General Description
The MAX9892 is an audio click-and-pop eliminator for
portable multimedia devices. Operating from a 1.7V to
3.6V supply, the MAX9892 connects to the output of the
existing system amplifier and provides a low-impedance
path to ground during startup and shutdown. The inputs
INL and INR accept voltage swings from VDD to 5.5V
below VDD. See the Setting the Supply Voltage section
for more information. The power-up and power-down
transients are shunted to ground to prevent clicks and
pops from becoming audible.
The MAX9892 features two low-impedance analog
switches controlled by MUTE that opens and closes the
switches. The switches are open during normal operation
and have no impact on the output signal. During startup
and shutdown of the amplifier, the MAX9892 can be
activated to short the outputs to ground and prevent clicks
and pops from pulling current through the headphones.
The MAX9892 is available in 6-bump UCSP™ (1mm
x 1.52mm x 0.6mm) and 6-pin µDFN (2mm x 2mm x
0.75mm) packages. The MAX9892 is specified over the
-40°C to +85°C temperature range.
Applications
Mobile Phones
Smart Phones
Mobile Internet Devices
Portable Gaming Consoles
Portable Media Players
Notebook Computers
Features
Distortion-Free, Click-and-Pop Elimination
Less than 1µA Supply Current
1.7V to 3.6V Single-Supply Operation
Tiny Packages
6-Bump UCSP (1mm x 1.52mm x 0.6mm)
6-Pin µDFN (2mm x 2mm x 0.75mm)
UCSP is a trademark of Maxim Integrated Products, Inc.
19-4295; Rev 1; 12/16
+Denotes a lead-free/RoHS-compliant package.
Typical Operating Circuit
Pin Congurations
MAX9892
MUTE
SET
CSET
VDD
GND
1.7V TO 3.6V
HEADPHONE
AMPLIFIER
INL INR
RSERIES
RSERIES
0.1µF
1 2 3
A
B
UCSP
TOP VIEW
(BUMPS ON BOTTOM)
INL GND INR
VDD SET
MUTE
4
3
INL
MUTE
5
2
GND
VDD
6
1
INR
SET
µDFN
TOP VIEW
MAX9892
MAX9892
+
Ordering Information
PART TEMP RANGE PIN-PACKAGE
MAX9892ERT+ -40°C to +85°C 6 UCSP
MAX9892ELT+ -40°C to +85°C 6 µDFN
MAX9892 Shunt Mode Audio Click-and-Pop Eliminator
VDD, MUTE, SET to GND .......................................-0.3V to +6V
INL, INR to GND ..............................(VDD - 6V) to (VDD + 0.3V)
Continuous Current In/Out of VDD .....................................30mA
Continuous Current In/Out of MUTE .................................. 30mA
Continuous Current In/Out of SET .....................................30mA
Continuous Current In/Out of INL, INR and GND ............390mA
Continuous Power Dissipation (TA = +70°C)
6-Bump UCSP (derate 3.9mW/°C above +70°C) .....308.3mW
6-Pin µDFN (derate 4.5mW/°C above +70°C) .........357.8mW
Operating Temperature Range ........................... -40°C to +85°C
Junction Temperature ...................................................... +150°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Bump Temperature (soldering)
Reflow ..........................................................................+235°C
(VDD = 3.0V, VGND = 0, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)
Note 2: All devices are 100% production tested at TA = +25°C. All temperature limits are guaranteed by design.
Note 3: Operating within the recommended supply voltage range ensures that negative audio signals are not limited by the device.
Supply voltages above the recommended supply voltage range may limit the headphone amplifiers maximum output voltage.
Note 4: Supply current is measured when switches are off.
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Electrical Characteristics
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage Range VDD Guaranteed by RON test 1.7 5.5 V
Recommended Supply Voltage Range VDD (Note 3) 1.7 3.6 V
Supply Current IDD VDD = 5.5V, TA = +25°C (Note 4) 0.6 1 µA
Input Voltage Range VIN Guaranteed by input leakage current test VDD -
5.5V VDD V
Turn-On Time (Figure 1) tON
Measured from MUTE = GND and input voltage
settled to 90% of its nal value 130 ns
Turn-Off Time (Figure 1) tOFF
CSET = 500pF 4 10 17
msCSET = 50pF 1
CSET = 50nF 1000
Turn-On Time Resistor RSET CSET = 500pF 350 800 1300 kΩ
Switch On-Resistance RON
VDD = 3.0V 0.3
VDD = 1.7V 2
VDD = 5.5V 1
Click-and-Pop Reduction RSERIES = 30Ω, RLOAD = 16Ω 35 dB
Input Leakage Current IIN TA = +25°C VIN = VDD - 5.5V, VDD = 1.7V ±1 µA
VIN = VDD, VDD = 5.5V ±1
MUTE Leakage Current IMUTE VDD = 5.5V, VMUTE = 0 or 5.5V, TA = +25°C ±1 µA
MUTE Input-Voltage High VIH 1.5 V
MUTE Input-Voltage Low VIL 0.4 V
UCSP
Junction-to-Ambient Thermal Resistance (θJA) ...259.50°C/W
Junction-to-Case Thermal Resistance JC) ..................... N/A
µDFN
Junction-to-Ambient Thermal Resistance (θJA) ...223.60°C/W
Junction-to-Case Thermal Resistance JC) .............122°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Package Thermal Characteristics (Note 1)
MAX9892 Shunt Mode Audio Click-and-Pop Eliminator
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(VDD = 3.0V, VGND = 0, TA = +25°C, unless otherwise noted.)
Typical Operating Characteristics
-90
-70
-80
-50
-60
-40
-30
-10
-20
0
0 2010 4030 6050 8070 10090
CLICK AND POP vs. RSERIES
MAX9892 toc01
RSERIES ()
CLICK AND POP (dBV)
TESTED WITH THE MAX4338
OUT OF SHUTDOWN
INTO SHUTDOWN
0
0.2
0.6
0.4
0.8
1.0
SUPPLY CURRENT
vs. SUPPLY VOLTAGE
MAX9892 toc04
VDD (V)
I
DD
(µA)
1.5 3.52.5 4.5 5.5
0
600
400
200
800
1000
1200
0 20155 10 25 30 35 40 45 50
tOFF vs. CSET
MAX9892 toc02
CSET (nF)
tOFF (ms)
-100
-80
-40
-60
-20
0
CLICK AND POP vs. VDD
MAX9892 toc05
VDD (V)
CLICK AND POP (dBV)
1.5 3.52.5 4.5 5.5
TESTED WITH THE MAX4338
OUT OF SHUTDOWN
INTO SHUTDOWN
CROSSTALK vs. FREQUENCY
MAX9892 toc07
FREQUENCY (kHz)
CROSSTALK (dB)
1010.1
-100
-80
-60
-40
-20
0
-120
0.01 100
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
1.5 2.5 3.5 4.5 5.5
RON vs. SUPPLY VOLTAGE
MAX9892 toc03
VDD (V)
RON ()
2ms/div
SWITCH TURN-OFF/ON TIME
MUTE
2V/div
MAX9892 toc06
IN_
2V/div
CSET = 500pF
MAX9892 Shunt Mode Audio Click-and-Pop Eliminator
Maxim Integrated
3
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Figure 1. Turn-On/Off Time
Pin Description
Timing Diagram
UCSP µDFN NAME FUNCTION
BUMP PIN
A1 1 INL Left-Channel Input. Connect INL in between the output coupling capacitor and
the headphone jack.
A2 2 GND Ground
A3 3 INR Right-Channel Input. Connect INR in between the output coupling capacitor and the
headphone jack.
B1 6 MUTE Active-Low Enable
B2 5 VDD Power Supply
B3 4 SET Turn-Off Time Set. Connect an external capacitor in between SET and GND to set the switch
open delay; see the Setting the Turn-Off Time section for more information.
MUTE
IN_
RON 0.5
VDD
VDD - 5.5V
GND
GND
tOFF tON
MAX9892 Shunt Mode Audio Click-and-Pop Eliminator
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Detailed Description
The MAX9892 is the second-generation click-and-pop
eliminator designed to be used with conventional head-
phone amplifiers. The MAX9892 works by adding a
low-impedance current path from the headphone side
of the DC-blocking capacitor to ground. Drive MUTE low
when turning off the amplifier, and high when enabling
the amplifier. A short turn-on time allows the switches in
the MAX9892 to close before the DC-blocking capacitors
have significantly discharged, eliminating clicks and pops
at amplifier turn-off. An adjustable turn-off time allows
the delay to be set to mask all clicks and pops during
amplifier turn-on.
Setting the Turn-Off Time
The MAX9892 features a SET input that allows the turn-
off time to be adjusted from 1ms to 1000ms to match the
click-and-pop profile of the amplifier startup. The value
of an external capacitor sets the switch open delay, as
shown in the following equation:
tON (ms) = 0.02 x CSET (pF)
When the headphone amplifier is enabled, the MAX9892
automatically waits the set delay time before opening the
analog switches. This allows amplifier turn-on click and
pop to be eliminated.
Applications Information
Setting the Supply Voltage
The MAX9892 operates from 1.7V to 3.6V supply voltage.
The inputs, INL and INR, accept voltage swings from VDD
to VDD - 5.5V. The audio signal applied to a headphone
is ground biased, meaning that the signal swings just
as much negative as positive. Since the MAX9892 input
voltage is limited to VDD - 5.5V on the negative side, the
voltage on VDD must be set properly to pass the audio
signal when the switch is open (Figure 2).
A voltage-divider can be used to scale down an available
supply voltage as shown in Figure 3. The voltage-divider
allows the creation of a supply voltage for the MAX9892
that is low enough to allow the negative portion of the
audio signal to pass. When using large resistances for the
voltage-divider, the supply current affects what resistors to
use. Select R2 between 10kΩ to 1MΩ for a given supply
voltage. Use the following equation to calculate the R1:
AMP DD
1
2 DD
(V V )
RII
=
+
where VAMP is the supply voltage of the amplifier, and I2
is the current through R2. For a signal of ±2V in reference
to GND, the MAX9892 supply can be set from 2V to 3.5V.
Selecting Series Resistors
A series resistor (RSERIES), as shown in the Typical
Operating Circuit, is necessary to achieve optimal click-
and-pop reduction. See the Click and Pop vs. RSERIES
graph in the Typical Operating Characteristics for details
on how much click-and-pop reduction to expect for a
given series resistor.
Layout Considerations
Bypass VDD to GND with a 0.1µF capacitor. The 0.1µF
bypass capacitor should be positioned as close as pos-
sible to VDD. Minimize trace length from GND to solid
system ground plane to ensure optimum performance.
Refer to the MAX9892 Evaluation Kit for a proven PCB
layout.
Figure 2. Proper Supply Selected for a Given Input Signal.
A: Supply Voltage with a Large Signal;
B: Supply Voltage with a Small Signal
IN_
VDD - 5.5V
GND
VDD
IN_ GND
VDD
A
B
VDD - 5.5V
MAX9892 Shunt Mode Audio Click-and-Pop Eliminator
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UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape-carrier information, printed circuit board
techniques, bump-pad layout, and recommended reflow
temperature profile, as well as the latest information on
reliability testing results, refer to Application Note 1891:
Understanding the Basics of the Wafer-Level Chip-
Scale Package (WL-CSP) at www.maximintegrated.
com/ucsp. See Figure 4 for the recommended MAX9892
PCB footprint.
Figure 4. PCB Footprint Recommendation Diagram
Figure 3. Scaling Down the Supply Voltage with a Voltage
Divider
VDD
GND
HEADPHONE
AMP VDD
0.1µF
R1
R2
MAX9892
250µm
45±5µm
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
6 UCSP R61A1+1 21-0228
6 μDFN L622-1 21-0164
MAX9892 Shunt Mode Audio Click-and-Pop Eliminator
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Revision History
REVISION
NUMBER
REVISION
DATE DESCRIPTION PAGES
CHANGED
0 10/08 Initial release
1 12/16 Added Package Thermal Characteristics section and updated Electrical Characteristics
table 1, 2
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
MAX9892 Shunt Mode Audio Click-and-Pop Eliminator
© 2016 Maxim Integrated Products, Inc.
7
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