©2018 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 10/17/18
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SM05 through SM36
Description
Applications
The AQxx-02HTG Series TVS Diode Array is designed
to protect sensitive equipment from damage due to
electrostatic discharge (ESD), electrical fast transients
(EFT), and lightning induced surges.
This AQxx-02HTG series can safely absorb repetitive ESD
strikes of ±30 kV (contact and air discharge as defined
in IEC 61000-4-2) without any performance degradation.
Additionally, the AQ05 can safely conduct a 33A 8/20 surge
event as defined in IEC 61000-4-5 2nd edition at low voltage
clamping levels.
Features
• ESD, IEC 61000-4-2,
±30kV contact, ±30kV air
• EFT, IEC 61000-4-4, 50A
(5/50ns)
• LLightning, 33A (8/20 as
defined in IEC 61000-4-5
2nd edition) for the AQ05
• Working voltages: 5V,
12V, 15V, 24V and 36V
• Low clamping voltage
• Low leakage current
• AEC-Q101 qualified
• Moisture Sensitivity Level
(MSL -1)
• Halogen free, lead free
and RoHS compliant
• PPAP capable
• Industrial Equipment
• Test and Medical
Equipment
• Point-of-Sale Terminals
• Motor Controls
• Legacy Ports
(RS-232, RS-485)
• Security and Alarm
Systems
Pinout and Functional Block Diagram
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
RoHS
Pb
GREEN
AQxx-02HTG Series 500W TVS Diode Array
1
2
3
RS-232 Application Example
IC
RD
TD
RTS
CTS
DSR
DTR
RS-232 Port
Transceiver
SM15 (x6)
(bidireconal implementaon)
Case GND
AQxx-02HTG Series
AQ15 (x6)
©2018 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 10/17/18
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SM05 through SM36
Notes:
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and
operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Absolute Maximum Ratings
Symbol Parameter Value Units
PPk Peak Pulse Power (tp=8/20μs) 500 W
TOP Operating Temperature -40 to 150 °C
TSTOR Storage Temperature -55 to 150 °C
AQ05 Electrical Characteristics (TOP=25ºC)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage VRWM IR=1μA 5.0 V
Breakdown Voltage VBR IR=1mA 6.0 7. 0 V
Reverse Leakage
Current ILEAK VR=5V 1.0 μA
Clamp Voltage1VC
IPP=1A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 8.0 9.8 V
IPP=10A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 10.5 13.0 V
Dynamic Resistance2RDYN TLP, tp=100ns, Pin 1 or Pin 2 to Pin 3 0.19 Ω
Peak Pulse Current1IPP tp=8/20µs 33 A
ESD Withstand Voltage1VESD
IEC 61000-4-2 (Contact Discharge) ±30 kV
IEC 61000-4-2 (Air Discharge) ±30 kV
Diode Capacitance1CI/O-GND Reverse Bias=0V, f=1MHz 290 350 pF
CI/O-I/O Reverse Bias=0V, f=1MHz 145 180 pF
AQ12 Electrical Characteristics (TOP=25ºC)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage VRWM IR=1μA 12.0 V
Breakdown Voltage VBR IR=1mA 13.3 14.2 V
Reverse Leakage
Current ILEAK VR=12V 1.0 μA
Clamp Voltage1VC
IPP=1A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 16.0 18.5 V
IPP=10A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 20.0 22.5 V
Dynamic Resistance2RDYN TLP, tp=100ns, Pin 1 or Pin 2 to Pin 3 0.25 Ω
Peak Pulse Current1IPP tp=8/20µs 20 A
ESD Withstand Voltage1VESD
IEC 61000-4-2 (Contact Discharge) ±30 kV
IEC 61000-4-2 (Air Discharge) ±30 kV
Diode Capacitance1CI/O-GND Reverse Bias=0V, f=1MHz 110 135 pF
CI/O-I/O Reverse Bias=0V, f=1MHz 55 85 pF
AQxx-02HTG Series
©2018 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 10/17/18
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SM05 through SM36
AQ15 Electrical Characteristics (TOP=25ºC)
AQ24 Electrical Characteristics (TOP=25ºC)
AQ36 Electrical Characteristics (TOP=25ºC)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage VRWM IR=1μA 15.0 V
Breakdown Voltage VBR IR=1mA 16.7 18.5 V
Reverse Leakage Current ILEAK VR=15V 1. 0 μA
Clamp Voltage1VC
IPP=1A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 20.5 24.0 V
IPP=10A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 26.6 30.0 V
Dynamic Resistance2RDYN TLP, tp=100ns, Pin 1 or Pin 2 to Pin 3 0.30 Ω
Peak Pulse Current1IPP tp=8/20µs 15 A
ESD Withstand Voltage1VESD
IEC 61000-4-2 (Contact Discharge) ±30 kV
IEC 61000-4-2 (Air Discharge) ±30 kV
Diode Capacitance1CI/O-GND Reverse Bias=0V, f=1MHz 85 100 pF
CI/O-I/O Reverse Bias=0V, f=1MHz 45 75 pF
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage VRWM IR=1μA 24.0 V
Breakdown Voltage VBR IR=1mA 26.7 28 V
Reverse Leakage Current ILEAK VR=24V 1.0 μA
Clamp Voltage1VC
IPP=1A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 30.0 36.0 V
IPP=5A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 36.0 42.0 V
Dynamic Resistance2RDYN TLP, tp=100ns, Pin 1 or Pin 2 to Pin 3 0.50 Ω
Peak Pulse Current1IPP tp=8/20µs 9 A
ESD Withstand Voltage1VESD
IEC 61000-4-2 (Contact Discharge) ±30 kV
IEC 61000-4-2 (Air Discharge) ±30 kV
Diode Capacitance1CI/O-GND Reverse Bias=0V, f=1MHz 60 65 pF
CI/O-I/O Reverse Bias=0V, f=1MHz 30 50 pF
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage VRWM IR=1μA 36.0 V
Breakdown Voltage VBR IR=1mA 40.0 41.8 V
Reverse Leakage Current ILEAK VR=36V 1.0 μA
Clamp Voltage1VC
IPP=1A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 45.0 52.0 V
IPP=5A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 58.5 62.0 V
Dynamic Resistance2RDYN TLP, tp=100ns, Pin 1 or Pin 2 to Pin 3 0.65 Ω
Peak Pulse Current1IPP tp=8/20µs 7 A
ESD Withstand Voltage1VESD
IEC 61000-4-2 (Contact Discharge) ±30 kV
IEC 61000-4-2 (Air Discharge) ±30 kV
Diode Capacitance1CI/O-GND Reverse Bias=0V, f=1MHz 45 50 pF
CI/O-I/O Reverse Bias=0V, f=1MHz 25 40 pF
Note:
1 Parameter is guaranteed by design and/or component characterization.
2 Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns
AQxx-02HTG Series
©2018 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 10/17/18
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SM05 through SM36
8/20μs Pulse Waveform
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.0 5.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
Percent of I
PP
Capacitance vs. Reverse Bias (Pin1 or Pin2 to Pin3)
SD36C
SD24C
AQ36
0
50
100
150
200
250
300
0.04.0 8.012.016.020.024.028.032.036.0
Capacitance (pF)
Reverse Bias (V)
AQ05
AQ12
AQ15 AQ24
0
2
4
6
8
10
12
14
16
18
20
0246810 12
TLP Voltage (V)
TLP Current (A)
AQ05 Transmission Line Pulsing(TLP) Plot
0
2
4
6
8
10
12
14
16
18
20
0510 15 20 25
TLP Voltage (V)
TLP Current (A)
AQ12 Transmission Line Pulsing(TLP) Plot
0
2
4
6
8
10
12
14
16
18
20
0510 15 20 25 30
TLP Voltage (V)
TLP Current (A)
AQ15 Transmission Line Pulsing(TLP) Plot
AQxx-02HTG Series
0
2
4
6
8
10
12
14
16
18
20
0510 15 20 25 30 35 40
TLP Voltage (V)
TLP Current (A)
AQ24 Transmission Line Pulsing(TLP) Plot
©2018 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 10/17/18
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SM05 through SM36
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
rehea
t
Ramp-up
R
amp-up
Ramp-down
R
amp-d
o
Critical Zone
TL to TP
C
ritical Zon
e
T
to
T
P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min)) 150°C
- Temperature Max (Ts(max)) 200°C
- Time (min to max) (ts) 60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL)
to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL) 60 – 150 seconds
Peak Temperature (TP) 260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP) 8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Product Characteristics
Lead Plating Matte Tin
Lead Material Copper Alloy
Lead Coplanarity 0.004 inches(0.102mm)
Substrate Material Silicon
Body Material Molded Compound
Flammability UL Recognized compound meeting
flammability rating V-0
Ordering Information
Part Number Package Min. Order Qty.
AQ05-02HTG SOT23-3 3000
AQ12-02HTG SOT23-3 3000
AQ15-02HTG SOT23-3 3000
AQ24-02HTG SOT23-3 3000
AQ36-02HTG SOT23-3 3000
0
2
4
6
8
10
12
14
16
18
20
0510 15 20 25 30 35 40 45 50 55
TLP Voltage (V)
TLP Current (A)
AQ36 Transmission Line Pulsing(TLP) Plot
AQxx-02HTG Series
Power Derating Curve
0
10
20
30
40
50
60
70
80
90
100
110
0255075100 125150
Ambient Temperature - T
A
(
o
C)
% of Rated Power I
PP
©2018 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Arrays (SPA ® Diodes)
Revision: 10/17/18
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SM05 through SM36
GENERAL INFORMATION
1. 3000 PIECES PER REEL.
2. ORDER IN MULTIPLES OF FULL REELS ONLY.
3. MEETS EIA-481 REVISION "A" SPECIFICATIONS.
COVER TAPE
USER DIRECTION OF FEED PIN 1
SOT23-3 (8mm POCKET PITCH)
8.4mm
180mm
14.4mm
13mm
60mm
ACCESS HOLE
8mm TAPE AND REEL
Embossed Carrier Tape & Reel Specification — SOT23-3
Symbol Millimeters Inches
Min Max Min Max
E1.65 1.85 0.065 0.073
F3.40 3.60 0.134 0.142
P2 1.90 2.10 0.075 0.083
D1.40 1.60 0.055 0.063
P0 3.90 4.10 0.154 0.161
W7.70 8.30 0.303 0.327
P3.90 4.10 0.154 0.161
A0 3.05 3.25 0.120 0.128
B0 2.67 2.87 0.105 0.113
K0 1.12 1.32 0.044 0.052
t0.22 0.24 0.009 0.009
Symbol Millimeters Inches
Min Max Min Max
A0.90 1.10 0.035 0.043
A1 0.03 0.09 0.001 0.004
b0.37 0.51 0.015 0.020
D2.80 3.04 0.110 0.120
E2.10 2.64 0.083 0.104
E1 1.20 1.40 0.047 0.055
e0.95 BSC 0.037 BSC
e1 1.90 BSC 0.075 BSC
L0.30 0.55 0.012 0.022
L1 0.25 BSC 0.010 BSC
θ0° 8° 0° 8°
θ1 7° TYP 7° TYP
Package Dimensions — SOT23-3
Part Numbering System
Part Marking System
AQ 02 TG
Series
Number of
Channels
Package
T= Tape & Reel
G= Green
–
TVS Diode Arrays
(SPA
®
Automotive
Grade Diodes)
H: SOT23-3
H
xx
Working
Voltage
Mxx
D
E1
E
e
e1
b x 3
A
A1
Pin1
Top View
Bottom View
Side View
0.60
1.30
0.80
Recommended soldering pad layout (unit :mm)
Detail A
Detail A
L L
L1 (gauge plane)
θ
1
θ
Drawing# : H01-B
1.30
2.50
2.90
8mm TAPE AND REEL
AQxx-02HTG Series
xx is the number of working voltage
D
E1
E
e
e1
b x 3
A
A1
Pin1
Top View
Bottom View
Side View
0.60
1.30
0.80
Recommended soldering pad layout (unit :mm)
Detail A
Detail A
L L
L1 (gauge plane)
θ
1
θ
Drawing# : H01-B
1.30
2.50
2.90
Disclaimer Noce - Informaon furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applicaons. Lielfuse products are not designed for, and may not be used in, all applicaons.
Read complete Disclaimer Noce at hp://www.lielfuse.com/disclaimer-electronics.