CY2309NZ Nine Output, 3.3V SDRAM Buffer for 2 DIMMs or 4 SO-DIMMs Features Functional Description * One input to nine output buffer/driver The CY2309NZ is a low-cost SDRAM buffer designed to distribute high-speed clocks in mobile PC systems and desktop PC systems with SDRAM support. The part has nine outputs, eight of which can be used to drive 2 DIMMs or 4 SO-DIMMs, and the remaining can be used for external feedback to a PLL. The device operates at 3.3V and outputs can run up to 100 MHz, making it compatible with Pentium II(R) processors and 100-MHz chipsets. The CY2309NZ can be used in conjunction with the CY2281, CY2282, CY2283, CY2284 or similar clock synthesizers for a full Pentium II motherboard solution. * Supports two SDRAM DIMMs or four SO-DIMMs with one additional output for feedback to an external or chipset PLL * Low power consumption for mobile applications -- Less than 25 mA at 66.6 MHz with unloaded outputs * 8.7-ns Input-Output delay * Buffers all frequencies from DC to 100 MHz * Output-output skew less than 250 ps The CY2309NZ is designed for low EMI and power optimization. It has multiple VSS and VDD pins for noise optimization and consumes less than 25 mA at 66.6 MHz, making it ideal for the low power requirements of mobile systems. It is available in an ultra-compact 150-mil 16-pin SOIC package. * Multiple VDD and VSS pins for noise and EMI reduction * Space-saving 16-pin 150-mil SOIC package * 3.3V operation Block Diagram Pin Configuration BUF_IN SDRAM1 16 SOIC Top View SDRAM2 BUF_IN SDRAM1 1 16 SDRAM3 2 15 SDRAM2 V DD 3 14 SDRAM4 4 13 SDRAM5 GND SDRAM3 5 12 6 11 SDRAM4 V DD 7 10 8 9 SDRAM6 SDRAM9 SDRAM8 SDRAM7 VDD GND SDRAM6 SDRAM5 GND SDRAM7 SDRAM8 SDRAM9 Pin Description for CY2309NZ Signal Pin Description VDD 4, 8, 13 3.3V Digital Voltage Supply GND 5, 9, 12 Ground BUF_IN SDRAM [1:9] 1 Input Clock 2, 3, 6, 7, 10, 11, 14, 15, 16 SDRAM Clock Outputs Intel and Pentium are registered trademarks of Intel Corporation. Cypress Semiconductor Corporation * 3901 North First Street * San Jose * CA 95134 * 408-943-2600 October 14, 1999 CY2309NZ Storage Temperature ................................. -65C to +150C Maximum Ratings Max. Soldering Temperature (10 sec.) ....................... 260C Supply Voltage to Ground Potential ............... -0.5V to +7.0V Junction Temperature ................................................. 150C DC Input Voltage (Except REF) ............-0.5V to VDD + 0.5V Static Discharge Voltage (per MIL-STD-883, Method 3015) ............................ >2,000V DC Input Voltage REF......................................... -0.5V to 7V Operating Conditions Parameter Description VDD Supply Voltage TA Operating Temperature (Ambient Temperature) Min. Max. Unit 3.0 3.6 V 0 70 C CL Load Capacitance 30 pF CIN Input Capacitance 7 pF BUF_IN, SDRAM [1:9] Operating Frequency DC 100 MHz Min. Max. Unit 0.8 V VIN = 0V 50.0 A Electrical Characteristics Parameter VIL Description Input LOW Voltage [1] VIH Input HIGH Voltage IIL Input LOW Current IIH Input HIGH Current VOL Test Conditions [1] Output LOW Voltage 2.0 V VIN = V DD 100.0 A [2] IOL = 8 mA 0.4 V [2] IOH = -8 mA 35 mA VOH Output HIGH Voltage IDD Supply Current 2.4 V Unloaded outputs at 66.66 MHz, SEL inputs at VDD or GND Switching Characteristics [3] Over the Operating Range Parameter Name Duty Cycle t3 Rise Time [2] = t2 / t1 [2] [2] Description Min. Typ. Max. Unit 40.0 50.0 60.0 % Measured between 0.8V and 2.0V 1.50 ns Measured at 1.4V t4 Fall Time Measured between 0.8V and 2.0V 1.50 ns t5 Output to Output Skew[2] All outputs equally loaded 250 ps t6 Propagation Delay, BUF_IN Rising Edge to SDRAM Rising Edge[2] Measured at VDD/2 8.7 ns Notes: 1. BUF_IN input has a threshold voltage of VDD/2. 2. Parameter is guaranteed by design and characterization. Not 100% tested in production. 3. All parameters specified with loaded outputs. 2 1 5 CY2309NZ Switching Waveforms Duty Cycle Timing t1 t2 1.4V 1.4V 1.4V All Outputs Rise/Fall Time OUTPUT 2.0V 0.8V 3.3V 2.0V 0.8V 0V t4 t3 Output-Output Skew OUTPUT 1.4V 1.4V OUTPUT t5 Input-Output Propagation Delay INPUT VDD /2 VDD/2 OUTPUT t6 3 CY2309NZ Test Circuits VDD CLK out 0.1 F OUTPUTS C LOAD VDD 0.1 F GND GND Ordering Information Ordering Code Package Name Package Type Operating Range CY2309NZSC-1H S16 16-pin 150-mil SOIC Commercial Document #: 38-00709-C Package Diagram 16-Lead (150-Mil) Molded SOIC S16 51-85068-A (c) Cypress Semiconductor Corporation, 1999. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.