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April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
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2008
DESCRIPTION
The
μ
PC8233TK is a silicon germanium carbon (SiGe:C) monolithic integrated circuit designed as low noise
amplifier for GPS and mobile communications. This device exhibits low noise figure and high power gain
characteristics. This device is enabled in the frequency range from 1.5 to 2.4 GHz by modifying the external matching
circuit.
This device is suitable for the reduction in power consumption of the mobile communication system because it
operates by low voltage and low current.
The package is 6-pin lead-less minimold, suitable for surface mount.
This IC is manufactured using our UHS4 (Ultra High Speed Process) SiGe:C bipolar process.
FEATURES
• Supply voltage : VCC = 1.6 to 3.3 V (2.7 V TYP.)
• Low noise : NF = 0.90 dB TYP. @ VCC = 2.7 V, fin = 1 575 MHz
NF = 0.90 dB TYP. @ VCC = 1.8 V, fin = 1 575 MHz
• High gain : GP = 20 dB TYP. @ VCC = 2.7 V, fin = 1 575 MHz
GP = 19.5 dB TYP. @ VCC = 1.8 V, fin = 1 575 MHz
• Low current consumption : ICC = 3.5 mA TYP. @ VCC = 2.7 V
• Built-in power-saving function : VPSon = 1.0 V to VCC, VPSoff = 0.0 to 0.4 V
• High-density surface mounting : 6-pin lead-less minimold package (1.5 × 1.1 × 0.55 mm)
• Included very robust bandgap regulator (Small VCC and TA dependence)
• Included protection circuits for ESD
APPLICATION
• Low noise amplifier for GPS and mobile communications
ORDERING INFORMATION
Part Number Order Number Package Marking Supplying Form
μ
PC8233TK-E2
μ
PC8233TK-E2-A 6-pin lead-less minimold
(1511 PKG) (Pb-Free)
6P • 8 mm wide embossed taping
• Pin 1, 6 face the perforation side of the tape
• Qty 5 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order:
μ
PC8233TK
DATA SHEET
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
BIPOLAR ANALOG INTEGRATED CIRCUIT
μ
PC8233TK
SiGe:C LOW NOISE AMPLIFIER
FOR GPS/MOBILE COMMUNICATIONS
Document No. PU10706EJ01V0DS (1st edition)
Date Published February 2008 NS
Printed in Japan
PIN CONNECTIONS
Pin No. Pin Name
1 INPUT
2 GND
3 Power Save
4 OUTPUT
5 GND
1
2
3
6
(Top View)
5
4
6
5
4
1
(Bottom View)
2
3
6P
6 VCC
INTERNAL BLOCK DIAGRAM
INPUT 1
Bias
2
3
GND
Power Save
V
CC
6
5
4
GND
OUTPUT
ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Test Conditions Ratings Unit
Supply Voltage VCC TA = +25°C 4.0 V
Power-Saving Voltage VPS TA = +25°C 4.0 V
Power Dissipation PD TA = +85°C Note 232 mW
Operating Ambient Temperature TA −40 to +85 °C
Storage Temperature Tstg −55 to +150 °C
Input Power Pin +10 dBm
Note Mounted on double-side copper-clad 50 × 50 × 1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter Symbol MIN. TYP. MAX. Unit
Supply Voltage VCC 1.6 2.7 3.3 V
Operating Ambient Temperature TA −40 +25 +85 °C
Power Save Turn-on Voltage VPSon 1.0 − VCC V
Power Save Turn-off Voltage VPSoff 0 − 0.4 V
Data Sheet PU10706EJ01V0DS
2
μ
PC8233TK
ELECTRICAL CHARACTERISTICS
(TA = +25°C, VCC = VPS = 2.7 V, fin = 1 575 MHz, unless otherwise specified)
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
Circuit Current ICC No Signal (VPS = 2.7 V) 2.5 3.5 4.8 mA
At Power-Saving Mode (VPS = 0 V) − − 1
μ
A
Power Gain GP Pin = −35 dBm 17.5 20.0 22.5 dB
Noise Figure NF − 0.9 1.2 dB
Input Return Loss RLin 7 10 − dB
Output Return Loss RLout 10 16 − dB
STANDARD CHARACTERISTICS FOR REFERENCE 1
(TA = +25°C, VCC = VPS = 2.7 V, fin = 1 575 MHz, unless otherwise specified)
Parameter Symbol Test Conditions Reference Unit
Input 3rd Order Intercept Point IIP3 fin1 = 1 575 MHz, fin2 = 1 574 MHz −8.5 dBm
Isolation ISL 36 dB
Gain 1 dB Compression Input Power Pin (1 dB) −23 dBm
STANDARD CHARACTERISTICS FOR REFERENCE 2
(TA = +25°C, VCC = VPS = 1.8 V, fin = 1 575 MHz, unless otherwise specified)
Parameter Symbol Test Conditions Reference Unit
Circuit Current ICC No Signal (VPS = 1.8 V) 3.3 mA
Power Gain GP Pin = −35 dBm 19.5 dB
Noise Figure NF 0.9 dB
Input 3rd Order Intercept Point IIP3 fin1 = 1 575 MHz, fin2 = 1 574 MHz −9.5 dBm
Input Return Loss RLin 9.5 dB
Output Return Loss RLout 15.5 dB
Isolation ISL 36 dB
Gain 1 dB Compression Input Power Pin (1 dB) −23.5 dBm
Data Sheet PU10706EJ01V0DS 3
μ
PC8233TK
TEST CIRCUIT
61
2
3
5
4
VPS
INPUT
OUTPUT
C1
C2
L1 C4
R1
L2
L3 C3
VCC
COMPONENT LIST
Symbol Type Value Unit
C1 Chip Capacitor 1 000 pF
C2 Chip Capacitor 1.2 pF
C3 Chip Capacitor 18 pF
C4 Chip Capacitor 1 000 pF
L1 Chip Inductor 8.2 nH
L2 Chip Inductor 18 nH
L3 Chip Inductor 6.8 nH
R1 Chip Resistor 360
Ω
Data Sheet PU10706EJ01V0DS
4
μ
PC8233TK
TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified)
6
5
4
3
2
0
1.0 1.5 2.0 2.5 3.0 3.5 4.0
1
6
5
4
3
2
001.0 3.0
1
0.5 1.5 2.0 2.5
6
5
4
2
1
0
VCC = VPS
RF = off
VCC = 2.7 V
RF = off
26
24
22
20
18
16
14
12
1 500 1 575 1 650
1 525 1 625
VCC = VPS = 2.7 V
1 550 1 600
2.0
1.4
1.2
0.8
0.6
0VCC = VPS = 2.7 V
1.0
0.4
0.2
TA = +85°C
–40°C
+25°C
TA = +85°C
–40°C
+25°C
1.8 V
6
5
4
3
2
001.0 3.0
1
0.5 1.5 2.0 2.5
VCC = 1.8 V
RF = off
TA = +85°C
–40°C
+25°C
–50 25 100
–25 75
050
VCC = VPS
RF = off
3
VCC = 2.7 V
TA = –40°C
+85°C
+25°C1.6
1.8
1 500 1 575 1 650
1 525 1 625
1 550 1 600
TA = +85°C
–40°C
+25°C
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
Circuit Current ICC (mA)
Supply Voltage VCC (V)
Circuit Current ICC (mA)
CIRCUIT CURRENT vs.
POWER-SAVING VOLTAGE
Power-Saving Voltage VPS (V)
Circuit Current ICC (mA)
CIRCUIT CURRENT vs.
POWER-SAVING VOLTAGE
Power-Saving Voltage VPS (V)
CIRCUIT CURRENT vs. OPERATING
AMBIENT TEMPERATURE
Circuit Current ICC (mA)
Operating Ambient Temperature TA (°C)
Power Gain GP (dB)
Frequency fin (MHz)
POWER GAIN vs. FREQUENCY
Noise Figure NF (dB)
Frequency fin (MHz)
NOISE FIGURE vs. FREQUENCY
Remark The graphs indicate nominal characteristics.
Data Sheet PU10706EJ01V0DS 5
μ
PC8233TK
26
24
22
20
18
16
14
121.0 1.5 2.0 2.5 3.0 3.5 4.0
VCC = VPS
fin = 1 575 MHz
+85°C
+25°C
26
24
22
20
18
16
14
12
1 500 1 575 1 650
1 525 1 625
VCC = VPS = 1.8 V
1 550 1 600
TA = –40°C
+85°C
+25°C
2.0
1.4
1.2
0.8
0.6
0VCC = VPS = 1.8 V
1.0
0.4
0.2
1.6
1.8
1 500 1 575 1 650
1 525 1 625
1 550 1 600
TA = +85°C
–40°C
+25°C
TA = –40°C
2.0
1.4
1.2
0.8
0.6
0
1.0
0.4
0.2
1.6
1.8
TA = +85°C
–40°C
+25°C
1.0 1.5 2.0 2.5 3.0 3.5 4.0
VCC = VPS
fin = 1 575 MHz
26
24
22
20
18
16
14
12
–50 25 100
–25 75
VCC = VPS
fin = 1 575 MHz
0 50
VCC = 2.7 V
1.8 V
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
VCC = VPS
fin = 1 575 MHz
–50 25 100
–25 75
0 50
VCC = 1.8 V
2.7 V
Power Gain GP (dB)
Frequency fin (MHz)
POWER GAIN vs. FREQUENCY
Noise Figure NF (dB)
Frequency fin (MHz)
NOISE FIGURE vs. FREQUENCY
Power Gain GP (dB)
POWER GAIN vs. SUPPLY VOLTAGE
Supply Voltage VCC (V)
Noise Figure NF (dB)
NOISE FIGURE vs. SUPPLY VOLTAGE
Supply Voltage VCC (V)
Power Gain GP (dB)
Operating Ambient Temperature TA (°C)
POWER GAIN vs. OPERATING
AMBIENT TEMPERATURE
NOISE FIGURE vs. OPERATING
AMBIENT TEMPERATURE
Operating Ambient Temperature TA (°C)
Noise Figure NF (dB)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10706EJ01V0DS
6
μ
PC8233TK
POWER GAIN, CIRCUIT CURRENT
vs. INPUT POWER
Power Gain G
P
(dB)
25
20
15
10
5
0
V
CC
= V
PS
= 2.7 V
f
in
= 1 575 MHz
10
0
–10
–30
–50 –30 –10
–40 –20
V
CC
= V
PS
= 2.7 V
f
in
= 1 575 MHz
–20
P
in (1dB)
= –23.7 dBm
10
0
–10
–30
–50 –30 –10
–40 –20
V
CC
= V
PS
= 1.8 V
f
in
= 1 575 MHz
–20
P
in (1dB)
= –23.9 dBm
Input Power P
in
(dBm)
–50 –30 –10
–40 –20 0
Circuit Current I
CC
(mA)
10
8
6
4
2
0
G
P
I
CC
25
20
15
10
5
0
V
CC
= V
PS
= 1.8 V
f
in
= 1 575 MHz
–50 –30 –10
–40 –20 0
10
8
6
4
2
0
G
P
I
CC
P
in (1dB)
= –23.7 dBm P
in (1dB)
= –23.9 dBm
0
+20
–40
–60
–80
–20
–100
–40 –20 0
–30 –10
V
CC
= V
PS
= 2.7 V
f
in
1 = 1 575 MHz
f
in
2 = 1 574 MHz
P
out
IM
3
IIP
3
= –9.3 dBm
0
+20
–40
–60
–80
–20
–100
–40 –20 0
–30 –10
V
CC
= V
PS
= 1.8 V
f
in
1 = 1 575 MHz
f
in
2 = 1 574 MHz
P
out
IM
3
IIP
3
= –10.5 dBm
Input Power P
in
(dBm)
Output Power P
out
(dBm)
OUTPUT POWER vs. INPUT POWER
Input Power P
in
(dBm)
Output Power P
out
(dBm)
OUTPUT POWER vs. INPUT POWER
POWER GAIN, CIRCUIT CURRENT
vs. INPUT POWER
Power Gain G
P
(dB)
Input Power P
in
(dBm)
Circuit Current I
CC
(mA)
Input Power P
in
(dBm)
Output Power P
out
(dBm)
3rd Order Intermodulation Distortion IM
3
(dBm)
OUTPUT POWER, IM3 vs. INPUT POWER
Input Power P
in
(dBm)
Output Power P
out
(dBm)
3rd Order Intermodulation Distortion IM
3
(dBm)
OUTPUT POWER, IM3 vs. INPUT POWER
Remark The graphs indicate nominal characteristics.
Data Sheet PU10706EJ01V0DS 7
μ
PC8233TK
–15
–20
–25
–30
–35
–50 25 100
–25
VCC = VPS
fin = 1 575 MHz
050 75
VCC = 2.7 V
1.8 V
VCC = VPS
fin1 = 1 575 MHz
fin2 = 1 574 MHz
OIP3
IIP3
20
15
10
5
0
–5
–10
–15
–50 25 100
–25 0 50 75
VCC = 2.7 V
1.8 V
VCC = 2.7 V
1.8 V
20
15
10
5
0
0
1
1.5 3.0 3.5 4.0 4.5 5.0
0.5
VCC = VPS = 2.7 V
1.0 2.0 2.5
20
15
10
5
0
0
1
1.5 3.0 3.5 4.0 4.5 5.0
0.5
VCC = VPS = 1.8 V
1.0 2.0 2.5
Input 3rd Order Intercept Point IIP3 (dBm)
Output 3rd Order Intercept Point OIP3 (dBm)
IIP3, OIP3 vs. OPERATING AMBIENT
TEMPERATURE
Operating Ambient Temperature TA (°C)
Gain 1 dB Compression Input Power Pin (1 dB) (dBm)
GAIN 1 dB COMPRESSION INPUT POWER
vs. OPERATING AMBIENT TEMPERATURE
Operating Ambient Temperature TA (°C)
Frequency fin (GHz)
K factor K
K FACTOR vs. FREQUENCY
Frequency fin (GHz)
K factor K
K FACTOR vs. FREQUENCY
Remark The graphs indicate nominal characteristics.
Data Sheet PU10706EJ01V0DS
8
μ
PC8233TK
S-PARAMETERS (TA = +25°C, VCC = VPS = 2.7 V, monitored at connector on board)
START 100.000 000 MHz STOP 4 100.000 000 MHz
1
START 100.000 000 MHz STOP 4 100.000 000 MHz
1:1 575 MHz
40.093
Ω
10.062
Ω
0
–5
–10
–15
–20
02 000 4 000
500 3 000
1 000 2 500
1 500 3 500
0
–5
–10
–15
–20
02 000 4 000
500 3 000
1 000 2 500
1 500 3 500
30
20
15
5
0
02 000 4 000
500 3 000
1 000 2 500
1 500 3 500
10
0
–10
–20
–30
–50
–70
02 000 4 000
500 3 000
1 000 2 500
1 500 3 500
–40
1:1 575 MHz
99.287
Ω
–6.175
Ω
1
25
–60
S
11
–FREQUENCY
S
22
–FREQUENCY
Frequency fin (MHz)
Input Return Loss RLin (dB)
INPUT RETURN LOSS vs. FREQUENCY
Frequency fin (MHz)
OUTPUT RETURN LOSS vs. FREQUENCY
Output Return Loss RLout (dB)
Frequency fin (MHz)
Power Gain GP (dB)
POWER GAIN vs. FREQUENCY
Frequency fin (MHz)
ISOLATION vs. FREQUENCY
Isolation ISL (dB)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10706EJ01V0DS 9
μ
PC8233TK
S-PARAMETERS (TA = +25°C, VCC = VPS = 1.8 V, monitored at connector on board)
START 100.000 000 MHz STOP 4 100.000 000 MHz START 100.000 000 MHz STOP 4 100.000 000 MHz
1:1 575 MHz
41.920
Ω
12.280
Ω
0
–5
–10
–15
–20
02 000 4 000
500 3 000
1 000 2 500
1 500 3 500
0
–5
–10
–15
–20
02 000 4 000
500 3 000
1 000 2 500
1 500 3 500
30
20
15
5
0
02 000 4 000
500 3 000
1 000 2 500
1 500 3 500
10
0
–10
–20
–30
–50
–70
02 000 4 000
500 3 000
1 000 2 500
1 500 3 500
–40
1:1 575 MHz
99.659
Ω
–13.768
Ω
1
25
–60
1
S
11
–FREQUENCY
S
22
–FREQUENCY
Frequency fin (MHz)
Input Return Loss RLin (dB)
INPUT RETURN LOSS vs. FREQUENCY
Frequency fin (MHz)
OUTPUT RETURN LOSS vs. FREQUENCY
Output Return Loss RLout (dB)
Frequency fin (MHz)
Power Gain GP (dB)
POWER GAIN vs. FREQUENCY
Frequency fin (MHz)
ISOLATION vs. FREQUENCY
Isolation ISL (dB)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10706EJ01V0DS
10
μ
PC8233TK
PACKAGE DIMENSIONS
6-PIN LEAD-LESS MINIMOLD (1511 PKG) (UNIT: mm)
0.48±0.050.48±0.05
1.5±0.1
1.3±0.05
1.1±0.1
0.55±0.03
0.11+0.1
–0.05 0.16±0.05
0.9±0.10.2±0.1
(Bottom View)
(Top View)
Data Sheet PU10706EJ01V0DS 11
μ
PC8233TK
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground terminals must be connected together with wide ground pattern to decrease impedance
difference.
(3) The bypass capacitor should be attached to VCC line.
(4) Do not supply DC voltage to INPUT pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method Soldering Conditions Condition Symbol
Infrared Reflow Peak temperature (package surface temperature) : 260°C or below
Time at peak temperature : 10 seconds or less
Time at temperature of 220°C or higher : 60 seconds or less
Preheating time at 120 to 180°C : 120±30 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
IR260
Wave Soldering Peak temperature (molten solder temperature) : 260°C or below
Time at peak temperature : 10 seconds or less
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes : 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
WS260
Partial Heating Peak temperature (terminal temperature) : 350°C or below
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PU10706EJ01V0DS
12
μ
PC8233TK
The information in this document is current as of February, 2008. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-
designated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
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•
•
•
•
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M8E 02. 11-1
(1)
(2)
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
"Standard":
"Special":
"Specific":
μ
PC8233TK
