DATA SHEET
Product specification 2001 Jul 09 Rev.0
DISCRETE CERAMICS
TFx13 series
0.1% TC25
Thin-film chip resistors
sizes 1206, 0805, 0603 and 0402
www.phycomp-components.com
2001 Jul 09 Rev.0 2 www.phycomp-components.com
Phycomp Product specification
Thin-film chip resistors
sizes 1206, 0805, 0603 and 0402
TFx13 series
0.1% TC25
FEATURES
•High precision
•High long-term stability
•Low temperature coefficient.
APPLICATIONS
•Converters
•Printer equipment
•Motherboards
•Telecom
•Consumer.
DESCRIPTION
The resistors are constructed on a
high grade ceramic body (aluminium
oxide). Internal metal electrodes are
added at each end and connected by
a resistive paste which is applied to
the top surface of the substrate. The
composition of the paste is adjusted
to give the approximate resistance
required and the value is trimmed to
within tolerance, by laser cutting of
this resistive layer.
The resistive layer is covered with a
protective coating and printed with the
resistance value. Finally, the two
external end terminations are added.
To guarantee optimum solderability
the outer layer consists of a
lead-tin alloy.
QUICK REFERENCE DATA
DESCRIPTION VALUE
TF013 TF113 TF213 TF313
Size code 1206 0805 0603 0402
Resistance range 10 Ω to 1 MΩ10 Ω to 1 MΩ10 Ω to 330 kΩ10 Ω to 100 kΩ
Resistance tolerance and series ±0.1%; E24 and E96 series
Temperature coefficient ≤±25 ×10−6/K
Maximum dissipation at
Tamb =70°C0.125 W 0.125 W 0.1 W 0.0625 W
Maximum permissible voltage
(DC or RMS) 200 V 150 V 75 V 50 V
Climatic category (IEC 60068) 55/125/56
Basic specification IEC 60115-8
2001 Jul 09 Rev.0 3 www.phycomp-components.com
Phycomp Product specification
Thin-film chip resistors
sizes 1206, 0805, 0603 and 0402
TFx13 series
0.1% TC25
ORDERING INFORMATION
Table 1 Ordering code indicating resistor type and packing
TYPE RESISTANCE
VALUE
TOL.
(%)
PAPER TAPE
ON REEL 12NC ORDERING CODE
TF013 10 Ωto1MΩ±0.1 5000 2390 611 4xxxx
TF113 10 Ωto1MΩ±0.1 5000 2390 601 4xxxx
TF213 10 Ωto 330 kΩ±0.1 5000 2390 604 4xxxx
TF313 10 Ωto 100 kΩ±0.1 10000 2390 607 4xxxx
Ordering code (12NC)
•The resistors have a 12-digit
ordering code starting with 2390;
see Table 1.
•The subsequent 4 digits indicate
the resistor type and packing.
•The remaining 4 digits indicate the
resistance value:
– The first 3 digits indicate the
resistance value.
– The last digit indicates the
resistance decade in
accordance with Table 2.
Table 2 Last digit of 12NC
RESISTANCE
DECADE LAST DIGIT
10Ωto 97.6 Ω9
100Ωto 976 Ω1
1kΩto9.76kΩ2
10 kΩto97.6kΩ3
100 kΩto976kΩ4
1MΩ5
ORDERING EXAMPLE
The ordering code of a TF013
resistor, value 1000 Ω with 0.1%
tolerance, supplied on paper tape of
5 000 units per reel is:
2390 611 41002.
2001 Jul 09 Rev.0 4 www.phycomp-components.com
Phycomp Product specification
Thin-film chip resistors
sizes 1206, 0805, 0603 and 0402
TFx13 series
0.1% TC25
FUNCTIONAL DESCRIPTION
Product characterization
Standard values of nominal
resistance are taken from the E24
and E96 series for resistors with a
tolerance of ±0.1%.
The values of the E24 and E96 series
are in accordance with
“IEC publication 60063”
.
Limiting values
Note
1. The maximum voltage that may
be continuously applied to the
resistor element, see
“IEC publication 60115-8”
.
TYPE
LIMITING
VOLTAGE
(note 1)
(V)
LIMITING
POWER
(W)
TF013 200 0.125
TF113 150 0.125
TF213 75 0.1
TF313 50 0.0625
DERATING
The power that the resistor can dissipate depends on the operating
temperature; see Fig.1.
handbook, halfpage MLB206
70 10055 50
T
amb( C)
o
(%P )
rated
0
0
50
100
125
Pmax
Fig.1 Maximum dissipation (Pmax) in percentage of rated power
as a function of the ambient temperature (Tamb).
2001 Jul 09 Rev.0 5 www.phycomp-components.com
Phycomp Product specification
Thin-film chip resistors
sizes 1206, 0805, 0603 and 0402
TFx13 series
0.1% TC25
MECHANICAL DATA
Mass per 100 units
TYPE MASS
(g)
TF013 1
TF113 0.55
TF213 0.25
TF313 0.052
OUTLINES
tb
tt
T
inner electrode
end termination
protective coat
CCB633
1001
marking
W
L
protective coat
resistor layer
ceramic substrate
Fig.2 Outlines.
For dimensions see Table 3.
Table 3 Chip resistor type and relevant physical dimensions; see Fig.2
TYPE L
(mm)
W
(mm)
T
(mm)
tt
(mm)
tb
(mm)
TF013
(1206) 3.1 ±0.1 1.6 ±0.1 0.55 ±0.1 0.45 ±0.2 0.4 ±0.2
TF113
(0805) 2.0 ±0.1 1.25 ±0.1 0.50 ±0.1 0.35 ±0.2 0.35 ±0.2
TF213
(0603) 1.6 ±0.1 0.8 ±0.1 0.45 ±0.1 0.25 ±0.15 0.25 ±0.15
TF313
(0402) 1.0 ±0.1 0.50 ±0.05 0.25 ±0.05 0.20 ±0.1 0.25 ±0.1
Marking
4-DIGIT MARKING
For values up to 976 Ω the R is used
as a decimal point. For values of 1 kΩ
or greater the first 3 digits apply to the
resistance value and the fourth
indicates the number of zeros to
follow.
Example
TYPE E24 E96
TF013 4 digits 4 digits
TF113 4 digits 4 digits
TF213 3 digits 3 digits
EIA-96
TF313 no marking
MARKING RESISTANCE
10R0 10 Ω
10R2 10.2 Ω
1001 1 kΩ
2001 Jul 09 Rev.0 6 www.phycomp-components.com
Phycomp Product specification
Thin-film chip resistors
sizes 1206, 0805, 0603 and 0402
TFx13 series
0.1% TC25
Table 4 First two digits of the resistance code
CODE VALUE CODE VALUE CODE VALUE CODE VALUE
01 100 25 178 49 316 73 562
02 102 26 182 50 324 74 576
03 105 27 187 51 332 75 590
04 107 28 191 52 340 76 604
05 110 29 196 53 348 77 619
06 113 30 200 54 357 78 634
07 115 31 205 55 365 79 649
08 118 32 210 56 374 80 665
09 121 33 215 57 383 81 681
10 124 34 221 58 392 82 698
11 127 35 226 59 402 83 715
12 130 36 232 60 412 84 732
13 133 37 237 61 422 85 750
14 137 38 243 62 432 86 768
15 140 39 249 63 442 87 787
16 143 40 255 63 453 88 806
17 147 41 261 65 464 89 825
18 150 42 267 66 475 90 845
19 154 43 274 67 487 91 866
20 158 44 280 68 499 92 887
21 162 45 287 69 511 93 909
22 165 46 294 70 523 94 931
23 169 47 301 71 536 95 953
24 174 48 309 72 549 96 976
Table 5 Multiplier codes
CODE Y X A B C D E F
Multiplier 10−210−111010
2103104105
3-DIGIT MARKING
For values up to 91 Ω the R is used as
a decimal point. For values of 100 Ω
or greater the first 2 digits apply to the
resistance value and the third
indicates the number of zeros to
follow.
Example
MARKING RESISTANCE
12R 12 Ω
123 12 kΩ
124 120 kΩ
3-DIGIT EIA-96 MARKING
The first 2 digits apply to the
resistance value and the third
character indicates the multiplier as
shown in Tables 4 and 5.
Example
MARKING RESISTANCE
10X 12.4 Ω
10C 12.4 kΩ
10D 124 kΩ
MARKING OF PACKING MATERIAL
The packing material is also marked
and includes resistance value,
tolerance, catalogue number,
quantity, production period, batch
number and source code.
2001 Jul 09 Rev.0 7 www.phycomp-components.com
Phycomp Product specification
Thin-film chip resistors
sizes 1206, 0805, 0603 and 0402
TFx13 series
0.1% TC25
TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with the
schedule of
“IEC publication 60115-8”
, category
55/125/56 (rated temperature range −55 to +125 °C;
damp heat, long term, 56 days). The testing also covers
the requirements specified by EIA and EIAJ.
The tests are carried out in accordance with
IEC publication 60068,
“Recommended basic climatic and
mechanical robustness testing procedure for electronic
components”
and under standard atmospheric conditions
in accordance with
“IEC 60068-1”
, subclause 5.3.
Unless otherwise specified the following values apply:
Temperature: 15 °Cto35°C
Relative humidity: 25% to 75%
Air pressure: 86 kPa to 106 kPa
(860 mbar to 1060 mbar).
In Table 6 the tests and requirements are listed with
reference to the relevant clauses of
“IEC publications 60115-8 and 60068”
; a short
description of the test procedure is also given. In some
instances deviations from the IEC recommendations were
necessary for our method of specifying.
All soldering tests are performed with mildly activated flux.
Table 6 Test procedures and requirements
IEC
60115-8
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
Tests in accordance with the schedule of IEC publication 60115-8
4.4.1 visual
examination
no holes; clean surface; no damage
4.4.2 dimensions
(outline)
gauge see Table 3
4.5 resistance applied voltage (+0/−10%):
10 Ω≤R<100 Ω: 0.3 V
100 Ω≤R<1kΩ: 1 V
1kΩ≤R<10 kΩ: 3 V
10 kΩ≤R<100 kΩ: 10 V
100 kΩ≤R<1MΩ: 25 V
1MΩ: 50 V
R−Rnom: max. ±0.1%
4.18 20 (Tb) resistance
to soldering
heat
unmounted chips;
10 ±1s;260±5°C
no visible damage
∆R/R max.: ±(0.5% +0.05 Ω)
4.17 20 (Ta) solderability unmounted chips completely
immersed for 5 ±0.5 s in a solder bath
at 230 ±5°C
good tinning (≥95% covered);
no damage
4.7 voltage
proof on
insulation
maximum voltage (RMS) during
1 minute, metal block method
no breakdown or flashover
4.13 short time
overload
room temperature; V = 2.5 ×Vrated;
5 s (voltage not more than 2 ×Vmax);
specimen stabilized at room
temperature for 30 minutes
∆R/R max.: ±(0.5% +0.05 Ω)
2001 Jul 09 Rev.0 8 www.phycomp-components.com
Phycomp Product specification
Thin-film chip resistors
sizes 1206, 0805, 0603 and 0402
TFx13 series
0.1% TC25
4.33 bending resistors mounted on a 90 mm
glass epoxy resin PCB (FR4);
bending: 2 mm for 1206
3 mm for 0805
3 mm for 0603
2 mm for 0402
no visual damage
∆R/R max.: ±(0.5% +0.05 Ω)
4.19 14 (Na) thermal
shock
2 minutes at LCT and
2 minutes at UCT; 5 cycles
no visible damage
∆R/R max.: ±(0.5% +0.05 Ω)
4.25.1 endurance 1000 +48/−0hours; 70±2°C;
loaded with Pn or Vmax;
1.5 hours on and 0.5 hours off;
specimen stabilized at room
temperature for 1 hour min. after test
∆R/R max.: ±(0.5% +0.05 Ω)
4.8.4.2 temperature
coefficient
at 25/LCT/25 °C and 25/UCT/25 °C≤±25 ×10−6/K
Other tests in accordance with IEC 60115
4.6.1.1 insulation
resistance
after 1 minute, metal block method
1206: 250 V (DC)
0805: 200 V (DC)
0603: 100 V (DC)
0402: 100 V (DC)
Rins min.: 104MΩ
Other applicable tests
EIA 575
3.13
leaching unmounted chips;
60 ±1s; 260±5°C
good tinning; no leaching
EIA/IS
703 4.6
moisture
resistance
65 ±2°C; 95 +3/−5% RH;
loaded with 0.01 Pn or Vmax for 42
damp heat cycles. (1 cycle consists of
7 steps. see Fig.3)
∆R/R max.: ±(0.5% +0.05 Ω)
IEC
60115-8
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
2001 Jul 09 Rev.0 9 www.phycomp-components.com
Phycomp Product specification
Thin-film chip resistors
sizes 1206, 0805, 0603 and 0402
TFx13 series
0.1% TC25
75
initial drying
24 hours
90 − 98% RH
80 − 98%
RH
temperature
tolerance
±2 °C (±3.6 °F)
unless otherwise
specified
initial measurements
as specified in 2.2
0
STEP1 STEP3STEP2
prior to first
cycle only
STEP4
one cycle 24 hours; repeat as specified in 2.5
voltage applied as specified in 2.4
circulation of conditioning air shall be at a
minimum cubic rate per minute equivalent to
10 times the volume of the chamber
STEP6 STEP7
HBK073
STEP5
51015
end of final cycle;
measurements
as specified in 2.7
optional sub-cycle if specified
(2.3); sub-cycle performed during
any 5 of the first 9 cycles; humidity
uncontrolled during sub-cycle
20
time [h]
temperature
[°C]
25
50
25
0
90 − 98% RH 90 − 98% RH
+10 °C (+18 °F)
−2 °C (−3.6 °F)
80 − 98%
RH
rate of change of temperature is unspecified,
however, specimens shall not be subjected to
radiant heating from chamber conditioning processes
Fig.3 Moisture resistance test requirements.
2001 Jul 09 Rev.0 10 www.phycomp-components.com
Phycomp Product specification
Thin-film chip resistors
sizes 1206, 0805, 0603 and 0402
TFx13 series
0.1% TC25
MOUNTING
Due to their rectangular shape and small dimensional
tolerances, surface-mounted resistors are suitable for
handling by automatic placement systems. Chip
placement can be on ceramic substrates and
printed-circuit boards (PCBs). Electrical connection to the
circuit is by soldering. The finishing of the end terminations
guarantees a reliable contact.
Footprint dimensions
Table 7 Reflow soldering; for dimensions see also Fig.4
Table 8 Wave soldering; for dimensions see also Fig.4
SIZE
CODE
FOOTPRINT DIMENSIONS (mm)
PROCESSING REMARKS
PLACEMENT
ACCURACY
(mm)
ABCDEFG
0402 1.5 0.5 0.5 0.6 0.1 1.9 1.0
IR soldering
±0.15
0603 2.1 0.5 0.8 0.9 0.0 2.5 1.7 ±0.25
0805 2.6 0.9 0.85 1.4 0.5 3.0 2.1 ±0.25
1206 3.8 2.0 0.9 1.8 1.4 4.2 2.5 ±0.25
SIZE
CODE
FOOTPRINT DIMENSIONS (mm) PROPOSED NUMBER AND
DIMENSIONS OF DUMMY
TRACKS (mm)
PLACEMENT
ACCURACY
(mm)
ABCDEFG
0603 2.7 0.9 0.9 0.8 0.15 3.2 1.9 1 ×(0.15 ×0.8) ±0.25
0805 3.3 1.3 1.0 1.3 0.34 3.9 2.4 1 ×(0.3 ×1.3) ±0.25
1206 4.5 2.5 1.0 1.7 1.25 3.9 2.4 3 ×(0.25 ×1.7) ±0.25
handbook, full pagewidth
MBG628
E
B
A
F
C
DG
preferred direction during wave soldering
solder land /
solder paste
pattern
solder resist
pattern
occupied area
tracks
E: available area for tracks
underneath the chip
Fig.4 Recommended footprint dimensions.
For dimensions see Table 7.
2001 Jul 09 Rev.0 11 www.phycomp-components.com
Phycomp Product specification
Thin-film chip resistors
sizes 1206, 0805, 0603 and 0402
TFx13 series
0.1% TC25
SOLDERING CONDITIONS
The robust construction of chip resistors allows them to be
completely immersed in a solder bath of 260 °C for one
minute. Therefore, it is possible to mount surface-mount
resistors on one side of a PCB and other components on
the reverse side (mixed PCBs).
Surface-mount resistors are tested for solderability at
235 °C during 2 seconds. The test condition for no
leaching is 260 °C for 60 seconds. Typical examples of
soldering processes that provide reliable joints without any
damage, are given in Figs 5 and 6.
0 50 100 150 200 250
300
250
200
150
100
50
0
10 s
260 °C
130 °C
(°C)
t (s)
MLA859
245 °C
215 °C
180 °C
10 s
40 s
2 K/s
T
Fig.5 Infrared soldering.
Typical values (solid line).
Process limits (dotted lines).
2001 Jul 09 Rev.0 12 www.phycomp-components.com
Phycomp Product specification
Thin-film chip resistors
sizes 1206, 0805, 0603 and 0402
TFx13 series
0.1% TC25
Fig.6 Double wave soldering.
Typical values (solid line).
Process limits (dotted lines).
The resistors may be soldered twice in accordance with this method if desired.
0 50 100 150 200 250
300
250
200
150
100
50
0
10 s
235 °C to 260 °Csecond wave
5 K/s
2 K/s
first wave
200 K/s
100 °C to 130 °Cforced
cooling
2 K/s
(°C)
t (s)
TMLA861
2001 Jul 09 Rev.0 13 www.phycomp-components.com
Phycomp Product specification
Thin-film chip resistors
sizes 1206, 0805, 0603 and 0402
TFx13 series
0.1% TC25
PACKING
Tape and reel specifications
All tape and reel specifications are in accordance with
“IEC 60286-3”
. Basic dimensions are given in Figs 7, 8
and 9 and Tables 9, and 10.
Peel-off force
Peel-off forces of both paper and blister tapes are in
accordance with
“IEC 60286-3”
; that is, at a peel-off speed
of 300 ±10 mm/minute, 0.1 N to 1.0 N for 8 mm tape. The
peel-off angle should be between 165° and 180°.
Paper tape specification
Table 9 Dimensions of paper tape for relevant chip size; see Fig.7
SYMBOL
PRODUCT SIZE CODE
UNIT0402 0603 0805 1206
SIZE TOL. SIZE TOL. SIZE TOL. SIZE TOL.
A00.65 ±0.1 1.10 ±0.1 1.65 ±0.1 1.90 ±0.1 mm
B01.15 ±0.1 1.90 ±0.1 2.40 ±0.1 3.50 ±0.1 mm
W8.0±0.2 8.0 ±0.2 8.0 ±0.2 8.0 ±0.2 mm
E1.75±0.1 1.75 ±0.1 1.75 ±0.1 1.75 ±0.1 mm
F3.50±0.05 3.50 ±0.05 3.50 ±0.05 3.50 ±0.05 mm
D01.5 +0.1/−0 1.5 +0.1/−01.50+0.1/−0 1.5 +0.1/−0mm
P04.0 ±0.1 4.0 ±0.1 4.0 ±0.1 4.0 ±0.1 mm
P12.0 ±0.05 4.0 ±0.05 4.0 ±0.05 4.0 ±0.05 mm
P22.0 ±0.05 2.0 ±0.05 2.0 ±0.05 2.0 ±0.05 mm
T0.53±0.1 0.7 ±0.1 0.85 ±0.1 0.85 ±0.1 mm
handbook, full pagewidth
MBG251
E
FW
P2
P0
P1
D0
B0
A0
T
cover tape
Fig.7 Paper tape.
Cumulative tolerance over 10 holes: ±0.2 mm.
Bottom fixing tape thickness: 50 ±10 µm.
Top fixing tape thickness: 50 ±10 µm.
For dimensions see Table 9.
2001 Jul 09 Rev.0 14 www.phycomp-components.com
Phycomp Product specification
Thin-film chip resistors
sizes 1206, 0805, 0603 and 0402
TFx13 series
0.1% TC25
Tape leader/trailer specification
CCB325
empty compartments
with cover tape
(min. 240 mm)
cover tape only
leader ≥400 mm
trailer (max. 260 mm)
trailer end
leader end
Fig.8 Leader/trailer tape.
Taping requirements
Resistance side facing up.
Component is free and not sticking to top and/or bottom
tape.
Component should be easy to remove from the carrier
tape and the chip cavity should have no mechanical
damage.
2001 Jul 09 Rev.0 15 www.phycomp-components.com
Phycomp Product specification
Thin-film chip resistors
sizes 1206, 0805, 0603 and 0402
TFx13 series
0.1% TC25
Reel specification
Table 10 Reel dimensions; see Fig.9
PRODUCT SIZE
CODE
UNITS
PER REEL
TAPE WIDTH
(mm)
A
(mm)
N
(mm)
C
(mm)
W1
(mm)
W2
MAX.
(mm)
0402 10000 8 180 +0/−360+1/−0 13.0 ±0.2 9.0 ±0.3 11.4 ±1
0603; 0805; 1206 5000
NCA
W1
W2
HBK039
Fig.9 Reel.
Dimensions in mm.
For reel dimensions see Table 10.
2001 Jul 09 Rev.0 16 www.phycomp-components.com
Phycomp Product specification
Thin-film chip resistors
sizes 1206, 0805, 0603 and 0402
TFx13 series
0.1% TC25
REVISION HISTORY
Revision Date Change
Notification
Description
Rev.0 2001 Jul 09 –- First issue of this specification
