1. Product profile
1.1 General description
General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic
packages.
1.2 Features
1.3 Applications
BAS70 series;
1PS7xSB70 series
General-purpose Schottky diodes
Rev. 09 — 13 January 2010 Product data sheet
Table 1. Product overview
Type number Package Configuration
NXP JEITA
1PS76SB70 SOD323 SC-76 single diode
1PS79SB70 SOD523 SC-79 single diode
BAS70 SOT23 - single diode
BAS70H SOD123F - single diode
BAS70L SOD882 - single diode
BAS70W SOT323 SC-70 single diode
BAS70-04 SOT23 - dual series
BAS70-04W SOT323 SC-70 dual series
BAS70-05 SOT23 - dual common cathode
BAS70-05W SOT323 SC-70 dual common cathode
BAS70-06 SOT23 - dual common anode
BAS70-06W SOT323 SC-70 dua l common anode
BAS70-07 SOT143B - dual isolated
BAS70-07S SOT363 SC-88 dual isolated
BAS70-07V SOT666 - dual isolated
BAS70VV SOT666 - triple isolated
BAS70XY SOT363 SC-88 quadruple; 2 series
High switching speed Low leakage current
High breakdo wn vo ltage Low capacitance
Ultra high-speed switching Voltage clamping
BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 09 — 13 January 2010 2 of 20
NXP Semiconductors BAS70 series; 1PS7xSB70 series
General-p u rpo s e Sc ho t tk y di od e s
1.4 Quick reference data
[1] Pulse test: tp300 μs; δ≤0.02.
2. Pinning information
Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
Per diode
IFforward current - - 70 mA
VFforward voltage IF=1mA [1] --410mV
VRreverse voltage - - 70 V
Table 3. Pinning
Pin Description Simplified outline Symbol
BAS70H; 1PS76SB70; 1PS79SB70
1 cathode [1]
2 anode
BAS70L
1 cathode [1]
2 anode
BAS70; BAS70W
1 anode
2 not connected
3 cathode
BAS70-04; BAS70-04W
1 anode (diode 1)
2 cathode (diode 2)
3 cathode (diode 1),
anode (diode 2)
001aab540
12
sym00
1
12
21
Transparent
top view
sym00
1
12
006aaa14
4
12
3
006aaa436
1
3
2
n.c.
006aaa14
4
12
3
006aaa43
7
12
3
BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 09 — 13 January 2010 3 of 20
NXP Semiconductors BAS70 series; 1PS7xSB70 series
General-p u rpo s e Sc ho t tk y di od e s
BAS70-05; BAS70-05W
1 anode (diode 1)
2 anode (diode 2)
3 cathode (diode 1),
cathode (diode 2)
BAS70-06; BAS70-06W
1 cathode (diode 1)
2 cathode (diode 2)
3 anode (diode 1),
anode (diode 2)
BAS70-07
1 cathode (diode 1)
2 cathode (diode 2)
3 anode (diode 2)
4 anode (diode 1)
BAS70-07S; BAS70-07V
1 anode (diode 1)
2 not connected
3 cathode (diode 2)
4 anode (diode 2)
5 not connected
6 cathode (diode 1)
BAS70VV
1 anode (diode 1)
2 anode (diode 2)
3 anode (diode 3)
4 cathode (diode 3)
5 cathode (diode 2)
6 cathode (diode 1)
Table 3. Pinning …continued
Pin Description Simplified outline Symbol
006aaa14
4
12
3
006aaa43
8
12
3
006aaa14
4
12
3
006aaa43
9
12
3
21
34
006aaa4
34
2
34
1
001aab55
5
6 45
1 32 006aaa44
0
654
123
123
456 6
1
5
2
4
3
sym04
6
BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 09 — 13 January 2010 4 of 20
NXP Semiconductors BAS70 series; 1PS7xSB70 series
General-p u rpo s e Sc ho t tk y di od e s
[1] The marking bar indicates the cathode.
3. Ordering information
BAS70XY
1 anode (diode 1)
2 cathode (diode 2)
3 anode (diode 3),
cathode (diode 4)
4 anode (diode 4)
5 cathode (diode 3)
6 cathode (diode 1),
anode (diode 2)
Table 3. Pinning …continued
Pin Description Simplified outline Symbol
132
4
56
006aaa25
654
123
Table 4. Ordering information
Type number Package
Name Description Version
1PS76SB70 SC-76 plastic surface-mounted package; 2 leads SOD323
1PS79SB70 SC-79 plastic surface-mounted package; 2 leads SOD523
BAS70 - plastic surface-mounted package; 3 leads SOT23
BAS70H - plastic surface-mounted package; 2 leads SOD123F
BAS70L - leadless ultra small plastic package; 2 terminals;
body 1.0 ×0.6 ×0.5 mm SOD882
BAS70W SC-70 plastic surface-mounted package; 3 leads SOT323
BAS70-04 - plastic surface-mounted package; 3 leads SOT23
BAS70-04W SC-70 plastic surface-mounted package; 3 leads SOT323
BAS70-05 - plastic surface-mounted package; 3 leads SOT23
BAS70-05W SC-70 plastic surface-mounted package; 3 leads SOT323
BAS70-06 - plastic surface-mounted package; 3 leads SOT23
BAS70-06W SC-70 plastic surface-mounted package; 3 leads SOT323
BAS70-07 - plastic surface-mounted package; 4 leads SOT143B
BAS70-07S SC-88 plastic surface-mounted package; 6 leads SOT363
BAS70-07V - plastic surface-mounted package; 6 leads SOT666
BAS70VV - plastic surface-mounted package; 6 leads SOT666
BAS70XY SC-88 plastic surface-mounted package; 6 leads SOT363
BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 09 — 13 January 2010 5 of 20
NXP Semiconductors BAS70 series; 1PS7xSB70 series
General-p u rpo s e Sc ho t tk y di od e s
4. Marking
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
[1] Tj=25°C prior to surge.
Table 5. Marking codes
Type number Marking code[1] Type number Marking code[1]
1PS76SB70 S2 BAS70-05W 75*
1PS79SB70 G BAS70-06 76*
BAS70 73* BAS70-06W 76*
BAS70H AH BAS70-07 77*
BAS70L S8 BAS70-07S 77*
BAS70W 73* BAS70-07V 77
BAS70-04 74* BAS70VV N1
BAS70-04W 74* BAS70XY 70*
BAS70-05 75* - -
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
VRreverse voltage - 70 V
IFforward current - 70 mA
IFRM repetitive peak forward
current tp1s; δ≤0.5 - 70 mA
IFSM non-repetitive peak forward
current tp10 ms [1] -100mA
Tjjunction temperature - 150 °C
Tamb ambient temperature 65 +150 °C
Tstg storage temperature 65 +150 °C
BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 09 — 13 January 2010 6 of 20
NXP Semiconductors BAS70 series; 1PS7xSB70 series
General-p u rpo s e Sc ho t tk y di od e s
6. Thermal characteristics
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Soldering point at pins 2, 3, 5 and 6.
7. Characteristics
[1] Pulse test: tp300 μs; δ≤0.02.
Table 7. Thermal characteris tics
Symbol Parameter Conditions Min Typ Max Unit
Per device
Rth(j-a) thermal resistance from
junction to ambient in free air [1]
SOT23 - - 500 K/W
SOT143B - - 500 K/W
SOT363 (BAS70-07S) - - 416 K/W
SOT666 (BAS70VV) [2] - - 700 K/W
SOT666 (BAS70-07V) [2] - - 416 K/W
SOD123F [2] - - 330 K/W
SOD323 - - 450 K/W
SOD523 [2] - - 450 K/W
SOD882 [2] - - 500 K/W
SOT323 - - 625 K/W
Rth(j-sp) thermal resistance from
junction to solder point
SOT363 (BAS70XY) [3] - - 260 K/W
Table 8. Characteristics
Tamb =25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VFforward voltage [1]
IF=1mA - - 410 mV
IF=10mA - - 750 mV
IF=15mA - - 1 V
IRreverse current VR=50V - - 100 nA
VR=70V - - 10 μA
Cddiode capacitance VR=0V; f=1MHz - - 2 pF
BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 09 — 13 January 2010 7 of 20
NXP Semiconductors BAS70 series; 1PS7xSB70 series
General-p u rpo s e Sc ho t tk y di od e s
(1) Tamb = 125 °C
(2) Tamb =85°C
(3) Tamb =25°C
(4) Tamb =40 °C
(1) Tamb = 125 °C
(2) Tamb =85°C
(3) Tamb =25°C
Fig 1. Forward current as a function of forward
voltage; typical values Fig 2. Reverse current as a functio n of reverse
voltage; typical values
f=10kHz T
amb =25°C; f = 1 MHz
Fig 3. Differential forward resistance as a function of
forward current; typical values Fig 4. Dio de ca pacitance as a function of reverse
voltage; typical values
10
0 0.2 0.4 0.6 0.8 1
1
IF
(mA)
VF (V)
mra803
(1) (4)(2) (3)
102
101
102
mra805
1
10
102
0 20406080
VR (V)
IR
(μA)
(1)
(3)
(2)
101
102
103
10
1
110
rdif
(Ω)
IF (mA)
mra802
101102
102
103
0
0.5
1
1.5
2
0 20406080
mra804
Cd
(pF)
VR (V)
BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 09 — 13 January 2010 8 of 20
NXP Semiconductors BAS70 series; 1PS7xSB70 series
General-p u rpo s e Sc ho t tk y di od e s
8. Package outline
Fig 5. Pac kage outline SOD323 (SC-76) Fig 6. Package outline SOD523 (SC-7 9)
Fig 7. Pac kage outline SOT23 (TO-236AB) Fig 8. Package outline SOD123F
Fig 9. Pac kage outline SOD882 Fig 10. Package outline SOT323 (SC-70)
03-12-17Dimensions in mm
0.25
0.10
0.45
0.15
2.7
2.3
1.8
1.6
0.40
0.25
1.1
0.8
1.35
1.15
1
2
02-12-13Dimensions in mm
1.65
1.55
1.25
1.15
0.17
0.11
0.34
0.26
0.65
0.58
0.85
0.75
1
2
04-11-04Dimensions in mm
0.45
0.15
1.9
1.1
0.9
3.0
2.8
2.5
2.1
1.4
1.2
0.48
0.38
0.15
0.09
12
3
04-11-29Dimensions in mm
1.2
1.0
0.25
0.10
3.6
3.4
2.7
2.5
0.55
0.35
0.70
0.55
1.7
1.5
1
2
03-04-17Dimensions in mm
0.55
0.47
0.65
0.62
0.55
0.50
0.46
cathode marking on top side
1.02
0.95
0.30
0.22
0.30
0.22
2
1
04-11-04Dimensions in mm
0.45
0.15
1.1
0.8
2.2
1.8
2.2
2.0
1.35
1.15
1.3
0.4
0.3
0.25
0.10
12
3
BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 09 — 13 January 2010 9 of 20
NXP Semiconductors BAS70 series; 1PS7xSB70 series
General-p u rpo s e Sc ho t tk y di od e s
Fig 11. Package outline SOT143B Fig 12. Packag e outline SOT363 (SC-88)
Fig 13. Package outline SOT666
04-11-16Dimensions in mm
3.0
2.8 1.1
0.9
2.5
2.1
1.4
1.2
1.7
1.9
0.48
0.38
0.15
0.09
0.45
0.15
0.88
0.78
21
34
06-03-16Dimensions in mm
0.25
0.10
0.3
0.2
pin 1
index
1.3
0.65
2.2
2.0
1.35
1.15
2.2
1.8
1.1
0.8
0.45
0.15
132
465
Dimensions in mm 04-11-08
1.7
1.5
1.7
1.5
1.3
1.1
1
0.18
0.08
0.27
0.17
0.5
pin 1 index
123
456
0.6
0.5
0.3
0.1
BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 09 — 13 January 2010 10 of 20
NXP Semiconductors BAS70 series; 1PS7xSB70 series
General-p u rpo s e Sc ho t tk y di od e s
9. Packing information
[1] For further information and the availability of packing methods, see Section 13.
[2] T1: normal taping
[3] T2: reverse taping
Table 9. Packing methods
The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]
Type number Package Description Packing quan tity
3000 4000 8000 10000
1PS76SB70 SOD323 4 mm pitch, 8 mm tape and reel -115 - - -135
1PS79SB70 SOD523 2 mm pitch, 8 mm tape and reel - - -315 -
4 mm pitch, 8 mm tape and reel -115 - - -135
BAS70 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235
BAS70H SOD123F 4 mm pitch, 8 mm tape and reel -115 - - -135
BAS70L SOD882 2 mm pitch, 8 mm tape and reel - - - -315
BAS70W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135
BAS70-04 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235
BAS70-04W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135
BAS70-05 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235
BAS70-05W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135
BAS70-06 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235
BAS70-06W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135
BAS70-07 SOT143B 4 mm pitch, 8 mm tape and reel -215 - - -235
BAS70-07S SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - -135
4 mm pitch, 8 mm tape and reel; T2 [3] -125 - - -165
BAS70-07V SOT666 2 mm pitch, 8 mm tape and reel - - -315 -
4 mm pitch, 8 mm tape and reel - -115 - -
BAS70VV SOT666 2 mm pitch, 8 mm tape and reel - - -315 -
4 mm pitch, 8 mm tape and reel - -115 - -
BAS70XY SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - -135
4 mm pitch, 8 mm tape and reel; T2 [3] -125 - - -165
BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 09 — 13 January 2010 11 of 20
NXP Semiconductors BAS70 series; 1PS7xSB70 series
General-p u rpo s e Sc ho t tk y di od e s
10. Soldering
Dimensions in mm
Fig 14. Reflow soldering footprint SOD323 (SC-76)
Dimensions in mm
Fig 15. Wave soldering footprint SOD323 (SC-76)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 16. Reflow soldering footprint SOD523 (SC-79)
msa433
1.65
0.50
(2×)
2.10
1.60
2.80
0.60
3.05
0.500.95
solder lands
solder resist
occupied area
solder paste
msa415
1.40
4.40
5.00
1.202.75
preferred transport direction during soldering
solder lands
solder resist
occupied area
mgs34
3
1.80
1.90
0.30
0.40
0.50
1.20 0.60
2.15
solder lands
solder resist
occupied area
solder paste
BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 09 — 13 January 2010 12 of 20
NXP Semiconductors BAS70 series; 1PS7xSB70 series
General-p u rpo s e Sc ho t tk y di od e s
Dimensions in mm
Fig 17. Reflow soldering footprint SOT23 (TO-236AB)
Dimensions in mm
Fig 18. Wave soldering footprint SOT23 (TO-236AB)
MSA439
1.00
0.60
(3x)
1.30
12
3
2.50
3.00
0.85
2.70
2.90
0.50 (3x)
0.60 (3x)
3.30
0.85
solder lands
solder resist
occupied area
solder paste
MSA427
4.00
4.60
2.80
4.50
1.20
3.40
3
21
1.20 (2x)
preferred transport direction during soldering
solder lands
solder resist
occupied area
BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 09 — 13 January 2010 13 of 20
NXP Semiconductors BAS70 series; 1PS7xSB70 series
General-p u rpo s e Sc ho t tk y di od e s
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 19. Reflow soldering footprint SOD123F
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 20. Reflow soldering footprint SOD882
1.6
1.6
2.9
4
4.4
1.1 1.22.1
1.1
(2×)
solder lands
solder resist
occupied area
solder paste
mbl87
2
1.30
0.30R = 0.05 (8×) R = 0.05 (8×)
0.60
(2×)
0.70
(2×)
0.80
(2×)
0.90
0.30
(2×)
0.40
(2×)
0.50
(2×)
solder lands
solder resist
occupied area
solder paste
BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 09 — 13 January 2010 14 of 20
NXP Semiconductors BAS70 series; 1PS7xSB70 series
General-p u rpo s e Sc ho t tk y di od e s
Dimensions in mm
Fig 21. Reflow soldering footprint SOT323 (SC-70)
Dimensions in mm
Fig 22. Wave soldering footprint SOT323 (SC-70)
msa429
0.852.35
0.55
(3×)
1.3250.75
2.40
2.65
1.30
3
2
1
0.60
(3×)
0.50
(3×)1.90
solder lands
solder resist
occupied area
solder paste
Dimensions in mm
msa41
9
4.00
4.60
2.103.65
1.15
2.70
3
2
10.90
(2×)
preferred transport direction during soldering
solder lands
solder resist
occupied area
Dimensions in mm
BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 09 — 13 January 2010 15 of 20
NXP Semiconductors BAS70 series; 1PS7xSB70 series
General-p u rpo s e Sc ho t tk y di od e s
Dimensions in mm
Fig 23. Reflow soldering footprint SOT143B
Dimensions in mm
Fig 24. Wave soldering footprint SOT143B
msa441
0.60
(4x)
1.30
2.50
3.00
2.70
0.50 (3x)
0.60 (3x)
3.25
43
21
0.90
1.00
solder lands
solder resist
occupied area
solder paste
msa422
4.00 4.60
1.20 (3×)
4.45
12
34
1.15
3.40
1.00 preferred transport direction during soldering
solder lands
solder resist
occupied area
Dimensions in mm
BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 09 — 13 January 2010 16 of 20
NXP Semiconductors BAS70 series; 1PS7xSB70 series
General-p u rpo s e Sc ho t tk y di od e s
Dimensions in mm
Fig 25. Reflow soldering footprint SOT363 (SC-88)
Fig 26. Wave soldering footprint SOT363 (SC-88)
MSA432
solder lands
solder resist
occupied area
solder paste
1.20
2.40
0.50
(4×)
0.40
(2×)0.90 2.10
0.50
(4×)
0.60
(2×)
2.35
2.65
sot363_
fw
solder lands
solder resist
occupied area
preferred transport
direction during soldering
5.3
1.3 1.3
1.5
0.3
1.5
4.5
2.45
2.5
Dimensions in mm
BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 09 — 13 January 2010 17 of 20
NXP Semiconductors BAS70 series; 1PS7xSB70 series
General-p u rpo s e Sc ho t tk y di od e s
Reflow soldering is the only recommended soldering method.
Fig 27. Reflow soldering footprint SOT666
solder lands
placement area
occupied area
solder paste
sot666_
fr
2.75
2.45
2.1
1.6
0.4
(6×)
0.55
(2×)
0.25
(2×)
0.6
(2×)
0.65
(2×)
0.3
(2×)
0.325
(4×)
0.45
(4×)
0.5
(4×)
0.375
(4×)
1.72
1.7
1.075
0.538
Dimensions in mm
BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 09 — 13 January 2010 18 of 20
NXP Semiconductors BAS70 series; 1PS7xSB70 series
General-p u rpo s e Sc ho t tk y di od e s
11. Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BAS70_1PS7XSB70_SER_9 20100113 Product data sheet - BAS70_1PS7XSB70_SER_8
Modifications: This data sheet was changed to reflec t the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
BAS70_1PS7XSB70_SER_8 20060504 Product data sheet - BAS70_1PS7XSB70_SER_7
BAS70_1PS7XSB70_SER_7 20050718 Product data sheet - 1PS76SB70_2
1PS79SB70_1 BAS7 0H_1
BAS70L_1 BAS70-07V_1
BAS70VV_1 BAS70W_3
BAS70-07S_4
BAS70_SERIES_6
1PS76SB70_2 20040126 Product specification - 1PS76SB70_1
1PS79SB70_1 19980716 Product specification - -
BAS70H_1 20050425 Product data sheet - -
BAS70L_1 20030520 Product specification - -
BAS70-07V_1 20020117 Product specification - -
BAS70VV_1 20040910 Product data sheet - -
BAS70W_3 19990326 Product specification - BAS70W_2
BAS70-07S_4 20030411 Product specification - BAS70_07S_3
BAS70_SERIES_6 20011011 Product specification - BAS70_5
BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 09 — 13 January 2010 19 of 20
NXP Semiconductors BAS70 series; 1PS7xSB70 series
General-p u rpo s e Sc ho t tk y di od e s
12. Legal information
12.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not b e relied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semicond uctors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre va il.
12.3 Disclaimers
General — In formation in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give an y represent ations or
warranties, expressed or impli ed, as to the accuracy or completeness of such
information and shall have no liability for th e co nsequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descripti ons, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ra tings System of IEC 60134) may cause pe rmanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other co nditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may af fect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warr anty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between inf ormation in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or the gr ant,
conveyance or implication of any license under any copyrights, patents or
other industrial or inte llectual property right s.
Export control — This document as well as the item(s) described herein
may be subject to export control regulatio ns. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
12.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respective ow ners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contain s data from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specificat ion.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors BAS70 series; 1PS7xSB70 series
General-p u rpo s e Sc ho t tk y di od e s
© NXP B.V. 2010. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 13 January 2010
Document identifier: BAS70_1PS7XSB70_SER_9
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
14. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 4
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 6
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
9 Packing information . . . . . . . . . . . . . . . . . . . . 10
10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18
12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19
12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19
12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
13 Contact information. . . . . . . . . . . . . . . . . . . . . 19
14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
NXP:
1PS76SB70,135 1PS76SB70,115 1PS79SB70,115 BAS70-05,235 BAS70,235 BAS70-04,215 BAS70-04W,115
BAS70-05,215 BAS70-05W,135 BAS70-05W,115 BAS70-06,215 BAS70-06W,115 BAS70-07S,115 BAS70-07,215
BAS70-07V,115 BAS70H,115 BAS70L,315 BAS70,215 BAS70VV,115 BAS70W,115 BAS70XY,115
1PS79SB70,315 BAS70-04,235