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FEATURES APPLICATIONS
DESCRIPTION
RI-RFM-008B , RI-ACC-008B
SCBS850 – MARCH 2001
SERIES 2000 HIGH PERFORMANCE REMOTE ANTENNA RFM AND TUNING MODULE
•Access Control•Best in Class Performance Through PatentedHDX Technology
•Vehicle Identification
•Container Tracking•High Power Output
•Asset Management•Extended Antenna Induction Range
•Waste Management•Reader Antenna Distance Up to 120 Meters•Proven In Harsh Industrial Environments•Easy To Install And Use
The Texas Instruments’ low-frequency (LF) reader provides all the functionality required to communicate withTexas Instruments 134.2 kHz LF transponders which are available in a variety of form factors. TheRI-RFM-008B radio frequency power module is capable driving the RI-ACC-008B, which then forms theresonant circuit with the antenna. The distance between the antenna - RI-ACC-008B combination and the reader(RI-RFM-008B + control module) can be extended up to 120 meters when connected by a symmetrical twinaxcable.
The RI-ACC-008B radio frequency power module is capable driving a variety of antennas with extendedinductance ranges from 8µH to 80µH including TI standard antennas RI-ANT-G01E, RI-ANT-G02E,RI-ANT-G04E gate antennas as well as RI-ANT-S01C and RI-ANT-S02C stick antennas. The RI-RFM-008 isdesigned to be connected to control modules RI-CTL-MB2A (RS232 interface) or RI-CTL-MB6A (RS422/485interface) which provide the interface to connect a host system, power supply connectors and additional I/O’s.The RI-RFM-008B module in combination with a control module and the RI-ACC-008B is well suited for usage ina broad range of applications including, but not limited to, access control, vehicle identification, containertracking, asset management and waste management applications.
The Series 2000 High Performance Remote Antenna RFM together with the Antenna Tuning Module supportsthe use of antennas installed at a distance of up to 120 meters. It is the interface between the 134.2 kHzHDX/FSK transponder and the Data Processing Unit. It sends an energizing signal to the transponder,modulates the RF signal to send data to the transponder, receives the identification signal and processes it fordigital decoding.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2001, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
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ABSOLUTE MAXIMUM RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
OPERATING CHARACTERISTICS
RI-RFM-008B , RI-ACC-008B
SCBS850 – MARCH 2001
over operating free-air temperature range (unless otherwise noted)
RI-RFM-008B RI-ACC-008B UNIT
Operating Temperature –25 to +70 –25 to +70 °CStorage Temperature –40 to +85 –40 to +85 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under Recommended OperatingConditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
over operating free-air temperature range (unless otherwise noted)
RI-RFM-008B RI-ACC-008B
Power Supply 7 to 24 Vdc, regulated —
over operating free-air temperature range (unless otherwise noted)
PART NUMBERPARAMETER UNITRI-RFM-008B RI-ACC-008B
Relative Humidity < 97% non-condensing, IEC 68-2-30 Test Db, 21 cyclesRF Transmit Frequency 134.2 kHzTransponder Types 134.2 kHz HDX/FSKAntenna Tuning Range Determined by the tuning-board 8 to 80 µHMax. 280 / 400 VpeakAntenna Resonance Voltage Max. 380 Vpeak (depending on the configuredinductance range)Dimensions (L ×W×H) (83 ×93 ×44) ±1 (115 ×70 ×27) ±1 mmWeight 160 162 gCable (RFM to tuning-board) Symmetrical shielded cable (twin-ax)
2
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PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
RI-ACC-008B-00 OBSOLETE 1 TBD Call TI Call TI
RI-ACC-008B-30 ACTIVE 0 1 TBD Call TI Call TI
RI-RFM-008B-30 ACTIVE 0 1 TBD Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
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Addendum-Page 1
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