508
Magnetic
Sensors
Piezo
Sensors
Capacitive
Sensor
Resistive
Sensors
MEMS Pressure Sensor
HSPP
□
Series
Small size pressur
e sensor with gr
owing applications.
Piezo
Sensor
Style
Dimensions
Unit:mm
¿
3
.
9
5
3.5
1.0 max.
0.1
0
.
5
1
.
0
0.9
1.5
3
.
5
2.5
2
.
5
0.7 max.
0.5
0
.
5
1.22
1
.
2
2
¿
4
.
0
0
1.85
2
.
8
0.15
HSPPAR
HSPPAA
HSPPARC
5
0
t
o
1
10
−
2
0
℃
to
+
6
0
℃
Output voltage/110kPa (mV)
Span voltage(
mV
)
Function
Pressure type
Operating pressure (kPa)
Operating temperature range
Supply current
(mA)
・
Vol
tage (V)
Typical Specifications
Items
H
SPPAR
Specifications
S
mall and low profile
A
bsolute pressure
−
2
0
℃
to
+
8
5
℃
Icc=
0.55mA
44
with amplifier
Water proof type
Size
2
.5
×
2
.5
×
0
.7mm
3.5
×
3
.5
×
1
.0mm
V
4
.0
×
2
.0mm
Vdd=
2.5
±
0.125V
Icc=
0.15mA
870
12
79
1600
21.5
Output voltage/101.3kPa (mV)
(
72.6
)(
1474
)(
19.8
)
Temperature characteristics of
offset voltage (%FS)
−
4
to
+
6
−
2
to
+
3
Temperature characteristics of
span voltage (%FS)
−
4
to
+
4
−
2
to
+
3
Bridge resistance (
kΩ
)
5
to
7
−
4
to
7
Output impedance (
kΩ
)
Minimum order unit
(
pcs.
)
−
3,000
7
to
13
1,500
−
Please contact us
HSPPAA
HSPPARC
Product
No.
8
45,000
3,000
3,000
HSPPAR
Number of packages
(
pcs.
)
Tape
width
(
mm
)
210
×
210
×
230
12
15,000
1,500
1,500
HSPPAA
Export
package
measurements
(
mm
)
1 reel
1 case
/Japan
1 case
/export
packing
Packing Specifications
Taping
Reel size
110
105
13
6
0
1
8
0
105
110
R
8
9
.
5
R
8
9
.
5
R
8
9
.
5
11.4
9
R
8
9
.
5
6
0
.
0
1
8
0
.
0
15.4
Unit:mm
HSPPAR
HSPPAA
※
For water-proof type (HSPPARC) packing sp
ecifications, please contact us.
Note
1.85
ø3.95
ø4.00
2.8
0.15
Please place purchase orders per minimum o
rder unit N (integer).
Note
HSPPAR
H
SPPAA
HSPPARC
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