PESD1LVDS ESD protection for in-vehicle ultra high-speed interfaces Rev. 2 -- 23 January 2013 Product data sheet 1. Product profile 1.1 General description The device is designed to protect in-vehicle ultra high-speed interfaces in automotive applications, such as Low-Voltage Differential Signaling (LVDS), High-Definition Multimedia Interface (HDMI) and DisplayPort interfaces against ElectroStatic Discharge (ESD). The device is housed in an ultra small SOT1165-1 (XSON10) Surface-Mounted Design (SMD) plastic package. 1.2 Features and benefits System ESD protection for LVDS, HDMI and DisplayPort interfaces Line capacitance of only 0.6 pF with 0.05 pF matching capacitance between signal pairs Ultra small XSON10 package with design-friendly `pass-thru' signal routing AEC-Q101 qualified 1.3 Applications The devices are designed for high-speed receiver and transmitter port protection: Automotive A/V monitors, displays and cameras 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter VRWM reverse standoff voltage Cch [1] channel capacitance This parameter is guaranteed by design. Conditions f = 1 MHz; Vbias = 2.5 V [1] Min Typ Max Unit - - 5.5 V - 0.6 - pF PESD1LVDS NXP Semiconductors ESD protection for in-vehicle ultra high-speed interfaces 2. Pinning information Table 2. Pinning Pin Symbol Description 1 CH1 negative channel 1 ESD protection 2 CH1+ Simplified outline positive channel 1 ESD protection Graphic symbol 10 9 8 7 6 1 2 3 4 5 1 2 4 5 Transparent top view 3 GND ground 4 CH2 negative channel 2 ESD protection 5 CH2+ positive channel 2 ESD protection 6 n.c. not connected 7 n.c. not connected 8 GND ground 9 n.c. not connected 10 n.c. not connected XSON10 3, 8 001aai619 3. Ordering information Table 3. Ordering information Type number PESD1LVDS Package Name Description Version XSON10 plastic extremely thin small outline package; no leads; SOT1165-1 10 terminals; body 1 2.5 0.5 mm 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Tstg Tamb Conditions Min Max Unit storage temperature 55 +125 C ambient temperature 40 +85 C Min Max Unit - 8 kV Table 5. ESD maximum ratings Tamb = 25 C unless otherwise specified. Symbol VESD PESD1LVDS Product data sheet Parameter Conditions electrostatic discharge voltage IEC 61000-4-2 (contact discharge) [1] Device stressed with ten non-repetitive ESD pulses. [2] All pins to ground. All information provided in this document is subject to legal disclaimers. Rev. 2 -- 23 January 2013 [1][2] (c) NXP B.V. 2013. All rights reserved. 2 of 12 PESD1LVDS NXP Semiconductors ESD protection for in-vehicle ultra high-speed interfaces Table 6. ESD standards compliance Standard Conditions IEC 61000-4-2; level 4 (ESD) > 8 kV (contact) MIL-STD-883; class 3B (human body model) > 8 kV 001aaa631 IPP 100 % 90 % 10 % t tr = 0.7 ns to 1 ns 30 ns 60 ns Fig 1. ESD pulse waveform according to IEC 61000-4-2 5. Characteristics Table 7. Characteristics Tamb = 25 C unless otherwise specified. PESD1LVDS Product data sheet Symbol Parameter VRWM reverse standoff voltage IRM reverse leakage current per channel; V = 3.0 V VBR breakdown voltage I = 1 mA VF forward voltage C(I/O-GND) input/output to ground capacitance f = 1 MHz; Vbias = 2.5 V C(I/O-GND) input/output to ground capacitance variation Cch(mutual) mutual channel capacitance [1] This parameter is guaranteed by design. [2] Between signal pin and pin n.c. Conditions Min Typ Max Unit - - 5.5 V - - 1 A 6 - 9 V - 0.7 - V [1] - 0.6 - pF f = 1 MHz; Vbias = 2.5 V [1] - 0.05 - pF f = 1 MHz; Vbias = 2.5 V [1][2] - 0.07 - pF All information provided in this document is subject to legal disclaimers. Rev. 2 -- 23 January 2013 (c) NXP B.V. 2013. All rights reserved. 3 of 12 PESD1LVDS NXP Semiconductors ESD protection for in-vehicle ultra high-speed interfaces ESD TESTER RZ 450 RG 223/U 50 coax 4 GHz DIGITAL OSCILLOSCOPE 10x ATTENUATOR CZ 50 DUT (DEVICE UNDER TEST) IEC 61000-4-2 network CZ = 150 pF; RZ = 330 vertical scale = 2 kV/div horizontal scale = 15 ns/div vertical scale = 20 V/div horizontal scale = 10 ns/div GND GND unclamped +8 kV ESD pulse waveform (IEC 61000-4-2 network) clamped +8 kV ESD pulse waveform (IEC 61000-4-2 network) vertical scale = 2 kV/div horizontal scale = 15 ns/div GND GND vertical scale = 20 V/div horizontal scale = 10 ns/div unclamped -8 kV ESD pulse waveform (IEC 61000-4-2 network) Fig 2. clamped -8 kV ESD pulse waveform (IEC 61000-4-2 network) 006aac764 ESD clamping test setup and waveforms PESD1LVDS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 -- 23 January 2013 (c) NXP B.V. 2013. All rights reserved. 4 of 12 PESD1LVDS NXP Semiconductors ESD protection for in-vehicle ultra high-speed interfaces 6. Application information The devices are designed to provide high-level ESD protection for high-speed serial data buses such as LVDS, HDMI and DisplayPort data lines. When designing the Printed-Circuit Board (PCB), careful consideration should be given to impedance matching, and signal coupling. Basic application diagrams for the ESD protection of an HDMI interface are shown in Figure 3. PESD1LVDS TMDS_D2+ 5 4 8 3 2 1 TMDS_CH2+ TMDS_GND TMDS_CH2- TMDS_D2- GND TMDS_D1+ TMDS_CH1+ TMDS_GND TMDS_CH1- TMDS_D1- PESD1LVDS TMDS_D0+ 5 TMDS_CH2+ TMDS_GND 4 8 3 2 1 TMDS_CH2- TMDS_D0- GND TMDS_CLK+ TMDS_CH1+ HDMI CONNECTOR TMDS_GND TMDS_CH1- TMDS_CLK- CEC n.c. DDC_CLK DDC_DAT GND +5 V HOT PLUG DETECTION 6 5 4 100 nF 1 2 3 006aac617 Fig 3. PESD1LVDS Product data sheet Application diagram of HDMI ESD protection All information provided in this document is subject to legal disclaimers. Rev. 2 -- 23 January 2013 (c) NXP B.V. 2013. All rights reserved. 5 of 12 PESD1LVDS NXP Semiconductors ESD protection for in-vehicle ultra high-speed interfaces 7. Test information 7.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. PESD1LVDS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 -- 23 January 2013 (c) NXP B.V. 2013. All rights reserved. 6 of 12 PESD1LVDS NXP Semiconductors ESD protection for in-vehicle ultra high-speed interfaces 8. Package outline XSON10: plastic, extremely thin small outline package; no leads; 10 terminals; body 1 x 2.5 x 0.5 mm SOT1165-1 X B D A E A A1 c terminal 1 index area detail X e1 b1 e terminal 1 index area 1 5 C C A B C v w b y1 C y L k 10 6 Terminal#3 identification 0 1 Dimensions Unit mm max nom min 2 mm scale A 0.5 D(1) E(1) e e1 0.05 0.25 0.45 2.6 0.20 0.40 0.127 2.5 0.00 0.15 0.35 2.4 1.1 1.0 0.9 0.5 2 A1 b b1 c k L v 0.1 0.2 0.43 0.38 0.33 w y y1 0.05 0.05 0.05 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. References Outline version IEC JEDEC JEITA SOT1165-1 --- --- --- Fig 4. sot1165-1_po European projection Issue date 10-02-12 13-01-09 Package outline SOT1165-1 (XSON10) PESD1LVDS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 -- 23 January 2013 (c) NXP B.V. 2013. All rights reserved. 7 of 12 PESD1LVDS NXP Semiconductors ESD protection for in-vehicle ultra high-speed interfaces 9. Soldering Footprint information for reflow soldering of XSON10 package SOT1165-1 Hx P C Hy Ay By 0.05 D D1 0.05 Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste occupied area solder resist Dimensions in mm P Ay By C D D1 Hx Hy 0.500 1.3 0.25 0.525 0.20 0.40 2.45 1.6 Remark: Stencil of 75 m is recommended. A stencil of 75 m gives an aspect ratio of 0.77 With a stencil of 100 m one will obtain an aspect ratio of 0.58 sot1165-1_fr Reflow soldering is the only recommended soldering method. Fig 5. Reflow soldering footprint SOT1165-1 (XSON10) PESD1LVDS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 -- 23 January 2013 (c) NXP B.V. 2013. All rights reserved. 8 of 12 PESD1LVDS NXP Semiconductors ESD protection for in-vehicle ultra high-speed interfaces 10. Revision history Table 8. Revision history Document ID Release date Data sheet status Change notice Supersedes PESD1LVDS v.2 20130123 Product data sheet - PESD1LVDS v.1 Modifications: PESD1LVDS v.1 PESD1LVDS Product data sheet * Figure 4 "Package outline SOT1165-1 (XSON10)": updated 20111010 Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 2 -- 23 January 2013 - (c) NXP B.V. 2013. All rights reserved. 9 of 12 PESD1LVDS NXP Semiconductors ESD protection for in-vehicle ultra high-speed interfaces 11. Legal information 11.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term `short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 11.3 Disclaimers Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. PESD1LVDS Product data sheet Suitability for use in automotive applications -- This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 2 -- 23 January 2013 (c) NXP B.V. 2013. All rights reserved. 10 of 12 PESD1LVDS NXP Semiconductors ESD protection for in-vehicle ultra high-speed interfaces No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PESD1LVDS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 -- 23 January 2013 (c) NXP B.V. 2013. All rights reserved. 11 of 12 PESD1LVDS NXP Semiconductors ESD protection for in-vehicle ultra high-speed interfaces 13. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 7.1 8 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Application information. . . . . . . . . . . . . . . . . . . 5 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 23 January 2013 Document identifier: PESD1LVDS