FUJITSU SEMICONDUCTOR DATA SHEET m@ DESCRIPTION The MB3802 is a power management switch incorporating two switch circuits with extremely low ON resistance. DS04-27601-2E NO diode is required because the switch block is configured with an N-ch MOS to prevent reverse current at switch OFF. The MB3802 starts at a very low voltage (typical Vin > 2.2V) and a stable ON resistance is obtained irrespective of the switching voltage because the internal DC/DC converter applies the optimum voltage for the N-ch MOS gate at switch ON. Moreover, the load-side capacitor is discharged at switch OFF, and the power supply for various power supply systems is switched efficiently. m@ FEATURES Extremely low ON resistance: Ron = 0.12Q (typical) Ron = 0.06Q (typical at parallel connection) Reverse current protection at load side at switch OFF Operation start at low input voltage: VIN > 2.2V (typical) Low power consumption At switch OFF: lin (input voltage) = 0 WA, Vin = OV At switch ON: lin = 230 WA, Vin = 5V Load discharge function External control of ON/OFF time Break-before-make operation m@ PACKAGE Plastic SOP, 16 pin (FPT-16P-M04)MB3802 m@ PIN ASSIGNMENT GNDa DCGa SWINa SWINa SWINB SWINB DCGe GNDs (TOP VIEW) O VINA DLYa SWOUTa SWOUTa MB3802 SWOUTs SWOUTs DLYs VINB (FPT-16P-M04) m@ PIN DESCRIPTION (SCSI Interface) Pin No. Pin symbol Description 16 VINA These pins switch ON at High level and OFF at Low level. They serve as power-supply pins for the DC/DC converter to generate 9 VINB the switch gate voltage. 3,4 SWINA Switch Input pins: Two common pins are assigned to SWINa and SWINs. They serve as power-supply pins for the switch-OFF circuit 5, 6 SWINB which starts at 1.5V min. 13, 14 SWOUTA Switch output pins: Two common pins are assigned to SWOUTa and SWOUTs. When DCGA and DCGB are High level, the load- 11, 12 SWOUTs discharge circuit starts discharge via these pins. 2 DCGa SWOUTa/SWOUTs-side discharge control pins: These pins are used to discharge from the load-side capacitor at switch OFF. 7 DCG Connect them to GND when discharge is not required. Switch-ON/OFF control pins: The ON/OFF time can be delayed 15 DLYa by connecting an external capacitor. Both times are delayed about three fold by installing a 500-pF capacitor between these pins and GND. Leave these pins open when they are not used. 10V may be generated when these pins are open. To keep these pins at high 10 DLYs impedance, take care to mount the device so that no current leaks (less than 0.1 WA). 1 GNDa Ground pins for input threshold reference voltage and load discharge: When two switching circuits are used, ground both 8 GNDs GND pins.MB3802 m@ BLOCK DIAGRAM AND EXTERNAL CONNECTIONS Co | Extemal capacitor DLY Power supply a, ( sWin\ ar Lt] Switch-ON Comp circuit y DC/DC converter TL ( } LJ Switch-OFF circuit Sw ou XQ \/ r (+) ) Switch control DDG Load Load discharge circuit aA | ( ano 4 Note: The MB3802 incorporates two switch blocks as shown above. However, GND is common to both blocks. BLOCK DESCRIPTION The MB3802 is a one-way switching IC with the SWIN and SWOUT pins serving respectively for input and output. When Vin exceeds 2.2V, the Comp. starts driving the DC/DC converter to switch the N-ch MOS and applies the optimum voltage for the switch gate. The DC/DC converter boosts the Vin voltage. When VIN is below 2.1V, the Comp. stops the DC/DC converter, starts the switch-OFF circuit, and discharges the voltage from the switch gate to GND. The switch-OF F circuit is powered from the SWin and consumes 0.4uA at 5V. Since the N-ch MOS back gate is connected to GND, switch-OFF reverse current is prevented irrespective of the High level state between SWin and SWout. Note, however, that turning the VIN pin on/off with 1.5 V or less applied to the SWIN pin may cause reverse current to flow because the switch-off circuit does not work then. For the method of compensating for the operation of the switch-off circuit, see section MIAPPLICATIONS 7.Low- side Switch. The load discharge circuit installed between SWout and GND is powered by the DCG pin, and discharges the load-side capacitor at switch OFF. When itis not necessary to discharge the load, connect the DCG pin to GND. The DLY pins are for connection to an external capacitor to delay the switch-ON/OFF time. The surge current at the load side is cut at power-on by controlling the switch-ON time. The switch-ON time depends on the boot time of the DC/DC converter. Consequently, when the VIN level is high and the SWin level is low, the switch-ON time is small; when the SWin level is high, the switch-OFF time is small.MB3802 @ ABSOLUTE MAXIMUM RATING (Ta = +25C) Parameter Symbol Condition Ratings Unit Input Voltage VIN _ 0.3 to 7.0 Vv Switching voltage Vew At switch OFF 0.3 to 7.0 V At switch ON 0.3 to 7.0 Switching current Isw At switch-ON peak 3.6 A Permissible loss Pb Ta<+ 75C 290 mw Storage Temperature TsTG _ 55 to +125 C WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. m@ RECOMMENDED OPERATING CONDITIONS Ratings Parameter Symbol Conditions - - Unit Min. Typical Max. Input voltage VIN _ 0 _ 6.0 Vv oo. At switch ON _ 6.0 Switching level Vswin Vv At switch OFF _ 6.0 as At switch on Switching current Isw (for single switch) _ _ 1.2 A Gate-pin connection capacitance Cp _ _ _ 10 nF Gate-pin mounting leak current IDLY _ -0.4 _ 0.1 LA Input voltage to load discharge circuit Voce |Vin=3V,5V 2.5 _ 6.0 Vv Operating temperature Top 40 +7.5 C WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device's electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their FUJITSU representatives beforehand.m@ ELECTRICAL CHARACTERISTICS 1. DC Characteristics MB3802 (Ta = +25C) Ratings Parameter Symbol Condition - Unit Min Typ Max lin Vin = OV _ 0 _ LA Input current | VIN = 3V _ 100 200 LA IN2 Vin = 5V _ 230 460 LA Vin = 3V, Isw = 0.5A, Ron Vswin = 3V _ 120 160 mQ Swiching resistance V BVT O5A IN = 5V, Isw = 0.5A, __ Rone Vswin = 3V 130 175 mQ Switch-OF F leak current IL Vin = OV, Vswin = 6V 0.5 2.0 LA VtH1 | At switch ON 2.0 2.2 2.4 Vv Input threshold voltage VtHe =| At switch OFF 1.9 2.1 2.3 Vv Input hysteresis width Vuys _ 50 100 _ mV . : Vin = 3V, 5V, Isw = 0.5A Switch resistance Ron Ta =-40 to 475C 210 ma Roce1 | Vswout = 3V, Voce = 3V _ 750 1500 Q Switch charge resistance Rocez | Vswout = 5V, Voce = 5V 500 1000 Q Input voltage to switch charge Ince Voce = 5V __ 0 2 uA circuit 2. AC Characteristics (Ta = +25C) Ratings Parameter Symbol Condition - Unit Min Typ Max tont Vin = OV > 3V, Vswin = 3V 20 300 900 us Switch-ON time tonz Vin = OV > 5V, Vswin = 5V 20 150 450 us torF1 | Vin = 3V OV, Vswin = 3V 5 60 180 us Switch OFF time torre |ViIn=5V > OV, Vswin = 5V 5 30 150 us tHys1 | Vin = 3V/ OV, Vswin = 3V 10 240 720 us Switch ON/OFF time lag tHyse |Vin = 5V/ OV, Vswin = 5V 10 120 300 usMB3802 m@ AC CHARACTERISTIC TEST DIAGRAMS 1. Test Condition Open DLY VIN SWIN swouT |'4 @) __|Vs=3V/5V GND} DCG R Load current=1A T/T f TIT TES T/T T/T ft R=30/5Q9 2. Switch-ON/OFF Timing Chart tr tf \ i* Vin | ZL 90% 90% \ ! 50% 50% I / \ I ov 110% 10%l | eae = SWin 90% SWout OV ton SW out 10% l_ oV torr Note: The rise/fall times (10%/90%) of Vin are both less than 1us.@ APPLICATIONS 1. Separate Use of Two Switching Circuits MB3802 VINA DCGa a @) Notes: The two power supplies Vsa andVss can be used separated by controlling the voltages VINa and VINs> VINB GND SWINa SWOUTa SWINB SWOUTs |__| DCGe VsB Load B thr Connect the DCD pin to GND when it is not used. 3Vto5V TIT Vsa Load A 7 TIT 3Vto5V 2. Switching Two Power Supplies VINa VINB ) TIT GND SWINa SWOUTa SWINB SWOUTs VsB Load TIT TIT 3Vto5V Note: When using different power supplies for a single load, control them capacitor so that both switches are not ON at the same time. TIT Vsa 3Vto5V by connecting an externalMB3802 3. Switching Two Loads VINa DCGa @) 71T VINB GND SWINa SWOUTa SWINB SWOUTs Vs DCGe Load B 7 Load A 7 T 3Vto5V TIT Note: Make this connection to control two different loads separately for a single power supply. 4. Connecting Serial Switches VINa DCGa ) TIT VINB GND SWINa SWOUTa SWINB SWOUTs Vs DCGe Load B 7H Load A 7H Note: Make this connection to supply power from Vs to load B via load A. 3Vto5V TTTMB3802 5. Connecting Parallel Switches DLYa DCGa VINA SWINa SWOUTA SWINs VINs SWOUTs GND TL |__| L* DLYs DCGs _ Load 3Vto5V 7/7 ar TTT Note: Connect the circuits A and B in parallel to produce a low ON resistance (Ron = 0.06Q). In this case, connect the DLYA and DLYB pins in common to give synchronous ON/OFF between both switches. 6. 25% ON Resistance DCGa VINa DLYa SWINa SWOUTa SWINB SWOUTs DLYs | _} oxo DCGe | Vs T | [ pce | | Load VINa DLYa SWOUTa VINB V3Vto5V SWINB SWOUTs VINB DLYs ___}_] on? Loca Notes: 1. Make this connection to produce an ON resistance that is much lower than the above connection. Also, connect the DLY pins in common. 2. Consider the difference between the ON resistances and the switch-ON/OFF times between two devices (MB3802) and insure that load control is not offset at one device.MB3802 7. Low-side Switch VIN A VINB GND SWINa SWOUTa SWINB Load A SWOUTs DLYa | DLYs Ra Re Load B Vin=3V,Vs=3V Vin=5VVs=5V Switch-ON time Switch-OFF time 80 ts 5.0 ms 45 us 3.5 ms Ra and Re = 10 MQ Notes: __|_Vss __|_Vsa 3Vto5V TIT 771T 1. Make this connection to control the switch ON/OFF at the lower load side. 2. To assist the switch-OFF circuit operation driven by the SWin power supply, connect high resistances (Ra and Re=5 to 10 MQ) to the DLY pins without overloading the DC/DC converter. 3. At this connection, the switch-OFF time is longer than the switch-ON time. 10 3Vto5Vm@ TYPICAL PERFORMANCE CHARACTERISTICS MB3802 ON Resistance (Input-voltage dependence) 150 ON Resistance (Load current dependence) 300 T T T T Isw = 1A Vswin =5 V,Vin=3V Vswin =5 V,Vin=5V IN - Vswn=6V \ Pe. = 250 Vswn=5V nD g \ -- Vswn=4V = {| tN _+ _ ~ ' Vswn=3V o - . - - 8 a en Vswin = 2V E KK Tet). oT G 200 x tenes Vswin=1V > 100 a \ mee Vewin = 0V O 8 \ Zz \ \ 2 Vswn=3V,Vin=3V O 150 NVswin=3V,Vin=5V WN 100 50 2.5 3.0 3.5 4.0 45 5.0 55 6.0 0 0.2 0.4 0.6 0.8 1.0 1.2. Input voltage (V) Load current (A) ON Resistance ON Resistance 450 (Temperature dependence: SWin = 3 V) 450 (Temperature dependence: SWin = 5 V) T T Vswin = 3 V Vswin = 5 V LL = Isw=1A Isw=1A sw 7 a a => eC - z oO i 7 > a | o =_ 2 L & 100 =< 5 10 b> a a -t 2 re - 2 ~ z Z Oo Oo Vin=3V VWin=3V Vin=5V VWin=5V 50 50 | -25 0 25 50 75 -25 0 25 50 75 Ta (C) Ta (C) Switch-ON time Switch-ON time 500 (Input voltage characteristic: SWin = 3 V) 500 (Input voltage characteristic: SWin = 5 V) q Vswin = 3'V Vewin =5V Isw=1A Isw=1A 400 400 QQ N ~ N iN 2 MN 2 MY N 2 300 SS 2 300 | SS z XQ $ RGN 0 200 Sn = oO 200 Sx NQ. L- Ta = 25C _| 5 ee L- Ta =25C S hs L-Ta = +25C = SZ Ta = +25C = = Ea] 4 = 100 _ 100 Frees ~ Ta=+75C Ta =+75C 0 0 | 30 35 40 45 50 55 6.0 30 35 40 45 50 55 60 Input voltage (V) Input voltage (V) (Continued) 1412 MB3802 100 s) ON-time (m Switch-OFF Time (Input voltage characteristic: SWin = 3 V) 100 T Vswin = 3 V Isw=1A _ 90 g \ Ta = -25C 80 | ic T 25C a=+ 9 70 x es ey ee ee ee 2 2 Ta=+75C 6. + . i= ox CY. Ly. Ld 50 3.0 3.5 4.0 4.5 5.0 55 6.0 Input voltage (V) Switch-ON Time (DLY-pin connection capacitance: SWin = 3 V) Vswin = 3 V Isw=1A 10 ] | ee ] ] 1000 Capacitance (pF) Switch-OFF Time (DLY-pin connection capacitance: SWin = 3 V) ON-time (ms) 100 Switch-OFF Time (Input voltage characteristic: SWin = 5 V) 100 T Vswin = 5 V Isw=1A 90 QQ = E 80 po i : Ra 2 70 < 2 = Ta = -25C o 60 K Ta = +25C I Ta = +75C 50 3.0 3.5 4.0 4.5 5.0 55 6.0 Input voltage (V) Switch-ON Time (DLY-pin connection capacitance: SWin = 5 V) F Vswin = 5 V C Isw=1A 10E 1 ra E a a a a a 7 L- 04 ! bop ! bop 100 1000 10000 Capacitance (pF) Switch-OFF Time (DLY-pin connection capacitance: SWin = 5 V) 10000 - 10000 'E E Vswn=3V E Vswin = 5 V T Iw=1A T Isw=1A A a @ 1000 F @ 1000 E iS F E F o C @ LL L - LL - LL i LL 100 \ 6 100 XK Vines F \ wees LT Vin=5V Vin=5V io L | Lope tii | Lot tt io L J ee ee | J Lo 100 1000 10000 100 1000 10000 Capacitance (pF) Capacitance (pF) (Continued)(Continued) MB3802 Discharge Resistance (DCG voltage dependence: SWin = 3 V) oO Vswin = 3 V Isw=1A Discharge resistance (kQ) Li / ~ Ta = +75C SSK Ta = +25C 0.1 3 4 5 6 DCG voltage (V) Output Leak Current (at switch OFF) 1000 - _~ | = - FA od . LA 2 5 100 F Zz 1 7 a Ta = +75C 5 Ta = +25C i Ta =-25C | Vn=O0V 10 2 3 4 5 6 SWIN voltage (V) Surge Current and Output Voltage Boot (DLY-pin connection capacitance dependence) Open 510 pF Output voltage 1000 pF Open 510 pF Surge current 1000 pF Output GND Input GND (Surge current) Vin=0>5V SWin = 5V Load capacitance = 47 uF Time Input current (uA) oO Discharge resistance (kQ) Discharge Resistance (DCG voltage dependence: SWin = 5 V) Vswin = 5 V Isw=1A Ta =+75C Ta =+25C 7 Pa a=t 0.1 3 5 6 DCG voltage (V) Input Current (Input voltage dependence) 300 200 J Ta = +75C Gy Ta= Ye 100 A | ~Ta = -25C 0 0 1.0 2.0 3.0 4.0 5.0 Switch voltage (V) V: 200 mA/div. (surge current) V: 1.0 V/div. (output voltage) H: 200 us/div. (time axis) Input voltage (V) Switch-On resistance (relationship between Vin and Vs) 140 mQ 30 Isw=1A 120 mQ 100 25 30 35 40 45 50 55 60 Vin voltage (V) 13MB3802 m@ PACKAGE DIMENSIONS Plastic FTP, 16 pin (FTP-16P-M04) 10.15 7520 (.400 oe } 2.10(.083)MAX HHAHAAEE OMN (STAND OFF) INDEX 10.40 3.9040.30 6.40+0.40 5.40 020 CO (.1544.012) (.252+.016) (943728) HH ERHHES | | 1.27(.050)TYP | | 0.45+0.10 @[G0.13(.005) 0.15508 0,50+0.20 (.018+.004) (0063%) (.020+.008) [C7].0.10(.004)| 8.89(.350)REF 1994 FUITSU LIMITED F160128-40-4 Dimensions in mm (inch) 14FUJITSU LIMITED For further information please contact: Japan FUJITSU LIMITED Corporate Global Business Support Division Electronic Devices KAWASAKI PLANT, 4-1-1, Kamikodanaka Nakahara-ku, Kawasaki-shi Kanagawa 211-8588, Japan Tel: 81(44) 754-3763 Fax: 81(44) 754-3329 http://www. fujitsu.co.jp/ North and South America FUJITSU MICROELECTRONICS, INC. Semiconductor Division 3545 North First Street San Jose, CA 95134-1804, USA Tel: (408) 922-9000 Fax: (408) 922-9179 Customer Response Center Mon. - Fri.: 7am -5 pm (PST) Tel: (800) 866-8608 Fax: (408) 922-9179 http://www. fujitsumicro.com/ Europe FUJITSU MIKROELEKTRONIK GmbH Am Siebenstein 6-10 D-63303 Dreieich-Buchschlag Germany Tel: (06103) 690-0 Fax: (06103) 690-122 http://www. fujitsu-ede.com/ Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE LTD #05-08, 151 Lorong Chuan New Tech Park Singapore 556741 Tel: (65) 281-0770 Fax: (65) 281-0220 http//www.fmap.com.sg/ F9902 FUJITSU LIMITED Printed in Japan MB3802 All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. The information and circuit diagrams in this document are presented as examples of semiconductor device applications, and are not intended to be incorporated in devices for actual use. Also, FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of this information or circuit diagrams. FUJITSU semiconductor devices are intended for use in standard applications (computers, office automation and other office equipment, industrial, communications, and measurement equipment, personal or household devices, etc.). CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with FUJITSU sales representatives before such use. The company will not be responsible for damages arising from such use without prior approval. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be required for export of those products from Japan. 15