INTRODUCTION
Fast and easy breadboarding of circuits using the PA60DK
is possible with the EK54 evaluation kit. The EK54 includes
both the universal EVAL36 board and the EVAL46 substrate.
The use of EVAL36 and EVAL46 allows for a large area of
breadboarding space to work with while allowing a surface
mount substrate for the PA60DK. The PA60DK amplifi er
may be surface mounted directly to the EVAL46, a thermally
conductive but electrically isolated substrate. The PA60DK
is soldered to a DUT foil footprint area the size of the
heatslug as shown in Figure 1. The metal substrate is cost
effective and can allow the PA60DK to dissipate power up
to the datasheet rating.
Part# Description Quantity
EVAL36 Universal PC Board 1
EVAL46 Evaluation substrate, PA60DK 1
TSM-116-01-T-SV Terminal Strip, 16 PIN 2
SSW-116-01-T-S Socket Strip, 16 PIN 2
PCE2055CT-ND CAP, 47uF, 50V 2
OX7R105KWN Cap, 200V, 1uF, Ceramic 2
*031606 5V, 10mA, 3.4°C/W
heatsink with fan, AAVID 1
* Parts are not supplied. Parts are application dependant.
Suggested part numbers are provided.
Figure 1
BEFORE YOU GET STARTED
• All Apex amplifiers should be handled using ESD
precaution.
• Review the Apex product datasheet and operating
conditions.
• Always provide the appropriate heat sinking. Power
dissipation must be considered to ensure maximum
junction temperature (TJ) is not exceeded.
• Always use adequate power supply bypass capacitors,
Apex recommends at least 10µF per amp of output
current.
• Do not change connections while the circuit is powered
• In case -Vs is disconnected before +Vs, a diode between
-Vs and ground is recommended to avoid damage.
• Initially set all power supplies to the minimum operating
levels allowed in the product datasheet.
• Check for oscillations up to and above the unity gain
bandwidth of the amplifi er.
ASSEMBLY
The PA60DK is a surface mount device and should be
assembled to the EVAL46 substrate using surface mount
processes. Solder paste may be dispensed or screen-printed
on the DUT pads. The heat slug on the back of the PA60DK
provides maximum heat dissipation capabilities when soldered
to the foil footprint area. The PA60DK should be refl owed to the
substrate using a solder refl ow furnace. If this is not available,
a heat plate capable of solder refl ow
temperatures may be used.
Once the amplifi er is mounted on the
top of the substrate, the heat sink fan or
selected heat sink can then be mounted
to the back of the substrate. A heat
sink is not supplied with the kit, but
several options are available through
AAVID Thermal Product, Inc. High thermal
conductive thermal grease should be
used when mounting the heat sink fan or
heat sink to the evaluation board.
Review Figure 2 on next page for other
possible assembly methods to construct
this evaluation kit.
T
O
R
C
I
ML
O
N
H
C
EY
G
O
EVAL46 rev A
EK54
NC
NC
NC
NC
-INA
+INA
+INB
-INB
NC
NC
NC
NC
NC
C1
C3
C2
C4
J1
J2
DUT
GND B
NC
NC
NC
NC
NC
NC
+VS
GND B
VOB
VOA
NC
GND A
NC
NC
NC
NC
-VS
GND A
-VS
NC
OUT(A)
NC
+VS
+VS
NC
OUT(B)
NC
NC
-VS
NC
-IN(A)
+IN(A)
NC
+IN(B)
-IN(B)
NC
NC
NC
1
10
20
11
EVAL46 TOP
.000
.000
.175
2.000
1.823
2.000
Ø0.120
2 PLACES
APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com
1
HTTP://WWW.APEXMICROTECH.COM (800) 546-APEX (800) 546-2739
MICROTECHNOLOGY
EVALUATION KIT FOR PA60DK
EK54
Figure 2
PA60DK
YYWW
T
O
R
C
I
ML
O
N
H
C
EY
GO
EVAL46 rev A
EK54
C1
C3
C2
C4
DUT
120
BOT. SIDE
0.00
0.00
4.50
6.50
2.40
3.90
0.90
2.90
EVAL36 TOP
DETAIL A
DETAIL A
EVAL36
031606
(NOT INCLUDED)
EVAL46
SSW-116-01-T-S
TSM-116-01-T-SV
PCE-2055CT-ND OX7R105KWN
APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739
2
EVALUATION KIT FOR
PA60DK
EK54
This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible inaccuracies or omissions. All specifi cations are subject to change without notice.
EK54U REV A JUNE 2003 © 2003 Apex Microtechnology Corp.