03/2012
ALT6708
HELP4TM UMTS900 (Band 8)
WCDMA, LTE Linear PAM
Data Sheet - Rev 2.3
M45 Package
10 Pin 3 mm x 3 mm x 1 mm
Surface Mount Module
Figure 1: Block Diagram
FEATURES
• HSPA, LTE Compliant
• 4th Generation HELPTM technology
• HighEfciency(R99waveform):
•40%@POUT = +28.8 dBm
•26%@POUT = +17 dBm
•17%@POUT = +13.5 dBm
•18%@POUT = +7.5 dBm
•10%@POUT = +3.5 dBm
• LowQuiescentCurrent:3mA
• LowLeakageCurrentinShutdownMode:<5µA
• InternalVoltageRegulator
• Integrated“daisychainable”directionalcoupler
withCPLIN and CPLOUT port.
• InternalDCBlocksonallRFports
• Optimized for a 50 ΩSystem
• 1.8V Control Logic
• RoHSCompliantPackage,260oC MSL-3
APPLICATIONS
• Band8LTEWirelessDevices
• Band8(EGSM)WCDMA/HSPAWireless
Devices
1
2
3
4
5
10
9
8
7
6
V
BATT
RF
IN
V
MODE2
V
MODE1
V
EN
CPL
OUT
GND
CPL
IN
RF
OUT
V
CC
Bias Control
Voltage Regulation
CPL
GND at Slug (pad)
PRODUCT DESCRIPTION
TheALT6708HELP4TMPAisa4thgenerationHELPTM
product for LTE and WCDMA devices operating in
UMTS900(Band8).ThisPAincorporatesANADIGICS’
HELP4TMtechnologytodeliverexceptionalefciency
atlowpowerlevelsandlowquiescentcurrentwithout
theneedforexternalvoltageregulatorsorconverters.
ThedeviceismanufacturedusingadvancedInGaP-
PlusTM HBT technology offering state-of-the-art
reliability, temperature stability, and ruggedness.
Threeselectablebiasmodesthatoptimizeefciency
fordifferentoutputpowerlevelsandashutdownmode
with low leakage current increase handset talk and
standbytime.A“daisychainable”directionalcoupleris
integratedinthemodule,thuseliminatingtheneedof
anexternalcoupler.Theself-contained3mmx3mm
x1mmsurfacemountpackageincorporatesmatching
networksoptimizedforoutputpower,efciency,and
linearity in a 50 Ωsystem.
ALT6708