DISCRETE CERAMICS DATA SHEET www.phycomp-components.com TFx13 series 0.1% TC25 Thin-film chip resistors sizes 1206, 0805, 0603 and 0402 Product specification 2001 Jul 09 Rev.0 Phycomp Product specification Thin-film chip resistors sizes 1206, 0805, 0603 and 0402 TFx13 series 0.1% TC25 FEATURES DESCRIPTION * High precision The resistors are constructed on a high grade ceramic body (aluminium oxide). Internal metal electrodes are added at each end and connected by a resistive paste which is applied to the top surface of the substrate. The composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to within tolerance, by laser cutting of this resistive layer. * High long-term stability * Low temperature coefficient. APPLICATIONS * Converters * Printer equipment * Motherboards * Telecom The resistive layer is covered with a protective coating and printed with the resistance value. Finally, the two external end terminations are added. To guarantee optimum solderability the outer layer consists of a lead-tin alloy. * Consumer. QUICK REFERENCE DATA VALUE DESCRIPTION Size code Resistance range TF013 TF113 TF213 TF313 1206 0805 0603 0402 10 to 1 M 10 to 1 M 10 to 330 k 10 to 100 k 0.1%; E24 and E96 series Resistance tolerance and series 25 x 10-6/K Temperature coefficient Maximum dissipation at Tamb = 70 C Maximum permissible voltage (DC or RMS) 0.125 W 0.125 W 0.1 W 0.0625 W 200 V 150 V 75 V 50 V Climatic category (IEC 60068) 55/125/56 Basic specification 2001 Jul 09 Rev.0 IEC 60115-8 2 www.phycomp-components.com Phycomp Product specification Thin-film chip resistors sizes 1206, 0805, 0603 and 0402 TFx13 series 0.1% TC25 ORDERING INFORMATION Table 1 Ordering code indicating resistor type and packing RESISTANCE VALUE TOL. (%) TF013 10 to 1 M 0.1 5000 2390 611 4xxxx TF113 10 to 1 M 0.1 5000 2390 601 4xxxx TF213 10 to 330 k 0.1 5000 2390 604 4xxxx TF313 10 to 100 k 0.1 10000 2390 607 4xxxx TYPE Ordering code (12NC) Table 2 PAPER TAPE ON REEL ORDERING EXAMPLE Last digit of 12NC * The resistors have a 12-digit ordering code starting with 2390; see Table 1. RESISTANCE DECADE LAST DIGIT * The subsequent 4 digits indicate the resistor type and packing. 10 to 97.6 9 100 to 976 1 1 k to9.76k 2 * The remaining 4 digits indicate the resistance value: - The first 3 digits indicate the resistance value. 12NC ORDERING CODE 10 k to97.6k 3 100 k to976k 4 1 M 5 The ordering code of a TF013 resistor, value 1000 with 0.1% tolerance, supplied on paper tape of 5 000 units per reel is: 2390 611 41002. - The last digit indicates the resistance decade in accordance with Table 2. 2001 Jul 09 Rev.0 3 www.phycomp-components.com Phycomp Product specification Thin-film chip resistors sizes 1206, 0805, 0603 and 0402 TFx13 series 0.1% TC25 FUNCTIONAL DESCRIPTION DERATING Product characterization The power that the resistor can dissipate depends on the operating temperature; see Fig.1. Standard values of nominal resistance are taken from the E24 and E96 series for resistors with a tolerance of 0.1%. The values of the E24 and E96 series are in accordance with "IEC publication 60063". handbook, P halfpage MLB206 max (%Prated ) 100 Limiting values LIMITING VOLTAGE (note 1) (V) LIMITING POWER (W) TF013 200 0.125 TF113 150 TF213 75 0.1 TF313 50 0.0625 TYPE 50 0 55 0.125 Fig.1 0 50 70 100 125 o Tamb ( C) Maximum dissipation (Pmax) in percentage of rated power as a function of the ambient temperature (Tamb). Note 1. The maximum voltage that may be continuously applied to the resistor element, see "IEC publication 60 115-8". 2001 Jul 09 Rev.0 4 www.phycomp-components.com Phycomp Product specification Thin-film chip resistors sizes 1206, 0805, 0603 and 0402 MECHANICAL DATA TFx13 series 0.1% TC25 OUTLINES Mass per 100 units protective coat MASS (g) TYPE TF013 1 TF113 0.55 TF213 0.25 TF313 0.052 resistor layer inner electrode T end termination ceramic substrate tb protective coat tt Marking TYPE E24 E96 TF013 4 digits 4 digits TF113 4 digits 4 digits 3 digits 3 digits EIA-96 TF213 TF313 no marking 1001 W CCB633 L For dimensions see Table 3. Fig.2 Outlines. 4-DIGIT MARKING For values up to 976 the R is used as a decimal point. For values of 1 k or greater the first 3 digits apply to the resistance value and the fourth indicates the number of zeros to follow. Example MARKING RESISTANCE 10R0 10 10R2 10.2 1001 1 k 2001 Jul 09 Rev.0 marking Table 3 Chip resistor type and relevant physical dimensions; see Fig.2 L (mm) W (mm) T (mm) tt (mm) tb (mm) TF013 (1206) 3.1 0.1 1.6 0.1 0.55 0.1 0.45 0.2 0.4 0.2 TF113 (0805) 2.0 0.1 1.25 0.1 0.50 0.1 0.35 0.2 0.35 0.2 TF213 (0603) 1.6 0.1 0.8 0.1 0.45 0.1 0.25 0.15 0.25 0.15 TF313 (0402) 1.0 0.1 0.50 0.05 0.25 0.05 0.20 0.1 0.25 0.1 TYPE 5 www.phycomp-components.com Phycomp Product specification Thin-film chip resistors sizes 1206, 0805, 0603 and 0402 TFx13 series 0.1% TC25 3-DIGIT MARKING 3-DIGIT EIA-96 MARKING MARKING For values up to 91 the R is used as a decimal point. For values of 100 or greater the first 2 digits apply to the resistance value and the third indicates the number of zeros to follow. The first 2 digits apply to the resistance value and the third character indicates the multiplier as shown in Tables 4 and 5. The packing material is also marked and includes resistance value, tolerance, catalogue number, quantity, production period, batch number and source code. Example MARKING Example RESISTANCE RESISTANCE 10X 12.4 12R 12 10C 12.4 k 123 12 k 10D 124 k 124 120 k MARKING Table 4 OF PACKING MATERIAL First two digits of the resistance code CODE VALUE CODE VALUE CODE VALUE CODE VALUE 01 100 25 178 49 316 73 562 02 102 26 182 50 324 74 576 03 105 27 187 51 332 75 590 04 107 28 191 52 340 76 604 05 110 29 196 53 348 77 619 06 113 30 200 54 357 78 634 07 115 31 205 55 365 79 649 08 118 32 210 56 374 80 665 09 121 33 215 57 383 81 681 10 124 34 221 58 392 82 698 11 127 35 226 59 402 83 715 12 130 36 232 60 412 84 732 13 133 37 237 61 422 85 750 14 137 38 243 62 432 86 768 15 140 39 249 63 442 87 787 16 143 40 255 63 453 88 806 17 147 41 261 65 464 89 825 18 150 42 267 66 475 90 845 19 154 43 274 67 487 91 866 20 158 44 280 68 499 92 887 21 162 45 287 69 511 93 909 22 165 46 294 70 523 94 931 23 169 47 301 71 536 95 953 24 174 48 309 72 549 96 976 Table 5 Multiplier codes CODE Multiplier Y X 10-2 10-1 2001 Jul 09 Rev.0 A 1 B C D E F 10 102 103 104 105 6 www.phycomp-components.com Phycomp Product specification Thin-film chip resistors sizes 1206, 0805, 0603 and 0402 TFx13 series 0.1% TC25 TESTS AND REQUIREMENTS Unless otherwise specified the following values apply: Temperature: 15 C to 35 C Essentially all tests are carried out in accordance with the schedule of "IEC publication 60115-8", category 55/125/56 (rated temperature range -55 to +125 C; damp heat, long term, 56 days). The testing also covers the requirements specified by EIA and EIAJ. Relative humidity: 25% to 75% Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar). In Table 6 the tests and requirements are listed with reference to the relevant clauses of "IEC publications 60115-8 and 60068" ; a short description of the test procedure is also given. In some instances deviations from the IEC recommendations were necessary for our method of specifying. The tests are carried out in accordance with IEC publication 60 068, "Recommended basic climatic and mechanical robustness testing procedure for electronic components" and under standard atmospheric conditions in accordance with "IEC 60068-1", subclause 5.3. All soldering tests are performed with mildly activated flux. Table 6 Test procedures and requirements IEC 60115-8 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS Tests in accordance with the schedule of IEC publication 60115-8 4.4.1 visual examination 4.4.2 dimensions (outline) gauge see Table 3 4.5 resistance applied voltage (+0/-10%): 10 R < 100 : 0.3 V 100 R < 1 k: 1 V 1 k R < 10 k: 3 V 10 k R < 100 k: 10 V 100 k R < 1 M: 25 V 1 M: 50 V R - Rnom: max. 0.1% resistance to soldering heat unmounted chips; 10 1 s; 260 5 C no visible damage 4.18 4.17 20 (Tb) 20 (Ta) no holes; clean surface; no damage R/R max.: (0.5% +0.05 ) solderability unmounted chips completely immersed for 5 0.5 s in a solder bath at 230 5 C good tinning (95% covered); no damage 4.7 voltage proof on insulation maximum voltage (RMS) during 1 minute, metal block method no breakdown or flashover 4.13 short time overload room temperature; V = 2.5 x Vrated; 5 s (voltage not more than 2 x Vmax); specimen stabilized at room temperature for 30 minutes R/R max.: (0.5% +0.05 ) 2001 Jul 09 Rev.0 7 www.phycomp-components.com Phycomp Product specification Thin-film chip resistors sizes 1206, 0805, 0603 and 0402 IEC 60115-8 CLAUSE IEC 60068-2 TEST METHOD TEST TFx13 series 0.1% TC25 PROCEDURE REQUIREMENTS resistors mounted on a 90 mm glass epoxy resin PCB (FR4); bending: 2 mm for 1206 3 mm for 0805 3 mm for 0603 2 mm for 0402 no visual damage thermal shock 2 minutes at LCT and 2 minutes at UCT; 5 cycles no visible damage 4.25.1 endurance 1000 +48/-0 hours; 70 2 C; loaded with Pn or Vmax; 1.5 hours on and 0.5 hours off; specimen stabilized at room temperature for 1 hour min. after test R/R max.: (0.5% +0.05 ) 4.8.4.2 temperature at 25/LCT/25 C and 25/UCT/25 C coefficient 4.33 4.19 bending 14 (Na) R/R max.: (0.5% +0.05 ) R/R max.: (0.5% +0.05 ) 25 x 10-6/K Other tests in accordance with IEC 60115 insulation resistance after 1 minute, metal block method 1206: 250 V (DC) 0805: 200 V (DC) 0603: 100 V (DC) 0402: 100 V (DC) Rins min.: 104 M EIA 575 3.13 leaching unmounted chips; 60 1 s; 260 5 C good tinning; no leaching EIA/IS 703 4.6 moisture resistance 65 2 C; 95 +3/-5% RH; R/R max.: (0.5% +0.05 ) loaded with 0.01 Pn or Vmax for 42 damp heat cycles. (1 cycle consists of 7 steps. see Fig.3) 4.6.1.1 Other applicable tests 2001 Jul 09 Rev.0 8 www.phycomp-components.com Phycomp Product specification Thin-film chip resistors sizes 1206, 0805, 0603 and 0402 75 80 - 98% RH 90 - 98% RH temperature [C] TFx13 series 0.1% TC25 90 - 98% RH 80 - 98% RH 90 - 98% RH initial drying 24 hours rate of change of temperature is unspecified, however, specimens shall not be subjected to radiant heating from chamber conditioning processes 50 end of final cycle; measurements as specified in 2.7 +10 C (+18 F) -2 C (-3.6 F) 25 initial measurements as specified in 2.2 0 temperature tolerance 2 C (3.6 F) unless otherwise specified voltage applied as specified in 2.4 STEP1 STEP2 prior to first cycle only HBK073 optional sub-cycle if specified (2.3); sub-cycle performed during any 5 of the first 9 cycles; humidity uncontrolled during sub-cycle circulation of conditioning air shall be at a minimum cubic rate per minute equivalent to 10 times the volume of the chamber STEP3 STEP4 STEP5 STEP6 STEP7 one cycle 24 hours; repeat as specified in 2.5 0 5 10 15 20 25 time [h] Fig.3 Moisture resistance test requirements. 2001 Jul 09 Rev.0 9 www.phycomp-components.com Phycomp Product specification Thin-film chip resistors sizes 1206, 0805, 0603 and 0402 TFx13 series 0.1% TC25 MOUNTING printed-circuit boards (PCBs). Electrical connection to the circuit is by soldering. The finishing of the end terminations guarantees a reliable contact. Due to their rectangular shape and small dimensional tolerances, surface-mounted resistors are suitable for handling by automatic placement systems. Chip placement can be on ceramic substrates and Footprint dimensions handbook, full pagewidth D E C B A F G preferred direction during wave soldering solder land / solder paste pattern solder resist pattern occupied area tracks MBG628 E: available area for tracks underneath the chip For dimensions see Table 7. Fig.4 Recommended footprint dimensions. Table 7 Reflow soldering; for dimensions see also Fig.4 A B C D E F G PLACEMENT ACCURACY (mm) 0402 1.5 0.5 0.5 0.6 0.1 1.9 1.0 0.15 0603 2.1 0.5 0.8 0.9 0.0 2.5 1.7 SIZE CODE FOOTPRINT DIMENSIONS (mm) PROCESSING REMARKS 0805 2.6 0.9 0.85 1.4 0.5 3.0 2.1 1206 3.8 2.0 0.9 1.8 1.4 4.2 2.5 Table 8 0.25 IR soldering 0.25 0.25 Wave soldering; for dimensions see also Fig.4 A B C D E F G PROPOSED NUMBER AND DIMENSIONS OF DUMMY TRACKS (mm) 0603 2.7 0.9 0.9 0.8 0.15 3.2 1.9 1 x (0.15 x 0.8) 0.25 0805 3.3 1.3 1.0 1.3 0.34 3.9 2.4 1 x (0.3 x 1.3) 0.25 1206 4.5 2.5 1.0 1.7 1.25 3.9 2.4 3 x (0.25 x 1.7) 0.25 SIZE CODE FOOTPRINT DIMENSIONS (mm) 2001 Jul 09 Rev.0 10 PLACEMENT ACCURACY (mm) www.phycomp-components.com Phycomp Product specification Thin-film chip resistors sizes 1206, 0805, 0603 and 0402 TFx13 series 0.1% TC25 SOLDERING CONDITIONS Surface-mount resistors are tested for solderability at 235 C during 2 seconds. The test condition for no leaching is 260 C for 60 seconds. Typical examples of soldering processes that provide reliable joints without any damage, are given in Figs 5 and 6. The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260 C for one minute. Therefore, it is possible to mount surface-mount resistors on one side of a PCB and other components on the reverse side (mixed PCBs). 300 MLA859 10 s T 260 C (C) 245 C 250 10 s 215 C 200 40 s 180 C 150 130 C 100 2 K/s 50 0 0 50 100 150 200 250 t (s) Typical values (solid line). Process limits (dotted lines). Fig.5 Infrared soldering. 2001 Jul 09 Rev.0 11 www.phycomp-components.com Phycomp Product specification Thin-film chip resistors sizes 1206, 0805, 0603 and 0402 300 TFx13 series 0.1% TC25 10 s T MLA861 (C) 250 235 C to 260 C 200 second wave 5 K/s first wave 2 K/s 200 K/s 150 100 C to 130 C forced cooling 100 2 K/s 50 0 0 50 100 150 200 t (s) 250 Typical values (solid line). Process limits (dotted lines). The resistors may be soldered twice in accordance with this method if desired. Fig.6 Double wave soldering. 2001 Jul 09 Rev.0 12 www.phycomp-components.com Phycomp Product specification Thin-film chip resistors sizes 1206, 0805, 0603 and 0402 TFx13 series 0.1% TC25 PACKING Peel-off force Tape and reel specifications Peel-off forces of both paper and blister tapes are in accordance with "IEC 60286-3" ; that is, at a peel-off speed of 300 10 mm/minute, 0.1 N to 1.0 N for 8 mm tape. The peel-off angle should be between 165 and 180. All tape and reel specifications are in accordance with "IEC 60286-3". Basic dimensions are given in Figs 7, 8 and 9 and Tables 9, and 10. Paper tape specification P0 handbook, full pagewidth D0 T P2 E F cover tape W B0 MBG251 A0 Cumulative tolerance over 10 holes: 0.2 mm. P1 Bottom fixing tape thickness: 50 10 m. Top fixing tape thickness: 50 10 m. For dimensions see Table 9. Fig.7 Paper tape. Table 9 Dimensions of paper tape for relevant chip size; see Fig.7 PRODUCT SIZE CODE SYMBOL 0402 0603 0805 1206 UNIT SIZE TOL. SIZE TOL. SIZE TOL. SIZE TOL. A0 0.65 0.1 1.10 0.1 1.65 0.1 1.90 0.1 mm B0 1.15 0.1 1.90 0.1 2.40 0.1 3.50 0.1 mm W 8.0 0.2 8.0 0.2 8.0 0.2 8.0 0.2 mm E 1.75 0.1 1.75 0.1 1.75 0.1 1.75 0.1 mm F 3.50 0.05 3.50 0.05 3.50 0.05 3.50 0.05 mm D0 1.5 +0.1/-0 1.5 +0.1/-0 1.50 +0.1/-0 1.5 +0.1/-0 mm P0 4.0 0.1 4.0 0.1 4.0 0.1 4.0 0.1 mm P1 2.0 0.05 4.0 0.05 4.0 0.05 4.0 0.05 mm P2 2.0 0.05 2.0 0.05 2.0 0.05 2.0 0.05 mm T 0.53 0.1 0.7 0.1 0.85 0.1 0.85 0.1 mm 2001 Jul 09 Rev.0 13 www.phycomp-components.com Phycomp Product specification Thin-film chip resistors sizes 1206, 0805, 0603 and 0402 TFx13 series 0.1% TC25 Tape leader/trailer specification leader end empty compartments with cover tape (min. 240 mm) trailer end cover tape only leader 400 mm trailer (max. 260 mm) CCB325 Fig.8 Leader/trailer tape. Taping requirements Resistance side facing up. Component is free and not sticking to top and/or bottom tape. Component should be easy to remove from the carrier tape and the chip cavity should have no mechanical damage. 2001 Jul 09 Rev.0 14 www.phycomp-components.com Phycomp Product specification Thin-film chip resistors sizes 1206, 0805, 0603 and 0402 TFx13 series 0.1% TC25 Reel specification W2 C N A HBK039 W1 Dimensions in mm. For reel dimensions see Table 10. Fig.9 Reel. Table 10 Reel dimensions; see Fig.9 PRODUCT SIZE CODE 0402 0603; 0805; 1206 2001 Jul 09 Rev.0 UNITS PER REEL 10000 5000 TAPE WIDTH (mm) A (mm) N (mm) C (mm) W1 (mm) W2 MAX. (mm) 8 180 +0/-3 60 +1/-0 13.0 0.2 9.0 0.3 11.4 1 15 www.phycomp-components.com Phycomp Product specification Thin-film chip resistors sizes 1206, 0805, 0603 and 0402 TFx13 series 0.1% TC25 REVISION HISTORY Revision Date Change Notification Description Rev.0 2001 Jul 09 - - First issue of this specification 2001 Jul 09 Rev.0 16 www.phycomp-components.com