PERFORMANCE
STANDARD RATING October, 2008
−4−
10
15
22
33
47
56
R.V. (VDC)
Cap.(µF) 2 2.5 4 6.3 8
4D
4D
4D
4D
4D
4D
4D
10
4D
68
82
100
150
180
220
R.V. (VDC)
Cap.(µF) 2 2.5 4 6.3 8
4D
4D
6D
6D,8D
8D
4D
4D
4D,6D
4D
4D
4D
6D
6D,8D
8D
4D
4D,6D
6D,8D
8D
6D
8D
8D
10
6D
8D
8D
270
330
390
470
R.V. (VDC)
Cap.(µF) 22.546.3 8
8D
8D6D
8D
8D
8D
8D 8D
10
No
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
In case of less than 4R.V., Leakage Current is 0.06CV Max..
In case of more than 6.3R.V., Leakage Current is 0.04CV Max..
Shall be within specified tolerance.
Shall not exceed the values shown in CATALOG NUMBERS AND RATING.
Shall not exceed the values shown in CATALOG NUMBERS AND RATING.
Leakage Current: Shall not exceed the value in No.1.
Capacitance Change: Within ±10% of the value before the test
Dissipation Factor: Shall not exceed the value in No.3.
Visual Examination: There shall be no evidence of mechanical damage.
No separation of terminal from solder.
Capacitance: Initial value to remain steady during measurement.
Visual Examination: There shall be no evidence of damage.
Capacitance: Initial value to remain steady during measurement.
Visual Examination: There shall be no evidence of damage.
There shall be no intermittent contact of 0.5ms or greater, short, or open. Nor shall
there be any spark discharge, insulation breakdown, or evidence of mechanical
damage.
Solder shall completely cover the terminal surface (there shall be no pin holes,
nonwetting or solder repelling).
However, no plating edges of the terminal shall not be evaluated.
Leakage Current: Shall not exceed the value in No.1.
Capacitance Change: Within ±10% of the value before the test
Dissipation Factor: Shall not exceed the value in No.3.
Visual Examination: There shall be no evidence of mechanical damage.
Leakage Current: Shall not exceed the value in No.1.
Capacitance Change: Within ±10% of the value before the test
Dissipation Factor: Shall not exceed the value in No.3.
Visual Examination: There shall be no evidence of mechanical damage.
Leakage Current: Shall not exceed 7.5 times the value in No.1.
Capacitance Change: Within +50% of the value before the test
Dissipation Factor: Shall not exceed two times the value in No.3.
Visual Examination: There shall be no evidence of mechanical damage.
Leakage Current: Shall not exceed the value in No.1.
Capacitance Change: Within +50% of the value before the test
Dissipation Factor: Shall not exceed two times the value in No.3.
Visual Examination: There shall be no evidence of mechanical damage.
Leakage Current: Shall not exceed the value in No.1.
Capacitance Change: Within ±10% of the value before the test
Dissipation Factor: Shall not exceed the value in No.3.
Visual Examination: There shall be no evidence of mechanical damage.
Leakage Current: Shall not exceed the value in No.1.
Capacitance Change: Within ±10% of the value before the test
Dissipation Factor: Shall not exceed the value in No.3.
Visual Examination: There shall be no evidence of mechanical damage.
JIS C 5101-1 4.9
Applied voltage: Rated voltage for 2 minutes through 1000Ω resistance.
JIS C 5101-1 4.7 120Hz
JIS C 5101-1 4.8 120Hz
EIAJ RC-2460 4.5.4 100kHz
JIS C 5101-1 4.29
20±2°C
-55±3°C
20±2°C
105±2°C
20±2°C
JIS C 5101-1 4.26
Temperature: 15~35°C
Surge voltage:
Protective resistance: 1000Ω
JIS C 5101-1 4.34
Reflow Temperature: 240±10°C / Time: 10 seconds or less
Force: 5N
Duration: 5±1s
JIS C 5101-1 4.35
Bending: 3mm
JIS C 5101-1 4.17
Frequency range: 10-55Hz Swing width: 1.5mm
Vibration direction: 3 directions with mutually right-angled
Duration: 2 hours in each of these mutually perpendicular
directions (total 6 hours)
Mounting: Solder terminal to the printed board
JIS C 5101-1 4.19
Peak acceleration: 490m/s2
Duration: 11ms
Wave form: Half-sine
JIS C 5101-1 4.15
Solder temperature: 235±5°C
Dipping time: 5±0.5 seconds
Dipping depth: Terminal shall be dipped into melted solder
EIAJ RC-2460 4.6
IR reflow method
Preheat: 160±10°C 120±10s
Reflow: 230°C 25~30s
Peak 240°C max.
JIS C5101-1 4.16
Step 1: -55±3°C 30±3 minutes
Step 2: 25 (-5/+10) °C, 3 minutes or less
Step 3: 105±2°C, 30±3 minutes
Step 4: 25 (-5/+10) °C, 3 minutes or less
Number of cycle: 5
JIS C5101-1 4.22
Temperature: 60±2°C
Moisture: 90~95%R.H.
Duration: 500 (-0/+24) hours
JIS C5101-1 4.22
Temperature: 60±2°C
Moisture: 90~95%R.H.
Applied voltage: Rated voltage
Duration: 1000 (-0/+48) hours
JIS C5101-1 4.25
Temperature: 105±2°C
Duration: 1000 (-0/+48) hours
JIS C5101-1 4.23
Temperature: 105±2°C
Applied voltage: Rated voltage
Duration: 1000 (-0/+48) hours
Item Performance Test Method
Leakage Current (µ
A
)
Capacitance (µ
F
)
Dissipation Factor
Equivalent Series
Resistance
Characteristics at High
and Low Temperature
Step 1
Step 2
Step 3
Step 4
Step 5
Surge
Shear
(formerly adhesion) Test
Substrate Bending Test
Vibration
Shock
Solderability
Resistance to Soldering
Heat
Rapid Change of
Temperature
High Temperature /
Moisture
High Temperature /
Moisture load
High Temperature Storage
Endurance
Leakage Current
Shall not exceed the value in No.1
Shall not exceed the value in No.1
Shall not exceed two times of No.1
Shall not exceed the value in No.1
Capacitance
Within the nominal value specified
Within ±15% of the value in Step 1
Within ±5% of the value in Step 1
Within ±20% of the value in Step 1
Within ±5% of the value in Step 1
Dissipation Factor
Shall not exceed the value in No.3
Shall not exceed the value in No.3
Shall not exceed the value in No.3
Shall not exceed the value in No.3
Shall not exceed the value in No.3
-20
-20
Rated voltage(V)
Surge voltage(V)
2
2.3
2.5
2.9
4
4.6
6.3
7.2
8
9.2
10
12