LT1210
12
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For more information www.linear.com/LT1210
applicaTions inForMaTion
Power Supplies
The LT1210 will operate from single or split supplies from
±5V (10V total) to ±15V (30V total). It is not necessary to
use equal value split supplies, however the offset voltage
and inverting input bias current will change. The offset
voltage changes about 500µV per volt of supply mismatch.
The inverting bias current can change as much as 5µA per
volt of supply mismatch, though typically the change is
less than 0.5µA per volt.
Power Supply Bypassing
To obtain the maximum output and the minimum distor-
tion from the LT1210, the power supply rails should be
well bypassed. For example, with the output stage pour-
ing 1A current peaks into the load, a 1Ω power supply
impedance will cause a droop of 1V, reducing the available
output swing by that amount. Surface mount tantalum
and ceramic capacitors make excellent low ESR bypass
elements when placed close to the chip. For frequencies
above 100kHz, use 1µF and 100nF ceramic capacitors.
If significant power must be delivered below 100kHz,
capacitive reactance becomes the limiting factor. Larger
ceramic or tantalum capacitors, such as 4.7µF, are recom-
mended in place of the 1µF unit mentioned above.
Inadequate bypassing is evidenced by reduced output
swing and “distorted” clipping effects when the output is
driven to the rails. If this is observed, check the supply
pins of the device for ripple directly related to the output
waveform. Significant supply modulation indicates poor
bypassing.
Thermal Considerations
The LT1210 contains a thermal shutdown feature which
protects against excessive internal (junction) temperature.
If the junction temperature of the device exceeds the pro-
tection threshold, the device will begin cycling between
normal operation and an off state. The cycling is not
harmful to the part. The thermal cycling occurs at a slow
rate, typically 10ms to several seconds, which depends
on the power dissipation and the thermal time constants
of the package and heat sinking. Raising the ambient
temperature until the device begins thermal shutdown
gives a good indication of how much margin there is in
the thermal design.
For surface mount devices heat sinking is accomplished
by using the heat spreading capabilities of the PC board
and its copper traces. Experiments have shown that the
heat spreading copper layer does not need to be electri-
cally connected to the tab of the device. The PCB material
can be very effective at transmitting heat between the pad
area attached to the tab of the device, and a ground or
power plane layer either inside or on the opposite side of
the board. Although the actual thermal resistance of the
PCB material is high, the length/area ratio of the thermal
resistance between the layer is small. Copper board stiffen-
ers and plated through holes can also be used to spread
the heat generated by the device.
Tables 1 and 2 list thermal resistance for each package.
For the TO-220 package, thermal resistance is given for
junction-to-case only since this package is usually mounted
to a heat sink. Measured values of thermal resistance for
several different board sizes and copper areas are listed
for each surface mount package. All measurements were
taken in still air on 3/32" FR-4 board with 2 oz copper. This
data can be used as a rough guideline in estimating thermal
resistance. The thermal resistance for each application will
be affected by thermal interactions with other components
as well as board size and shape.
Table 1. R Package, 7-Lead DD
COPPER AREA
BOARD AREA
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
TOPSIDE* BACKSIDE
2500 sq. mm 2500 sq. mm 2500 sq. mm 25°C/W
1000 sq. mm 2500 sq. mm 2500 sq. mm 27°C/W
125 sq. mm 2500 sq. mm 2500 sq. mm 35°C/W
*Tab of device attached to topside copper
Table 2. Fused 16-Lead SO Package
COPPER AREA
BOARD AREA
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
TOPSIDE* BACKSIDE
2500 sq. mm 2500 sq. mm 5000 sq. mm 40°C/W
1000 sq. mm 2500 sq. mm 3500 sq. mm 46°C/W
600 sq. mm 2500 sq. mm 3100 sq. mm 48°C/W
180 sq. mm 2500 sq. mm 2680 sq. mm 49°C/W
180 sq. mm 1000 sq. mm 1180 sq. mm 56°C/W
180 sq. mm 600 sq. mm 780 sq. mm 58°C/W
180 sq. mm 300 sq. mm 480 sq. mm 59°C/W
180 sq. mm 100 sq. mm 280 sq. mm 60°C/W
180 sq. mm 0 sq. mm 180 sq. mm 61°C/W