Thyristors Surface Mount - 600V > Z0103MN, Z0107MN, Z0109MN Z0103MN, Z0107MN, Z0109MN Pb Description Designed for use in solid state relays, MPU interface, TTL logic and other light industrial or consumer applications. Supplied in surface mount package for use in automated manufacturing. Features * Sensitive Gate Trigger Current in Four Trigger Modes * Blocking Voltage to 600 V *Glass Passivated Surface for Reliability and Uniformity Pin Out * Surface Mount Package * These are Pb-Free Devices Functional Diagram 4 MT 2 MT 1 G 1 2 3 Additional Information Datasheet Resources Samples (c) 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/26/19 Thyristors Surface Mount - 600V > Z0103MN, Z0107MN, Z0109MN Maximum Ratings (TJ = 25C unless otherwise noted) Symbol Value Peak Repetitive Off-State Voltage (Note 1) (RGK = IK, TJ- 40 to +125C, Sine Wave, 50 to 60 Hz) Rating VDRM, VRRM 600 On-State RMS Current (Full Sine Wave 50 to 60 Hz; TC = 80C) IT (RMS) 1.0 A Peak Non-repetitive Surge Current (One Full Cycle Sine Wave, 60 Hz, TC = 25C) IT (RMS) 8.0 A 2 It 0.4 A2s PG(AV) 1.0 W IGM 1.0 A Circuit Fusing Considerations (t = 8.3 ms) Average Gate Power (TC = 80C, t 8.3 ms) Peak Gate Current (t 20 s, TJ = +125C) Unit V Operating Junction Temperature Range @ Rated VRRM and VDRM TJ -40 to +110 C Storage Temperature Range Tstg -40 to +150 C Thermal Characteristics Rating Thermal Resistance, Junction-to-Ambient PCB Mounted per Figure 1 Thermal Resistance, Junction-to-Tab Measured on MT2 Tab Adjacent to Epoxy Maximum Device Temperature for Soldering Purposes for 10 Secs Maximum Symbol Value Unit R8JA 156 C/W R8JT 25 C/W TL 260 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1.VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded. Electrical Characteristics - OFF (TJ = 25C unless otherwise noted) Characteristic Peak Repetitive Forward or Reverse Blocking Current (Note 3) (VAK = Rated VDRM or VRRM, RGK = 1000 kQ Symbol TJ = 25C TJ = 125C IDRM, Min Typ Max - - 5.0 - - 500 Unit A (c) 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/26/19 Thyristors Surface Mount - 600V > Z0103MN, Z0107MN, Z0109MN Electrical Characteristics - ON (TJ = 25C unless otherwise noted; Electricals apply in both directions) Characteristic Symbol Min Typ Max Unit VTM - - 1.8 V MT2(+), G(+) 0.15 - 3.0 MT2(+), G(-) 0.15 - 3.0 0.15 - 3.0 Peak On-State Voltage (ITM = 11 A Peak, Pulse Width 2 ms, Duty Cycle 2%) Z0103MN Gate Trigger Current (Continuous dc) (VD = 12 V, RL = 30 Ohms) Z0107MN Gate Trigger Current (Continuous dc) (VD = 12 V, RL = 30 Ohms) Z0109MN Gate Trigger Current (Continuous dc) (VD = 12 V, RL = 30 Ohms) Z0103MN Latching Current (VD = 12 V, IG = 1.2 x IGT) ALL TYPES Z0107MN Latching Current (VD = 12 V, IG = 1.2 x IGT) ALL TYPES Z0109MN Latching Current (VD = 12 V, IG = 1.2 x IGT) ALL TYPES MT2(-), G(-) IGT MT2(-), G(+) 0.25 - 5.0 MT2(+), G(+) 0.15 - 5.0 0.15 - 5.0 0.15 - 5.0 MT2(+), G(-) MT2(-), G(-) IGT MT2(-), G(+) 0.25 - 7.0 MT2(+), G(+) 0.15 - 10 MT2(+), G(-) 0.15 - 10 0.15 - 10 MT2(-), G(-) IGT MT2(-), G(+) 0.25 - 10 MT2(+), G(+) - - 7.0 - - 15 - - 7.0 7.0 MT2(+), G(-) MT2(-), G(-) IL MT2(-), G(+) - - MT2(+), G(+) - - 10 MT2(+), G(-) - - 20 - - 10 MT2(-), G(-) IL MT2(-), G(+) - - 10 MT2(+), G(+) - - 15 - - 25 - - 15 - - 15 MT2(+), G(-) MT2(-), G(-) IL MT2(-), G(+) Electrical Characteristics - ON (TJ = 25C unless otherwise noted; Electricals apply in both directions) mA mA mA mA mA mA Continued Gate Trigger Voltage (Continuous dc) (VD = 12 Vdc, RL = 30 Ohms) VGT - - 1.3 V Gate-Controlled Turn-On Time, (VD = Rated VDRM, ITM = 16 A Peak, IG = 30 mA) tgt 0.2 - 10 s (c) 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/26/19 Thyristors Surface Mount - 600V > Z0103MN, Z0107MN, Z0109MN Dynamic Characteristics Characteristic Rate of Change of Commutating Current (VD = 400 V, ITM = 0.84 A, Commutating dv/dt = 1.5 V/s, Gate Open, TJ = 110C, f = 250 Hz, with Snubber) Symbol Min Typ Max Unit dv/dt 1.6 - - A/ms 10 30 _ Z0103MN Critical Rate of Rise of On-State Current (TC = 110C, IG = 2 x IGT, RGK = 1 k) Z0107MN di/dt Z0109MN Repetitive Critical Rate of Rise of On-State Current, TJ = 125C Pulse Width = 20 s, IPKmax = 15 A, diG/dt = 1 A/s, f = 60 Hz 20 60 _ 50 75 _ - - 20 V/s A/s Voltage Current Characteristic of SCR Symbol Parameter VDRM Peak Repetitive Forward Off State Voltage IDRM Peak Forward Blocking Current VRRM Peak Repetitive Reverse Off State Voltage IRRM Peak Reverse Blocking Current VTM Maximum On State Voltage IH +C urrent V TM on stat e IH I RR M at V RR M Holding Current off stat e IH Quadrant 3 Main Terminal 2 MT2 POSITIVE (Positive Half Cycle) + 0.15 3.8 0.079 2.0 0.091 2.3 MT 1 RE F RE F ( ) MT 2 ( ) MT 2 I GT 0.091 2.3 0.244 6.2 0.079 2.0 Q ua dr a nt I (+) I GT GA TE MT 1 Q u a dr a n t III V TM (+) MT 2 (+) MT 2 ( ) I GT GA TE +V oltage I DR M at V DR M Figure 1. PCB for Thermal Impedance and Power Testing of SOT-223 Quadrant Definitions for a Triac Q u a dr a n t II Quadrant 1 Main Terminal 2 + 0.059 1.5 0.984 25.0 0.059 1.5 0.059 1.5 inches mm +I GT Q u a dr a n t IV (+) I GT GA TE ( ) I GT GA TE MT 1 MT 1 0.096 2.44 0.096 2.44 0.096 2.44 0.059 1.5 0.059 1.5 RE F RE F 0.472 12.0 MT2 NEGA TIVE (Negative Half Cycle) All polarities are referenced to MT1. With in phase signals (using standard AC lines) quadrants I and III are used . BOARD MOUNTED VERTICALLY IN CINCH 8840 EDGE CONNECTOR BOARD THICKNESS = 65 MIL., FOIL THICKNESS = 2.5 MIL. MATERIAL: G10 FIBERGLASS BASE EPOXY (c) 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/26/19 Thyristors Surface Mount - 600V > Z0103MN, Z0107MN, Z0109MN Figure 3. Junction to Ambient Thermal Resistance vs Copper Tab Area Figure 2. On-State Characteristics 10 1.0 0.1 TYPICAL AT TJ = 110C MAX AT TJ = 110C MAX AT TJ = 25C IT 0.01 0 1.0 2.0 3.0 4.0 5.0 vT TA , MAXIMUM ALLOWABLEA MBIENT TEMPERATURE ( C) Figure 4. Current Derating, Minimum Pad Size Reference: Ambient Temperature Figure 5. Current Derating, 1.0 cm Square Pad Reference: Ambient Temperature 110 100 30 90 60 90 80 = CONDUCTION ANGLE dc 70 = 180 60 120 50 MINIMUM FOOTPRINT 50 OR 60 Hz 40 30 20 0 0.1 IT(RMS) 0.2 0.3 0.4 0.5 Figure 6. Current Derating, 2.0 cm Square Pad Reference: Ambient Temperature Figure 7. Current Derating Reference: MT2 Tab (c) 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/26/19 Thyristors Surface Mount - 600V > Z0103MN, Z0107MN, Z0109MN Figure 9. Thermal Response, Device Mounted on Figure 1 Printed Circuit Board Figure 8. Power Dissipation Figure 10. Simplified Test Circuit to Measure the Critical Rate of Rise of Commutating Voltage (dv/dt)c LL 1N4007 200 VRMS ADJUST FOR ITM, 60 Hz VAC TRIGGER CHARGE CONTROL CL TRIGGER CONTROL CHARGE MEASURE I CS MT2 1N914 51 G c. Figure 11. Typical Commutating dv/dt vs Current Crossing Rate and Junction Temperature RS - ADJUST FOR + dv/dt(c) 200 V MT1 See AN1048 for additional information. Figure 12. Typical Commutating dv/dt vs Junction Temperature at 0.8 Amps RMS (c) 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/26/19 Thyristors Surface Mount - 600V > Z0103MN, Z0107MN, Z0109MN Figure 13. Exponential Static dv/dt versus Gate - Main Terminal 1 Resistance Figure 14. Typical Gate Trigger Current Variation Figure 15. Typical Holding Current Variation Figure 16. Gate Trigger Voltage Variation (c) 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/26/19 Thyristors Surface Mount - 600V > Z0103MN, Z0107MN, Z0109MN Dimensions Soldering Footprint 3.8 0.15 D b1 HE 2.0 0.079 4 12 E 3 2.3 0.091 b e1 e C A 0.08 (0003) Dim A1 L Inches 2.0 0.079 L1 1.5 0.059 Millimeters Min Nom Max Min Nom Max --- --- 0.071 --- --- 1.80 A1 0.001 0.003 0.005 0.02 0.07 0.13 b 0.026 0.030 0.033 0.66 0.75 0.84 b1 0.114 0.118 0.122 2.90 3.00 3.10 c 0.009 0.011 0.014 0.23 0.29 0.35 D 0.260 0.260 0.264 6.60 6.60 6.71 E 0.130 0.138 0.146 3.30 3.50 3.70 e --- 0.091 --- --- 2.30 --- e1 0.030 0.037 0.045 0.75 0.95 1.15 A L1 0.059 0.069 0.079 1.50 1.75 2.00 HE 0.268 0.276 0.283 6.80 7.00 7.20 o 0 --- 10 0 --- 10 Ordering Information Z0103MNT1G Z0107MNT1G Z0109MNT1G Package Shipping SOT-223 (Pb-Free) SOT-223 (Pb-Free) SOT-223 (Pb-Free) 1000 / Tape & Reel SCALE 6:1 mm inches Part Marking System SOT 223 CASE 318 E STYLE 11 10XMN x Y M A XX G 10XMN YMAXX =Device Code =3, 7, and 9 =Year =Month =Assembly Site =Lot Serial Code =Pb-Free Package (Note: Microdot may be in either location) 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2.CONTROLLING DIMENSION: INCH. Device 6.3 0.248 2.3 0.091 Pin Assignment 1 Main Terminal 1 2 Main Terminal 2 3 Gate 4 Main Terminal 2 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at: www.littelfuse.com/disclaimer-electronics (c) 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/26/19