 Output Complement, True 50, 51 D4N, D4P LVDS Bit 4 Output Complement, True 52, 53 D5N, D5P LVDS Bit 5 Output Complement, True 54, 55 D6N, D6P LVDS Bit 6 Output Complement, True 56, 57 D7N, D7P LVDS Bit 7 Output Complement, True 58, 59 ORN, ORP Over-Range Complement, True 64-66 FUNCTION 1.8V Analog Supply Reference Voltage Select (0:Int 1:Ext) Common-Mode Voltage Output Do Not Connect Clock Divide by Two (Active Low) Clock Input Complement, True Output Supply Return 1.8V LVDS Supply Power On Reset (Active Low) Connect to OVDD2 68 2SC Exposed Paddle AVSS 7 Two's Complement Select (Active Low) Analog Supply Return FN6813.1 April 14, 2011 KAD2708L 2SC DNC OVDD2 OVDD2 OVDD2 DNC DNC OVSS OVDD2 ORP ORN D7P D7N D6P D6N D5P D5N 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 Pin Configuration AVDD2 1 51 D4P AVSS 2 50 D4N VREF 3 49 D3P VREFSEL 4 48 D3N VCM 5 47 D2P AVDD3 6 46 D2N AVSS 7 KAD2708L 45 OVSS 44 OVDD2 43 CLKOUTP 68 QFN 42 CLKOUTN INP 8 INN 9 AVSS 10 DNC 11 41 OVDD2 DNC 12 40 D1P DNC 13 39 D1N 38 D0P 37 D0N Top View Not to Scale 21 22 23 24 25 26 27 28 29 30 31 32 33 34 AVSS CLKP AVSS AVDD3 OVSS OVDD2 RST DNC DNC DNC DNC DNC DNC DNC CLKN DNC 35 20 36 17 AVDD2 16 19 AVDD3 CLKDIV 18 15 AVSS 14 AVDD3 AVDD2 AVDD2 FIGURE 2. PIN CONFIGURATION 8 FN6813.1 April 14, 2011 KAD2708L Typical Performance Curves AVDD2 = OVDD2 = 1.8V, AVDD3 = 3.3V, TA = +25C, fSAMPLE = 350MHz, fIN = 175MHz, AIN = -0.5dBFS unless noted. -50 70 SFDR -60 HD 2, HD3((dBc) dBc S N R( d B F S ), S FD R ( d Bc) B -55 65 60 55 50 HD3 -70 -75 -80 SNR 45 -65 HD2 -85 -90 40 5 105 205 305 f IN (M Hz) 405 5 505 10 5 205 3 05 f IN( MHz) 405 505 FIGURE 4. HD2 AND HD3 vs fIN FIGURE 3. SNR AND SFDR vs fIN 80 70 HD3 -30 60 HD2, HD3 (dBc) dBc S N R (d B F S ) , S F D R (dBc) (d -20 -40 SNR 50 -50 HD2 -60 40 SFDR -70 30 -80 -30 20 -30 -2 5 -20 -1 5 A IN ( d B F S ) -1 0 -5 0 -25 -15 -10 -5 0 300 350 Input Amplitude (dBFS) FIGURE 5. SNR AND SFDR vs AIN FIGURE 6. HD2 AND HD3 vs AIN 80 -65 76 SFDR 72 -70 68 HD2, HD3(dBc) SNR(dBFS), SFDR (dBc) -20 64 60 56 52 -75 HD3 -80 -85 48 HD2 SNR 44 -90 40 50 100 150 200 250 f SA MP LE (fS ) (MSPS) FIGURE 7. SNR AND SFDR vs fSAMPLE 9 300 350 50 100 150 200 250 fSAMPLE (MSPS) FIGURE 8. HD2 AND HD3 vs fSAMPLE FN6813.1 April 14, 2011 KAD2708L Typical Performance Curves AVDD2 = OVDD2 = 1.8V, AVDD3 = 3.3V, TA = +25C, fSAMPLE = 350MHz, fIN = 175MHz, AIN = -0.5dBFS unless noted. (Continued) 350 1 POWER DISSIPATION (PD) (mW) 330 0.75 310 0.5 290 DNL (LSB s) 270 250 230 210 0.25 0 -0.25 190 -0.5 170 -0.75 150 100 150 200 250 fSAMPLE (fS ) (MSPS) 300 -1 0 350 32 64 96 128 CODE 160 192 224 255 FIGURE 10. DIFFERENTIAL NONLINEARITY vs OUTPUT CODE FIGURE 9. POWER DISSIPATION vs fSAMPLE 50,000 1 45,000 0.7 5 40,000 35,000 CODE COUNT INL (LS Bs) 0.5 0.2 5 0 -0.2 5 30,000 25,000 20,000 15,000 -0.5 10,000 -0.7 5 -1 5,000 0 32 64 96 128 CODE 160 1 92 2 24 0 124 25 5 125 FIGURE 11. INTEGRAL NONLINEARITY vs OUTPUT CODE 128 129 130 0 Ain = -0.47dBFS Ain = -0.47dBFS SNR = 49.4dBFS -20 SNR = 49.4dBFS -20 SFDR = 68.4dBc -40 SINAD = 49.3dBFS HD2 = -86dBc -60 HD3 = -69dBc -80 SFDR = 69.2dBc AMPLITUDE (dB) AMPLITUDE (dB) 127 CODE FIGURE 12. NOISE HISTOGRAM 0 -40 SINAD = 49.4dBFS HD2 = -81dBc -60 HD3 = -91dBc -80 -100 -100 -120 0 126 20 40 60 80 FREQUENCY (MHz) 100 120 FIGURE 13. OUTPUT SPECTRUM @ 9.865MHz 10 -120 0 20 40 60 80 FREQUENCY (MHz) 100 120 FIGURE 14. OUTPUT SPECTRUM @ 133.805MHz FN6813.1 April 14, 2011 KAD2708L Typical Performance Curves AVDD2 = OVDD2 = 1.8V, AVDD3 = 3.3V, TA = +25C, fSAMPLE = 350MHz, fIN = 175MHz, AIN = -0.5dBFS unless noted. (Continued) 0 0 Ain = -0.48dBFS Ain = -7.1dBFS SNR = 49.3dBFS -20 -20 2TSF DR = 67dBc IMD3 = -74dBFS SINAD = 49.1dBFS -40 AMPLIT UDE (dB) AMPLITUDE (dB) SFDR = 63dBc HD2 = -63dBc HD3 = -67dBc -60 -80 -60 -80 -100 -100 -120 -40 0 20 40 60 80 FREQUENCY (MHz) 100 -120 120 0 FIGURE 15. OUTPUT SPECTRUM @ 299.645MHz 20 40 60 80 FREQUENCY (MHz) 0 Ain = -7dBFS Ain = -7dBFS 2TSFD R = 63dBc -20 2TSF DR = 73dBc -20 IMD3 = -76dBFS IMD3 = -81dBFS -40 AMPLITUDE (dB) AMPLIT UDE (dB) -40 -60 -60 -80 -80 -100 -100 0 20 40 60 80 FREQUENCY (MHz) 100 -120 120 FIGURE 17. TWO-TONE SPECTRUM @ 140MHz, 141MHz 0 20 40 60 80 FREQUENCY (MHz) 100 120 FIGURE 18. TWO-TONE SPECTRUM @ 300MHz, 305MHz 75 700 70 SFDR 600 65 500 60 tCAL(ms) SNR(dBFS), SFDR(dBc) 120 FIGURE 16. TWO-TONE SPECTRUM @ 69MHz, 70MHz 0 -120 100 55 400 300 50 200 SNR 45 40 -40 -20 0 20 40 AMBIENT TEMPERATURE, C 60 FIGURE 19. SNR AND SFDR vs TEMPERATURE 11 80 100 100 125 150 175 200 225 250 275 300 325 350 f SAMPLE (f S) (MSPS) FIGURE 20. CALIBRATION TIME vs fS FN6813.1 April 14, 2011 KAD2708L Functional Description Voltage Reference The KAD2708L is an 8-bit, 350MSPS A/D converter in a pipelined architecture. The input voltage is captured by a sample-and-hold circuit and converted to a unit of charge. Proprietary charge-domain techniques are used to compare the input to a series of reference charges. These comparisons determine the digital code for each input value. The converter pipeline requires 24 sample clocks to produce a result. Digital error correction is also applied, resulting in a total latency of 28 clock cycles. This is evident to the user as a latency between the start of a conversion and the data being available on the digital outputs. The VREF pin is the full-scale reference, which sets the full-scale input voltage for the chip and requires a bypass capacitor of 0.1F or larger. An internally generated reference voltage is provided from a bandgap voltage buffer. This buffer can sink or source up to 50A externally. At start-up, a self-calibration is performed to minimize gain and offset errors. The reset pin (RST) is initially held low internally at power-up and remains in that state until calibration is complete. The clock frequency should remain fixed during this time. An external voltage can be applied to this pin to provide a more accurate reference than the internally generated bandgap voltage or to match the full-scale reference among a system of KAD2708L chips. One option in the latter configuration is to use one KAD2708L's internally generated reference as the external reference voltage for the other chips in the system. Additionally, an externally provided reference can be changed from the nominal value to adjust the full-scale input voltage within a limited range. Calibration accuracy is maintained for the sample rate at which it is performed and therefore should be repeated if the clock frequency is changed by more than 10%. Recalibration can be initiated via the RST pin, or power cycling, at any time. To select whether the full-scale reference is internally generated or externally provided, the digital input port, VREFSEL, should be set appropriately: low for internal, or high for external. This pin also has an internal 18k pull-up resistor. To use the internally generated reference, VREFSEL can be tied directly to AVSS, and to use an external reference, VREFSEL can be left unconnected. Reset Analog Input Recalibration of the ADC can be initiated at any time by driving the RST pin low for a minimum of one clock cycle. An open-drain driver is recommended. The fully differential ADC input (INP/INN) connects to the sample-and-hold circuit. The ideal full-scale input voltage is 1.5VP-P, centered at the VCM voltage of 0.86V, as shown in Figure 22. The calibration sequence is initiated on the rising edge of RST, as shown in Figure 21. The over-range output (ORP) is set high once RST is pulled low, and it remains in that state until calibration is complete. The ORP output returns to normal operation at that time, so it is important that the analog input be within the converter's full-scale range in order to observe the transition. If the input is in an over-range state, the ORP pin stays high, and it is not possible to detect the end of the calibration cycle. While RST is low, the output clock (CLKOUTP/CLKOUTN) stops toggling and is set low. Normal operation of the output clock resumes at the next input clock edge (CLKP/CLKN) after RST is deasserted. At 350MSPS, the nominal calibration time is ~190ms. CLKN CLKP Calibration Time RST Calibration Begins V 1.8 1.4 0.75V INN INP VCM 1.0 0.86V 0.6 -0.75V 0.2 t FIGURE 22. ANALOG INPUT RANGE Best performance is obtained when the analog inputs are driven differentially. The common-mode output voltage, VCM, should be used to properly bias each input, as shown in Figures 23 and 24. An RF transformer gives the best noise and distortion performance for wideband and/or high intermediate frequency (IF) inputs. Two different transformer input schemes are shown in Figures 23 and 24. ORP Calibration Complete CLKOUTP FIGURE 21. CALIBRATION TIMING 12 FN6813.1 April 14, 2011 KAD2708L Clock Input 0.01F Analog In 50O KAD2708 VCM ADT1-1WT ADT1-1WT 0.1F FIGURE 23. TRANSFORMER INPUT, GENERAL APPLICATION The clock input circuit is a differential pair (Figure 29). Driving these inputs with a high level (up to 1.8VP-P on each input) sine or square wave provides the lowest jitter performance. The recommended drive circuit is shown in Figure 26. The clock can be driven single-ended, but this reduces the edge rate and may impact SNR performance. 1kO 1kO AVDD2 CLKP 1nF ADTL1-12 Analog Input ADTL1-12 25O 1nF KAD2708 1nF A back-to-back transformer scheme is used to improve common-mode rejection, which keeps the common-mode level of the input matched to VCM. The value of the termination resistor should be determined based on the desired impedance. The sample-and-hold circuit design uses a switched capacitor input stage, which creates current spikes when the sampling capacitance is reconnected to the input voltage. This creates a disturbance at the input, which must settle before the next sampling point. Lower source impedance results in faster settling and improved performance; therefore, a 1:1 transformer and low shunt resistance are recommended for optimal performance. A differential amplifier can be used in applications that require DC coupling, at the expense of reduced dynamic performance. In this configuration, the amplifier typically reduces the achievable SNR and distortion performance. A typical differential amplifier configuration is shown in Figure 25. 348O 69.8O CLKN TC4-1W 0.1F FIGURE 26. RECOMMENDED CLOCK DRIVE FIGURE 24. TRANSFORMER INPUT, HIGH IF APPLICATION 25O Use of the clock divider is optional. The KAD2708L's ADC requires a clock with 50% duty cycle for optimum performance. If such a clock is not available, one option is to generate twice the desired sampling rate, and then use the KAD2708L's divide-by-2 to generate a 50%-duty-cycle clock. This frequency divider uses the rising edge of the clock, so a 50% clock duty cycle is assured. Table 2 describes the CLKDIV connection. TABLE 2. CLKDIV PIN SETTINGS CLKDIV PIN DIVIDE RATIO AVSS 2 AVDD 1 CLKDIV is internally pulled low, so a pull-up resistor or logic driver must be connected for undivided clock. Jitter In a sampled data system, clock jitter directly impacts the achievable SNR performance. The theoretical relationship between clock jitter and maximum SNR is shown in Equation 1 and illustrated in Figure 27. 1 SNR = 20 log 10 -------------------- 2f t 100O (EQ. 1) IN J 151O 0.22F CM 25O 69.8O 348O 0.1F FIGURE 25. DIFFERENTIAL AMPLIFIER INPUT 13 KAD2708 VCM 100O 49.9O 200O VCM 25O + Vin - 1nF Clock Input Where tJ is the RMS uncertainty in the sampling instant. This relationship shows the SNR that would be achieved if clock jitter were the only non-ideal factor. In reality, achievable SNR is limited by internal factors such as differential nonlinearity aperture jitter and thermal noise. FN6813.1 April 14, 2011 KAD2708L Any internal aperture jitter combines with the input clock jitter in a root-sum-square fashion, since they are not statistically correlated, and this determines the total jitter in the system. The total jitter, combined with other noise sources, then determines the achievable SNR. 10 0 95 tj=0.1 ps 90 14 Bits SN R - dB 85 80 tj=1 ps 12 Bits 75 Digital Outputs 70 tj=10 p s 65 60 Data is output on a parallel bus with LVDS-compatible drivers. 1 0 Bits tj=1 00 ps 55 The output format (Binary or Two's Complement) is selected via the 2SC pin as shown in Table 3. 50 1 10 1 00 1 00 0 In put Fr equen cy - MH z TABLE 3. 2SC PIN SETTINGS FIGURE 27. SNR vs CLOCK JITTER 2SC PIN MODE AVSS Two's Complement AVDD (or unconnected) Binary Equivalent Circuits AVDD2 A VD D3 IN P F1 C sam p 0.3pF F2 To C harge Pipeline AVDD2 To Clock Generation CLKP AV D D 3 IN N 2pF F1 C sam p 0.3pF F2 To C harge Pipeline AVDD2 CLKN FIGURE 28. ANALOG INPUTS FIGURE 29. CLOCK INPUTS OVDD OVDD DATA DATA D[7:0]P OVDD D[7:0]N DATA DATA FIGURE 30. LVDS OUTPUTS 14 FN6813.1 April 14, 2011 KAD2708L Layout Considerations Split Ground and Power Planes Data converters operating at high sampling frequencies require extra care in PC board layout. Many complex board designs benefit from isolating the analog and digital sections. Analog supply and ground planes should be laid out under signal and clock inputs. Locate the digital planes under outputs and logic pins. Ground planes, if separated, should be joined at the exposed paddle under the chip. Clock Input Considerations Use matched transmission lines to the inputs for the analog input and clock signals. Locate transformers, drivers and terminations as close to the chip as possible. Bypass and Filtering Aperture Jitter is the RMS variation in aperture delay for a set of samples. Clock Duty Cycle is the ratio of the time the clock wave is at logic high to the total time of one clock period. Differential Non-Linearity (DNL) is the deviation of any code width from an ideal 1 LSB step. Effective Number of Bits (ENOB) is an alternate method of specifying Signal to Noise-and-Distortion Ratio (SINAD). In dB, it is calculated as: ENOB = (SINAD - 1.76)/6.02. Integral Non-Linearity (INL) is the deviation of each individual code from a line drawn from negative full-scale (1/2 LSB below the first code transition) through positive full-scale (1/2 LSB above the last code transition). The deviation of any given code from this line is measured from the center of that code. Bulk capacitors should have low equivalent series resistance. Tantalum is a good choice. For best performance, keep ceramic bypass capacitors very close to device pins. Longer traces increase inductance, resulting in diminished dynamic performance and accuracy. Make sure that connections to ground are direct and low impedance. Least Significant Bit (LSB) is the bit that has the smallest value or weight in a digital word. Its value in terms of input voltage is VFS/(2N-1) where N is the resolution in bits. LVDS Outputs Most Significant Bit (MSB) is the bit that has the largest value or weight. Its value in terms of input voltage is VFS/2. Output traces and connections must be designed for 50 (100 differential) characteristic impedance. Keep traces direct, and minimize bends where possible. Avoid crossing ground and power-plane breaks with signal traces. Unused Inputs The RST and 2SC inputs are internally pulled up and can be left open-circuit if not used. CLKDIV is internally pulled low, which divides the input clock by two. VREFSEL is internally pulled up. It must be held low for internal reference, but it can be left open for external reference. Definitions Analog Input Bandwidth is the analog input frequency at which the spectral output power at the fundamental frequency (as determined by FFT analysis) is reduced by 3dB from its full-scale, low-frequency value. This is also referred to as Full Power Bandwidth. Aperture Delay or Sampling Delay is the time required after the rise of the clock input for the sampling switch to open, at which time the signal is held for conversion. Missing Codes are output codes that are skipped and never appear at the ADC output. These codes cannot be reached with any input value. Pipeline Delay is the number of clock cycles between the initiation of a conversion and the appearance at the output pins of the corresponding data. Power Supply Rejection Ratio (PSRR) is the ratio of a change in power supply voltage to the input voltage necessary to negate the resultant change in output code. Signal to Noise-and-Distortion (SINAD) is the ratio of the RMS signal amplitude to the RMS sum of all other spectral components below one-half the clock frequency, including harmonics but excluding DC. Signal-to-Noise Ratio (SNR) (without Harmonics) is the ratio of the RMS signal amplitude to the RMS sum of all other spectral components below one-half the sampling frequency, excluding harmonics and DC. Spurious-Free-Dynamic Range (SFDR) is the ratio of the RMS signal amplitude to the RMS value of the peak spurious spectral component. The peak spurious spectral component may or may not be a harmonic. Two-Tone SFDR is the ratio of the RMS value of either input tone to the RMS value of the peak spurious component. The peak spurious component may or may not be an IMD product. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 15 FN6813.1 April 14, 2011 KAD2708L Package Outline Drawing L68.10x10B 68 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 11/08 PIN 1 INDEX AREA 6 10.00 A 4X 8.00 B 52 PIN 1 INDEX AREA 6 68 51 1 35 17 64X 0.50 Exp. DAP 7.70 Sq. 10.00 0.15 (4X) 34 18 68X 0.55 TOP VIEW 68X 0.25 4 0.10 M C A B BOTTOM VIEW SEE DETAIL "X" 0.90 Max 8.00 Sq 0.10 C C 0.08 C SEATING PLANE 64X 0.50 SIDE VIEW 68X 0.25 9.65 Sq C 7.70 Sq 0 . 2 REF 5 0 . 00 MIN. 0 . 05 MAX. 68X 0.75 DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSEY14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 16 FN6813.1 April 14, 2011