Cal-Chip Electronics, Incorporated CN SERIES Thick Film Chip Resistor Arrays CONSTRUCTION FEATURES * High Density * Automatic Placement DIMENSIONS Unit: mm TYPE CN34 L W t 3.20.1 1.60.1 0.550.1 CN35 CN64 5.20.2 CN65 6.40.2 P a 0.80.1 0.450.05 0.640.05 0.350.1 b c 0.30.2 0.30.2 3.10.2 0.550.1 1.270.05 0.80.2 0.50.2 0.50.2 Max Working Voltage Max. Overload Voltage Operating Temp. (C) Resistance Tolerance Resistance Range () Temp Coefficient ppm/C 25V 50V 10~1M 200ppm/C RATING TYPE Power Rating at 70C CN34 1/16W CN35 1/16W CN64 1/8W CN65 1/8W -55~+125C 50V 100V F1% J5% ORDERING INFORMATION CN 34 J 103 Chip Resistor Networks/Arrays CT Packaging Nominal Resistance Series 34-0603x4 35-0603x5 64-1206x4 65-1206x5 8P4R 10P8R 8P4R 10P8R Resistance Tolerance J = 5% F = 1% 65 Cal-Chip Electronics, Incorporated CN SERIES Thick Film Chip Resistor Arrays 1.0 Number of Element Depend on its element's number. (2-2 element. 4-4 element) 2.0 Resistance Tolerance F: 1% J: 5% 3.0 Nominal Resistance Example: 103, 10 is effective digit, 3 is a multiple which represents the cube of 10, zero number is three. 4.0 Schematics R1 = R2 = R3 = R4 5.0 Power Derating Curve The resistors operated in ambient temperatures above 70C, power rating must be derated in accordance with the curve in Figure 1. 5.1 Rated Voltage The value of rated voltage shall be determined from formula (1). E = P x R........(1) E =Rated Voltage (V) P = Power Rating (W) R = Nominal Resistance () 6.0 Electrical / Machine Characteristics and Test Methods Item Specifications Temperature Coefficient Short Time Overload (2%+0.05) Load Life (3%+0.05) Load Life in Humidity (3%+0.05) Temperature Cycling Effect of Soldering Solderability Intermittent Overload Dielectric Withstanding Voltage Insulation Resistance 66 TCR: 200 ppm (1 %+0.05) (2.5%+0.05) Non-damage by machinery 95% coverage min. (5%+0.1) No evidence of mechanical damage 108 min Test Methods Inspection Temp. Cold: +25C~55C Hot: +25C~+125C 1. Apply 2.5 x rated voltage for 5 sec. 2. Wait 30 minutes 3. Measure resistance value 1. Dwell in chamber at 702C for ON: 90 min. at rated voltage; then OFF: 30 min. 2. Perform 1,000 hours cyclically 1. Dwell in humidity chamber at 40 2C and 95% RH for ON: 90 min. at rated voltage; then OFF: 30 min. 2. Perform 1,000 hours cyclically 1. -553C~1253C, make 5 cycles. 2. Released 1 hour in room temp., then measure value. 1. Immersed in molten solder at 2705C for 10.01 sec. 2.Released 1 hour in room temp., then measure value. 1. Immersed in rosin solution for 5-10 seconds. 2. Re-immersed in solder pot at 2305C for 30.5 sec 1. Perform 10,000 voltage cycles as follows: ON (2.5 x rated voltage or current) 1 sec. and OFF 25 sec. 2. Released 30 min. without loading. 3. Measure resistance. Apply 300VAC for 1 second Apply 100VDC. Cal-Chip Electronics, Incorporated CN SERIES Thick Film Chip Resistor Arrays TAPING SPECIFICATION Carrier Tape Unit in mm PaperTape Type CN34 CN35 5,000 A B 2.00.2 3.60.2 C D E F G H J t 8.00.1 3.50.05 1.750.1 4.00.1 2.00.05 4.00.1 1.50.1 1.0 12.00.1 5.50.05 1.750.1 4.00.1 2.00.05 4.00.1 1.50.1 1.0 Plastic Concave-Tape CN64 CN65 4,000 3.50.1 5.50.1 3.50.1 6.750.1 67 Cal-Chip Electronics, Incorporated CN SERIES Thick Film Chip Resistor Arrays The top fixed tape for each carrier shall have an adhesion peel strength of 10 to 50g, measure methods is shown below to peel away. CARRIER TAPE TOP COVER TAPE TO PEEL AWAY (ABOUT 200 mm/min) 10 TO PEEL AWAY TAPE REEL Type A B C D E W1 W2 CN34 1782.0 802.0 130.5 21.0 2.00.5 10.01.0 12.51.0 1782. 0 802.0 130.2 21.0 2.00.5 13.51.0 15.51.0 CN35 CN64 CN65 68