MOTOROLA
SEMICONDUCTOR TECHNICAL DATA Order Number: MC100ES6011
Rev 1, 09/2003
1
Motorola, Inc. 2003
2.5 V / 3.3 V ECL 1:2
Differential Fanout Buffer
The MC100ES6011 is a differential 1:2 fanout buffer. The ES6011 is
ideal for applications requiring lower voltage.
The 100ES Series contains temperature compensation.
Features
270 ps Typical Propagation Delay
Maximum Frequency > 3 GHz Typical
PECL Mode Operating Range: VCC = 2.375 V to 3.8 V
with VEE =0V
ECL Mode Operating Range: VCC =0V
with VEE = --2.375 V to --3.8 V
Open Input Default State
Q Output Will Default LOW with Inputs Open or at VEE
LVDS Input Compatible
1
2
3
45
6
7
8
D
VEE
VCC
Q0
DQ1
Q1
Q0
Figure 1. 8--Lead Pinout (Top View) and Logic Diagram
PIN DESCRIPTION
PIN
D*, D**
Q0, Q0,Q1,Q1 ECL Data Outputs
FUNCTION
ECL Data Inputs
VCC
VEE Negative Supply
Positive Supply
* Pins will default LOW when left open.
** Pins will default to 0.572 VCC/2 when left open.
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
MC100ES6011
D SUFFIX
8 LEAD SOIC PACKAGE
CASE 751
DT SUFFIX
8 LEAD TSSOP PACKAGE
CASE TBA
Device Package
ORDERING INFORMATION
MC100ES6011D SO--8
MC100ES6011DR2 SO--8
MC100ES6011DT TSSOP--8
MC100ES6011DTR2 TSSOP--8
MC100ES6011
MOTOROLA TIMING SOLUTIONS2
Table 1. ATTRIBUTES
Characteristics Value
Internal Input Pulldown Resistor 75 k
Internal Input Pullup Resistor 56 k
ESD Protection Human Body Model
Machine Model
Charged Device Model
> 4000 V
> 200 V
> 1500 V
θJA Thermal Resistance (Junction to
Ambient)
0LFPM,8SOIC
500 LFPM, 8 SOIC
190°C/W
130°C/W
0LFPM,8TSSOP
500 LFPM, 8 TSSOP
TBD
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
Table 2. MAXIMUM RATINGS a
Symbol Parameter Conditions Rating Units
VSUPPLY Power Supply Voltage Difference between
VCC &V
EE
3.9 V
VIN Input Voltage VCC-- V EE ±3.6 V VCC+0.3 V
I
N
p
g
C
C
E
E
±
C
C
VEE-- 0 . 3 V
Iout Output Current Continuous Surge 50
100
mA
mA
TA Operating Temperature Range -- 4 0 t o + 8 5 °C
Tstg Storage Temperature Range --65 to +150 °C
a Absolute maxim continuous ratings are those maximum values beyond which damage to the device may occur. Exposure to these conditions
or conditions beyond those indicated may adversely affect device reliability. Functional operation at absolute--maximum--rated conditions is not
implied.
Table 3. DC CHARACTERISTICS (VCC =0V;V
EE =--2.5V±5% or VCC =2.5V±5%; VEE =0V)
a
-- 4 0 °C 0°Cto85°C
Symbol Characteristic Min Typ Max Min Typ Max Unit
IEE Power Supply Current 12 25 12 25 mA
VOH Output HIGH VoltagebVCC--1085 VCC--1005 VCC--880 VCC--1025 VCC--955 VCC--740 mV
VOL Output LOW VoltagebVCC--1830 VCC--1605 VCC--1305 VCC--1810 VCC--1705 VCC--1405 mV
VoutPP Output Peak-to-Peak Voltage 200 200 mV
VIH Input HIGH Voltage (Single Ended) VCC--1165 VCC--880 VCC--1165 VCC--880 mV
VIL Input LOW Voltage (Single Ended) VCC--1810 VCC--1475 VCC--1810 VCC--1475 mV
VPP Differential Input Voltagec0.12 1.3 0.12 1.3 V
VCMR Differential Cross Point VoltagedVEE+1.0 VCC-- 0 . 8 VEE+1.0 VCC-- 0 . 8 V
IIN Input Current ±150 ±150 µA
a ES6011 circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The circuit
is in a test socket or mounted on a printed circuit board and transverse airflow > 500 LFPM is maintained.
b Output termination voltage VTT =0VforV
CC = 2.5V operation is supported but the power consumption of the device will increase.
cV
PP (DC) is the minimum differential input voltage swing required to maintain device functionality.
dV
CMR (DC) is the crosspoint of the differential input signal. Functional operation is obtained when the crosspoint is within the VCMR (DC) range
and the input swing lies within the VPP (DC) specification.
MC100ES6011
TIMING SOLUTIONS 3 MOTOROLA
Table 4. DC CHARACTERISTICS (VCC =0V;V
EE = --3.8 to --3.135 or VCC = 3.8 to 3.135 V; VEE =0V)
a
-- 4 0 °C 0°Cto85°C
Symbol Characteristic Min Typ Max Min Typ Max Unit
IEE Power Supply Current 12 25 12 25 mA
VOH Output HIGH VoltagebVCC--1085 VCC--1005 VCC--880 VCC--1025 VCC--955 VCC--740 mV
VOL Output LOW VoltagebVCC--1830 VCC--1705 VCC--1405 VCC--1830 VCC--1705 VCC--1405 mV
Voutpp Output Peak-to-Peak Voltage 200 200 mV
VIH Input HIGH Voltage (Single Ended) VCC--1165 VCC--880 VCC--1165 VCC--880 mV
VIL Input LOW Voltage (Single Ended) VCC--1810 VCC--1475 VCC--1810 VCC--1475 mV
VPP Differential Input Voltagec0.12 1.3 0.12 1.3 V
VCMR Differential Cross Point VoltagedVEE+1.0 VCC-- 0 . 8 VEE+1.0 VCC-- 0 . 8 V
IIN Input Current ±150 ±150 µA
a ES6011 circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The circuit
is in a test socket or mounted on a printed circuit board and transverse airflow > 500 LFPM is maintained.
b Output termination voltage Vtt =0VforV
cc = 2.5V operation is supported but the power consumption of the divice will increase.
cV
PP (DC) is the minimum differential input voltage swing required to maintain device functionality.
dV
CMR (DC) is the crosspoint of the differential input signal. Functional operation is obtained when the crosspoint is within the VCMR (DC) range
and the input swing lies within the VPP (DC) specification.
Table 5. AC CHARACTERISTICS (VCC =0V;V
EE = --3.8 V to --2.375 V or VCC = 2.375 V to 3.8 V; VEE =0V)
a
-- 4 0 °C-- 2 5 °C 0°Cto85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit
fMAX Maximum Frequency >3 >3 GHz
tPLH,
tPHL
Propagation Delay (Differential)
CLK to Q, Q
170 260 300 180 270 310 210 285 360 ps
tSKEW Within Device Skew Q, Q
Device to Device Skewb
920
130
920
130
920
150
ps
tJITTER Cycle to Cycle Jitter <2 <2 <2 ps
VPP Input Voltage Swing
(Differential)
150 1200 150 1200 150 1200 mV
VCMR Differential Cross Point
Voltage
VEE+1.2 VCC-- 1 . 1 VEE+1.2 VCC-- 1 . 1 VEE+1.2 VCC-- 1 . 1 V
tr
tf
Output Rise/Fall Times
(20% -- 80%)
70 220 70 220 70 220 ps
a Measured using a 750 mV source 50% Duty Cycle clock source. All loading with 50 ohms to VCC--2.0 volts.
b Skew is measured between outputs under identical transitions.
Figure 2. Voutpp versus Frequency
VTT =VCC -- 2 . 0 V
Driver
Device
Receiver
Device
Q
Qb
D
Db
50
50
VTT
Figure 3. Typical Termination for Output Driver and
Device Evaluation
MC100ES6011
MOTOROLA TIMING SOLUTIONS4
Marking Notes:
Device Nomenclature 8--Lead SOIC Marking 8--Lead TSSOP Marking
MC100ES6011D M6011
MC100ES6011DT 6011
Trace Code Identification:
“A” -- The First character indicates the Assembly location.
“L” -- The Second character indicates the Source Wafer Lot Tracking Code.
“Y” -- The Third character indicates the ALPHA CODE” of the year device was assembled.
“W -- The Fourth character indicates the ALPHA CODE” of the Work Week device was assembled.
The “Y” Year ALPHA CODES The “W” Work Week ALPHA CODES
Year Month Work Week Code 1st 6 Months (WW01 -- WW26) 2nd 6 Months (WW27 -- WW52)
A = 2003 FIRST 6 MONTHS WW01 -- WW26 A = WW01 A = WW27
B = 2003 SECOND 6 MONTHS WW27 -- WW52 B = WW02 B = WW28
C = 2004 FIRST 6 MONTHS WW01 -- WW26 C = WW03 C = WW29
D = 2004 SECOND 6 MONTHS WW27 -- WW52 D = WW04 D = WW30
E = 2005 FIRST 6 MONTHS WW01 -- WW26 E = WW05 E = WW31
F = 2005 SECOND 6 MONTHS WW27 -- WW52 F = WW06 F = WW32
G = 2006 FIRST 6 MONTHS WW01 -- WW26 G = WW07 G = WW33
H = 2006 SECOND 6 MONTHS WW27 -- WW52 H = WW08 H = WW34
I = 2007 FIRST 6 MONTHS WW01 -- WW26 I = WW09 I = WW35
J = 2007 SECOND 6 MONTHS WW27 -- WW52 J = WW10 J = WW36
K = 2008 FIRST 6 MONTHS WW01 -- WW26 K = WW11 K = WW37
L = 2008 SECOND 6 MONTHS WW27 -- WW52 L = WW12 L = WW38
M = 2009 FIRST 6 MONTHS WW01 -- WW26 M = WW13 M = WW39
N = 2009 SECOND 6 MONTHS WW27 -- WW52 N = WW14 N = WW40
O = 2010 FIRST 6 MONTHS WW01 -- WW26 O = WW15 O = WW41
P = 2010 SECOND 6 MONTHS WW27 -- WW52 P = WW16 P = WW42
Q = 2011 FIRST 6 MONTHS WW01 -- WW26 Q = WW17 Q = WW43
R = 2011 SECOND 6 MONTHS WW27 -- WW52 R = WW18 R = WW44
S = 2012 FIRST 6 MONTHS WW01 -- WW26 S = WW19 S = WW45
T = 2012 SECOND 6 MONTHS WW27 -- WW52 T = WW20 T = WW46
U = 2013 FIRST 6 MONTHS WW01 -- WW26 U = WW21 U = WW47
V = 2013 SECOND 6 MONTHS WW27 -- WW52 V = WW22 V = WW48
W = 2014 FIRST 6 MONTHS WW01 -- WW26 W = WW23 W = WW49
X = 2014 SECOND 6 MONTHS WW27 -- WW52 X = WW24 X = WW50
Y = 2015 FIRST 6 MONTHS WW01 -- WW26 Y = WW25 Y = WW51
Z = 2015 SECOND 6 MONTHS WW27 -- WW52 Z = WW26 Z = WW52
= Assembly Location
Marking Example:
XABR
X
= First Lot Assembled of this device in the designated Work WeekA
= 2003 Second 6 Months, WW27 -- WW52B
= WW44 of 2003R
MC100ES6011
TIMING SOLUTIONS 5 MOTOROLA
OUTLINE DIMENSIONS
D SUFFIX
8 LEAD SOIC PACKAGE
CASE 751-06
ISSUE T
SEATING
PLANE
1
4
58
A0.25 MCB SS
0.25 MBM
h
θ
C
X45
_
L
DIM MIN MAX
MILLIMETERS
A1.35 1.75
A1 0.10 0.25
B0.35 0.49
C0.19 0.25
D4.80 5.00
E
1.27 BSCe
3.80 4.00
H5.80 6.20
h
07
L0.40 1.25
θ
0.25 0.50
__
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
D
EH
A
Be
B
A1
CA
0.10
MC100ES6011
MOTOROLA TIMING SOLUTIONS6
NOTES
MC100ES6011
TIMING SOLUTIONS 7 MOTOROLA
NOTES
MC100ES6011
MOTOROLA TIMING SOLUTIONS8
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EMotorola Inc. 2003
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MC100ES6011