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e2v semiconductors SAS 2009
PC7448
PowerPC 7448 RISC Microprocessor
Datasheet
Features
•3000 Dhrystone 2.1 MIPS at 1.3 GHz
•Selectable Bus Clock (30 CPU Bus Dividers up to 28x)
•Selectable MPx/60x Interface Voltage (1.5V; 1.8V; 2.5V)
•PD Typically 10W at 1.25 GHz at VDD = 1.1V
Full Operating Conditions
•Nap, Doze and Sleep Power Saving Modes
•Superscalar (Four Instructions Fetched Per Clock Cycle)
•4 GB Direct Addressing Range
•Virtual Memory: 4 Hexabytes (252)
•64-bit Data and 36-bit Address Bus Interface
•Integrated L1: 32 KB Instruction and 32 KB Data Cache
•Integrated L2: 1 MB with ECC
•11 Independent Execution Units and 3 Register Files
•Write-back and Write-through Operations
•fINT Max = 1267 MHz
•fBUS Max = 133 MHz/166 MHz and 200 MHz
Description
This document is primarily concerned with the Power Architecture™ PC7448. The PC7448 is an implementation of the
PowerPC microprocessor family of Reduced Instruction Set Computer (RISC) microprocessors. This document describes
pertinent electrical and physical characteristics of the PC7448. For information regarding specific PC7448 part numbers
covered by this document and part numbers covered by other documents, See “Ordering Information” on page 52.” For
functional characteristics of the processor, refer to the PC7450 RISC Microprocessor Family Reference Manual.
Screening
•Full Military Temperature Range (TC = –55°C, TJ = +125°C)
•Industrial Temperature Range (TC = –40°C, TJ = +110°C)
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1. Overview
The PC7448 is the sixth implementation of fourth-generation (G4) microprocessors from Freescale™.
The PC7448 implements the full PowerPC 32 bits architecture and is targeted at networking and com-
puting systems applications. The PC7448 consists of a processor core and a 1 Mbyte L2.
Figure 1-1 on page 3 shows a block diagram of the PC7448. The core is a high-performance superscalar
design supporting a double-precision floating-point unit and a SIMD multimedia unit.
The memory storage subsystem supports the MPX bus protocol and a subset of the 60x bus protocol to
main memory and other system resources.
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Figure 1-1. PC7448 Block Diagram
+
Integer
Reservation
Station
Unit 2
+
Integer
Reservation
Station
Unit 2
Additional Features
• Time Base Counter/Decrementer
Clock Multiplier
JTAG/COP Interface
Thermal/Power Management
Performance Monitor
Out-of-Order Issue of AltiVec Instr.
+
+
x ÷
FPSCR
FPSCR
PA
+ x ÷
Instruction Unit Instruction Queue
(12-Word)
96-Bit (3 Instructions)
Reservation
Integer
128-Bit (4 Instructions)
32-Bit
Floating-
Point Unit
64-Bit
Reservation
Load/Store Unit
(EA Calculation)
Finished
32-Bit
(16-Entry)
Tags 32-Kbyte
D Cache
36-Bit 64-Bit
Integer
Stations (2)
Reservation
Station
Reservation
Stations (2) FPR File
16 Rename
Buffers
Stations (2-Entry)
GPR File
16 Rename
Buffers
Reservation
Station
VR File
16 Rename
Buffers
64-Bit
128-Bit
128-Bit
Completed
Instruction MMU
SRs
(Shadow)
128-Entry
IBAT Array
ITLB Tags 32-Kbyte
I Cache
Stores
Stores
Load Miss
Vector
To u c h
Queue
(3)
VR Issue FPR Issue
Branch Processing Unit
CTR
LR
BTIC (128-Entry)
BHT (2048-Entry)
Fetcher
GPR Issue
(6-Entry/3-Issue)(4-Entry/2-Issue) (2-Entry/1-Issue)
Dispatch
Unit Data MMU
SRs
(Original)
128-Entry
DBAT Array
DTLB
Vector Touch Engine
32-Bit
EA
L1 Castout
Status
L2 Store Queue (L2SQ)
Vector
FPU
Reservation
Station
Reservation
Station
Reservation
Station
Vector
Integer
Unit 1
Vector
Integer
Unit 2
Vector
Permute
Unit
Line
Tags
Block 0 (32-Byte)
Status
Block 1 (32-Byte)
Memory Subsystem
Snoop Push/
Interventions
L1 Castouts
Bus Accumulator
L1 Push
(4)
Unit 2 Unit 1
L1 Load Queue (LLQ)
L1 Load Miss (5)
Cacheable Store Miss (2)
Instruction Fetch (2)
L1 Service
L1 Store Queue
(LSQ)
System Bus Interface
L2 Prefetch (3)
Address Bus Data Bus
Queues
Castout
Bus Store Queue
Push
Load
Queue (11)
Queue (5) /
Queue (6)
1
1-Mbyte Unified L2 Cache Controller
Completion Queue
Completion Unit
Completes up
to three
per clock
instructions
Notes: The castout Queue and Push Queue share resources such for a combined total of 6 entries.
The castout Queue itself is limited to 5 entries, ensuring 1 entry will be available for a push.
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Note that the PC7448 is a footprint-compatible, drop-in replacement in an PC7447A application if the
core voltages are identical.
2. Features
This section summarizes features of the PC7448 implementation of the PowerPC architecture.
Major features of the PC7448 are as follows:
• High-performance, superscalar microprocessor
Up to four instructions can be fetched from the instruction cache at a time
Up to three instructions plus a branch instruction can be dispatched to the issue queues at a time
Up to 12 instructions can be in the Instruction Queue (IQ)
Up to 16 instructions can be at some stage of execution simultaneously
Single-cycle execution for most instructions
One instruction per clock cycle throughput for most instructions
Seven-stage pipeline control
• Eleven independent execution units and three register files
Branch Processing Unit (BPU) features static and dynamic branch prediction
– 128-entry (32-set, four-way set-associative) Branch Target Instruction Cache (BTIC), a
cache of branch instructions that have been encountered in branch/loop code sequences. If
a target instruction is in the BTIC, it is fetched into the instruction queue a cycle sooner than
it can be made available from the instruction cache. Typically, a fetch that hits the BTIC
provides the first four instructions in the target stream
– 2048-entry Branch History Table (BHT) with 2 bits per entry for four levels of prediction: not
taken, strongly not taken, taken, and strongly taken
– Up to three outstanding speculative branches
– Branch instructions that do not update the count register (CTR) or Link Register (LR) are
often removed from the instruction stream
– Eight-entry link register stack to predict the target address of branch conditional to link
register (bclr) instructions
Four Integer Units (IUs) that share 32 GPRs for integer operands
– Three identical IUs (IU1a, IU1b, and IU1c) can execute all integer instructions except
multiply, divide, and move to/from special-purpose register instructions
– IU2 executes miscellaneous instructions, including the CR logical operations, integer
multiplication and division instructions, and move to/from special-purpose register
instructions
Five-stage FPU and 32-entry FPR file
– Fully IEEE® 754-1985 – compliant FPU for both single- and double-precision operations
– Supports non-IEEE mode for time-critical operations
– Hardware support for denormalized numbers
– Thirty-two 64 bits FPRs for single or double-precision operands
Four vector units and 32-entry Vector Register file (VRs).
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– Vector Permute Unit (VPU)
– Vector Integer Unit 1 (VIU1) handles short-latency AltiVec® integer instructions, such as
vector add instructions (for example, vaddsbs, vaddshs, and vaddsws)
– Vector Integer Unit 2 (VIU2) handles longer-latency AltiVec integer instructions, such as
vector multiply add instructions (for example, vmhaddshs, vmhraddshs, and vmladduhm)
– Vector Floating-point Unit (VFPU)
Three-stage Load/Store Unit (LSU)
– Supports integer, floating-point, and vector instruction load/store traffic
– Four-entry Vector Touch Queue (VTQ) supports all four architected AltiVec data stream
operations
– Three-cycle GPR and AltiVec load latency (byte, half word, word, vector) with one-cycle
throughput
– Four-cycle FPR load latency (single, double) with one-cycle throughput
– No additional delay for misaligned access within double-word boundary
– A dedicated adder calculates Effective Addresses (EAs)
– Supports store gathering
– Performs alignment, normalization, and precision conversion for floating-point data
– Executes cache control and TLB instructions
– Performs alignment, zero padding, and sign extension for integer data
– Supports hits under misses (multiple outstanding misses)
– Supports both big and little-endian modes, including misaligned little-endian accesses
• Three issue queues, FIQ, VIQ, and GIQ, can accept as many as one, two, and three instructions,
respectively, in a cycle. Instruction dispatch requires the following:
Instructions can only be dispatched from the three lowest IQ entries, IQ0, IQ1, and IQ2
A maximum of three instructions can be dispatched to the issue queues per clock cycle
Space must be available in the CQ for an instruction to dispatch (this includes instructions that are
assigned a space in the CQ but not in an issue queue)
• Rename buffers
16 GPR rename buffers
16 FPR rename buffers
16 VR rename buffers
• Dispatch unit
Decode/dispatch stage fully decodes each instruction
• Completion unit
Retires an instruction from the 16-entry Completion Queue (CQ) when all instructions ahead of it
have been completed, the instruction has finished executing, and no exceptions are pending
Guarantees sequential programming model (precise exception model)
Monitors all dispatched instructions and retires them in order
Tracks unresolved branches and flushes instructions after a mispredicted branch
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Retires as many as three instructions per clock cycle
• Separate on-chip L1 instruction and data caches (Harvard architecture)
32-Kbyte, eight-way set-associative instruction and data caches
Pseudo Least-Recently-Used (PLRU) replacement algorithm
32-byte (eight-word) L1 cache block
Physically indexed/physical tags
Cache write-back or write-through operation programmable on a per-page or per-block basis
Instruction cache can provide four instructions per clock cycle; data cache can provide four words
per clock cycle
Caches can be disabled in software
Caches can be locked in software
MESI data cache coherency maintained in hardware
Separate copy of data cache tags for efficient snooping
Parity support on L1 and L2 cache and L2 tags
No snooping of instruction cache except for icbi instruction
Data cache supports AltiVec LRU and transient instructions
Critical double- and/or quad-word forwarding is performed as needed. Critical quad-word forwarding
is used for AltiVec loads and instruction fetches. Other accesses use critical double-word forwarding
• Level 2 (L2) cache interface
On-chip, 1-Mbyte, eight-way set-associative unified instruction and data cache
Cache write-back or write-through operation programmable on a per-page or per-block basis
Parity support on cache tags
ECC or parity support on data
Error injection allows testing of error recovery software
• Separate Memory Management Units (MMUs) for instructions and data
52-bit virtual address, 32- or 36-bit physical address
Address translation for 4-Kbyte pages, variable-sized blocks, and 256-Mbyte segments
Memory programmable as write-back/write-through, caching-inhibited/caching-allowed, and memory
coherency enforced/memory coherency not enforced on a page or block basis
Separate IBATs and DBATs (eight each) also defined as SPRs
Separate instruction and data Translation Lookaside Buffers (TLBs)
– Both TLBs are 128-entry, two-way set-associative and use an LRU replacement algorithm
– TLBs are hardware- or software-reloadable (that is, a page table search is performed in
hardware or by system software on a TLB miss)
• Efficient data flow
Although the VR/LSU interface is 128 bits, the L1/L2 bus interface allows up to 256 bits
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The L1 data cache is fully pipelined to provide 128 bits/cycle to or from the VRs
The L2 cache is fully pipelined to provide 32 bytes per clock every other cycle to the L1 caches
As many as 16 out-of-order transactions can be present on the MPX bus
Store merging for multiple store misses to the same line. Only coherency action taken (address-
only) for store misses merged to all 32 bytes of a cache block (no data tenure needed)
Three-entry finished store queue and five-entry completed store queue between the LSU and the L1
data cache
Separate additional queues for efficient buffering of outbound data (such as castouts and write-
through stores) from the L1 data cache and L2 cache
• Multiprocessing support features include the following:
Hardware-enforced, MESI cache coherency protocols for data cache
Load/store with reservation instruction pair for atomic memory references, semaphores, and other
multiprocessor operations
• Power and thermal management
Dynamic Frequency Switching (DFS) feature allows processor core frequency to be halved or quar-
tered through software to reduce power consumption
The following three power-saving modes are available to the system:
– Nap: Instruction fetching is halted. Only the clocks for the time base, decrementer, and JTAG
logic remain running. The part goes into the doze state to snoop memory operations on the
bus and then back to nap using a QREQ/QACK processor-system handshake protocol
– Sleep, Power consumption is further reduced by disabling bus snooping, leaving only the
PLL in a locked and running state. All internal functional units are disabled
– Deep sleep: When the part is in the sleep state, the system can disable the PLL. The system
can then disable the SYSCLK source for greater system power savings. Power-on reset
procedures for restarting and relocking the PLL must be followed upon exiting the deep sleep
state
Instruction cache throttling provides control of instruction fetching to limit device temperature
A new temperature diode that can determine the temperature of the microprocessor
Support for core voltage derating to further reduce power consumption
• Performance monitor can be used to help debug system designs and improve software efficiency
• In-system testability and debugging features through JTAG boundary-scan capability
• Testability
LSSD scan design
IEEE 1149.1 JTAG interface
• Reliability and serviceability
Parity checking on system bus
Parity checking on the L1 caches and L2 data tags
ECC or parity checking on L2 data
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3. Comparison with the PC7447A and PC7447
Table 3-1 compares the key features of the PC7448 with the key features of the earlier PC7447A and
PC7447. All are based on the PC7450 RISC microprocessor and are architecturally very similar. The
PC7448 is identical to the PC7447A, but the PC7448 supports 1 Mbyte of L2 cache with ECC and the
use of Dynamic Frequency Switching (DFS) with more bus-to-core ratios.
Table 3-1. Microarchitecture Comparison
Microarchitectural Specs PC7448 PC7447A PC7447
Basic Pipeline Functions
Logic inversions per cycle 18
Pipeline stages up to execute 5
Total pipeline stages (minimum) 7
Pipeline maximum instruction throughput 3 + branch
Pipeline Resources
Instruction buffer size 12
Completion buffer size 16
Renames (integer, float, vector) 16, 16, 16
Maximum Execution Throughput
SFX 3
Vector 2 (any 2 of 4 units)
Scalar floating-point 1
Out-of-Order Window Size in Execution Queues
SFX integer units 1 entry × 3 queues
Vector units In order, 4 queues
Scalar floating-point unit In order
Branch Processing Resources
Prediction structures BTIC, BHT, link stack
BTIC size, associativity 128-entry, 4-way
BHT size 2K-entry
Link stack depth 8
Unresolved branches supported 3
Branch taken penalty (BTIC hit) 1
Minimum misprediction penalty 6
Execution Unit Timings (Latency-Throughput)
Aligned load (integer, float, vector) 3-1, 4-1, 3-1
Misaligned load (integer, float, vector) 4-2, 5-2, 4-2
L1 miss, L2 hit latency with ECC (data/instruction) 12/16 –
L1 miss, L2 hit latency without ECC (data/instruction) 11/15 9/13
SFX (add, sub, shift, rot, cmp, logicals) 1-1
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Integer multiply (32 ×8, 32 ×16, 32 ×32) 4-1, 4-1, 5-2
Scalar float 5-1
VSFX (vector simple) 1-1
VCFX (vector complex) 4-1
VFPU (vector float) 4-1
VPER (vector permute) 2-1
MMUs
TLBs (instruction and data) 128-entry, 2-way
Tablewalk mechanism Hardware + software
Instruction BATs/data BATs 8/8
L1 I Cache/D Cache Features
Size 32K/32K
Associativity 8-way
Locking granularity Way
Parity on I cache Word
Parity on D cache Byte
Number of D cache misses (load/store) 5/2 5/1
Data stream touch engines 4 streams
On-Chip Cache Features
Cache level L2
Size/associativity 1-Mbyte/ 8-way 512-Kbyte/8-way
Access width 256 bits
Number of 32-byte sectors/line 2 2
Parity tag Byte Byte
Parity data Byte Byte
Data ECC 64 bits –
Thermal Control
Dynamic frequency switching divide-by-two mode Yes Yes No
Dynamic frequency switching divide-by-four mode Yes No No
Thermal diode Yes Yes No
Table 3-1. Microarchitecture Comparison (Continued)
Microarchitectural Specs PC7448 PC7447A PC7447
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4. General Parameters
The following list summarizes the general parameters of the PC7448:
5. Electrical and Thermal Characteristics
This section provides the AC and DC electrical specifications and thermal characteristics for the
PC7448.
5.1 Detailed Specification
This specification describes the specific requirements for the microprocessor PC7448 in compliance with
e2v standard screening.
5.2 Applicable Documents
1. MIL-STD-883: Test methods and procedures for electronics.
The microcircuits are in accordance with the applicable documents and as specified herein.
Table 4-1. Device Parameters
Parameter Description
Technology 90 nm CMOS SOI, nine-layer metal
Die size 8 mm × 7.3 mm
Transistor count 90 million
Logic design Mixed static and dynamic
Packages
Surface mount 360 ceramic ball grid array (HiTCE)
Surface mount 360 ceramic land grid array (HiTCE)
RoHS HiTCE LGA
Surface mount 360 ceramic ball grid array with lead-free spheres (HiTCE) = RoHS
Core power supply
1.1V ± 50 mV (1250 MHz)
1.05V ± 50 mV (1267 MHz)
1.0V ± 50 mV (600 MHz, 1000 MHz)
I/O power supply
1.5V ± 5% DC, or
1.8V ± 5% DC, or
2.5V ± 5% DC
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5.3 DC Electrical Characteristics
The tables in this section describe the PC7448 DC electrical characteristics. Table 5-1 provides the
absolute maximum ratings.
Notes: 1. Functional and tested operating conditions are given in Table 5-3 on page 12. Absolute maximum ratings are stress ratings
only and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability
or cause permanent damage to the device.
2. See Section 9.2 ”Power Supply Design and Sequencing” on page 35 for power sequencing requirements.
3. Bus must be configured in the corresponding I/O voltage mode; see Table 5-2 on page 12.
4. Caution: VIN must not VIN OVDD by more than 0.3V at any time including during power-on reset except as allowed by the
overshoot specifications. VIN may overshoot/undershoot to a voltage and for a maximum duration as shown in Figure 5-1.
Figure 5-1 shows the undershoot and overshoot voltage on the PC7448.
Figure 5-1. Overshoot/Undershoot Voltage
The PC7448 provides several I/O voltages to support both compatibility with existing systems and migra-
tion to future systems. The PC7448 core voltage must always be provided at the nominal voltage (see
Table 5-3 on page 12) or at the supported derated voltage (see Section ”” on page 23).
Table 5-1. Absolute Maximum Ratings(1)
Characteristic Symbol Maximum Value Unit Notes
Core supply voltage VDD -0.3 to 1.4 V (2)
PLL supply voltage AVDD -0.3 to 1.4 V (2)
Processor bus supply
voltage
I/O Voltage Mode = 1.5V
OVDD
-0.3 to 1.8
V
(3)
I/O Voltage Mode = 1.8V -0.3 to 2.2 (3)
I/O Voltage Mode = 2.5V -0.3 to 3.0 (3)
Input voltage
Processor bus VIN -0.3 to OVDD + 0.3 V (4)
JTAG signals VIN -0.3 to OVDD + 0.3 V
Storage temperature range Tstg –65 to 150 °C
GND
GND – 0.3V
GND – 0.7V
Not to exceed 10% of tSYS
OVDD + 20%
OVDD + 5%
OVDD
(1)
VIH
VIL
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The input voltage threshold for each bus is selected by sampling the state of the voltage select pins at
the negation of the signal HRESET.
The output voltage will swing from GND to the maximum voltage applied to the OVDD power pins. Table
5-2 on page 12 provides the input threshold voltage settings. Because these settings may change in
future products, it is recommended that BVSEL[0:1] be configured using resistor options, jumpers, or
some other flexible means, with the capability to reconfigure the termination of this signal in the future, if
necessary.
Notes: 1. Caution: The I/O voltage mode selected must agree with the OVDD voltages supplied. See Table 5-3.
2. If used, pull-down resistors should be less than 250Ω.
3. The pin configuration used to select 1.8V mode on the PC7448 is not compatible with the pin configura-
tion used to select 1.8V mode on the PC7447A and earlier devices.
4. The pin configuration used to select 2.5V mode on the PC7448 is fully compatible with the pin configu-
ration used to select 2.5V mode on the PC7447A and earlier devices.
Table 5-3 provides the recommended operating conditions for the PC7448 part numbers described by
this document.
Note: Table 5-3 describes the nominal operating conditions of the device. For information regarding the operation
of the device at supported derated core voltage conditions, see Section ”” on page 23.
Notes: 1. These are the recommended and tested operating conditions. In addition, these devices also support voltage derating; see
Section ”” on page 23. Proper device operation outside of these conditions and those specified in Section on page 23 is not
guaranteed.
2. This voltage is the input to the filter discussed in Section 9.2.2 ”PLL Power Supply Filtering” on page 36 and not necessarily
the voltage at the AVDD pin, which may be reduced from VDD by the filter.
Table 5-2. Input Threshold Voltage Setting
BVSEL0 BVSEL1 I/O Voltage Mode(1) Notes
0 0 1.8V (2)(3)
0 1 2.5V (2)(4)
1 0 1.5V (2)
1 1 2.5V (4)
Table 5-3. Recommended Operating Conditions(1)
Characteristic Symbol
Recommended Value
Unit Notes600 MHz, 1000 MHz 1250 MHz 1267 MHz
Min Max Min Max Min Max
Core supply voltage VDD 1.0V ± 50 mV 1.1V ± 50 mV 1.05V ± 50 mV V (3)
PLL supply voltage AVDD 1.0V ± 50 mV 1.1V ± 50 mV 1.05V ± 50 mV V (2)(3)
Processor
bus supply
voltage
I/O Voltage
mode = 1.5V
OVDD
1.5V ± 5%
V
(4)
I/O Voltage
mode = 1.8V 1.8V ± 5% (4)
I/O Voltage
mode = 2.5V 2.5V ± 5% (4)
Input voltage
Processor bus VIN GND OVDD GND OVDD GND OVDD V
JTAG signals VIN GND OVDD GND OVDD GND OVDD
Operating temperature TJTC = –55 TJ = +125 TC = –55 TJ = +125 TC = –55 TJ = +125 °C
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3. VDD and AVDD may be reduced in order to reduce power consumption if further maximum core frequency constraints are
observed. See Section ”” on page 23, for specific information.
4. Caution: Power sequencing requirements must be met; see Section 9.2 ”Power Supply Design and Sequencing” on page
35.
5. See Section 9.2.3 ”Transient Specifications” on page 37 for information regarding transients on this power supply.
Table 5-4 provides the package thermal characteristics for the PC7448. For more information regarding
thermal management, see Section 9.8, “Thermal Management Information.”
Notes: 1. Refer to Section 9.8, “Thermal Management Information,” for details about thermal management.
2. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) tempera-
ture, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance.
3. Per JEDEC JESD51-2 with the single-layer board horizontal.
4. Per JEDEC JESD51-6 with the board horizontal.
5. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
6. This is the thermal resistance between die and case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1) with the calculated case temperature. The actual value of RθJC for the part is less than 0.1°C/W.
Table 5-4. Package Thermal Characteristics(1)
Characteristic Symbol Value Unit Notes
Junction-to-ambient thermal resistance, natural convection, single-layer (1s) board RθJA 26 °C/W (2)(3)
Junction-to-ambient thermal resistance, natural convection, four-layer (2s2p) board RθJMA 19 °C/W (2)(4)
Junction-to-ambient thermal resistance, 200 ft./min. airflow, single-layer (1s) board RθJMA 22 °C/W (2)(4)
Junction-to-ambient thermal resistance, 200 ft./min. airflow, four-layer (2s2p) board RθJMA 16 °C/W (2)(4)
Junction-to-board thermal resistance RθJB 11 °C/W (5)
Junction-to-case thermal resistance RθJC < 0.1 °C/W (6)
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Table 5-5 provides the DC electrical characteristics for the PC7448.
Notes: 1. Nominal voltages; see Table 5-3 for recommended operating conditions.
2. All I/O signals are referenced to OVDD.
3. Excludes test signals and IEEE 1149.1 boundary scan (JTAG) signals.
4. The leakage is measured for nominal OVDD/GVDD and VDD, or both OVDD/GVDD and VDD must vary in the same direction (for
example, both OVDD and VDD vary by either +5% or –5%).
5. Capacitance is periodically sampled rather than 100% tested.
Table 5-5. DC Electrical Specifications (At Recommended Operating Conditions, see Table 5-3 on page 12)
Characteristic
Nominal Bus
Voltag e(1) Symbol Min Max Unit Notes
Input high voltage (all inputs)
1.5
VIH
OVDD × 0.65 OVDD + 0.3
V(2)
1.8 OVDD × 0.65 OVDD + 0.3
2.5 1.7 OVDD + 0.3
Input low voltage (all inputs)
1.5
VIL
-0.3 OVDD × 0.35
V(2)
1.8 -0.3 OVDD × 0.35
2.5 -0.3 0.7
Input leakage current,
VIN = GVDD/ODD
VIN = GND
–I
IN –50
–50
µA (2)(3)
High-impedance (off-state) leakage current,
VIN = GVDD/ODD
VIN = GND
–I
TSI –50
–50
µA (2)(3)(4)
Output high voltage at IOH = –5 mA
1.5
VOH
OVDD - 0.45 –
V1.8 OVDD - 0.45 –
2.5 1.8 –
Output low voltage at IOL = 5 mA
1.5
VOL
–0.45
V1.8 – 0.45
2.5 – 0.6
Capacitance,
VIN = 0V, f = 1 MHz All inputs CIN –8pF
(5)
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PC7448
Table 5-6 on page 15 provides the power consumption for the PC7448 part numbers described by this
document; see Section 10. ”Ordering Information” on page 52, for more information. For information
regarding power consumption when dynamic frequency switching is enabled, see Section 9.7.5
”Dynamic Frequency Switching (DFS)” on page 49.
Note: The power consumption information in this table applies when the device is operated at the nominal core
voltage indicated in Table 5-6. For power consumption at derated core voltage conditions, see Section ””
on page 23.
Notes: 1. These values specify the power consumption for the core power supply (VDD) at nominal voltage and apply to all valid pro-
cessor bus frequencies and configurations. The values do not include I/O supply power (OVDD) or PLL supply power (AVDD).
OVDD power is system dependent but is typically < 5% of VDD power. Worst case power consumption for AVDD < 13 mW.
2. Typical power is an average value measured at the nominal recommended VDD (see Table 5-3 on page 12) and 65°C while
running the Dhrystone 2.1 benchmark and achieving 2.3 Dhrystone MIPs/MHz.
3. Maximum power is the average measured at nominal VDD and 125°C junction temperature while running an entirely cache-
resident, contrived sequence of instructions which keep all the execution units maximally busy.
4. Doze mode is not a user-definable state; it is an intermediate state between full-power and either nap or sleep mode. As a
result, power consumption for this mode is not tested.
5. Typical thermal power consumption is an average value measured at the nominal recommended VDD (see Table 5-3 on
page 12) and 105°C while running the Dhrystone 2.1 benchmark and achieving 2.3 Dhrystone MIPs/MHz. This parameter
is not 100% tested but periodically sampled.
6. Typical power consumption for these modes is measured at the nominal recommended VDD (see Table 5-3 on page 12)
and 105°C in the mode described. This parameter is not 100% tested but is periodically sampled.
7. Power consumption for the 600 MHz K-spec and 1267 MHz N-spec devices are intentionally constrained via testing and
sorting to assure low power consumption for this device.
Table 5-6. Power Consumption for PC7448
Processor (CPU) Frequency
Unit Notes600 MHz 1000 MHz 1250 MHz 1267 MHz(7)
Full-Power Mode
Ty p i c a l N-Spec: 8.5
K-Spec(7): 6.5 9.5 10 8.4 W (1)(2)
Typical Thermal N-Spec: 10.8
K-Spec(7): 7.5 12 12.6 10.3 W (1)(5)
Maximum N-Spec: 12.5
K-Spec(7): 8.5 13.9 14.6 TJ = 110°C : 12W
TJ = 125°C : 13W W(1)(3)
Nap Mode
Typical 6.5 6.5 8.3 6.5 W (1)(6)
Sleep Mode
Typical 6.3 6.3 8 6.3 W (1)(6)
Deep Sleep Mode (PLL Disabled)
Typical 6 6 7.7 6.0 W (1)(6)
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5.4 Voltage and Frequency Derating
To reduce the power consumption of the device, these devices support voltage and frequency derating
whereby the core voltage (VDD) may be reduced if the reduced maximum processor core frequency
requirements are observed. The supported derated core voltage, resulting maximum processor core fre-
quency (fcore), and power consumption are provided in Table 5-7. Only those parameters in Table 5-7 are
affected; all other parameter specifications are unaffected.
5.5 AC Electrical Characteristics
This section provides the AC electrical characteristics for the PC7448. After fabrication, functional parts
are sorted by maximum processor core frequency as shown in “Clock AC Specifications” , and tested for
conformance to the AC specifications for that frequency. The processor core frequency, determined by
the bus (SYSCLK) frequency and the settings of the PLL_CFG[0:5] signals, can be dynamically modified
using Dynamic Frequency Switching (DFS). Parts are sold by maximum processor core frequency.See
Section 9.7.5 ”Dynamic Frequency Switching (DFS)” on page 49.
5.5.1 Clock AC Specifications
Table 5-8 on page 16 provides the clock AC timing specifications for the PC7448 part numbers
described herein.
Note: The core frequency information in this table applies when the device is operated at the nominal core volt-
age indicated in Table 5-3 on page 12. For core frequency specifications at derated core voltage conditions,
see Section ”” on page 23.
Table 5-7. Supported Voltage, Core Frequency, and Power Consumption Derating
Maximum Rated
Core Frequency
(Device Marking)
Supported Derated
Core Voltage (VDD)
Maximum Derated
Core Frequency (fcore)
Full-Power Mode Power Consumption
Typical Thermal Maximum
600 NA
1000 NA
1250 NA
1267 1.0V ± 50 mV 1000 MHz 6.0W 7.3W TJ = 110°C : 8.5W
TJ = 125°C : 9.5W
Table 5-8. Clock AC Timing Specifications (At Recommended Operating Conditions, see Table 5-3 on page 12)
Characteristic Symbol
Maximum Processor Core Frequency
Unit Notes
600 MHz 1000 MHz 1250 MHz 1267 MHz
Min Max Min Max Min Max Min Max
Processor
frequency
DFS mode disabled fCORE 500 600 500 1000 500 1250 500 1267
MHz
(1)(8)(9)
DFS mode enabled fCORE-DFS 250 300 250 500 250 625 250 633 (10)
VCO frequency fVCO 500 600 500 1000 500 1250 500 1267 MHz (1)(9)
SYSCLK frequency fSYSCLK 33 200 33 200 33 200 33 200 MHz (1)(2)(8)
SYSCK cycle time tSYSCLK 530530530530ns(2)
SYSCLK rise and fall time tKR, tKF – 0.5 – 0.5 – 0.5 – 0.5 ns (3)
SYSCLK duty cycle measured at OVDD/2 tKHKL/tSYSCLK 40 60 40 60 40 60 40 60 % (4)
SYSCLK cycle-to-cycle jitter – 150 – 150 – 150 – 150 ps (5)(6)
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Notes: 1. Caution: The SYSCLK frequency and PLL_CFG[0:5] settings must be chosen such that the resulting SYSCLK (bus) fre-
quency, processor core frequency, and PLL (VCO) frequency do not exceed their respective maximum or minimum
operating frequencies. Refer to the PLL_CFG[0:5] signal description in Section 9.1.1 ”PLL Configuration” on page 32, for
valid PLL_CFG[0:5] settings.
2. Actual maximum system bus frequency is system-dependent. See Section 5.5.1 ”Clock AC Specifications” on page 16.
3. Rise and fall times for the SYSCLK input measured from 0.4 to 1.4V.
4. Timing is guaranteed by design and characterization.
5. Guaranteed by design.
6. The SYSCLK driver’s closed loop jitter bandwidth should be less than 1.5 MHz at –3 dB.
7. Relock timing is guaranteed by design and characterization. PLL-relock time is the maximum amount of time required for
PLL lock after a stable VDD and SYSCLK are reached during the power-on reset sequence. This specification also applies
when the PLL has been disabled and subsequently re-enabled during sleep mode. Also note that HRESET must be held
asserted for a minimum of 255 bus clocks after the PLL-relock time during the power-on reset sequence.
8. This reflects the maximum and minimum core frequencies when the Dynamic Frequency Switching feature (DFS) is dis-
abled. fCORE_DFS provides the maximum and minimum core frequencies when operating in a DFS mode.
9. Caution: These values specify the maximum processor core and VCO frequencies when the device is operated at the nomi-
nal core voltage. If operating the device at the derated core voltage, the processor core and VCO frequencies must be
reduced. See Section ”” on page 23, for more information.
10. This specification is provided to support use of the Dynamic Frequency Switching (DFS) feature and is applicable only when
one of the DFS modes (divide-by-2 or divide-by-4) has been enabled. When DFS is disabled, the core frequency must con-
form to the maximum and minimum frequencies stated for fCORE.
11. Use of the DFS feature does not affect VCO frequency.
Figure 5-2 provides the SYSCLK input timing diagram.
Figure 5-2. SYSCLK Input Timing Diagram
Note: VM = Midpoint Voltage (OVDD/2)
SYSCLK VMVMVM
tKHKL
tSYSCLK
CVIL
CVIH
tKR tKF
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5.5.2 Processor Bus AC Specifications
Table 5-9 provides the processor bus AC timing specifications for the PC7448 as defined in Figure 5-3
on page 19 and Figure 5-4 on page 19..
Notes: 1. All input specifications are measured from the midpoint of the signal in question to the midpoint of the rising edge of the input
SYSCLK. All output specifications are measured from the midpoint of the rising edge of SYSCLK to the midpoint of the sig-
nal in question. All output timings assume a purely resistive 50Ω load (see Figure 5-3 on page 19). Input and output timings
are measured at the pin; time-of-flight delays must be added for trace lengths, vias, and connectors in the system.
Table 5-9. Processor Bus AC Timing Specifications(1) (At Recommended Operating Conditions, see Table 5-3 on page
12)
Parameter Symbol(2)
All Speed Grades
Unit NotesMin Max
Input setup times:
A[0:35], AP[0:4]
D[0:63], DP[0:7]
AACK, ARTRY, BG, CKSTP_IN, DBG, DTI[0:3], GBL,
TT[0:3], QACK, TA, TBEN, TEA, TS,EXT_QUAL,
PMON_IN, SHD[0:1],
BMODE[0:1], BVSEL[0:1]
tAVKH
tDVKH
tIVKH
tMVKH
1.5
1.5
1.5
1.5
–
–
–
–
ns
–
–
–
(8)
Input hold times:
A[0:35], AP[0:4]
D[0:63], DP[0:7]
AACK, ARTRY, BG, CKSTP_IN, DBG, DTI[0:3], GBL,
TT[0:3], QACK, TA, TBEN, TEA, TS, EXT_QUAL,
PMON_IN, SHD[0:1]
BMODE[0:1], BVSEL[0:1]
tAXKH
tDXKH
tIXKH
tMXKH
0
0
0
0
–
–
–
–
ns
–
–
–
(8)
Output valid times:
A[0:35], AP[0:4]
D[0:63], DP[0:7]
AACK, BR, CI, CKSTP_IN, DRDY, DTI[0:3], GBL, HIT, PMON_OUT,
QREQ, TBST, TSIZ[0:2], TT[0:3], WT
TS
ARTRY, SHD[0:1]
tKHAV
tKHDV
tKHOV
tKHTSV
tKHARV
–
–
–
–
–
1.8
1.8
1.8
1.8
1.8
ns
Output hold times:
A[0:35], AP[0:4]
D[0:63], DP[0:7]
AACK, BR, CI, CKSTP_IN, DRDY, DTI[0:3], GBL, HIT, PMON_OUT,
QREQ, TBST, TSIZ[0:2], TT[0:3], WT
TS,
ARTRY
, SHD[0:1]
tKHAX
tKHDX
tKHOX
tKHTSX
tKHARX
0.5
0.5
0.5
0.5
0.5
–
–
–
–
–
ns
SYSCLK to output enable tKHOE 0.5 – ns (5)
SYSCLK to output high impedance (all except TS, ARTRY, SHD0, SHD1)t
KHOZ –1.8ns(5)
SYSCLK to TS high impedance after precharge tKHTSPZ –1t
SYSCLK (3)(4)(5)
Maximum delay to ARTRY/SHD0/SHD1 precharge tKHARP –1t
SYSCLK (3)(5)(6)(7)
SYSCLK to ARTRY/SHD0/SHD1 high impedance after precharge tKHARPZ –2t
SYSCLK (3)(5)(6)(7)
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2. The symbology used for timing specifications herein follows the pattern of t(signal)(state)(reference)(state) for inputs and t(refer-
ence)(state)(signal)(state) for outputs. For example, tIVKH symbolizes the time input signals (I) reach the valid state (V) relative to the
SYSCLK reference (K) going to the high (H) state or input setup time. And tKHOV symbolizes the time from SYSCLK(K) going
high (H) until outputs (O) are valid (V) or output valid time. Input hold time can be read as the time that the input signal (I)
went invalid (X) with respect to the rising clock edge (KH) (note the position of the reference and its state for inputs) and out-
put hold time can be read as the time from the rising edge (KH) until the output went invalid (OX).
3. tSYSCLK is the period of the external clock (SYSCLK) in ns. The numbers given in the table must be multiplied by the period of
SYSCLK to compute the actual time duration (in ns) of the parameter in question.
4. According to the bus protocol, TS is driven only by the currently active bus master. It is asserted low and precharged high
before returning to high impedance, as shown in Figure 5-5 on page 20. The nominal precharge width for TS is tSYSCLK, that
is, one clock period. Since no master can assert TS on the following clock edge, there is no concern regarding contention
with the precharge. Output valid and output hold timing is tested for the signal asserted. Output valid time is tested for pre-
charge.The high-impedance behavior is guaranteed by design.
5. Guaranteed by design and not tested.
6. According to the bus protocol, ARTRY can be driven by multiple bus masters through the clock period immediately following
AACK. Bus contention is not an issue because any master asserting ARTRY will be driving it low. Any master asserting it low
in the first clock following AACK will then go to high impedance for a fraction of a cycle, then negated for up to an entire cycle
(crossing a bus cycle boundary) before being three-stated again. The nominal precharge width for ARTRY is 1.0 tSYSCLK; that
is, it should be high impedance as shown in Figure 5-5 before the first opportunity for another master to assert ARTRY. Out-
put valid and output hold timing is tested for the signal asserted.The high-impedance behavior is guaranteed by design.
7. According to the MPX bus protocol, SHD0 and SHD1 can be driven by multiple bus masters beginning two cycles after TS.
Timing is the same as ARTRY, that is, the signal is high impedance for a fraction of a cycle, then negated for up to an entire
cycle (crossing a bus cycle boundary) before being three-stated again. The nominal precharge width for SHD0 and SHD1 is
1.0 tSYSCLK. The edges of the precharge vary depending on the programmed ratio of core to bus (PLL configurations).
8. BMODE[0:1] and BVSEL[0:1] are mode-select inputs. BMODE[0:1] are sampled before and after HRESET negation.
BVSEL[0:1] are sampled before HRESET negation. These parameters represent the input setup and hold times for each
sample. These values are guaranteed by design and not tested. BMODE[0:1] must remain stable after the second sample;
BVSEL[0:1] must remain stable after the first (and only) sample. See Figure 5-4 on page 19 for sample timing.
Figure 5-6 provides the AC test load for PC7448.
Figure 5-3. AC Test Load
Figure 5-4 provides the BMODE[0:1] input timing diagram for the PC7448. These mode select inputs are
sampled once before and once after HRESET negation.
Figure 5-4. BMODE[0:1] Input Sample Timing Diagram
Note: VM = Midpoint Voltage (OVDD/2)
Output Z0 = 50Ω
RL = 50Ω
OVDD/2
HRESET
BMODE[0:1]
VMVM
SYSCLK
1st Sample 2nd Sample
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Figure 5-5 provides the input/output timing diagram for the PC7448.
Figure 5-5. Input/Output Timing Diagram
Note: VM = Midpoint Voltage (OVDD/2)
SYSCLK
All Inputs
VM
All Outputs
VM
(Except TS,
All Outputs
TS
VM
tKHOE
ARTRY, SHD0, SHD1)
(Except TS,
ARTRY, SHD0, SHD1)
ARTRY,
SHD0,
SHD1
tAVKH
tKHAV
tMVKH
tIVKH
tAXKH
tIXKH
tMXKH
tKHDV
tKHOV
tKHAX
tKHDX
tKHOX
tKHOZ
tKHTSPZ
tKHTSX
tKHTSV
tKHTSV
tKHARV tKHARP
tKHARX
tKHARPZ
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5.5.3 IEEE 1149.1 AC Timing Specifications
Table 5-10 provides the IEEE 1149.1 (JTAG) AC timing specifications as defined in Figure 5-7 on page
22 through Figure 5-10 on page 23.
Notes: 1. All outputs are measured from the midpoint voltage of the falling/rising edge of TCLK to the midpoint of
the signal in question. The output timings are measured at the pins. All output timings assume a purely
resistive 50Ω load (see Figure 5-6). Time-of-flight delays must be added for trace lengths, vias and con-
nectors in the system.
2. TRST is an asynchronous level sensitive signal. The time is for test purposes only.
3. Non-JTAG signal input timing with respect to TCK.
4. Non-JTAG signal output timing with respect to TCK.
5. Guaranteed by design and characterization.
Figure 5-6 provides the AC test load for TDO and the boundary-scan outputs of the PC7448.
Figure 5-6. Alternate AC Test Load for the JTAG Interface
Table 5-10. JTAG AC Timing Specifications (Independent of SYSCLK)(1)
(At Recommended Operating Conditions, see Table 5-3 on page 12)
Parameter Symbol Min Max Unit Notes
TCK frequency of operation fTCLK 0 33.3 MHz
TCK cycle time tTCLK 30 – ns
TCK clock pulse width measured at 1.4V tJHJL 15 – ns
TCK rise and fall times tJR and tJF –2ns
TRST assert time tTRST 25 – ns (2)
Input Setup Times:
- Boundary-scan data
- TMS, TDI
tDVJH
tIVJH
4
0
–
–
ns (3)
Input Hold Times:
- Boundary-scan data
- TMS, TDI
tDXJH
tIXJH
20
25
–
–
ns (3)
Valid Times:
- Boundary-scan data
- TDO
tJLDV
tJLOV
4
4
20
25
ns (4)
Output hold times:
- Boundary-scan data
- TDO
tJLDX
tJLOX
30
30
–
–
ns (4)
TCK to output high impedance:
- Boundary-scan data
- TDO
tJLDZ
tJLOZ
3
3
19
9
ns (4)(5)
Output Z0 = 50Ω
RL = 50Ω
OVDD/2
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Figure 5-7 provides the JTAG clock input timing diagram.
Figure 5-7. JTAG Clock Input Timing Diagram
Note: VM = Midpoint Voltage (OVDD/2)
Figure 5-8 provides the TRST timing diagram.
Figure 5-8. TRST Timing Diagram
Note: VM = Midpoint Voltage (OVDD/2)
Figure 5-9 provides the boundary-scan timing diagram.
Figure 5-9. Boundary-scan Timing Diagram
Note: VM = Midpoint Voltage (OVDD/2)
VMVMVM
t
TCLK
t
JR
t
JF
t
JHJL
TCLK
VMTCK
Boundary
Data Inputs
Boundary
Data Outputs
Boundary
Data Outputs
tDXJH
tDVJH
tJLDV
tJLDZ
Output Data Valid
tJLDX
VM
Input
Data Valid
Output Data Valid
VMTCK
Boundary
Data Inputs
Boundary
Data Outputs
Boundary
Data Outputs
tDXJH
tDVJH
tJLDV
tJLDZ
Output Data Valid
tJLDX
VM
Input
Data Valid
Output Data Valid
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6. Pin Assignments
Figure 6-1 shows the pinout of the PC7448, 360 high coefficient of the thermal expansion ceramic ball
grid array (HiTCE) package as viewed from the top surface. Figure 6-2 shows the side profile of the
HiTCE package to indicate the direction of the top surface view.
Figure 6-1. Pinout of the PC7448, 360 HITCE Package as Viewed from the Top Surface
Figure 6-2. Pinout of the PC7448, 360 HiTCE Package as Viewed from the Top Surface
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
321456 1617 18 19
U
V
W
151413121110987
Not to scale
Substrate Assembly
Encapsulant
View
Die
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7. Pinout Listings
Table 7-1 provides the pinout listing for the PC7448, 360 HiTCE package. The pinouts of the PC7448
and PC7447A are pin compatible, but the requirements regarding the use of the additional power and
ground pins may change. The PC7448 may require these pins be connected to the appropriate power or
ground plane to achieve the full rated core frequency. As a result, these pins should be connected in all
new designs.
Additionally, the PC7448 may be populated on a board designed for a PC7447 (or PC7445 or PC7441),
provided the core voltage can be made to match the requirements in Table 5-3 and all pins defined as
‘no connect’ for the PC7447 are unterminated, as required by the PC7457 RISC Microprocessor Hard-
ware Specifications. The PC7448 uses pins previously marked ‘no connect’ for the temperature diode
pins and for additional power and ground connections. The additional power and ground pins are
required to achieve high core frequencies; see Section 9.3 ”Connection Recommendations” on page 38,
for additional information. Because these ‘no connect’ pins in the PC7447 360 pin package are not
driven in functional mode, an PC7447 can be populated in an PC7448 board.
Note: Caution must be exercised when performing boundary scan test operations on a board designed for an
PC7448, but populated with an PC7447 or earlier device. This is because in the PC7447 it is possible to
drive the latches associated with the former ‘no connect’ pins in the PC7447, potentially causing contention
on those pins. To prevent this, ensure that these pins are not connected on the board or, if they are con-
nected, ensure that the states of internal PC7447 latches do not cause these pins to be driven during board
testing.
For the PC7448, pins that were defined as the TEST[0:4] factory test signal group on the PC7447A and
earlier devices have been assigned new functions. For most of these, the termination recommendations
for the TEST[0:4] pins of the PC7447A are compatible with the PC7448 and will allow correct operation
with no performance loss. The exception is BVSEL1 (TEST3 on the PC7447A and earlier devices),
which may require a different termination depending which I/O voltage mode is desired; see Table 5-2 on
page 12 for more information.
Note: This pinout is not compatible with the PC750, PC7400, or PC7410 360 BGA package.
Table 7-1. Pinout Listing for the PC7448, 360 HiTCE Package
Signal Name Pin Number Active I/O Notes
A[0:35] E11, H1, C11, G3, F10, L2, D11, D1, C10, G2, D12, L3, G4, T2, F4, V1, J4, R2, K5, W2, J2,
K4, N4, J3, M5, P5, N3, T1, V2, U1, N5, W1, B12, C4, G10, B11 High I/O (2)
AACK R1 Low Input
AP[0:4] C1, E3, H6, F5, G7 High I/O (2)
ARTRY N2 Low I/O (3)
AVDD A8 – Input
BG M1 Low Input
BMODE0 G9 Low Input (4)
BMODE1 F8 Low Input (5)
BR D2 Low Output
BVSEL0 B7 High Input (1)(6)
BVSEL1 E10 High Input (1)(20)
CI J1 Low Output
CKSTP_IN A3 Low Input
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CKSTP_OUT B1 Low Output
CLK_OUT H2 High Output
D[0:63]
R15, W15, T14, V16, W16, T15, U15, P14, V13, W13, T13, P13, U14, W14, R12, T12,
W12, V12, N11, N10, R11, U11, W11, T11, R10, N9, P10, U10, R9, W10, U9, V9, W5, U6,
T5, U5, W7, R6, P7, V6, P17, R19, V18, R18, V19, T19, U19, W19, U18, W17, W18, T16,
T18, T17, W3, V17, U4, U8, U7, R7, P6, R8, W8, T8
High I/O
DBG M2 Low Input
DFS2 A12 Low Input (20)(21)
DFS4 B6 Low Input (12)(20)(21)
DP[0:7] T3, W4, T4, W9, M6, V3, N8, W6 High I/O
DRDY R3 Low Output (7)
DTI[0:3] G1, K1, P1, N1 High Input (8)
EXT_QUAL A11 High Input (9)
GBL E2 Low I/O
GND
B5, C3, D6, D13, E17, F3, G17, H4, H7, H9, H11, H13, J6, J8, J10, J12, K7, K3, K9, K11,
K13, L6, L8, L10, L12, M4, M7, M9, M11, M13, N7, P3, P9, P12, R5, R14, R17, T7, T10,
U3, U13, U17, V5, V8, V11, V15
––
GND A17, A19, B13, B16, B18, E12, E19, F13, F16, F18, G19, H18, J14, L14, M15, M17, M19,
N14, N16, P15, P19 ––
(15)
GND_SENSE G12, N13 ––
(19)
HIT B2 Low Output (7)
HRESET D8 Low Input
INT D4 Low Input
L1_TSTCLK G8 High Input (9)
L2_TSTCLK B3 High Input (10)
LVRAM B10 ––
(12)(20)(22)
NC (No Connect)
A6, A14, A15, B14, B15, C14, C15, C16, C17, C18, C19, D14, D15, D16, D17, D18, D19,
E14, E15, F14, F15, G14, G15, H15, H16, J15, J16, J17, J18, J19, K15, K16, K17, K18,
K19, L15, L16, L17, L18, L19
––
(11)
LSSD_MODE E8 Low Input (6)(12)
MCP C9 Low Input
OVDD
B4, C2, C12, D5, F2, H3, J5, K2, L5, M3, N6, P2, P8, P11, R4, R13, R16, T6, T9, U2, U12,
U16, V4, V7, V10, V14 ––
OVDD_SENSE E18, G18 ––
(16)
PLL_CFG[0:4] B8, C8, C7, D7, A7 High Input
PLL_CFG[5] D10 High Input (9)(20)
PMON_IN D9 Low Input (13)
PMON_OUT A9 Low Output
QACK G5 Low Input
QREQ P4 Low Output
SHD[0:1] E4, H5 Low I/O (3)
Table 7-1. Pinout Listing for the PC7448, 360 HiTCE Package (Continued)
Signal Name Pin Number Active I/O Notes
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Notes: 1. OVDD supplies power to the processor bus, JTAG, and all control signals; VDD supplies power to the processor core and the
PLL (after filtering to become AVDD). To program the I/O voltage, see Table 5-2 on page 12. If used, the pull-down resistor
should be less than 250Ω because these settings may change in future products, it is recommended BVSEL[0:1] be config-
ured using resistor options, jumpers, or some other flexible means, with the capability to reconfigure the termination of this
signal in the future if necessary. For actual recommended value of VIN or supply voltages see Table 5-3 on page 12.
2. Unused address pins must be pulled down to GND and corresponding address parity pins pulled up to OVDD.
3. These pins require weak pull-up resistors (for example, 4.7 KΩ) to maintain the control signals in the negated state after they
have been actively negated and released by the PC7448 and other bus masters.
4. This signal selects between MPX bus mode (asserted) and 60x bus mode (negated) and will be sampled at HRESET going
high.
5. This signal must be negated during reset, by pull-up resistor to OVDD or negation by ¬HRESET (inverse of HRESET), to
ensure proper operation.
6. Internal pull up on die.
7. Ignored in 60x bus mode.
8. These signals must be pulled down to GND if unused, or if the PC7448 is in 60x bus mode.
9. These input signals are for factory use only and must be pulled down to GND for normal machine operation.
10. This test signal is recommended to be tied to HRESET; however, other configurations will not adversely affect performance.
11. These signals are for factory use only and must be left unconnected for normal machine operation. Some pins that were
NCs on the PC7447 have now been defined for other purposes.
12. These input signals are for factory use only and must be pulled up to OVDD for normal machine operation.
SMI F9 Low Input
SRESET A2 Low Input
SYSCLK A10 – Input
TA K6 Low Input
TBEN E1 High Input
TBST F11 Low Output
TCK C6 High Input
TDI B9 High Input (6)
TDO A4 High Output
TEA L1 Low Input
TEMP_ANODE N18 ––
(17)
TEMP_CATHODE N19 ––
(17)
TMS F1 High Input (6)
TRST A5 Low Input (6)(14)
TS L4 Low I/O (3)
TSIZ[0:2] G6, F7, E7 High Output
TT[0:4] E5, E6, F6, E9, C5 High I/O
WT D3 Low Output
VDD H8, H10, H12, J7, J9, J11, J13, K8, K10, K12, K14, L7, L9, L11, L13, M8, M10, M12 – –
VDD
A13, A16, A18, B17, B19, C13, E13, E16, F12, F17, F19, G11, G16, H14, H17, H19, M14,
M16, M18, N15, N17, P16, P18 ––
(15)
VDD_SENSE G13, N12 ––
(18)
Table 7-1. Pinout Listing for the PC7448, 360 HiTCE Package (Continued)
Signal Name Pin Number Active I/O Notes
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13. This pin can externally cause a performance monitor event. Counting of the event is enabled through software.
14. This signal must be asserted during reset, by pull down to GND or assertion by HRESET, to ensure proper operation.
15. These pins were NCs on the PC7447. See Section 9.3 ”Connection Recommendations” on page 38, for more information.
16. These pins were OVDD pins on the PC7447. These pins are internally connected to OVDD and are intended to allow an exter-
nal device to detect the I/O voltage level present inside the device package. If unused, they must be connected directly to
OVDD or left unconnected.
17. These pins provide connectivity to the on-chip temperature diode that can be used to determine the die junction temperature
of the processor. These pins may be left unterminated if unused.
18. These pins are internally connected to VDD and are intended to allow an external device to detect the processor core voltage
level present inside the device package. If unused, they must be connected directly to VDD or left unconnected.
19. These pins are internally connected to GND and are intended to allow an external device to detect the processor ground
voltage level present inside the device package. If unused, they must be connected directly to GND or left unconnected.
20. These pins were in the TEST[0:4] factory test pin group on the PC7447A and PC7447. They have been assigned new func-
tions on the PC7448.
21. These pins can be used to enable the supported dynamic frequency switching (DFS) modes via hardware. If both are pulled
down, DFS mode is disabled completely and cannot be enabled via software. If unused, they should be pulled up to OVDD to
allow software control of DFS. See the PC7450 RISC Microprocessor Family Reference Manual for more information.
22. This pin is provided to allow operation of the L2 cache at low core voltages and is for factory use only. See the PC7450 RISC
Microprocessor Family Reference Manual for more information.
8. Package Description
The following sections provide the package parameters and mechanical dimensions for the HiTCE
package.
8.1 Package Parameters for the PC7448, 360 HiTCE BGA
The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360-lead
high coefficient of thermal expansion ceramic ball grid array (HiTCE).
Package outline 25 mm × 25 mm
Interconnects 360 (19 × 19 ball array - 1)
Pitch 1.27 mm (50 mil)
Minimum module height 2.32 mm
Maximum module height 2.80 mm
Ball diameter 0.89 mm (35 mil)
Coefficient of thermal expansion 12.3 ppm/°C
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8.2 Mechanical Dimensions for the PC7448, 360 HiTCE BGA
Figure 8-1 on page 29 provides the mechanical dimensions and bottom surface nomenclature for the
PC7448, 360 HiTCE BGA package.
Figure 8-1. Mechanical Dimensions and Bottom Surface Nomenclature for the PC7448, 360 HiTCE BGA Package
8.3 Package Parameters for the PC7448, 360 HiTCE LGA
The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360 pin
high coefficient of thermal expansion ceramic land grid array (HiTCE).
Package outline 25 mm × 25 mm
Interconnects 360 (19 × 19 ball array - 1)
Pitch 1.27 mm (50 mil)
Minimum module height 1.52 mm
Maximum module height 1.80 mm
Pad diameter 0.89 mm (35 mil)
Coefficient of thermal expansion 12.3 ppm/°C
CA
360X
B
0.3
A
0.15
b
0.2
2X
A1 CORNER
Capacitor Region
0.35 A
Millimeters
Dim Min Max
A 2.32 2.80
A1 0.80 1
A2 0.70 0.90
A3 – 0.6
b 0.82 0.93
D 25 BSC
D1 – 11.3
D2 8 –
D3 – 6.5
D4 7.2 7.4
e 1.27 BSC
E 25 BSC
E1 – 11.3
E2 8 –
E3 – 6.5
E4 7.9 8.1
D
E
e
0.2
2X
C
B
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
A
U
W
V
1
D3
E2
E1
A
A1
A2
A3
E4
D4
E3
D1
D2
1 2 345 6 78 910 11 12 13 1415 16 17 18 19
0.15 A
Notes:
1. Dimensioning and tolerance per ASME
Y14.5M, 1994.
2. Dimensions in millimeters.
3. Top side A1 corner index is a metalized
feature with various shapes.
Bottom side A1 corner is designated with
a ball missing from the array.
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8.4 Mechanical Dimensions for the PC7448, 360 HiTCE LGA
Figure 8-1 provides the mechanical dimensions and bottom surface nomenclature for the PC7448, 360
HiTCE LGA package.
Figure 8-2. Mechanical Dimensions and Bottom Surface Nomenclature for the PC7448, 360 HiTCE LGA Package
8.5 Package Parameters for the PC7448, 360 HiTCE RoHS-Compliant BGA
The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360-lead
high coefficient of thermal expansion ceramic ball grid array (HiTCE) with RoHS-compliant lead-free
spheres.
Package outline 25 mm × 25 mm
Interconnects 360 (19 × 19 ball array - 1)
Pitch 1.27 mm (50 mil)
Minimum module height 1.92 mm
Maximum module height 2.40 mm
Ball diameter 0.75 mm (30 mil)
Coefficient of thermal expansion 12.3 ppm/°C
Millimeters
Dim Mim Max
A 1.52 1.80
A1 0.70 0.90
A2 – 0.6
b 0.82 0.93
D 25 BSC
D1 – 11.3
D2 8 –
D3 – 6.5
D4 7.2 7.4
e 1.27 BSC
E 25 BSC
E1 – 11.3
E2 8 –
E3 – 6.5
E4 7.9 8.1
CA
360X
B
0.3
A
0.15
b
0.2
2X
A1 CORNER
Capacitor Region
0.35 A
D
E
e
0.2
2X
C
B
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
W
V
1
D3
E2
E1
E4
D4
E3
D1
D2
1 2 345 6 78 910 11 12 13 14 15 16 17 18 19
0.15 A
A
A
A1
A2
Notes:
1. Dimensioning and tolerance per ASME
Y14.5M, 1994.
2. Dimensions in millimeters.
3. Top side A1 corner index is a metalized
feature with various shapes.
Bottom side A1 corner is designated with
a pad missing from the array.
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8.6 Mechanical Dimensions for the PC7448, 360 HiTCE RoHS-Compliant BGA
Figure 8-1 on page 29 provides the mechanical dimensions and bottom surface nomenclature for the
PC7448, 360 HiTCE BGA package with RoHS-compliant lead-free spheres.
Figure 8-3. Mechanical Dimensions and Bottom Surface Nomenclature for the PC7448, 360 HiTCE RoHS-Compliant
BGA Package
A
0.15 A
0.35 A
A
A1
A2
A3
Millimeters
DIM MIN MAX
A 1.92 2.40
A1 0.40 0.60
A2 0.70 0.90
A3 – 0.6
b 0.60 0.90
D 25 BSC
D1 – 11.3
D2 8 –
D3 – 6.5
D4 7.2 7.4
e 1.27 BSC
E 25 BSC
E1 – 11.3
E2 8 –
E3 – 6.5
E4 7.9 8.1
4
CA
360X
B
0.3
A
0.15
b
0.2
2X
A1 CORNER
Capacitor Region
D
E
e
0.2
2X
C
B
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
W
V
1
D3
E2
E1
E4
D4
E3
D1
D2
1 2 345 6 78 910 11 12 13 1415 16 17 18 19
Notes:
1. Dimensioning and tolerance per ASME
Y14.5M, 1994.
2. Dimensions in millimeters.
3. Top side A1 corner index is a metallized
feature with various shapes. Bottom side
A1 corner is designated with a ball missing
from the array.
4. Dimension A1 represents the collapsed
sphere diameter.
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9. System Design Information
This section provides system and thermal design requirements and recommendations for successful
application of the PC7448.
9.1 Clocks
The following sections provide more detailed information regarding the clocking of the PC7448.
9.1.1 PLL Configuration
The PC7448 PLL is configured by the PLL_CFG[0:5] signals. For a given SYSCLK (bus) frequency, the
PLL configuration signals set the internal CPU and VCO frequency of operation. The PLL configuration
for the PC7448 is shown in Table 9-1. In this example, shaded cells represent settings that, for a given
SYSCLK frequency, result in core and/or VCO frequencies that do not comply with Table 5-8 on page
16. When enabled, Dynamic Frequency Switching (DFS) also affects the core frequency by halving or
quartering the bus-to-core multiplier; see Section 9.7.5 ”Dynamic Frequency Switching (DFS)” on page
49, for more information. Note that when DFS is enabled the resulting core frequency must meet the
adjusted minimum core frequency requirements (fcore_DFS) described in Table 5-8 on page 16. Note that
the PLL_CFG[5] is currently used for factory test only and should be tied low, and that the PC7448 PLL
configuration settings are compatible with the PC7447A PLL configuration settings when
PLL_CFG[5] = 0.
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Notes: 1. PLL_CFG[0:5] settings not listed are reserved.
Table 9-1. PC7448 Microprocessor PLL Configuration Example
PLL_CFG[0:5]
Example Core and VCO Frequency in MHz
Bus-to-Core
Multiplier(5)
Core-to-VCO
Multiplier(5)
Bus (SYSCLK) Frequency
33.3
MHz
50
MHz
66.6
MHz
75
MHz
83
MHz
100
MHz
133
MHz
167
MHz
200
MHz
010000 2x 1x
100000 3x 1x 600
101000 4x 1x 667 800
101100 5x 1x 667 835 1000
100100 5.5x 1x 733 919 1100
110100 6x 1x 600 800 1002 1200
010100 6.5x 1x 650 866 1086 1300
001000 7x 1x 700 931 1169 1400
000100 7.5x 1x 623 750 1000 1253 1500
110000 8x 1x 600 664 800 1064 1336 1600
011000 8.5x 1x 638 706 850 1131 1417 1700
011110 9x 1x 600 675 747 900 1197 1500
011100 9.5x 1x 633 712 789 950 1264 1583
101010 10x 1x 667 750 830 1000 1333 1667
100010 10.5x 1x 700 938 872 1050 1397
100110 11x 1x 733 825 913 1100 1467
000000 11.5x 1x 766 863 955 1150 1533
101110 12x 1x 600 800 900 996 1200 1600
111110 12.5x 1x 625 833 938 1038 1250 1667
010110 13x 1x 650 865 975 1079 1300
111000 13.5x 1x 675 900 1013 1121 1350
110010 14x 1x 700 933 1050 1162 1400
000110 15x 1x 750 1000 1125 1245 1500
110110 16x 1x 800 1066 1200 1328 1600
000010 17x 1x 850 1132 1275 1417 1700
001010 18x 1x 600 900 1200 1350 1500
001110 20x 1x 667 1000 1332 1500 1666
010010 21x 1x 700 1050 1399 1575
011010 24x 1x 800 1200 1600
111010 28x 1x 933 1400
001100 PLL bypass PLL off, SYSCLK clocks core circuitry directly
111100 PLL off PLL off, no core clocking occurs
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2. The sample bus-to-core frequencies shown are for reference only. Some PLL configurations may select bus, core, or VCO
frequencies which are not useful, not supported, or not tested for by the PC7448; see Section 5.5.1 ”Clock AC Specifica-
tions” on page 16, for valid SYSCLK, core, and VCO frequencies.
3. In PLL-bypass mode, the SYSCLK input signal clocks the internal processor directly and the PLL is disabled. However, the
bus interface unit requires a 2x clock to function. Therefore, an additional signal, EXT_QUAL, must be driven at half the fre-
quency of SYSCLK and offset in phase to meet the required input setup tIVKH and hold time tIXKH (see Table 5-9 on page
18). The result will be that the processor bus frequency will be one-half SYSCLK, while the internal processor is clocked at
SYSCLK frequency. This mode is intended for factory use and emulator tool use only.
Note: The AC timing specifications given in this document do not apply in PLL-bypass mode.
4. In PLL-off mode, no clocking occurs inside the PC7448 regardless of the SYSCLK input.
5. Applicable when DFS modes are disabled. These multipliers change when operating in a DFS mode.
9.1.2 System Bus Clock (SYSCLK) and Spread Spectrum Sources
Spread spectrum clock sources are an increasingly popular way to control electromagnetic interference
emissions (EMI) by spreading the emitted noise to a wider spectrum and reducing the peak noise magni-
tude in order to meet industry and government requirements. These clock sources intentionally add long-
term jitter in order to diffuse the EMI spectral content. The jitter specification given in Table 5-8 on page
16 considers short-term (cycle-to-cycle) jitter only and the clock generator’s cycle-to-cycle output jit-
ter should meet the PC7448 input cycle-to-cycle jitter requirement.
Frequency modulation and spread are separate concerns, and the PC7448 is compatible with spread
spectrum sources if the recommendations listed in Table 9-2 are observed.
Notes: 1. Guaranteed by design.
2. SYSCLK frequencies resulting from frequency spreading, and the resulting core and VCO frequencies,
must meet the minimum and maximum specifications given in Table 5-8 on page 16.
It is imperative to note that the processor’s minimum and maximum SYSCLK, core, and VCO frequen-
cies must not be exceeded regardless of the type of clock source. Therefore, systems in which the
processor is operated at its maximum rated core or bus frequency should avoid violating the stated limits
by using down-spreading only.
Table 9-2. Spread Spectrum Clock Source Recommendations
Parameter Min Max Unit Notes
Frequency modulation – 50 kHz (1)
Frequency spread – 1 % (1)(2)
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9.2 Power Supply Design and Sequencing
The following sections provide detailed information regarding power supply design for the PC7448.
9.2.1 Power Supply Sequencing
The PC7448 requires its power rails and clock to be applied in a specific sequence to ensure proper
device operation and to prevent device damage. The power sequencing requirements are as follows:
•AV
DD must be delayed with respect to VDD by the RC time constant of the PLL filter circuit described
in Section 9.2.2 ”PLL Power Supply Filtering” on page 36. This time constant is nominally 100 µs.
•OV
DD may ramp anytime before or after VDD and AVDD.
Additionally, the following requirements exist regarding the application of SYSCLK:
• The voltage at the SYSCLK input must not exceed VDD until VDD has ramped to 0.9 V.
• The voltage at the SYSCLK input must not exceed OVDD by more 20% during transients (see
overshoot/undershoot specifications in Figure 5-1 on page 11) or 0.3V DC (see Table 5-3 on page
12) at any time.
These requirements are shown graphically in Figure 9-1.
Figure 9-1. PC7448 Power up Sequencing Requirements
Certain stipulations also apply to the manner in which the power rails of the PC7448 power down, as
follows:
•OV
DD may ramp down any time before VDD. No restrictions apply in this case.
•If OV
DD ramps down with or after VDD, then OVDD must not exceed VDD by more than 1.4V during
power down (VDD below 90% of its nominal value, see Table 5-3 on page 12), as shown in Figure 9-2.
AVDD
VDD
OVDD
SYSCLK
0.9 V
no restrictions between
OVDD and VDD
0.9 V
limit imposed by VDD if OVDD ramps up first
limit imposed by OVDD if VDD ramps up first
100 ∝s (nominal) delay from VDD to AVDD
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Figure 9-2. PC7448 Power Down Sequencing Requirements
There is no requirement regarding AVDD during power down, but it is recommended that AVDD track VDD
within the RC time constant of the PLL filter circuit described in Section 9.2.2 ”PLL Power Supply Filter-
ing” on page 36 (nominally 100 µs).
9.2.2 PLL Power Supply Filtering
The AVDD power signal is provided on the PC7448 to provide power to the clock generation PLL. To
ensure stability of the internal clock, the power supplied to the AVDD input signal should be filtered of any
noise in the 500-KHz to 10-MHz resonant frequency range of the PLL. The circuit shown in Figure 9-3
using surface mount capacitors with minimum effective series inductance (ESL) is strongly recom-
mended. In addition to filtering noise from the AVDD input, it also provides the required delay between
VDD and AVDD as described in Section 9.2.1 ”Power Supply Sequencing” on page 35.
The circuit should be placed as close as possible to the AVDD pin to minimize noise coupled from nearby
circuits. It is often possible to route directly from the capacitors to the AVDD pin, which is on the periphery
of the device footprint.
Figure 9-3. PLL Power Supply Filter Circuit
VDD
OVDD
no restrictions between VDD and OVDD
SYSCLK
0.9V
AVDD
no restrictions between VDD and AVDD
note also restrictions between SYSCLK and OVDD
0.9V
limit imposed by VDD if VDD ramps down first
limit imposed by OVDD if OVDD ramps down first
VDD
10Ω
2.2 μF2.2 μF
GND
AVDD
Low ESL surface mount capacitors
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9.2.3 Transient Specifications
The ensure the long-term reliability of the device, the PC7448 requires that transients on the core power
rail (VDD) be constrained. The recommended operating voltage specifications provided in Table 5-3 on
page 12 are DC specifications. That is, the device may be operated continuously with VDD within the
specified range without adversely affecting the device’s reliability. Excursions above the stated recom-
mended operation range, including overshoot during power-up, can impact the long-term reliability of the
device. Excursions are described by their amplitude and duration. Duration is defined as the time period
during which the VDD power plane, as measured at the VDD_SENSE pins, will be within a specific volt-
age range, expressed as percentage of the total time the device will be powered up over the device
lifetime. In practice, the period over which transients are measured can be any arbitrary period of time
that accurately represents the expected range of processor and system activity. The voltage ranges and
durations for normal operation and transients are described in Table 9-3.
Notes: 1. Permitted duration is defined as the percentage of the total time the device is powered on that the VDD
power supply voltage may exist within the specified voltage range.
2. See Table 5-3 on page 12 for nominal VDD specifications.
3. To simplify measurement, excursions into the High Transient region are included in this duration.
4. Excursions above the absolute maximum rating of 1.4V are not permitted; see Table 5-1 on page 11.
Note that, to simplify transient measurements, the duration of the excursion into the High Transient
region is also included in the Low Transient duration, so that only the time the voltage is above each
threshold must be considered. Figure 9-4 on page 37 shows an example of measuring voltage
transients.
Figure 9-4. Voltage Transient Example
Table 9-3. VDD Power Supply Transient Specificatins (At Recommended Operating Conditions, see
Table 5-3 on page 12)
Voltage Region
Voltage Range (V)
Permitted Duration NotesMin Max
Normal VDD minimum VDD maximum 100%
Low Transient VDD maximum 1.35V 10%
High Transient 1.35V 1.40V 0.2%
VDD (nominal)
1.40V
A + B < T 10%
1.35V
VDD (maximum)
VDD (minimum)
AC
B
T
C < T 0.2%
Normal
Low Transient
High Transient
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9.2.4 Decoupling Recommendations
Due to the PC7448 dynamic power management feature, large address and data buses, and high oper-
ating frequencies, the PC7448 can generate transient power surges and high frequency noise in its
power supply, especially while driving large capacitive loads. This noise must be prevented from reach-
ing other components in the PC7448 system, and the PC7448 itself requires a clean, tightly regulated
source of power. Therefore, it is recommended that the system designer use sufficient decoupling
capacitors, typically one capacitor for every 1–2 VDD pins, and a similar or lesser amount for the OVDD
pins, placed as close as possible to the power pins of the PC7448. It is also recommended that these
decoupling capacitors receive their power from separate VDD, OVDD, and GND power planes in the PCB,
utilizing short traces to minimize inductance.
These capacitors should have a value of 0.01 or 0.1 µF. Only ceramic surface mount technology (SMT)
capacitors should be used to minimize lead inductance. Orientations where connections are made along
the length of the part, such as 0204, are preferable but not mandatory. Consistent with the recommenda-
tions of Dr. Howard Johnson in High Speed Digital Design: A Handbook of Black Magic (Prentice Hall,
1993) and contrary to previous recommendations for decoupling Freescale microprocessors, multiple
small capacitors of equal value are recommended over using multiple values of capacitance.
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
feeding the VDD and OVDD planes, to enable quick recharging of the smaller chip capacitors. These bulk
capacitors should have a low equivalent series resistance (ESR) rating to ensure the quick response
time necessary. They should also be connected to the power and ground planes through two vias to min-
imize inductance. Suggested bulk capacitors are 100–330 µF (AVX TPS tantalum or Sanyo OSCON).
9.3 Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level. Unless otherwise noted, unused active low inputs should be tied to OVDD and unused active high
inputs should be connected to GND. All NC (no connect) signals must remain unconnected.
Power and ground connections must be made to all external VDD, OVDD, and GND pins in the PC7448.
For backward compatibility with the PC7447, or for migrating a system originally designed for this device
to the PC7448, the new power and ground signals (formerly NC, see Table 7-1 on page 25) may be left
unconnected if the core frequency is 1 GHz or less. Operation above 1 GHz requires that these addi-
tional power and ground signals be connected, and it is strongly recommended that all new designs
include the additional connections. See also Section 7. ”Pinout Listings” on page 25, for additional
information.
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9.4 Output Buffer DC Impedance
The PC7448 processor bus drivers are characterized over process, voltage, and temperature. To mea-
sure Z0, an external resistor is connected from the chip pad to OVDD or GND. The value of each resistor
is varied until the pad voltage is OVDD/2. Figure 9-5 shows the driver impedance measurement.
Figure 9-5. Driver Impedance Measurement
The output impedance is the average of two components, the resistances of the pull-up and pull-down
devices. When data is held low, SW2 is closed (SW1 is open), and RN is trimmed until the voltage at the
pad equals OVDD/2. RN then becomes the resistance of the pull-down devices. When data is held high,
SW1 is closed (SW2 is open), and RP is trimmed until the voltage at the pad equals OVDD/2. RP then
becomes the resistance of the pull-up devices. RP and RN are designed to be close to each other in
value. Then, Z0 = (RP + RN)/2.
Table 9-4 summarizes the signal impedance results. The impedance increases with junction tempera-
ture and is relatively unaffected by bus voltage.
9.5 Pull-up/Pull-down Resistor Requirements
The PC7448 requires high-resistive (weak: 4.7-KΩ) pull-up resistors on several control pins of the bus
interface to maintain the control signals in the negated state after they have been actively negated and
released by the PC7448 or other bus masters. These pins are: TS, ARTRY, SHDO, and SHD1.
Some pins designated as being factory test pins must be pulled up to OVDD or down to GND to ensure
proper device operation. The pins that must be pulled up to OVDD are LSSD_MODE and TEST[0:3]; the
pins that must be pulled down to GND are L1_TSTCLK and TEST[4]. The CKSTP_IN signal should like-
wise be pulled up through a pull-up resistor (weak or stronger: 4.7–1 KΩ) to prevent erroneous
assertions of this signal.
Table 9-4. Impedance Characteristics (At Recommended Operating Conditions, see Table 5-3 on
page 12)
Impedance Processor bus L3 Bus Unit
Z0
Typical 33 – 42 34 – 42 Ω
Maximum 31 – 51 32 – 44 Ω
OVDD
OGND
SW2
SW1
RN
RP
Pad
Data
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In addition, the PC7448 has one open-drain style output that requires a pull-up resistor (weak or stron-
ger: 4.7–1 KΩ) if it is used by the system. This pin is CKSTP_OUT.
BVSEL0 and BVSEL1 should not be allowed to float, and should be configured either via pull-up or pull-
down resistors or actively driven by external logic. If pull-down resistors are used to configure BVSEL0 or
BVSEL1, the resistors should be less than 250Ω (see Table 7-1 on page 25). Because PLL_CFG[0:5]
must remain stable during normal operation, strong pull-up and pull-down resistors (1 KΩ or less) are
recommended to configure these signals in order to protect against erroneous switching due to ground
bounce, power supply noise, or noise coupling.
During inactive periods on the bus, the address and transfer attributes may not be driven by any master
and may, therefore, float in the high-impedance state for relatively long periods of time. Because the
PC7448 must continually monitor these signals for snooping, this float condition may cause excessive
power draw by the input receivers on the PC7448 or by other receivers in the system. These signals can
be pulled up through weak (10 KΩ) pull-up resistors by the system, address bus driven mode enabled
(see the PC7450 RISC Microprocessor Family Users’ Manual for more information on this mode), or
they may be otherwise driven by the system during inactive periods of the bus to avoid this additional
power draw. Preliminary studies have shown the additional power draw by the PC7448 input receivers to
be negligible and, in any event, none of these measures are necessary for proper device operation. The
snooped address and transfer attribute inputs are: A[0:35], AP[0:4], TT[0:4], CI, WT, and GBL.
If address or data parity is not used by the system, and respective parity checking is disabled through
HID1, the input receivers for those pins are disabled and do not require pull-up resistors, therefore they
may be left unconnected by the system. If extended addressing is not used (HID0[XAEN] = 0), A[0:3] are
unused and must be pulled low to GND through weak pull-down resistors; additionally, if address parity
checking is enabled (HID1[EBA] = 1) and extended addressing is not used, AP[0] must be pulled up to
OVDD through a weak pull-up resistor. If the PC7448 is in 60x bus mode, DTI[0:3] must be pulled low to
GND through weak pull-down resistors.
The data bus input receivers are normally turned off when no read operation is in progress and, there-
fore, do not require pull-up resistors on the bus. Other data bus receivers in the system, however, may
require pull-ups or require that those signals be otherwise driven by the system during inactive periods.
The data bus signals are D[0:63] and DP[0:7].
9.6 JTAG Configuration Signals
Boundary-scan testing is enabled through the JTAG interface signals. The TRST signal is optional in the
IEEE 1149.1 specification, but is provided on all processors that implement the PowerPC architecture.
While it is possible to force the TAP controller to the reset state using only the TCK and TMS signals,
more reliable power-on reset performance will be obtained if the TRST signal is asserted during power-
on reset. Because the JTAG interface is also used for accessing the common on-chip processor (COP)
function, simply tying TRST to HRESET is not practical.
The COP function of these processors allows a remote computer system (typically a PC with dedicated
hardware and debugging software) to access and control the internal operations of the processor. The
COP interface connects primarily through the JTAG port of the processor, with some additional status
monitoring signals. The COP port requires the ability to independently assert HRESET or TRST in order
to fully control the processor. If the target system has independent reset sources, such as voltage moni-
tors, watchdog timers, power supply failures, or push-button switches, then the COP reset signals must
be merged into these signals with logic.
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The arrangement shown in Figure 9-6 on page 42 allows the COP port to independently assert HRESET
or TRST, while ensuring that the target can drive HRESET as well. If the JTAG interface and COP
header will not be used, TRST should be tied to HRESET through a 0Ω. isolation resistor so that it is
asserted when the system reset signal (HRESET) is asserted, ensuring that the JTAG scan chain is ini-
tialized during power-on. Although Freescale recommends that the COP header be designed into the
system as shown in Figure 9-6, if this is not possible, the isolation resistor will allow future access to
TRST in the case where a JTAG interface may need to be wired onto the system in debug situations.
The COP header shown in Figure 9-6 adds many benefits: breakpoints, watchpoints, register and mem-
ory examination/modification, and other standard debugger features are possible through this interface
and can be as inexpensive as an unpopulated footprint for a header to be added when needed.
The COP interface has a standard header for connection to the target system, based on the 0.025"
square-post, 0.100" centered header assembly (often called a Berg header). The connector typically has
pin 14 removed as a connector key.
There is no standardized way to number the COP header shown in Figure 9-6; consequently, many dif-
ferent pin numbers have been observed from emulator vendors. Some are numbered top-to-bottom then
left-to-right, while others use left-to-right then top-to-bottom, while still others number the pins counter
clockwise from pin 1 (as with an IC). Regardless of the numbering, the signal placement recommended
in Figure 9-6 is common to all known emulators.
The QACK signal shown in Figure 9-6 is usually connected to the PCI bridge chip in a system and is an
input to the PC7448 informing it that it can go into the quiescent state. Under normal operation this
occurs during a low-power mode selection. In order for COP to work, the PC7448 must see this signal
asserted (pulled down). While shown on the COP header, not all emulator products drive this signal. If
the product does not, a pull-down resistor can be populated to assert this signal.
Additionally, some emulator products implement open-drain type outputs and can only drive QACK
asserted; for these tools, a pull-up resistor can be implemented to ensure this signal is negated when it is
not being driven by the tool. Note that the pull-up and pull-down resistors on the QACK signal are mutu-
ally exclusive and it is never necessary to populate both in a system. To preserve correct power-down
operation, QACK should be merged through logic so that it also can be driven by the PCI bridge.
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Figure 9-6. JTAG Interface Connection
Notes: 1. RUN/STOP, normally found on pin 5 of the COP header, is not implemented on the PC7448. Connect
pin 5 of the COP header to OVDD with a 10 kΩ pull-up resistor.
2. Key location; pin 14 is not physically present on the COP header.
3. Component not populated. Populate only if debug tool does not drive QACK.
4. Populate only if debug tool uses an open-drain type output and does not actively negate QACK.
5. If the JTAG interface is implemented, connect HRESET from the target source to TRST from the COP
header though an AND gate to TRST of the part. If the JTAG interface is not implemented, connect
HRESET from the target source to TRST of the part through a 0Ω isolation resistor.
6. The COP port and target board should be able to independently assert HRESET and TRST to the pro-
cessor in order to fully control the processor as shown above.
HRESET HRESET(6)
HRESET
13
SRESET
SRESET
SRESET
11
VDD_SENSE
6
5(1)
15
2 kΩ10 kΩ
10 kΩ
10 kΩ
OVDD
OVDD
OVDD
OVDD
CHKSTP_IN CHKSTP_IN
8
TMS
TDO
TDI
TCK
TMS
TDO
TDI
TCK
9
1
3
4
TRST
7
16
2
10
14(2)
Key
QACK
OVDD
OVDD
OVDD
TRST(6)
10 kΩ
10 kΩ
10 kΩ
10 kΩ
OVDD
QACK
QACK
CHKSTP_OUT
CHKSTP_OUT
3
13
9
5
1
6
10
2
15
11
7
16
12
8
4
KEY
No Pin
COP Connector
Physical Pin Out
10 kΩ(4)
OVDD
OVDD
1
2 kΩ(3)
0Ω(5)
12
NC
NC
From Target
Board Sources
(if any)
COP Header
10 kΩ
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9.7 Thermal Management Information
This section provides thermal management information for the high coefficient of thermal expansion
(HiTCE) package for air-cooled applications. Proper thermal control design is primarily dependent on the
system-level design, the heat sink, airflow, and thermal interface material. The PC7448 implements sev-
eral features designed to assist with thermal management, including DFS and the temperature diode.
DFS reduces the power consumption of the device by reducing the core frequency; see Section 9.7.5.1
”Power Consumption with DFS Enabled” on page 50, for specific information regarding power reduction
and DFS. The temperature diode allows an external device to monitor the die temperature in order to
detect excessive temperature conditions and alert the system; see Section 9.7.4 ”Temperature Diode”
on page 48, for more information.
To reduce the die-junction temperature, heat sinks may be attached to the package by several methods,
spring clip to holes in the printed-circuit board or package, and mounting clip and screw assembly (see
Figure 9-7); however, due to the potential large mass of the heat sink, attachment through the printed-
circuit board is suggested. In any implementation of a heat sink solution, the force on the die should not
exceed ten pounds.
Figure 9-7. BGA Package Exploded Cross-Sectional View with Several Heat Sink Options
Note: A clip on heat sink is not recommended for LGA because there may not be adequate clearance between
the device and the circuit board.. A through-hole solution is recommended, as shown in Figure 9-8 below.
Printed-Circuit Board
Thermal Interface
Material
Heat Sink
Clip
Heat Sink HCTE BGA Package
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Figure 9-8. LGA Package Exploded Cross-Sectional View with Several Heat Sink Options
9.7.1 Internal Package Conduction Resistance
For the exposed-die packaging technology described in Table 5-4 on page 13, the intrinsic conduction
thermal resistance paths are as follows:
• The die junction-to-case thermal resistance (the case is actually the top of the exposed silicon die)
• The die junction-to-ball thermal resistance
Figure 9-5 on page 39 depicts the primary heat transfer path for a package with an attached heat sink
mounted to a printed-circuit board.
Figure 9-9. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
Note the internal versus external package resistance.
Heat generated on the active side of the chip is conducted through the silicon, through the heat sink
attach material (or thermal interface material), and, finally, to the heat sink, where it is removed by
forced-air convection.
Because the silicon thermal resistance is quite small, the temperature drop in the silicon may be
neglected for a first-order analysis. Thus, the thermal interface material and the heat sink conduc-
tion/convective thermal resistances are the dominant terms.
Printed-Circuit Board
Thermal Interface
Material
Heat Sink
Clip
Heat Sink
HCTE LGA Package
External Resistance
External Resistance
Internal Resistance
Radiation Convection
Heat Sink
Thermal Interface Material
Die/Package
Die Junction
Package/Leads
Printed-Circuit Board
Radiation Convection
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9.7.2 Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the
thermal contact resistance. For those applications where the heat sink is attached by spring clip mecha-
nism, Figure 9-10 shows the thermal performance of three thin-sheet thermal-interface materials
(silicone, graphite/oil, fluoroether oil), a bare joint, and a joint with thermal grease as a function of contact
pressure. As shown, the performance of these thermal interface materials improves with increasing con-
tact pressure. The use of thermal grease significantly reduces the interface thermal resistance. That is,
the bare joint results in a thermal resistance approximately seven times greater than the thermal grease
joint.
Often, heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit
board (see Figure 9-7 on page 43). Therefore, synthetic grease offers the best thermal performance due
to the low interface pressure and is recommended due to the high power dissipation of the PC7448. Of
course, the selection of any thermal interface material depends on many factors, thermal performance
requirements, manufacturability, service temperature, dielectric properties, cost, and so on.
Figure 9-10. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interfaces. Heat sink adhesive materi-
als should be selected based on high conductivity and mechanical strength to meet equipment
shock/vibration requirements.
0
0.5
1
1.5
2
010 20304050607080
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
Specific Thermal Resistance (K-in.2/W)
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There are several commercially available thermal interfaces and adhesive materials provided by the fol-
lowing vendors:
The Bergquist Company 800-347-4572
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc. 781-935-4850
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
Dow-Corning Corporation 800-248-2481
Corporate Center
P.O. Box 994.
Midland, MI 48686-0994
Internet: www.dowcorning.com
Shin-Etsu MicroSi, Inc. 888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
Thermagon Inc. 888-246-9050
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
The following section provides a heat sink selection example using one of the commercially available
heat sinks.
9.7.3 Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
TJ = TI + Tr + (RθJC + Rθint + Rθsa) × Pd
where:
TJ is the die-junction temperature
Ti is the inlet cabinet ambient temperature
Tr is the air temperature rise within the computer cabinet
RθJC is the junction-to-case thermal resistance
Rθint is the adhesive or interface material thermal resistance
Rθsa is the heat sink base-to-ambient thermal resistance
Pd is the power dissipated by the device
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During operation, the die-junction temperatures (TJ) should be maintained less than the value specified
in Table 5-3 on page 12. The temperature of air cooling the component greatly depends on the ambient
inlet air temperature and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-
air temperature (Ti) may range from 30° to 40°C. The air temperature rise within a cabinet (Tr) may be in
the range of 5° to 10°C. The thermal resistance of the thermal interface material (Rθint) is typically about
1.1°C/W. For example, assuming a Ti of 30°C, a Tr of 5°C, an HiTCE package RθJC = 0.1, and a typical
power consumption (Pd) of 21W, the following expression for TJ is obtained:
Die-junction temperature: TJ = 30°C + 5°C + (0.1°C/W + 1.1°C/W + θsa) × 25.6
For this example, a Rθsa value of 1.53°C/W or less is required to maintain the die junction temperature
below the maximum value of Table 5-3 on page 12.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common fig-
ure-of-merit used for comparing the thermal performance of various microelectronic packaging
technologies, one should exercise caution when only using this metric in determining thermal manage-
ment because no single parameter can adequately describe three-dimensional heat flow. The final die-
junction operating temperature is not only a function of the component-level thermal resistance, but the
system-level design and its operating conditions. In addition to the component's power consumption, a
number of factors affect the final operating die-junction temperature: airflow, board population (local heat
flux of adjacent components), heat sink efficiency, heat sink attach, heat sink placement, next-level inter-
connect technology, system air temperature rise, altitude, and so on.
Due to the complexity and variety of system-level boundary conditions for today's microelectronic equip-
ment, the combined effects of the heat transfer mechanisms (radiation, convection, and conduction) may
vary widely. For these reasons, we recommend using conjugate heat transfer models for the board as
well as system-level designs.
For system thermal modeling, the PC7448 thermal model is shown in Figure 9-11 on page 48. Four vol-
umes represent this device. Two of the volumes, solder ball-air and substrate, are modeled using the
package outline size of the package.The other two, die and bump-underfill, have the same size as the
die. The silicon die should be modeled 8.0 × 7.3 × 0.86 mm3 with the heat source applied as a uniform
source at the bottom of the volume. The bump and underfill layer is modeled as 8.0 × 7.3 × 0.07 mm3
collapsed in the z-direction with a thermal conductivity of 5.0 W/(m • K) in the z-direction. The substrate
volume is 25 × 25 × 1.14 mm3 and has 9.9 W/(m • K) isotropic conductivity in the xy-plane and 2.95 W/(m
• K) in the direction of the z-axis. The solder ball and air layer are modeled with the same horizontal
dimensions as the substrate and is 0.8 mm thick. For the LGA package the solder and air layer is 0.1 mm
thick, but the material properties are the same. It can also be modeled as a collapsed volume using
orthotropic material properties: 0.034 W/(m • K) in the xy-plane direction and 11.2 W/(m • K) in the direc-
tion of the z-axis.
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Figure 9-11. Recommended Thermal Model of PC7448
9.7.4 Temperature Diode
The PC7448 has a temperature diode on the microprocessor that can be used in conjunction with other
system temperature monitoring devices (such as Analog Devices, ADT7461™). These devices use the
negative temperature coefficient of a diode operated at a constant current to determine the temperature
of the microprocessor and its environment. For proper operation, the monitoring device used should
auto-calibrate the device by canceling out the VBE variation of each PC7448’s internal diode.
The following are the specifications of the PC7448 on-board temperature diode:
Vf > 0.40V
Vf < 0.90V
Operating range 2 - 300 µA
Diode leakage < 10 nA at 125°C
Ideality factor over 5 µA – 150 µA at 60°C: n = 1.0275 ± 0.9%
Ideality factor is defined as the deviation from the ideal diode equation:
Another useful equation is:
Bump and underfill
Die
Substrate
Solder and air
Die
Top view of model (not to scale)
Side view of model (not to scale)
x
y
z
Conductivity Value Unit
Die (8.0 x 7.3 x 0.86 mm )
Silicon Temperature-
dependent W/(m • K)
W/(m • K)
W/(m • K)
W/(m • K)
Bump and underfill (8.0 x 7.3 x 0.07 mm )
kz5.0
Substrate (25 x 25 x 1.14 mm )
kx9.9
ky9.9
kz2.95
kx0.034
ky0.034
kz11.2
Substrate
3
3
3
Solder ball and air (25 x 25 x 0.8 mm )
3
IfW Ise
qVf
nKT
-----------
1–=
VHVL
–nKT
q
------- lnIH
IL
----- 1–=
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Where:
Ifw = Forward current
Is = Saturation current
Vd = Voltage at diode
Vf = Voltage forward biased
VH = Diode voltage while IH is flowing
VL = Diode voltage while IL is flowing
IH = Larger diode bias current
IL = Smaller diode bias current
q = Charge of electron (1.6 × 10-19 C)
n = Ideality factor (normally 1.0)
K = Boltzman’s constant (1.38 × 10-23 Joules/K)
T = Temperature (Kelvins)
The ratio of IH to IL is usually selected to be 10:1. The above simplifies to the following:
VH - VL = 1.986 × 10-4 × nT
Solving for T, the equation becomes:
9.7.5 Dynamic Frequency Switching (DFS)
The DFS feature in the PC7448 adds the ability to divide the processor-to-system bus ratio by two or four
during normal functional operation. Divide-by-two mode is enabled by setting the HID1[DFS2] bit in soft-
ware or by asserting the DFS2 pin via hardware. The PC7448 can be returned for full speed by clearing
HID1[DFS2] or negating DFS2. Similarly, divide-by-four mode is enabled by setting HID1[DFS4] in soft-
ware or by asserting the DFS4 pin. In all cases, the frequency change occurs in 1 clock cycle and no idle
waiting period is required to switch between modes. Note that asserting either DFS2 or DFS4 overrides
software control of DFS, and that asserting both DFS2 and DFS4 disables DFS completely, including
software control. Additional information regarding DFS can be found in the PC7450 RISC Microproces-
sor Family Reference Manual. Note that minimum core frequency requirements must be observed when
enabling DFS, and the resulting core frequency must meet the requirements for fCORE_DFS given in Table
5-8 on page 16.
nT VHV–L
1.986 10 4–
×
------------------------------------=
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9.7.5.1 Power Consumption with DFS Enabled
Power consumption with DFS enabled can be approximated using the following formula:
Where:
PDFS = Power consumption with DFS enabled
fDFS = Core frequency with DFS enabled
f = Core frequency prior to enabling DFS
P = Power consumption prior to enabling DFS (see Table 5-6 on page 15)
PDS = Deep sleep mode power consumption (see Table 5-6 on page 15)
The above is an approximation only. Power consumption with DFS enabled is not tested or guaranteed.
PDFS fDFS
f
-----------PP
DS
–()
PDS
+=
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9.7.5.2 Bus-to-Core Multiplier Constraints with DFS
DFS is not available for all bus-to-core multipliers as configured by PLL_CFG[0:5] during hard reset. The
complete listing is shown in Table 9-5.
Table 9-5. Valid divide Ratio Configurations
Bus-to-Core Multiplier Configured by
PLL_CFG[0:5] (see Table 9-1 on page 33)
Bus-to-Core Multiplier with
HID1[DFS2] = 1 or DFS2 = 0 (÷2)
Bus-to-Core Multiplier with
HID1[DFS4] = 1 or DFS4 = 0 (÷4)
2x N/A N/A
3x N/A N/A
4x 2x N/A
5x 2.5x N/A
5.5x 2.75x N/A
6x 3x N/A
6.5x 3.25x N/A
7x 3.5x N/A
7.5x 3.75x N/A
8x 4x 2x
8.5x 4.25x N/A
9x 4.5x 2.25x
9.5x 4.75x N/A
10x 5x 2.5x
10.5x 5.25x N/A
11x 5.5x 2.75x
11.5x 5.75x N/A
12x 6x 3x
12.5x 6.25x N/A
13x 6.5x 3.25x
13.5x 6.75x N/A
14x 7x 3.5x
15x 7.5x 3.75x
16x 8x 4x
17x 8.5x 4.25x
18x 9x 4.5x
20x 10x 5x
21x 10.5x 5.25x
24x 12x 6x
28x 14x 7x
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9.7.5.3 Minimum Core Frequency Requirements with DFS
In many systems, enabling DFS can result in very low processor core frequencies. However, care must
be taken to ensure that the resulting processor core frequency is within the limits specified in Table 5-8
on page 16. Proper operation of the device is not guaranteed at core frequencies below the specified
minimum fCORE.
10. Ordering Information
Notes: 1. For availability of the different versions, contact your local e2v sales office.
2. The letter X in the part number designates a "Prototype" product that has not been qualified by e2v. Reliability of a PCX part-
number is not guaranteed and such part-number shall not be used in Flight Hardware. Product changes may still occur while
shipping prototypes.
3. Power consumption for the 600 MHz K-spec and 1267 MHz N-spec devices are intentionally constrained via testing and
sorting to assure low power consumption for this device.
11. Definitions
11.1 Life Support Applications
These products are not designed for use in life support appliances, devices or systems where malfunc-
tion of these products can reasonably be expected to result in personal injury. e2v customers using or
selling these products for use in such applications do so at their own risk and agree to fully indemnify e2v
for any damages resulting from such improper use or sale.
Table 10-1. Ordering Information
xx 7448 y xxx nnnn N x
Product
Code(1)
Part
Identifier
Temperature
Range(1) Package(1)
Processor
Frequency
Application
Modifier Revision Level(1)
PC(X)(2) 7448
V: TC = -40°C, TJ = +110°C
M: TC = -55°C, TJ = +125°C
F: TC = -40°C, TJ = 125°C
GH Hi-TCE CBGA
LH: Hi-TCE LGA
SH: RoHS BGA
600 MHz K: 1.0V ± 50 mV(3)
D: 2.2 :PVR = 8004_0202
600 MHz N: 1.0V ± 50 mV
1000 MHz N: 1.0V ± 50 mV
1250 MHz N: 1.1V ± 50 mV
1267 MHz N: 1.05V ± 50 mV(3)
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12. Document Revision History
Table 12-1 provides a revision history for this hardware specification.
Table 12-1. Document Revision History
Revision Number Date Substantive Change(s)
G 04/09 Table 10-1 on page 52: Added new temperature range
F 02/09
Add 600 MHz parts modification
- Table 4-1 on page 10
- Table 5-3 on page 12
- Table 5-6 on page 15
- Table 5-8 on page 16
- Table 5-7 on page 16
- Section 10. ”Ordering Information” on page 52
E 12/08 Page 6: “Parity support on cache” replaced by “Parity support on L1 and L2 cache and
L2 Tags”.
D 12/07 Add 1267 MHz parts.
C 08/07 "Preliminary" status removed from this datasheet consecutive to product qualification
completion.
B 02/07
Name change from Atmel to e2v.
On first page: modifying Typical/Power consumption and maximum frequency.
Table 4-1 on page 10 : removed HiTCE in core power supply at 1000 MHz
Table 5-3 on page 12 : change operating temperature to TC = –55 ; TJ = +125
Table 5-6 on page 15 note 3 : change temperature to 125°C
Ordering information:
- change processor frequency
- associated VDD level
- Added rev D parts
A 10/05 Initial revision.
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Table of Contents
Features..................................................................................................... 1
Description ................................................................................................ 1
Screening .................................................................................................. 1
1 Overview ................................................................................................... 2
2 Features .................................................................................................... 4
3 Comparison with the PC7447A and PC7447 ......................................... 8
4 General Parameters ............................................................................... 10
5 Electrical and Thermal Characteristics ............................................... 10
5.1 Detailed Specification ............................................................................................10
5.2 Applicable Documents ...........................................................................................10
5.3 DC Electrical Characteristics .................................................................................11
5.4 Voltage and Frequency Derating ...........................................................................16
5.5 AC Electrical Characteristics .................................................................................16
6 Pin Assignments .................................................................................... 24
7 Pinout Listings ....................................................................................... 25
8 Package Description ............................................................................. 28
8.1 Package Parameters for the PC7448, 360 HiTCE BGA ....................................... 28
8.2 Mechanical Dimensions for the PC7448, 360 HiTCE BGA ................................... 29
8.3 Package Parameters for the PC7448, 360 HiTCE LGA ........................................29
8.4 Mechanical Dimensions for the PC7448, 360 HiTCE LGA ................................... 30
8.5 Package Parameters for the PC7448, 360 HiTCE RoHS-Compliant BGA ........... 30
8.6 Mechanical Dimensions for the PC7448, 360 HiTCE RoHS-Compliant BGA .......31
9 System Design Information .................................................................. 32
9.1 Clocks ....................................................................................................................32
9.2 Power Supply Design and Sequencing ................................................................. 35
9.3 Connection Recommendations ............................................................................. 38
9.4 Output Buffer DC Impedance ................................................................................39
9.5 Pull-up/Pull-down Resistor Requirements ............................................................. 39
9.6 JTAG Configuration Signals ..................................................................................40
9.7 Thermal Management Information ........................................................................43
ii
0814G–HIREL–04/09
PC7448
e2v semiconductors SAS 2009
10 Ordering Information ............................................................................. 52
11 Definitions .............................................................................................. 52
11.1 Life Support Applications .....................................................................................52
12 Document Revision History .................................................................. 53
Table of Contents ...................................................................................... i
0814G–HIREL–04/09
e2v semiconductors SAS 2009
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