EVALUATION KIT FOR PA60DK EK54 HTTP://WWW.APEXMICROTECH.COM M I C R O T E C H N O L O G Y (800) 546-APEX (800) 546-2739 INTRODUCTION BEFORE YOU GET STARTED Fast and easy breadboarding of circuits using the PA60DK is possible with the EK54 evaluation kit. The EK54 includes both the universal EVAL36 board and the EVAL46 substrate. The use of EVAL36 and EVAL46 allows for a large area of breadboarding space to work with while allowing a surface mount substrate for the PA60DK. The PA60DK amplifier may be surface mounted directly to the EVAL46, a thermally conductive but electrically isolated substrate. The PA60DK is soldered to a DUT foil footprint area the size of the heatslug as shown in Figure 1. The metal substrate is cost effective and can allow the PA60DK to dissipate power up to the datasheet rating. * All Apex amplifiers should be handled using ESD precaution. * Review the Apex product datasheet and operating conditions. * Always provide the appropriate heat sinking. Power dissipation must be considered to ensure maximum junction temperature (TJ) is not exceeded. * Always use adequate power supply bypass capacitors, Apex recommends at least 10F per amp of output current. * Do not change connections while the circuit is powered * In case -Vs is disconnected before +Vs, a diode between -Vs and ground is recommended to avoid damage. * Initially set all power supplies to the minimum operating levels allowed in the product datasheet. * Check for oscillations up to and above the unity gain bandwidth of the amplifier. Part# EVAL36 EVAL46 TSM-116-01-T-SV SSW-116-01-T-S PCE2055CT-ND OX7R105KWN *031606 Description Quantity Universal PC Board 1 Evaluation substrate, PA60DK 1 Terminal Strip, 16 PIN 2 Socket Strip, 16 PIN 2 CAP, 47uF, 50V 2 Cap, 200V, 1uF, Ceramic 2 5V, 10mA, 3.4C/W heatsink with fan, AAVID 1 * Parts are not supplied. Parts are application dependant. Suggested part numbers are provided. Figure 1 2.000 C1 J1 C2 NC M I C RO T EC H NO L OG Y NC EVAL46 rev A EK54 NC NC 1 20 -VS NC -IN(A) +IN(A) NC +IN(B) -IN(B) NC NC NC -INA +INA +INB -INB NC -VS NC OUT(A) NC +VS +VS NC OUT(B) NC NC 10 NC ASSEMBLY The PA60DK is a surface mount device and should be assembled to the EVAL46 substrate using surface mount processes. Solder paste may be dispensed or screen-printed on the DUT pads. The heat slug on the back of the PA60DK provides maximum heat dissipation capabilities when soldered to the foil footprint area. The PA60DK should be reflowed to the substrate using a solder reflow furnace. If this is not available, a heat plate capable of solder reflow temperatures may be used. Once the amplifier is mounted on the GND A top of the substrate, the heat sink fan or GND A selected heat sink can then be mounted NC to the back of the substrate. A heat -VS sink is not supplied with the kit, but several options are available through NC AAVID Thermal Product, Inc. High thermal NC conductive thermal grease should be NC used when mounting the heat sink fan or NC heat sink to the evaluation board. Review Figure 2 on next page for other VOA possible assembly methods to construct NC this evaluation kit. VOB NC 11 +VS DUT NC NC GND B NC GND B NC C4 NC J2 NC .175 C3 .000 EVAL46 TOP O0.120 2 PLACES 2.000 .000 1.823 NC APEX MICROTECHNOLOGY CORPORATION * TELEPHONE (520) 690-8600 * FAX (520) 888-3329 * ORDERS (520) 690-8601 * EMAIL prodlit@apexmicrotech.com 1 EVALUATION KIT FOR PA60DK EK54 Figure 2 DETAIL A 031606 (NOT INCLUDED) DETAIL A EVAL46 BOT. SIDE TSM-116-01-T-SV SSW-116-01-T-S EVAL36 PCE-2055CT-ND OX7R105KWN 4.50 2.90 C3 C4 PA60DK YYWW DUT 20 1 EK54 EVAL46 rev A M I C RO T EC H NO L OG Y C2 C1 0.90 0.00 6.50 3.90 2.40 0.00 EVAL36 TOP This data sheet has been carefully checked and is believed be reliable, however, no responsibility for possible inaccuracies All specifications areHOTLINE: subject to change without notice. APEX MICROTECHNOLOGY CORPORATION * to5980 NORTH SHANNON ROAD *is assumed TUCSON, ARIZONA 85741or*omissions. USA * APPLICATIONS 1 (800) 546-2739 2 EK54U REV A JUNE 2003 (c) 2003 Apex Microtechnology Corp.