Thick Film Chip Resistor
M55342/12 RM0603
GLASS
PASSIVATION
WRAPAROUND
TERMINATIONS 96% ALUMINA CHIP
RESISTOR
FILM
04/09/08
PERFORMANCE
MECHANICAL
Resistance Range 1 - 22M
Tolerances 1%, 2%, 5%, 10%
Maximum Power 100 mW
Maximum Voltage 50 Volts
WWResistance Range 1-22M
Tolerances 1%, 2%, 5%, 10%
Maximum Power 100 mW
Maximum Voltage 50 Volts
WW
PART NUMBERING
M55342 K 12 B 100DS-TRM55342 K 12 B 100D S - TR
TEMPERATURE CHARACTERISTIC: K: ± 100ppm M: ± 300ppmTEMPERATURE CHARACTERISTIC: K: ± 100ppm M: ± 300ppm
PERFORMANCE SPECIFICATION MIL-PRF-55342PERFORMANCE SPECIFICATION MIL-PRF-55342
TERMINATION MATERIALS:
B: Solderable wraparound C: Epoxy bondable palladium/silver wraparound U: Epoxy bondable platinum/gold wraparound
W: Gold wire bondable G: Gold wraparound
TERMINATION MATERIALS:
B: Solderable wraparound C: Epoxy bondable palladium/silver wraparound U: Epoxy bondable platinum/gold wraparound
W: Gold wire bondable G: Gold wraparound
SIZE CODE: /12 = RM0603SIZE CODE: /12 = RM0603
RESISTANCEAND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
RESISTANCEAND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% S: 0.001% T: Space Level C: Non - ERPRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% S: 0.001% T: Space Level C: Non - ER
D: 1% G: 2% J: 5% M: 10%
E: 1% K H: 2% K K: 5% K N: 10% K
F: 1% M T: 2% M L: 5% M P: 10% M
WWW W
WWW W
WWW W
D: 1% G: 2% J: 5% M: 10%
E: 1% KH:2% KK:5% KN:10% K
F: 1% MT:2% ML:5% MP:10% M
WWW W
WWW W
WWW W
PACKAGING CODE: TR = Tape & Reel W= Waffle PackPACKAGING CODE: TR = Tape & Reel W= Waffle Pack
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
TESTS
TCR (-55 to +125 C) in ppm/ C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours
High Temperature Exposure
°°
TESTS
TCR (-55 to +125 C) in ppm/ C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours
High Temperature Exposure
°°
K
±100
±0.5%
±0.25%
±0.25%
±0.25%
±0.5%
±0.5%
±0.5%
K
±100
±0.5%
±0.25%
±0.25%
±0.25%
±0.5%
±0.5%
±0.5%
M
±300
±0.5%
±0.5%
±0.5%
±0.25%
±0.5%
±2.0%
±1.0%
M
±300
±0.5%
±0.5%
±0.5%
±0.25%
±0.5%
±2.0%
±1.0%
CHARACTERISTICS*
StateoftheArt,Inc.
LIFE TEST POWER DERATING
POWER DISSIPATION
TEMPERATURE RISE (°C)
POWER DISSIPATION (WATTS)
fiber epoxy board
ceramic board
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
.092
.034
.030
.031
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.062 (.058 - .070)
.032 (.027 - .037)
.018 (.010 - .033)
.010 (.007 - .017)
.014 (.010 - .020)
.034 (.030 - .038)
.00235 grams
.062 (.058 - .070)
.032 (.027 - .037)
.018 (.010 - .033)
.010 (.007 - .017)
.014 (.010 - .020)
.034 (.030 - .038)
.00235 grams
1.58 (1.47 - 1.78)
0.81 (0.69 - 0.94)
0.46 (0.25 - 0.84)
0.25 (0.18 - 0.43)
0.36 (0.25 - 0.51)
0.86 (0.76 - 0.97)
1.58 (1.47 - 1.78)
0.81 (0.69 - 0.94)
0.46 (0.25 - 0.84)
0.25 (0.18 - 0.43)
0.36 (0.25 - 0.51)
0.86 (0.76 - 0.97)
INCHES MILLIMETERSINCHES MILLIMETERS
State of the Art, Inc.State of the Art, Inc. 2470 Fox Hill Road, State College, PA 16803-17972470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401Toll Free 1-800-458-3401
www.resistor.com
“Specifications subject to change without notice.”“Specifications subject to change without notice.”
