TD83C51FA-2 - Intel - Datasheet.Live

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changes to these specifications at any time, without notice. Microcomputer Products may have minor variations to this specification known as errata.

8XC51FX

CHMOS SINGLE-CHIP 8-BIT MICROCONTROLLERS

Commercial/Express

87C51FA/83C51FA/80C51FA/87C51FB/83C51FB/87C51FC/83C51FC

*See Table 1 for Proliferation Options

YHigh Performance CHMOS

EPROM/ROM/CPU

Y12/24/33 MHz Operation

YThree 16-Bit Timer/Counters

YProgrammable Counter Array with:

Ð High Speed Output,

Ð Compare/Capture,

Ð Pulse Width Modulator,

Ð Watchdog Timer Capabilities

YUp/Down Timer/Counter

YThree Level Program Lock System

Y8K/16K/32K On-Chip Program Memory

Y256 Bytes of On-Chip Data RAM

YImproved Quick Pulse Programming

Algorithm

YBoolean Processor

Y32 Programmable I/O Lines

Y7 Interrupt Sources

YFour Level Interrupt Priority

YProgrammable Serial Channel with:

Ð Framing Error Detection

Ð Automatic Address Recognition

YTTL Compatible Logic Levels

Y64K External Program Memory Space

Y64K External Data Memory Space

YMCSÉ51 Controller Compatible

Instruction Set

YPower Saving Idle and Power Down

Modes

YONCE (On-Circuit Emulation) Mode

YExtended Temperature Range Except

for 33 MHz Offering (b40§Ctoa

85§C)

MEMORY ORGANIZATION

Device

ROM

Version

EPROM ROMLESS

Version

ROM/

Bytes

RAM

EPROM

Bytes

83C51FA 87C51FA 80C51FA 8K 256

83C51FB 87C51FB 80C51FA 16K 256

83C51FC 87C51FC 80C51FA 32K 256

These devices can address up to 64 Kbytes of external program/data memory.

The Intel 87C51FA/8XC51FB/8XC51FC is a single-chip control oriented microcontroller which is fabricated on

Intel’s reliable CHMOS III-E technology. The Intel 83C51FA/80C51FA is fabricated on CHMOS III technology.

Being a member of the MCSÉ51 controller family, the 8XC51FA/8XC51FB/8XC51FC uses the same powerful

instruction set, has the same architecture, and is pin-for-pin compatible with the existing MCS 51 controller

products. The 8XC51FA/8XC51FB/8XC51FC is an enhanced version of the 8XC52/8XC54/8XC58. Its added

features make it an even more powerful microcontroller for applications that require Pulse Width Modulation,

High Speed I/O and up/down counting capabilities such as motor control.

For the remainder of this document, the 8XC51FA, 8XC51FB, 8XC51FC will be referred to as the 8XC51FX,

unless information applies to a specific device.

8XC51FX

Table 1. Proliferation Options

Standard*1-1 -2 -24 -33

80C51FA X X X X X

83C51FA X X X X X

87C51FA X X X X X

83C51FB X X X X X

87C51FB X X X X X

83C51FC X X X X X

87C51FC X X X X X

NOTES:

*1 3.5 MHz to 12 MHz; 5V g20%

-1 3.5 MHz to 16 MHz; 5V g20%

-2 0.5 MHz to 12 MHz; 5V g20%

-24 3.5 MHz to 24 MHz; 5V g20%

-33 3.5 MHz to 33 MHz; 5V g10%

272322–1

Figure 1. 8XC51FX Block Diagram

8XC51FX

PROCESS INFORMATION

The 87C51FA/8XC51FB/8XC51FC is manufactured

on P629.0, a CHMOS III-E process. Additional pro-

cess and reliability information is available in Intel’s

Components Quality and Reliability Handbook,

Or-

der No. 210997.

PACKAGES

Part Prefix Package Type

8XC51FX P 40-Pin Plastic DIP

D 40-Pin CERDIP

N 44-Pin PLCC

S 44-Pin QFP

272322–2

DIP

272322–23

PLCC

272322–24

*Do not connect Reserved Pins.

QFP

Figure 2. Pin Connections

8XC51FX

PIN DESCRIPTIONS

VCC:Supply voltage.

VSS:Circuit ground.

VSS1:Secondary ground (not on DIP devices or any

83C51FA/80C51FA device). Provided to reduce

ground bounce and improve power supply by-pass-

ing.

NOTE:

This pin is not a substitution for the VSS pin. (Con-

nection not necessary for proper operation.)

Port 0: Port 0 is an 8-bit, open drain, bidirectional

I/O port. As an output port each pin can sink several

LS TTL inputs. Port 0 pins that have 1’s written to

them float, and in that state can be used as high-im-

pedance inputs.

Port 0 is also the multiplexed low-order address and

data bus during accesses to external Program and

Data Memory. In this application it uses strong inter-

nal pullups when emitting 1’s, and can source and

sink several LS TTL inputs.

Port 0 also receives the code bytes during EPROM

programming, and outputs the code bytes during

program verification. External pullup resistors are re-

quired during program verification.

Port 1: Port 1 is an 8-bit bidirectional I/O port with

internal pullups. The Port 1 output buffers can drive

LS TTL inputs. Port 1 pins that have 1’s written to

them are pulled high by the internal pullups, and in

that state can be used as inputs. As inputs, Port 1

pins that are externally pulled low will source current

(IIL, on the data sheet) because of the internal pull-

ups.

In addition, Port 1 serves the functions of the follow-

ing special features of the 8XC51FX:

Port Pin Alternate Function

P1.0 T2 (External Count Input to Timer/

Counter 2), Clock Out

P1.1 T2EX (Timer/Counter 2 Capture/

Reload Trigger and Direction Control)

P1.2 ECI (External Count Input to the PCA)

P1.3 CEX0 (External I/O for Compare/

Capture Module 0)

P1.4 CEX1 (External I/O for Compare/

Capture Module 1)

P1.5 CEX2 (External I/O for Compare/

Capture Module 2)

P1.6 CEX3 (External I/O for Compare/

Capture Module 3)

P1.7 CEX4 (External I/O for Compare/

Capture Module 4)

Port 1 receives the low-order address bytes during

EPROM programming and verifying.

Port 2: Port 2 is an 8-bit bidirectional I/O port with

internal pullups. The Port 2 output buffers can drive

LS TTL inputs. Port 2 pins that have 1’s written to

them are pulled high by the internal pullups, and in

that state can be used as inputs. As inputs, Port 2

pins that are externally pulled low will source current

(IIL, on the data sheet) because of the internal pull-

ups.

Port 2 emits the high-order address byte during

fetches from external Program Memory and during

accesses to external Data Memory that use 16-bit

addresses (MOVX @DPTR). In this application it

uses strong internal pullups when emitting 1’s. Dur-

ing accesses to external Data Memory that use 8-bit

addresses (MOVX @Ri), Port 2 emits the contents of

the P2 Special Function Register.

Some Port 2 pins receive the high-order address bits

during EPROM programming and program verifica-

tion.

Port 3: Port 3 is an 8-bit bidirectional I/O port with

internal pullups. The Port 3 output buffers can drive

LS TTL inputs. Port 3 pins that have 1’s written to

them are pulled high by the internal pullups, and in

that state can be used as inputs. As inputs, Port 3

pins that are externally pulled low will source current

(IIL, on the data sheet) because of the pullups.

8XC51FX

Port 3 also serves the functions of various special

features of the MCS-51 Family, as listed below:

Port Pin Alternate Function

P3.0 RXD (serial input port)

P3.1 TXD (serial output port)

P3.2 INT0 (external interrupt 0)

P3.3 INT1 (external interrupt 1)

P3.4 T0 (Timer 0 external input)

P3.5 T1 (Timer 1 external input)

P3.6 WR (external data memory write strobe)

P3.7 RD (external data memory read strobe)

RST: Reset input. A high on this pin for two machine

cycles while the oscillator is running resets the de-

vice. The port pins will be driven to their reset condi-

tion when a minimum VIH1 voltage is applied wheth-

er the oscillator is running or not. An internal pull-

down resistor permits a power-on reset with only a

capacitor connected to VCC.

ALE: Address Latch Enable output pulse for latching

the low byte of the address during accesses to ex-

ternal memory. This pin (ALE/PROG) is also the

program pulse input during EPROM programming for

the 87C51FX.

In normal operation ALE is emitted at a constant

rate of (/6 the oscillator frequency, and may be used

for external timing or clocking purposes. Note, how-

ever, that one ALE pulse is skipped during each ac-

cess to external Data Memory.

If desired, ALE operation can be disabled by setting

bit 0 of SFR location 8EH. With this bit set, the pin is

weakly pulled high. However, the ALE disable fea-

ture will be suspended during a MOVX or MOVC in-

struction, idle mode, power down mode and ICE

mode. The ALE disable feature will be terminated by

reset. When the ALE disable feature is suspended or

terminated, the ALE pin will no longer be pulled up

weakly. Setting the ALE-disable bit has no affect if

the microcontroller is in external execution mode.

Throughout the remainder of this data sheet, ALE

will refer to the signal coming out of the ALE/PROG

pin, and the pin will be referred to as the ALE/PROG

pin.

PSEN:Program Store Enable is the read strobe to

external Program Memory.

When the 8XC51FX is executing code from external

Program Memory, PSEN is activated twice each ma-

chine cycle, except that two PSEN activations are

skipped during each access to external Data Memo-

ry.

EA/VPP:External Access enable. EA must be

strapped to VSS in order to enable the device to

fetch code from external Program Memory locations

0000H to 0FFFH. Note, however, that if either of the

Program Lock bits are programmed, EA will be inter-

nally latched on reset.

EA should be strapped to VCC for internal program

executions.

This pin also receives the programming supply volt-

age (VPP) during EPROM programming.

XTAL1: Input to the inverting oscillator amplifier.

XTAL2: Output from the inverting oscillator amplifi-

er.

OSCILLATOR CHARACTERISTICS

XTAL1 and XTAL2 are the input and output, respec-

tively, of a inverting amplifier which can be config-

ured for use as an on-chip oscillator, as shown in

Figure 3. Either a quartz crystal or ceramic resonator

may be used. More detailed information concerning

the use of the on-chip oscillator is available in Appli-

cation Note AP-155, ‘‘Oscillators for Microcontrol-

lers.’’

To drive the device from an external clock source,

XTAL1 should be driven, while XTAL2 floats, as

shown in Figure 4. There are no requirements on the

duty cycle of the external clock signal, since the in-

put to the internal clocking circuitry is through a

divide-by-two flip-flop, but minimum and maximum

high and low times specified on the data sheet must

be observed.

An external oscillator may encounter as much as a

100 pF load at XTAL1 when it starts up. This is due

to interaction between the amplifier and its feedback

capacitance. Once the external signal meets the VIL

and VIH specifications the capacitance will not ex-

ceed 20 pF.

8XC51FX

272322–3

C1, C2 e30 pF g10 pF for Crystals

For Ceramic Resonators, contact resonator manufacturer.

Figure 3. Oscillator Connections

272322–4

Figure 4. External Clock Drive Configuration

IDLE MODE

The user’s software can invoke the Idle Mode. When

the microcontroller is in this mode, power consump-

tion is reduced. The Special Function Registers and

the onboard RAM retain their values during Idle, but

the processor stops executing instructions. Idle

Mode will be exited if the chip is reset or if an en-

abled interrupt occurs. The PCA timer/counter can

optionally be left running or paused during Idle

Mode.

POWER DOWN MODE

To save even more power, a Power Down mode can

be invoked by software. In this mode, the oscillator

is stopped and the instruction that invoked Power

Down is the last instruction executed. The on-chip

RAM and Special Function Registers retain their val-

ues until the Power Down mode is terminated.

On the 8XC51FX either hardware reset or external

interrupt can cause an exit from Power Down. Reset

redefines all the SFRs but does not change the on-

chip RAM. An external interrupt allows both the

SFRs and the on-chip RAM to retain their values.

To properly terminate Power Down the reset or ex-

ternal interrupt should not be executed before VCC is

restored to its normal operating level and must be

held active long enough for the oscillator to restart

and stabilize (normally less than 10 ms).

With an external interrupt, INT0 or INT1 must be en-

abled and configured as level-sensitive. Holding the

pin low restarts the oscillator but bringing the pin

back high completes the exit. Once the interrupt is

serviced, the next instruction to be executed after

RETI will be the one following the instruction that put

the device into Power Down.

DESIGN CONSIDERATION

#Ambient light is known to affect the internal RAM

contents during operation. If the 87C51FX appli-

cation requires the part to be run under ambient

lighting, an opaque label should be placed over

the window to exclude light.

#When the idle mode is terminated by a hardware

reset, the device normally resumes program exe-

cution, from where it left off, up to two machine

cycles before the internal reset algorithm takes

control. On-chip hardware inhibits access to inter-

nal RAM in this event, but access to the port pins

is not inhibited. To eliminate the possibility of an

unexpected write when Idle is terminated by re-

set, the instruction following the one that invokes

Idle should not be one that writes to a port pin or

to external memory.

Table 2. Status of the External Pins during Idle and Power Down

Mode Program ALE PSEN PORT0 PORT1 PORT2 PORT3

Memory

Idle Internal 1 1 Data Data Data Data

Idle External 1 1 Float Data Address Data

Power Down Internal 0 0 Data Data Data Data

Power Down External 0 0 Float Data Data Data

NOTE:

For more detailed information on the reduced power modes refer to current Embedded Microcontrollers and Processors

Handbook Volume I, and Application Note AP-252 (Embedded Applications Handbook), ‘‘Designing with the 80C51BH.’’

8XC51FX

ONCE MODE

The ONCE (‘‘On-Circuit Emulation’’) Mode facilitates

testing and debugging of systems using the

8XC51FX without the 8XC51FX having to be re-

moved from the circuit. The ONCE Mode is invoked

by:

1) Pull ALE low while the device is in reset and

PSEN is high;

2) Hold ALE low as RST is deactivated.

While the device is in ONCE Mode, the Port 0 pins

float, and the other port pins and ALE and PSEN are

weakly pulled high. The oscillator circuit remains ac-

tive. While the 8XC51FX is in this mode, an emulator

or test CPU can be used to drive the circuit. Normal

operation is restored when a normal reset is applied.

8XC51FX EXPRESS

The Intel EXPRESS system offers enhancements to

the operational specifications of the MCS-51 family

of microcontrollers. These EXPRESS products are

designed to meet the needs of those applications

whose operating requirements exceed commercial

standards.

The EXPRESS program includes the commercial

standard temperature range with burn-in and an ex-

tended temperature range with or without burn-in.

With the commercial standard temperature range,

operational characteristics are guaranteed over the

temperature range of 0§Cto70

C. With the extend-

ed temperature range option, operational character-

istics are guaranteed over the range of b40§Cto

85§C.

The optional burn-in is dynamic for a minimum time

of 168 hours at 125§C with VCC e6.9V g0.25V,

following guidelines in MlL-STD-883, Method 1015.

Package types and EXPRESS versions are identified

by a one- or two-letter prefix to the part number. The

prefixes are listed in Table 3.

For the extended temperature range option, this

data sheet specifies the parameters which deviate

from their commercial temperature range limits.

NOTE:

Intel offers Express Temperature specifica-

tions for all 8XC51FX speed options except

for 33 MHz.

Table 3. Prefix Identification

Prefix Package Type Temperature Range Burn-In

D Cerdip Commercial No

N PLCC Commercial No

P Plastic Commercial No

S QFP Commercial No

LD Cerdip Extended Yes

LN PLCC Extended Yes

LP Plastic Extended Yes

LS QFP Extended Yes

TD Cerdip Extended No

TN PLCC Extended No

TP Plastic Extended No

TS QFP Extended No

NOTE:

Contact distributor or local sales office to match EXPRESS prefix with proper device.

EXAMPLES:

P87C51FC indicates 87C51FC in a plastic package and specified for commercial temperature range, without burn-in.

LD87C51FC indicates 87C51FC in a cerdip package and specified for extended temperature range with burn-in.

8XC51FX

ABSOLUTE MAXIMUM RATINGS*

Ambient Temperature Under Bias Àb40§Ctoa

85§C

Storage Temperature ÀÀÀÀÀÀÀÀÀÀb65§Ctoa

150§C

Voltage on EA/VPP Pin to VSS ÀÀÀÀÀÀÀ0V to a13.0V

Voltage on Any Other Pin to VSS ÀÀb0.5V to a6.5V

IOL per I/O Pin ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ15 mA

Power DissipationÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ1.5W

(based on PACKAGE heat transfer limitations, not

device power consumption)

NOTICE: This data sheet contains preliminary infor-

mation on new products in production. It is valid for

the devices indicated in the revision history. The

specifications are subject to change without notice.

WARNING: Stressing the device beyond the ‘‘Absolute

Maximum Ratings’’ may cause permanent damage.

These are stress ratings only. Operation beyond the

‘‘Operating Conditions’’ is not recommended and ex-

tended exposure beyond the ‘‘Operating Conditions’’

may affect device reliability.

OPERATING CONDITIONS

Symbol Description Min Max Units

TAAmbient Temperature Under Bias

Commercial 0 a70 §C

Express b40 a85

VCC Supply Voltage

8XC51FX-33 4.5 5.5 V

All Others 4.0 6.0

fOSC Oscillator Frequency

8XC51FX 3.5 12

8XC51FX-1 3.5 16 MHz

8XC51FX-2 0.5 12

8XC51FX-24 3.5 24

8XC51FX-33 3.5 33

DC CHARACTERISTICS (Over Operating Conditions)

All parameter values apply to all devices unless otherwise indicated.

Symbol Parameter Min Typical Max Units Test Conditions

(Note 4)

VIL Input Low Voltage b0.5 0.2 VCC b0.1 V

VIL1 Input Low Voltage EA 0 0.2 VCC b0.3 V

VIH Input High Voltage 0.2 VCC a0.9 VCC a0.5 V

(Except XTAL1, RST)

VIH1 Input High Voltage 0.7 VCC VCC a0.5 V

(XTAL1, RST)

VOL Output Low Voltage (Note 5) 0.3 IOL e100 mA

(Ports 1, 2 and 3) 0.45 V IOL e1.6 mA (Note 1)

1.0 IOL e3.5 mA

VOL1 Output Low Voltage (Note 5) 0.3 IOL e200 mA

(Port 0, ALE/PROG, PSEN) 0.45 V IOL e3.2 mA (Note 1)

1.0 IOL e7.0 mA

VOH Output High Voltage VCC b0.3 IOH eb

10 mA

(Ports 1, 2 and 3 VCC b0.7 V IOH eb

30 mA (Note 2)

ALE/PROG and PSEN)V

CC b1.5 IOH eb

60 mA

VOH1 Output High Voltage VCC b0.3 IOH eb

200 mA

(Port 0 in External Bus Mode) VCC b0.7 V IOH eb

3.2 mA (Note 2)

VCC b1.5 IOH eb

7.0 mA

83C51FA/80C51FA (Express) IOH eb

6.0 mA

IIL Logical 0 Input Current b50 mAV

IN e0.45V

(Ports 1, 2 and 3)

8XC51FX

DC CHARACTERISTICS (Over Operating Conditions)

All parameter values apply to all devices unless otherwise indicated. (Continued)

Symbol Parameter Min Typical Max Units Test Conditions

(Note 4)

ILI Input leakage Current (Port 0) g10 mAV

IN eVIL or VIH

ITL Logical 1 to 0 Transition Current VIN e2V

(Ports 1, 2 and 3)

Express b750 mA

Commercial b650

RRST RST Pulldown Resistor 40 225 KX

CIO Pin Capacitance 10 pF @1MHz, 25§C

ICC Power Supply Current: (Note 3)

Active Mode

At 12 MHz (Figure 5) 15 30 mA

At 16 MHz 20 38 mA

At 24 MHz 28 56 mA

At 33 MHz 35 56 mA

Idle Mode

At 12 MHz (Figure 5) 5 7.5 mA

At 16 MHz 6 9.5 mA

At 24 MHz 7 13.5 mA

At 33 MHz 7 15 mA

Power Down Mode 5 75 mA

NOTES:

1. Capacitive loading on Ports 0 and 2 may cause noise pulses above 0.4V to be superimposed on the VOLs of ALE and

Ports 1, 2 and 3. The noise is due to external bus capacitance discharging into the Port 0 and Port 2 pins when these pins

change from 1 to 0. In applications where capacitance loading exceeds 100 pF, the noise pulses on these signals may

exceed 0.8V. It may be desirable to qualify ALE or other signals with a Schmitt Trigger, or CMOS-level input logic.

2. Capacitive loading on Ports 0 and 2 cause the VOH on ALE and PSEN to drop below the 0.9 VCC specification when the

address lines are stabilizing.

3. See Figures 6–9 for test conditions. Minimum VCC for power down is 2V.

4. Typicals are based on limited number of samples, and are not guaranteed. The values listed are at room temperature and 5V.

5. Under steady state (non-transient) conditions, IOL must be externally limited as follows:

Maximum IOL per port pin: 10 mA

Maximum IOL per 8-bit port -

Port 0: 26 mA

Ports 1, 2, and 3: 15 mA

Maximum total IOL for all output pins: 71 mA

If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater

than the listed test conditions.

272322–5

Note:

ICC max at 33 MHz is at 5V g10% VCC, while ICC max at 24 MHz and below is at 5V g20% VCC.

Figure 5. 8XC51FA/FB/FC ICC vs Frequency

8XC51FX

272322–6

All other pins disconnected

TCLCH eTCHCL e5ns

Figure 6. ICC Test Condition, Active Mode

272322–7

All other pins disconnected

TCLCH eTCHCL e5ns

Figure 7. ICC Test Condition Idle Mode

272322–8

All other pins disconnected

Figure 8. ICC Test Condition, Power Down Mode.

VCC e2.0V to 6.0V.

272322–19

Figure 9. Clock Signal Waveform for ICC Tests in Active and Idle Modes. TCLCH eTCHCL e5 ns.

8XC51FX

EXPLANATION OF THE AC SYMBOLS

Each timing symbol has 5 characters. The first char-

acter is always a ‘T’ (stands for time). The other

characters, depending on their positions, stand for

the name of a signal or the logical status of that

signal. The following is a list of all the characters and

what they stand for.

A: Address

C: Clock

D: Input Data

H: Logic level HIGH

I: Instruction (program memory contents)

L: Logic level LOW, or ALE

P: PSEN

Q: Output Data

R: RD signal

T: Time

V: Valid

W: WR signal

X: No longer a valid logic level

Z: Float

For example,

TAVLL eTime from Address Valid to ALE Low

TLLPL eTime from ALE Low to PSEN Low

AC CHARACTERISTICS (Over Operating Conditions, Load Capacitance for Port 0, ALE/PROG and

PSEN e100 pF, Load Capacitance for All Other Outputs e80 pF)

EXTERNAL MEMORY CHARACTERISTICS

All parameter values apply to all devices unless otherwise indicated. In this table, 8XC51FX refers to

8XC51FX, 8XC51FX-1 and 8XC51FX-2.

Symbol Parameter

Oscillator

Units

12 MHz 24 MHz 33 MHz Variable

Min Max Min Max Min Max Min Max

1/TCLCL Oscillator Frequency

MHz

8XC51FX 3.5 12

8XC51FX-1 3.5 16

8XC51FX-2 0.5 12

8XC51FX-24 3.5 24

8XC51FX-33 3.5 33

TLHLL ALE Pulse Width 127 43 21 2TCLCLb40 ns

TAVLL Address Valid to ALE Low

8XC51FX 43 TCLCLb40 ns

8XC51FX-24 12 TCLCLb30 ns

8XC51FX-33 5 TCLCLb25 ns

TLLAX Address Hold After ALE Low

8XC51FX/-24 53 12 TCLCLb30 ns

8XC51FX-33 5 TCLCLb25 ns

TLLIV ALE Low to Valid Instr In

8XC51FX 234 4TCLCLb100 ns

8XC51FX-24 91 4TCLCLb75 ns

8XC51FX-33 56 4TCLCLb65 ns

TLLPL ALE Low to PSEN Low

8XC51FX/-24 53 12 TCLCLb30 ns

8XC51FX-33 5 TCLCLb25 ns

TPLPH PSEN Pulse Width 205 80 46 3TCLCLb45

TPLIV PSEN Low to Valid Instr In

8XC51FX 145 3TCLCLb105 ns

8XC51FX-24 35 3TCLCLb90 ns

8XC51FX-33 35 3TCLCLb55 ns

TPXIX Input Instr Hold after PSEN 000 0 ns

8XC51FX

EXTERNAL MEMORY CHARACTERISTICS (Continued)

All parameter values apply to all devices unless otherwise indicated

Symbol Parameter

Oscillator

Units

12 MHz 24 MHz 33 MHz Variable

Min Max Min Max Min Max Min Max

TPXIZ Input Instr Float After PSEN

8XC51FX 59 TCLCL-25 ns

8XC51FX-24 21 TCLCL-20 ns

8XC51FX-33 5 TCLCL-25 ns

TAVIV Address to Valid Instr In

8XC51FX/-24 312 103 5TCLCLb105 ns

8XC51FX-33 71 5TCLCLb80 ns

TPLAZ PSEN Low to Address Float 10 10 10 10 ns

TRLRH RD Pulse Width 400 150 82 6TCLCLb100 ns

TWLWH WR Pulse Width 400 150 82 6TCLCLb100 ns

TRLDV RD Low to Valid Data In

8XC51FX 252 5TCLCLb165 ns

8XC51FX-24 113 5TCLCLb95 ns

8XC51FX-33 61 5TCLCLb90 ns

TRHDX Data Hold After RD 000 0 ns

TRHDZ Data Float After RD

8XC51FX/24 107 23 2TCLCLb60 ns

8XC51FX-33 35 2TCLCLb25 ns

TLLDV ALE Low to Valid Data In

8XC51FX 517 8TCLCLb150 ns

8XC51FX-24/33 243 150 8TCLCLb90 ns

TAVDV Address to Valid Data In

8XC51FX 585 9TCLCLb165 ns

8XC51FX-24/33 285 180 9TCLCLb90 ns

TLLWL ALE Low to RD or WR Low 200 300 75 175 41 140 3TCLCLb50 3TCLCLa50 ns

TAVWL Address to RD or WR Low

8XC51FX 203 4TCLCLb130 ns

8XC51FX-24 77 4TCLCLb90 ns

8XC51FX-33 46 4TCLCLb75 ns

TQVWX Data Valid to WR Transition

8XC51FX 33 TCLCLb50 ns

8XC51FX-24/33 12 0 TCLCLb30 ns

TWHQX Data Hold After WR

8XC51FX 33 TCLCLb50 ns

8XC51FX-24 7 TCLCLb35 ns

8XC51FX-33 3 TCLCLb27 ns

TQVWH Data Valid to WR High

8XC51FX 433 7TCLCLb150 ns

8XC51FX-24/33 222 142 7TCLCLb70 ns

TRLAZ RD Low to Address Float 0 0 0 0 ns

TWHLH RD or WR High to ALE High

8XC51FX 43 123 TCLCLb40 TCLCLa40 ns

8XC51FX-24 12 71 TCLCLb30 TCLCLa30 ns

8XC51FX-33 5 55 TCLCLb25 TCLCLa25 ns

8XC51FX

EXTERNAL PROGRAM MEMORY READ CYCLE

272322–9

EXTERNAL DATA MEMORY READ CYCLE

272322–10

EXTERNAL DATA MEMORY WRITE CYCLE

272322–11

8XC51FX

SERIAL PORT TIMINGÐSHIFT REGISTER MODE

Test Conditions: Over Operating Conditions; Load Capacitance e80 pF

Symbol Parameter

Oscillator

Units

12 MHz 24 MHz 33 MHz Variable

Min Max Min Max Min Max Min Max

TXLXL Serial Port 1 0.50 0.36 12TCLCL ms

Clock

Cycle Time

TQVXH Output Data 700 284 167 10TCLCLb133 ns

Setup to Clock

Rising Edge

TXHQX Output Data

Hold After Clock

Rising Edge

8XC51FX 50 2TCLCLb117 ns

8XC51FX-24/33 34 10 2TCLCLb50 ns

TXHDX Input Data Hold 0 0 0 0 ns

After Clock

Rising Edge

TXHDV Clock Rising 700 283 167 10TCLCLb133 ns

Edge to Input

Data Valid

SHIFT REGISTER MODE TIMING WAVEFORMS

272322–12

8XC51FX

EXTERNAL CLOCK DRIVE

Symbol Parameter Min Max Units

1/TCLCL Oscillator Frequency MHz

8XC51FX 3.5 12 MHz

8XC51FX-1 3.5 16 MHz

8XC51FX-2 0.5 12 MHz

8XC51FX-24 3.5 24 MHz

8XC51FX-33 3.5 33 MHz

TCHCX High Time 20 ns

8XC51FX-24/33 0.35 TOSC 0.65 TOSC ns

TCLCX Low Time 20 ns

8XC51FX-24/33 0.35 TOSC 0.65 TOSC ns

TCLCH Rise Time 20 ns

8XC51FX-24 10 ns

8XC51FX-33 5 ns

TCHCL Fall Time 20 ns

8XC51FX-24 10 ns

8XC51FX-33 5 ns

EXTERNAL CLOCK DRIVE WAVEFORM

272322–13

AC TESTING INPUT, OUTPUT WAVEFORMS

272322–14

AC Inputs during testing are driven at VCCb0.5V for a Logic ‘‘1’’

and 0.45V for a Logic ‘‘0’’. Timing measurements are made at VIH

min for a Logic ‘‘1’’ and VOL max for a Logic ‘‘0’’.

FLOAT WAVEFORMS

272322–15

For timing purposes a port pin is no longer floating when a

100 mV change from load voltage occurs, and begins to float

when a 100 mV change from the loaded VOH/VOL level occurs.

IOL/IOH eg20 mA.

8XC51FX

PROGRAMMING THE EPROM/OTP

To be programmed, the part must be running with a

4 to 6 MHz oscillator. (The reason the oscillator

needs to be running is that the internal bus is being

used to transfer address and program data to appro-

priate internal EPROM locations.) The address of an

EPROM location to be programmed is applied to

Port 1 and pins P2.0 - P2.4 of Port 2, while the code

byte to be programmed into that location is applied

to Port 0. The other Port 2 and 3 pins, RST PSEN,

and EA/VPP should be held at the ‘‘Program’’ levels

indicated in Table 4. ALE/PROG is pulsed low to

program the code byte into the addressed EPROM

location. The setup is shown in Figure 10.

Normally EA/VPP is held at logic high until just be-

fore ALE/PROG is to be pulsed. Then EA/VPP is

raised to VPP, ALE/PROG is pulsed low, and then

EA/VPP is returned to a valid high voltage. The volt-

age on the EA/VPP pin must be at the valid EA/VPP

high level before a verify is attempted. Waveforms

and detailed timing specifications are shown in later

sections of this data sheet.

NOTE:

#EA/VPP pin must not be allowed to go above the

maximum specified VPP level for any amount of

time. Even a narrow glitch above that voltage lev-

el can cause permanent damage to the device.

The VPP source should be well regulated and free

of glitches.

Table 4. EPROM Programming Modes

Mode RST PSEN ALE/ EA/ P2.6 P2.7 P3.3 P3.6 P3.7

PROG VPP

Program Code Data H L ß12.75V L H H H H

Verify Code Data H L H H L L L H H

Program Encryption H L ß12.75V L H H L H

Array Address 0– 3FH

Program Lock Bit 1 H L ß12.75V H H H H H

Bits Bit 2 H L ß12.75V H H H L L

Bit 3 H L ß12.75V H L H H L

Read Signature Byte H L H H L L L L L

272322–20

*See Table 4 for proper input on these pins

Figure 10. Programming the EPROM

8XC51FX

PROGRAMMING ALGORITHM

Refer to Table 4 and Figures 10 and 11 for address,

data, and control signals set up. To program the

87C51FX the following sequence must be exercised.

1. Input the valid address on the address lines.

2. Input the appropriate data byte on the data

lines.

3. Activate the correct combination of control sig-

nals.

4. Raise EA/VPP from VCC to 12.75V g0.25V.

5. Pulse, ALE/PROG 5 times for the EPROM ar-

ray, and 25 times for the encryption table and

the lock bits.

Repeat 1 through 5 changing the address and data

for the entire array or until the end of the object file is

reached.

PROGRAM VERIFY

Program verify may be done after each byte or block

of bytes is programmed. In either case a complete

verify of the programmed array will ensure reliable

programming of the 87C51FX.

The lock bits cannot be directly verified. Verification

of the lock bits is done by observing that their fea-

tures are enabled.

272322–21

Figure 11. Programming Signals Waveforms

ROM and EPROM Lock System

The 87C51FX program lock system, when pro-

grammed, protects the onboard program against

software piracy.

The 83C51FX has a one-level program lock system

and a 64-byte encryption table. See line 2 of Table

5. If program protection is desired, the user submits

the encryption table with their code, and both the

lock-bit and encryption array are programmed by the

factory. The encryption array is not available without

the lock bit. For the lock bit to be programmed, the

user must submit an encryption table. The 83C51FA

does not have protection features.

The 87C51FX has a 3-level program lock system

and a 64-byte encryption array. Since this is an

EPROM device, all locations are user-programma-

ble. See Table 5.

Table 5. Program Lock Bits and the Features

Program Lock Bits ProtectIon Type

LB1 LB2 LB3

1 U U U No Program Lock features enabled. (Code verify will still be encrypted by the

Encryption Array if programmed.)

2 P U U MOVC instructions executed from external program memory are disabled from

fetching code bytes from internal memory, EA is sampled and latched on Reset, and

further programming of the EPROM is disabled.

3 P P U Same as 2, also verify is disabled.

4 P P P Same as 3, also external execution is disabled.

Any other combination of the lock bits is not defined.

8XC51FX

Encryption Array

Within the EPROM array are 64 bytes of Encryption

Array that are initially unprogrammed (all 1’s). Every

time that a byte is addressed during a verify, 6 ad-

dress lines are used to select a byte of the Encryp-

tion Array. This byte is then exclusive-NOR’ed

(XNOR) with the code byte, creating an Encryption

Verify byte. The algorithm, with the array in the un-

programmed state (all 1’s), will return the code in its

original, unmodified form. For programming the En-

cryption Array, refer to Table 4 (Programming the

EPROM).

When using the encryption array, one important fac-

tor needs to be considered. If a code byte has the

value 0FFH, verifying the byte will produce the en-

cryption byte value. lf a large block (l64 bytes) of

code is left unprogrammed, a verification routine will

display the contents of the encryption array. For this

reason all unused code bytes should be pro-

grammed with some value other than 0FFH, and not

all of them the same value. This will ensure maxi-

mum program protection.

Program Lock Bits

The 87C51FX has 3 programmable lock bits that

when programmed according to Table 5 will provide

different levels of protection for the on-chip code

and data.

Erasing the EPROM also erases the encryption ar-

ray and the program lock bits, returning the part to

full functionality.

Reading the Signature Bytes

The 87C51FX has 3 signature bytes in locations

30H, 31H, and 60H. The 83C51FA has 2 signature

bytes in locations 30H and 31H. To read these bytes

follow the procedure for EPROM verify, but activate

the control lines provided in Table 4 for Read Signa-

ture Byte.

Location Device Contents

30H All 89H

31H All 58H

60H 83C51FA 7AH/FAH

87C51FA FAH

83C51FB 7BH/FBH

87C51FB FBH

83C51FC 7CH/FCH

87C51FC FCH

Erasure Characteristics (Windowed

Packages Only)

Erasure of the EPROM begins to occur when the

chip is exposed to light with wavelength shorter than

approximately 4,000 Angstroms. Since sunlight and

fluorescent lighting have wavelengths in this range,

exposure to these light sources over an extended

time (about 1 week in sunlight, or 3 years in room-

level fluorescent lighting) could cause inadvertent

erasure. If an application subjects the device to this

type of exposure, it is suggested that an opaque la-

bel be placed over the window.

The recommended erasure procedure is exposure

to ultraviolet light (at 2537 Angstroms) to an integrat-

ed dose of at least 15 W-sec/cm. Exposing the

EPROM to an ultraviolet lamp of 12,000 mW/cm rat-

ing for 30 minutes, at a distance of about 1 inch,

should be sufficient.

Erasure leaves all the EPROM Cells in a 1’s state.

8XC51FX

EPROM PROGRAMMING AND VERIFICATION CHARACTERISTICS

(TAe21§Cto27

C; VCC e5V g20%; VSS e0V)

Symbol Parameter Min Max Units

VPP Programming Supply Voltage 12.5 13.0 V

IPP Programming Supply Current 75 mA

1/TCLCL Oscillator Frequency 4 6 MHz

TAVGL Address Setup to PROG Low 48TCLCL

TGHAX Address Hold after PROG 48TCLCL

TDVGL Data Setup to PROG Low 48TCLCL

TGHDX Data Hold after PROG 48TCLCL

TEHSH P2.7 (ENABLE) High to VPP 48TCLCL

TSHGL VPP Setup to PROG Low 10 ms

TGHSL VPP Hold after PROG 10 ms

TGLGH PROG Width 90 110 ms

TAVQV Address to Data Valid 48TCLCL

TELQV ENABLE Low to Data Valid 48TCLCL

TEHQZ Data Float after ENABLE 0 48TCLCL

TGHGL PROG High to PROG Low 10 ms

EPROM PROGRAMMING AND VERIFICATION WAVEFORMS

272322–18

NOTE:

*5 pulses for the EPROM array, 25 pulses for the encryption table and lock bits.

8XC51FX

Thermal Impedance

All thermal impedance data is approximate for static

air conditions at 1W of power dissipation. Values will

change depending on operating conditions and ap-

plications. See the Intel Packaging Handbook (Order

No. 240800) for a description of Intel’s thermal im-

pedance test methodology.

Package iJA iJC Device

P45

C/W 16§C/W All

D36

C/W 13§C/W 80C51FA, 83C51FA,

8XC51FC

45§C/W 15§C/W 87C51FA, 8XC51FB

N46

C/W 16§C/W All

S97

C/W 24§C/W FA

96§C/W 24§C/W FB

87§C/W 18§C/W FC

DATA SHEET REVISION HISTORY

Data sheets are changed as new device information becomes available. Verify with your local Intel sales office

that you have the latest version before finalizing a design or ordering devices.

The following differences exist between this datasheet (272322-003) and the previous version (272322-002):

1. Removed 8XC51FX-3 and 8XC51FX-20, replaced with 8XC51FX-24.

2. Included 8XC51FX-24 and 8XC51FX-33 devices.

3. 80C51FA and 83C51FA now have the same features as 87C51FA, 8XC51FB and 8XC51FC; same DC spec

used for all devices.

The following differences exist between the ‘‘-002’’ and ‘‘-001’’ version of 8XC51FX datasheet:

1. Removed 8XC51FX-L from datasheet.

2. Include VOH1 for 83C51FA (Express)/80C51FA (Express).

This 8XC51FX datasheet (272322-001) replaces the following datasheets:

87C51FA/83C51FA/80C51FA 270258-007

83C51FA/80C51FA EXPRESS 270620-001

87C51FA EXPRESS 270619-001

87C51FA-20/-3 272081-002

87C51FB/83C51FB 270563-005

87C51FB-20/-3 83C51FB-20/-3 272080-002

87C51FB/83C51FB EXPRESS 270767-002

87C51FC/83C51FC 270789-004

87C51FC/83C51FC EXPRESS 270903-001

87C51FC-20/-3 83C51FC-20/-3 272028-002