1
© 2014 Microsemi Corporation. All Rights Reserved.
Features
DSP with Voice Hardware Accelerators
D ual ΔΣ DACs with output samp ling u p to 48 kHz
and internal output drivers
4 single-ended or 2 differential Output Amps
44.1/48 kHz Stereo Music Playback with Voice
A single Digital Microphone input supporting
up to 2 Microphones
Two TDM ports shared between PCM and Inter-
IC Sound (I2S)
Each port provides sample rate conversion
and synchronous and asynchronous TDM bus
operation
SPI Slave port for host processor interface
Master SPI port for serial Flash interface
14 General Purpose Input/Output (GPIO) pins
General purpose UART port
Boots from SPI, UART, or Flash allowing easy
firmware updates
Can run unattended (controllerless), self-
booting into a configured operational state
Ult ra-l ow a n d Standb y o ff powe r
Full duplex operation supports AEC (up to
256 ms) in both Narrowband and Wideband
operation (8 kHz or 16 kHz respectively)
Psychoacoustic noise reduction
Singl e mi cro ph one
Stationar y no ise re duc tio n
•AGC/ALC
Dynamic Range Compression
Built-in support for G.712 and G.722
Single and Dual Tone Generation
MiTuner GUI Softw are
Autom at ed AE C t uni ng
Applications
Han ds- F ree Phon e and A u dio c apabi lity fo r
Automotive applications
Description
The Microsemi AcuEdge Technology ZL38080 Hands-
Free Automotive Audio Processor is designed to
provide le ading edge acoust ic ec ho c ancellatio n and
noise reduction for the Hands-Free Automotive market.
The ZL38080 device is a highly adaptable hardware
platform designed to support hig h pe rfo rmance audio
process ing applica ti ons . Th e Z L38080 provides a
powerful DSP with voice specific hardware
accelerat ors, one digital microph one interface, two
independent 1 6-b it D ACs , and two flexible TDM
interface s in a si ngle 64-pin QFN package.
The Microsemi AcuEdge Technology ZLS38080
license-free Firmware provides Acoustic Echo
Cancellation (AEC), noise reduction and a variety of
other voic e enhance m ents to improve bot h t he
intelligibility and subjective quality of voice in harsh
acoustic environ m ents.
Performance
AEC Tail Length: 256 ms
AEC sampling rate: 8 and 16 kHz
Single Talk TCLw: > 60 dB
Double Talk TCLw: > 40 dB
Dou ble Talk At ten u atio n: < 3 dB
Noise reduction up to 30 dB
Document ID# 149152 Version 2 May 2014
Ordering Inform ation
Device OPN
(1)
Package Packing
ZL38080 LDF1 64-pin Q FN (9x9) Tape & Reel
ZL38080 LDG1 64-pin Q FN (9x9) Tray
1. The Green package meets RoHS 2 Directive 201 1/65/EU of the
European Council to minimize the environmental impact of
electrical equipment.
Microsemi
®
AcuEdge™ Techn o logy
ZL38080
Hands-Free Automotive Audio Processor
Product Brief
ZL38080
Product Brief
2
© 2014 Microsemi Corporation. All Rights Reserved.
Vo ice Processing Series Solution Overview
Designed for world-class high definition voice applications, Microsemi’s new ZL380 series of audio processors
features the company’s Microsemi AcuEdge™ Technology. This innovative technology is a set of highly-complex
and integrated algorithms that allows the user to extract more information from the audio environment. The new
Microsemi AcuEdge Technology consists of license-free, royalty-free intelligent audio IP algorithms. When
combined with Microsemi’s highly-integrated ZL380 series of audio processors, the solution accelerates customers
time-to-market via validated reference design and easy-to-use development tools including the Microsemi Audio
Interface Box (AIB) Kit which uti liz es the MiTuner™ GUI software.
ZL38080 Block Diagram
The ZL3808 0 Hands -Free Autom otive Audio Processo r provid es the fol lowing enh anced voic e processin g feature
set.
Microsemi ZL38080 Hardware
Host Interface: SPI, UART, I2C
Standalone (controllerless) auto-boot from Flash
Two c loc k in depe n den t TD M po rts ( PCM or I2S)
14 GPI Os , con fig ur able wit h bu il t-in con tro l feat ure s
Cry stal-l ess ope ra tio n (w ith a va lid T DM clo ck )
Digital microphone interface supporting one or two digital microphones
PCMA/I
2
SA
Host Bus Interface
TDM
PCM/I
2
S
Mast er SPI
PLL
UART
GPIO
PCMB/I
2
SB
SPI Slave/I
2
C S l ave
Flash
UART
GPIO
Crystal
DSP
Integrated
Memory
Hardware
Accelerators
DAC1
DAC2
Decimation
Filter
Speaker 1
Speaker 2
Digital
Mics
ZL38080
Product Brief
3
© 2014 Microsemi Corporation. All Rights Reserved.
Dual 16-bit digital-to-analog converters (DACs)
Headphone amps capable of four single-ended or two differential outputs
Two independent headphone drivers
32 mW ou tpu t dr ive pow er in to 16 ohm s
Impul se p op/ cli ck pr ote ct ion
Microsemi AcuEdge™ Technology
ZLS3 808 0 F irmware
W ideb an d an d N ar row ban d A cou stic Ec ho C an cel lati on
Initial convergence conditioning
Psychoacoustic noise reduction
Singl e mi cro ph one
Stationar y no ise re duc tio n
Low active power consumption
Multi-tone generation
Signal mixing
44.1 kHz/48 kHz music mixed with 8 kHz/16 kHz voice
H owl ing d ete ctio n/c an cel la tion
Various encoding/decoding options:
16-bit 2’s complement (linear)
G.711 A/μ law
•G.722
Send and receive path equalizers
16-ba nd f or N arro wb an d m ode
22-ba nd f or W ide ba nd m od e
Comfort noise generation
44.1 kHz/48 kHz bypass mode
Configurable Cross-Point Switch
AEC Auto-Tuning
To optim iz e t he ac oustic properties of a given system des ign, the Audio Proc es s or f irm w are requires gain and leve l
tuning. The mechanical design, including the speaker and microphone quality and placement, will all affect the
system’s acoustic performance. Microsemi has developed MiTuner GUI Softw are (ZLS38508) and the Microsemi
Audio I nterface Box ( AIB) ha rdware (ZLE384 70) to automat ically op timize the firmw are’s tunabl e parameters for a
given h ardware design , facilitating the sy stem d esign p rocess and elim inating the ne ed for tedious manual tuning.
The MiTuner GUI Softwa re provide s ste p-by-step ins t ruc t ions that allo w the s oftwa re’s algo rit hm s to achieve a high
level of aco us t ic perf orm ance for a given encl os ure.
ZL38080
Product Brief
4
© 2014 Microsemi Corporation. All Rights Reserved.
Application Example - Hands-Free Automot ive Block Diagram
Device Pinout - Top View
ZL38080
Hands-Free
Phone
DAC1
Di gi t al M i c
Flash
SPI/I2C
TDMA/I2S
Host
Processor
TDMB/I2S Bluetooth
Car Audio
Navigation
Prompts
SPIM
64 585960616263 57 56 55 54
11
10
9
8
7
6
5
4
3
2
1
DRB/I2S_SDIB
GPIO_9/SM_CS
PCLKB/I2S_SCKB
FSB/I2S_WSB
DVDD12
DVDD33
HDOUT
UART_TX
VSS
DXB/I2S_SDOB
53 52 51 50 49
16
15
14
13
12
38
39
40
41
42
43
44
45
46
47
48
33
34
35
36
37
3231
3029282726252423
22
2120191817
HCLK
DVDD33
UART_RX
HCS
HINT
DVDD33
GPIO_10
GPIO_8
DVDD12
GPIO_7
GPIO_6
GPIO_12
GPIO_2
GPIO_5
GPIO_4
GPIO_0
GPIO_3
DVDD33
GPIO_13
GPIO_1
FSA/I2S_WSA
DRA/I2S_SDIA
DMIC_IN
NC
DVDD33
NC
XO
DVDD12
DMIC_CLK
NC
EXT_SEL
VSS
DXA/I2S_SDOA
SM_CLK
SM_MISO
SM_MOSI
DVDD33
DAC1_M
DAC1_P
DAC2_P
CDAC
CREF
RESET
DVDD12
GPIO_11
AVDD33
DAC2_M
DVDD12
AVDD33
HDIN
Exposed Ground Pad
VDD12_CTRL
XI
DVDD33_XTAL
PCLKA/I2S_SCKA
ZL38080
Product Brief
5
© 2014 Microsemi Corporation. All Rights Reserved.
Package Outline (64-Pin QFN)
Info rm a tion r el at in g to pro d uc ts a nd s ervice s fu r n is he d here in by M i crosem i C orpor at io n or its s u bs id ia r ie s (c ollectivel y M ic rosemi”) is
believed to be reliable. However, Microsemi assumes no liability for errors that may appear in this publication, or for liability otherwis e
arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual
proper ty rig ht s owned by t hird p arti es whi ch may resul t from su ch appl icat ion or use . Neit her the su pply of such in format ion or purcha se
of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by
Microsemi or licensed from third parties by Microsemi, whatsoever. Purchasers of products are also hereby notified that the use of
product in certain ways or in combination with Microsemi, or non-Microsemi furnished goods or services may infringe patents or other
intellectual property rights owned by Microsemi.
This publication is issued to provide information only and (unless agreed by Microsemi in writing) may not be used, applied or
reproduced for any purpose nor form part of an y order or contract nor to be regard ed as a representation relating to the products or
services concerned. The products, their specifications, services and other information appearing in this publication are subject to
change by Microsemi without notice. No warranty or guarantee express or implied is made regarding the capability, performance or
suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not
cons ti tute an y gu a r an te e th at suc h m eth o ds o f us e w il l b e s at is fa ct or y i n a s p ec i fic p ie c e o f eq ui pm e nt . I t i s th e us er’s res po nsibility to
fully determine the performance and suitability of any equipment using such information and to ensure that any publication or dat a used
is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These
products are not suitable for use in any medical and other products whose failure to perform may result in significant injury or death to
the user. All products and materials are sold and services provided subject to Microsemi’s conditions of sale which are available on
request.
For more informat io n about all Microsemi products
visi t ou r web si te at
www.microsemi.com
TECHNICAL DOCUMENTATION – NOT FOR RESALE
© 2014 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of
Microsemi Corporation. All other trademarks and service marks are the property of their respective owners.
Microsemi Corporation (NASDAQ: MSCC) offers a comprehensive portfolio of semiconductor
solutions for: aerospace, defense and security; enterprise and communications; and industrial
and alternative energy markets. Products include mixed-signal ICs, SoCs, and ASICs;
programmable logic solutions; power management products; timing and voice processing
devices; RF solutions; discrete c omponents; and s ystems. Microsemi is headquartered in Aliso
Viejo, Calif. Learn more at www.microsemi.com.
Microsemi Corporate Headquarters
One Enterprise, Aliso Viejo CA 92656 USA
Within the USA: +1 (949) 380-6100
Sales: +1 (949) 380-6136
Fax: +1 (949) 215-4 996