Technical Data 4350 Effective June 2017
Supersedes June 2011
Product features
•11.2 x 11.2 x 9.0mm maximum surface mount
package
•Ferrite core material
•High current carrying capacity, low core losses
•Controlled DCR tolerance for sensing circuits
•Inductance range from 205nH to 950nH
•Current range from 11.5 to 69 amps
•Frequency range up to 2MHz
Applications
•Storage temperature range (component):
-40 °C to +125 °C
•Operating temperature range: -40 °C to +125 °C
(ambient plus self-temperature rise)
•Solder reflow temperature:
J-STD-020 (latest revision) compliant
FP1109
High frequency, high current power inductors
Pb
HALOGEN
HF
FREE
•Multi-phase regulators
•Voltage Regulator Module (VRM)
•Desktop and server VRMs and EVRDs
•Data networking and storage systems
•Graphics cards and battery power systems
•Point-of-load modules
•DCR sensing
Environmental data
SMD Device
2
Technical Data 4350
Effective June 2017
FP1109
High frequency, high current power inductors
www.eaton.com/electronics
Packaging information - mm
Dimensions- mm
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms,I
sat1
3I
rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
4I
sat1: Peak current for approximately 30% rolloff at +25°C.
5I
sat2: Peak current for approximately 30% rolloff at +125°C.
6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K *L *ΔI *10-3,B
p-p : (Gauss),
K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).
7 Part Number Definition: FP1109-xxx-R
• FP1109 = Product code and size
• xxx= Inductance value in μH, R = decimal point. If no “R” is present, then
third character = # of zeros
• “-R” suffix = RoHS compliant
Product Specifications
Part Number7OCL1± 20% (nH) FLL2Min. (nH) Irms3(Amps) Isat14@ 25°C (Amps) Isat25@ 125°C (Amps) DCR (mΩ) @ 20°C K-factor6
FP1109-R20-R 205 122 69 52 233
FP1109-R23-R 247 147 55 41 233
FP1109-R27-R 270 160 51 38 233
FP1109-R33-R 311 185 35 44 33 0.42 ±10% 233
FP1109-R47-R 463 275 27 20 233
FP1109-R58-R 548 325 22.5 17 233
FP1109-1R0-R 950 565 11.5 8.5 233
Top View Side View Recommended Pad Layout Schematic
1
2
2.5 nom.
(2x)
1
wwllyy R
2
FP1109-xxx
3.0
(2X)
3.0
(2X)
11.4
11.2
max
11.2 max
9.0
max
4.10 ref
(2X)
2.03 ref
Front View
Part Marking: FP1109 xxx = Inductance value in μH. (R = Decimal point). If no “R” is present, then last character is # of zeros wwllyy = Date code R = Revision level
Section A-A
9.3
1.5 dia. +0.1/-0.0
1.5 dia. min
4.00
2.00
20.00
1.75
11.50
24.0 ±0.3
User direction of feed
11.4
11.4
1
2
16.4
17.5
2.0
FP1109-xxx
wwllyy R
Supplied in tape-and-reel packaging, 350 parts per reel, 13” diameter reel.
3
www.eaton.com/electronics
Technical Data 4350
Effective June 2017
Core loss vs Bp-p
Inductance characteristics
FP1109
High frequency, high current power inductor
Temperature rise vs total loss
50
40
30
20
10
0
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6
T otal Loss (W )
Tem perature R ise (°C )
1MHz
100
500kHz
10
300kHz
200kHz
100kHz
1
0.1
0.01
0.001
0.0001
0.00001
100100010000
Bp-p (Gauss)
Core Loss (W)
% o f O C L v s . % o f Is a t 1
120%
100%
80%
- 4 0 ° C
60%
40%
+125° C +25° C
20%
0%
0% 20%40%60%80% 100% 120%
% o f Is a t 1
% of OCL
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Publication No. 4350 BU-SB11642
June 2017
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Technical Data 4350
Effective June 2017
FP1109
High frequency, high current power inductor
Solder Reflow Profile
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
Ta
ab
bl
le
e
1
1
-
-
S
St
ta
an
nd
da
ar
rd
d
S
Sn
nP
Pb
b
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
VolumeVolume
Package mm3mm3
Thickness <350 _
>350
<2.5mm 235°C220°C
_
>2.5mm 220°C220°C
T
Ta
ab
bl
le
e
2
2
-
-
L
Le
ea
ad
d
(
(P
Pb
b)
)
F
Fr
re
ee
e
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
Volume Volume Volume
Package mm3mm3mm3
Thickness <350 350 - 2000 >2000
<1.6mm 260°C260°C260°C
1.6 – 2.5mm 260°C250°C245°C
>2.5mm 250°C245°C245°C
Reference JDEC J-STD-020
Standard SnPb Solder Lead (Pb) Free SolderProfile Feature
Preheat and Soak•eTmperature min. (Tsmin) 100°C150°C
• Temperature max. (Tsmax) 150°C200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds60-120 Seconds
3°C/ Second Max. 3°C/ Second Max.
183°C217°C
60-150 Seconds60-150 Seconds
Table 1 able 2T
20 Seconds** 30 Seconds**
6°C/ Second Max. 6°C/ Second Max.
Average ramp up rate Tsmaxto Tp
Liquidous temperature (T
L
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tpto Tsmax)
Time 25°C to Peak Temperature Minutes Max.68 Minutes Max.
*Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
