Cal-Chip EElleeccttrroonniiccss,, IInnccoorrppoorraatteeddCN SERIES
Thick Film Chip Resistor Arrays
65
CONSTRUCTION
FEATURES
• High Density
• Automatic Placement
DIMENSIONS
Unit: mm
RATING
ORDERING INFORMATION
CN 34 J 103 CT
Chip Resistor Packaging
Networks/Arrays Nominal Resistance
Series
34-0603x4 8P4R
35-0603x5 10P8R Resistance Tolerance
64-1206x4 8P4R J = ±5%
65-1206x5 10P8R F = ±1%
TYPE L W t P a b c
CN34 0.8±0.1 0.45±0.05
CN35 3.2±0.1 1.6±0.1 0.55±0.1 0.64±0.05 0.35±0.1 0.3±0.2 0.3±0.2
CN64 5.2±0.2
CN65 6.4±0.2 3.1±0.2 0.55±0.1 1.27±0.05 0.8±0.2 0.5±0.2 0.5±0.2
Power Max Max. Temp
TYPE Rating Working Overload Operating Resistance Resistance Coefficient
at 70°C Voltage Voltage Temp. (°C) Tolerance Range (Ω) ppm/°C
CN34 1/16W 25V 50V
CN35 1/16W -55~+125°C F±1% 10Ω~1MΩ±200ppm/°C
CN64 1/8W 50V 100V J±5%
CN65 1/8W
Cal-Chip EElleeccttrroonniiccss,, IInnccoorrppoorraatteeddCN SERIES
Thick Film Chip Resistor Arrays
66
1.0 Number of Element
Depend on its element’s number. (2-2 element. 4-4 element)
2.0 Resistance T olerance
F: ±1% J:±5%
3.0 Nominal Resistance
Example: 103, 10 is effective digit, 3 is a multiple which represents the cube of 10, zero number is three.
4.0 Schematics R1= R2= R3= R4
5.0 Power Derating Curve
The resistors operated in ambient temperatures above 70°C, power rating must be derated in accordance
with the cur ve in Figure 1.
5.1 Rated Voltage
The value of rated voltage shall be determined from formula (1).
E = √P x R........(1)
E =Rated Voltage (V)
P = Power Rating (W)
R = Nominal Resistance (Ω)
6.0 Electrical / Machine Characteristics and Test Methods
Item Specifications Test Methods
Temperature Coefficient TCR: ±200 ppm Inspection Temp. Cold: +25°C~55°C
Hot: +25°C~+125°C
1. Apply 2.5 x rated voltage for 5 sec.
Short Time Overload ±(2%+0.05Ω) 2. Wait 30 minutes
3. Measure resistance value
1. Dwell in chamber at 70±2°C for ON: 90 min. at
Load Life ±(3%+0.05Ω) rated voltage; then OFF: 30 min.
2. Perform 1,000 hours cyclically
1. Dwell in humidity chamber at 40 ±2°C and 95% RH for
Load Life in Humidity ±(3%+0.05Ω) ON: 90 min. at rated voltage; then OFF: 30 min.
2. Perform 1,000 hours cyclically
Temperature Cycling ±(1 %+0.05Ω)1. -55±3°C~125±3°C, make 5 cycles.
2. Released 1 hour in room temp., then measure value.
Effect of Soldering ±(2.5%+0.05Ω) 1. Immersed in molten solder at 270±5°C for 10±.01 sec.
Non-damage by machinery 2.Released 1 hour in room temp., then measure value.
Solderability 95% coverage min. 1. Immersed in rosin solution for 5-10 seconds.
2. Re-immersed in solder pot at 230±5°C for 3±0.5 sec
1. Perform 10,000 voltage cycles as follows: ON (2.5 x rated
Intermittent Overload ±(5%+0.1Ω) voltage or current) 1 sec. and OFF 25 sec.
2. Released 30 min. without loading.
3. Measure resistance.
Dielectric Withstanding Voltage No evidence of mechanical damage Apply 300VAC for 1 second
Insulation Resistance 108Ωmin Apply 100VDC.
Cal-Chip EElleeccttrroonniiccss,, IInnccoorrppoorraatteeddCN SERIES
Thick Film Chip Resistor Arrays
67
TAPING SPECIFICATION
Carrier T ape Unit in mm
PaperTape
Plastic Concave-Tape
Type A B C D E F G H J t
CN34 5,000 2.0±0.2 3.6±0.2 8.0±0.1 3.5±0.05 1.75±0.1 4.0±0.1 2.0±0.05 4.0±0.1 1.5±0.1 1.0
CN35
CN64 4,000 3.5±0.1 5.5±0.1 12.0±0.1 5.5±0.05 1.75±0.1 4.0±0.1 2.0±0.05 4.0±0.1 1.5±0.1 1.0
CN65 3.5±0.1 6.75±0.1
Cal-Chip EElleeccttrroonniiccss,, IInnccoorrppoorraatteeddCN SERIES
Thick Film Chip Resistor Arrays
68
The top fixed tape for each carrier shall have an adhesion peel strength of 10 to 50g, measure methods is
shown below to peel away.
TAPE REEL
CARRIER TAPE
TO PEEL AWAY
TOP COVER TAPE
TO PEEL AWAY
(ABOUT 200 mm/min)
10°
TypeABCDEW1W2
CN34 φ178±2.0 φ80±2.0 φ13±0.5 φ21.0 2.0±0.5 10.0±1.0 12.5±1.0
CN35
CN64 φ178±2. 0 φ80±2.0 φ13±0.2 φ21.0 2.0±0.5 13.5±1.0 15.5±1.0
CN65
