ATWINC1500B-MU-Y - MICROCHIP TECHNOLOGY

ATWINC15x0

ATWINC15x0-MR210xB IEEE® 802.11 b/g/n SmartConnect

IoT Module

Introduction

The ATWINC15x0-MR210xB is a low power consumption 802.11 b/g/n IoT (Internet of Things)

module,specifically optimized for low power IoT applications. The module integrates Power Amplifier (PA),

Low-Noise Amplifier (LNA), Switch, Power Management, and a printed antenna or a micro co-ax (u.FL)

connector for an external antenna resulting in a small form factor (21.7 x 14.7 x 2.1 mm) design. It is

interoperable with various vendors’ 802.11 b/g/n access points. This module provides SPI ports to

interface with a host controller.

The references to the ATWINC15x0-MR210xB module include the module devices listed in the following:

• ATWINC1500-MR210PB

• ATWINC1500-MR210UB

• ATWINC1510-MR210PB

• ATWINC1510-MR210UB

Features

• IEEE® 802.11 b/g/n 20 MHz (1x1) solution

• Single spatial stream in 2.4 GHz ISM band

• Integrated Transmit/Receive switch

• Integrated PCB antenna or u.FL micro co-ax connector for external antenna

• Superior sensitivity and range via advanced PHY signal processing

• Advanced equalization and channel estimation

• Advanced carrier and timing synchronization

• Wi-Fi® Direct (supported till firmware release 19.5.2)

• Soft-AP support

• Supports IEEE 802.11 WEP, WPA, WPA2 security

• Superior MAC throughput via hardware accelerated two-level A-MSDU/A-MPDU frame aggregation

and block acknowledgment

• On-chip memory management engine to reduce host load

• SPI host interface

• Operating temperature range from -40°C to +85°C. RF performance at room temperature of 25oC

with a 2-3 db change at boundary conditions

• I/O operating voltage of 2.7V to 3.6V

• Built-in 26 MHz crystal

• Integrated Flash memory for system software

• Power Save modes

– 4 µA Power-Down mode typical at 3.3V I/O

– 380 µA Doze mode with chip settings preserved (used for beacon monitoring)1

– On-chip low power sleep oscillator

– Fast host wake-up from Doze mode by a pin or SPI transaction

• Fast Boot options

– On-chip boot ROM (Firmware instant boot)

– SPI flash boot

– Low-leakage on-chip memory for state variables

– Fast AP re-association (150 ms)

• On-chip Network stack to offload MCU

– Integrated Network IP stack to minimize host CPU requirements

– Network features TCP, UDP, DHCP, ARP, HTTP, TLS, and DNS

– Hardware accelerators for Wi-Fi and TLS security to improve connection time

• Hardware accelerator for IP checksum

• Hardware accelerators for OTA security

• Small footprint host driver

• Wi-Fi Alliance® certifications for Connectivity and Optimizations

– ID: WFA61069

Note: For information on module power modes, refer to Power Consumption.

ATWINC15x0

Table of Contents

1. Ordering Information and Module Marking................................................................ 5

2. Block Diagram........................................................................................................... 6

3. Pin Description.......................................................................................................... 7

4. Electrical Specifications.............................................................................................9

4.1. Absolute Maximum Ratings..........................................................................................................9

4.2. Recommended Operating Conditions.......................................................................................... 9

5. CPU and Memory Subsystems............................................................................... 10

5.1. Processor................................................................................................................................... 10

5.2. Memory Subsystem....................................................................................................................10

5.3. Non-volatile Memory (eFuse)..................................................................................................... 10

6. WLAN Subsystem................................................................................................... 12

6.1. MAC........................................................................................................................................... 12

6.2. PHY............................................................................................................................................13

6.3. Radio..........................................................................................................................................13

7. External Interfaces...................................................................................................17

7.1. Interfacing with the Host Microcontroller.................................................................................... 17

7.2. SPI Interface...............................................................................................................................18

7.3. UART Interface...........................................................................................................................20

8. Power Consumption................................................................................................ 22

8.1. Description of Device States...................................................................................................... 22

8.2. Current Consumption in Various Device States......................................................................... 22

8.3. Restrictions for Power States..................................................................................................... 23

8.4. Power-up/down Sequence......................................................................................................... 23

8.5. Digital I/O Pin Behavior During Power-up Sequences............................................................... 24

8.6. Module Reset............................................................................................................................. 25

9. Notes On Interfacing to the ATWINC15x0-MR210xB.............................................. 26

9.1. Programmable Pull Up Resistors............................................................................................... 26

10. Schematic Design Information.................................................................................27

10.1. Application Schematic................................................................................................................ 27

11. Module Drawing.......................................................................................................28

11.1. Module Footprint........................................................................................................................ 29

12. Design Considerations............................................................................................ 31

12.1. ATWINC15x0-MR210PB Placement and Routing Guidelines....................................................31

12.2. Printed PCB Antenna Performance of ATWINC15x0-MR210PB............................................... 31

12.3. ATWINC15x0-MR210UB Placement and Routing Guidelines................................................... 34

12.4. Module Assembly Considerations.............................................................................................. 35

13. Reflow Profile Information....................................................................................... 36

13.1. Storage Condition.......................................................................................................................36

13.2. Solder Paste...............................................................................................................................36

13.3. Stencil Design............................................................................................................................ 36

13.4. Printing Process......................................................................................................................... 36

13.5. Baking Conditions...................................................................................................................... 36

13.6. Soldering and Reflow Condition................................................................................................. 37

14. Regulatory Approval................................................................................................39

14.1. United States..............................................................................................................................39

14.2. Canada.......................................................................................................................................41

14.3. Europe........................................................................................................................................43

14.4. Other Regulatory Information..................................................................................................... 45

15. Reference Documentation and Support.................................................................. 46

15.1. Reference Documents................................................................................................................46

16. Document Revision History..................................................................................... 47

The Microchip Web Site................................................................................................ 51

Customer Change Notification Service..........................................................................51

Customer Support......................................................................................................... 51

Microchip Devices Code Protection Feature................................................................. 51

Legal Notice...................................................................................................................52

Trademarks................................................................................................................... 52

Quality Management System Certified by DNV.............................................................53

Worldwide Sales and Service........................................................................................54

ATWINC15x0

1. Ordering Information and Module Marking

Following table describes the ordering details for the ATWINC15x0-MR210xB modules.

Table 1-1. Ordering Details

Model Number Ordering

Code

Package

Dimension

No.

Pins

Description Regulatory

Certification

ATWINC1500-

MR210PB

ATWINC1500-

MR210PB1952

21.7 x 14.7 x 2.1

28 Certified Module with

ATWINC1500B chip

(4Mb Flash) and PCB

printed antenna

FCC, ISED,

ATWINC1500-

MR210UB

ATWINC1500-

MR210UB1952

21.7 x 14.7 x 2.1

28 Certified Module with

ATWINC1500B chip

(4Mb Flash) and u.FL

connector

FCC, ISED

ATWINC1510-

MR210PB

ATWINC1510-

MR210PB1952

21.7 x 14.7 x 2.1

28 Certified Module with

ATWINC1510B chip

(8Mb Flash) and PCB

printed antenna

FCC, ISED,

ATWINC1510-

MR210UB

ATWINC1510-

MR210UB1952

21.7 x 14.7 x 2.1

28 Certified Module with

ATWINC1510B chip

(8Mb Flash) and u.FL

connector

Planned

Following figure illustrates the ATWINC15x0-MR210xB modules’ marking information.

Figure 1-1. Marking Information

Module Revision Letter

Software Version

ATWINC15x0 - MR 21 0 P

ATWINC1500: 4Mb Flash

ATWINC1510: 8Mb Flash

1: No OTA / with shield

2: OTA with shield

P: PCB Antenna

U: uFL Connector

MR Industrial

Reserved

1 0

ATWINC15x0

Ordering Information and Module Marking

2. Block Diagram

Figure 2-1. ATWINC15x0-MR210xB Module Block Diagram

BAL UN

RX/TX

26 MHz

GN D

SPI_CFG

SPI

GPIO 4

GPIO 5

GPIO 6

IRQN

Chip_EN

WAKE

RESET

VBAT VDDIO

GPIO 3

crystal

Printed 2.4 GHz Antenna

u.FL 2.4 GHz External

Antenna Connector

Wi-Fi

SoC

ATWINC15x0

Block Diagram

3. Pin Description

Figure 3-1. Pin Diagram

VBAT

GPIO_1

CHIP_EN

VDDIO

GPIO_3

GPIO_4

GPIO_5

GND_3

GND_1

RESET_N

I2C_SDA

I2C_SCL

GPIO_6

SPI_CFG

WAKE

GND_2

IRQN

UART_TXD

SPI_MOSI

SPI_SSN

SPI_MISO

SPI_SCK

UART_RXD

1P3V_TP

ATWINC15x0-MR210

PADDLE

GND

(Bottom)

Table 3-1. ATWINC15x0-MR210xB Pin Description

Name Type Description Programmable

Pull Up Resistor

1 GPIO_6 I/O General purpose I/O. Yes

2 I2C_SCL I/O I2C Slave Clock. Currently used only for development

debug. Leave unconnected.

Yes

3 I2C_SDA I/O I2C Slave Data. Currently used only for development

debug. Leave unconnected.

Yes

4 RESET_N I Active-Low Hard Reset. When this pin is asserted

low, the module will be placed in the reset state.

When this pin is asserted high, the module will be out

of reset and will function normally. Connect to a host

output that defaults low at power up. If the host output

is tri-stated, add a 1MΩ pull down resistor to ensure a

low level at power-up.

5 NC - No connect.

ATWINC15x0

Pin Description

Name Type Description Programmable

Pull Up Resistor

6 NC - No connect.

7 NC - No connect.

8 NC - No connect.

9 GND_1 - GND.

10 SPI_CFG I Tie to VDDIO through a 1MΩ resistor to enable the

SPI interface.

11 WAKE I Host Wake control. Can be used to wake-up the

module from Doze mode. Connect to a host GPIO.

Yes

12 GND_2 - GND.

13 IRQN O ATWINC15x0-MR210xB Device Interrupt output.

Connect to host interrupt input pin.

Yes

14 UART_TXD O UART Transmit Output from ATWINC15x0-MR210xB

Added debug.

Yes

15 SPI_RXD I SPI MOSI (Master Out, Slave In) pin. Yes

16 SPI_SSN I SPI Slave Select. Active-low. Yes

17 SPI_TXD O SPI MISO (Master In, Slave Out) pin. Yes

18 SPI_SCK I SPI Clock. Yes

19 UART_RXD I UART Receive input to ATWINC15x0-MR210xB.

Added debug.

Yes

20 VBATT - Battery power supply.

21 GPIO_1/RTC I General Purpose I/O / RTC. Yes

22 CHIP_EN I Module enable. High level enables the module; low

level places module in Power-Down mode. Connect

to a host output that defaults low at power-up. If the

host output is tri-stated, add a 1MΩ pull down resistor

to ensure a low level at power-up.

23 VDDIO - I/O Power Supply. Must match host I/O voltage.

24 1P3V_TP - 1.3V VDD Core Test Point. Decouple with 10µF, and

0.01µF to GND.

25 GPIO_3 I/O General purpose I/O.

26 GPIO_4 I/O General purpose I/O. Yes

27 GPIO_5 I/O General purpose I/O. Yes

28 GND_3 - GND.

29 PADDLE GND - GND.

ATWINC15x0

Pin Description

4. Electrical Specifications

4.1 Absolute Maximum Ratings

Absolute maximum ratings for the ATWINC15x0-MR210xB modules are listed below.

Table 4-1. Conditions

Symbol Description Min. Max. Unit

VBATT Input supply voltage -0.3 5.0 V

VDDIO I/O voltage -0.3 4.2 V

Operating Temperature -40 +85 oC

CAUTION

Stresses listed under "Absolute Maximum Ratings" may cause permanent damage to the

device. This is a stress rating only. The functional operation of the device at those or any other

conditions above those indicated in the operation listings of this specification is not implied.

Exposure to maximum rating conditions for extended periods may affect the device reliability.

4.2 Recommended Operating Conditions

Table 4-2. Recommended Operating Conditions

Symbol Min. Typ. Max. Unit

VBATT 3.0 3.3 4.2 V

VDDIO 2.7 3.3 3.6 V

Note: 1. Test Conditions: -40oC - +85oC

ATWINC15x0

Electrical Specifications

5. CPU and Memory Subsystems

5.1 Processor

The ATWINC15x0-MR210xB modules have a Cortus APS3 32-bit processor. This processor performs

many of the MAC functions, including but not limited to the association, authentication, power

management, security key management, and MSDU aggregation/de-aggregation. In addition, the

processor provides flexibility for various modes of operation, such as STA and AP modes.

5.2 Memory Subsystem

The APS3 core uses a 128KB instruction/boot ROM along with a 160KB instruction RAM and a 64KB

data RAM. The ATWINC15x0-MR210xB modules come populated with either 4Mb or 8Mb of Flash

memory depending on the module model that is ordered. This memory can be used for system software.

See Table 1-1 for more information. In addition, the device uses a 128KB shared RAM, accessible by the

processor and MAC, which allows the APS3 core to perform various data management tasks on the TX

and RX data packets.

5.3 Non-volatile Memory (eFuse)

The ATWINC15x0-MR210xB modules have 768 bits of non-volatile eFuse memory that can be read by

the CPU after device reset. This non-volatile one-time-programmable (OTP) memory can be used to store

customer-specific parameters, such as MAC address; various calibration information, such as TX power,

crystal frequency offset, etc.; and other software-specific configuration parameters. The eFuse is

partitioned into six 128-bit banks. Each bank has the same bitmap (see following figure). The purpose of

the first 80 bits in each bank is fixed, and the remaining 48 bits are general-purpose software dependent

bits, or reserved for future use. Since each bank can be programmed independently, this allows for

several updates of the device parameters following the initial programming; for example, if the MAC

address has to be changed, Bank 1 has to be programmed with the new MAC address along with the

values of TX gain correction and frequency offset if they are used and programmed in Bank 0. The

contents of Bank 0 have to be invalidated in this case by programming the invalid bit in the Bank 0. This

will allow the firmware to use the MAC address. By default, all the ATWINC15x0-MR210xB modules are

programmed with the MAC address and the frequency offset bits of Bank 0.

ATWINC15x0

CPU and Memory Subsystems

Figure 5-1. eFuse Bitmap

Bank 0

Bank 1

Bank 2

Bank 3

Bank 4

Bank 5

F MAC ADDR

Used

Invalid

Version

Reserved

MAC ADDR

Used

Flags

31 1 4 1

Used

Gain

Correc

tion

Used

Freq.

Offset

1 7

8816

1 15

128 Bits

ATWINC15x0

CPU and Memory Subsystems

6. WLAN Subsystem

The WLAN subsystem is composed of the Media Access Controller (MAC) and the Physical Layer (PHY).

The following two subsections describe the MAC and PHY in detail.

6.1 MAC

6.1.1 Description

The ATWINC15x0-MR210xB MAC is designed to operate at low power while providing high data

throughput. The IEEE 802.11 MAC functions are implemented with a combination of dedicated datapath

engines, hardwired control logic, and a low-power, high-efficiency microprocessor. The combination of

dedicated logic with a programmable processor provides optimal power efficiency and real-time response

while providing the flexibility to accommodate evolving standards and future feature enhancements.

Dedicated datapath engines are used to implement datapath functions with heavy computational

requirements. For example, an FCS engine checks the CRC of the transmitting and receiving packets,

and a cipher engine performs all the required encryption and decryption operations for the WEP, WPA-

TKIP, and WPA2 CCMP-AES.

Control functions which have real-time requirements are implemented using hardwired control logic

modules. These logic modules offer real-time response while maintaining configurability via the

processor. Examples of hardwired control logic modules are the channel access control module

(implements EDCA/HCCA, Beacon TX control, interframe spacing, etc.), protocol timer module

(responsible for the Network Access Vector, back-off timing, timing synchronization function, and slot

management), MPDU handling module, aggregation/de-aggregation module, block ACK controller

(implements the protocol requirements for burst block communication), and TX/RX control FSMs

(coordinate data movement between PHY-MAC interface, cipher engine, and the DMA interface to the

TX/RX FIFOs).

The MAC functions implemented solely in software on the microprocessor have the following

characteristics:

• Functions with high memory requirements or complex data structures. Examples are association

table management and power save queuing.

• Functions with low computational load or without critical real-time requirements. Examples are

authentication and association.

• Functions which need flexibility and upgradeability. Examples are beacon frame processing and

QoS scheduling.

6.1.2 Features

The ATWINC15x0-MR210xB IEEE802.11 MAC supports the following functions:

• IEEE 802.11b/g/n

• IEEE 802.11e WMM QoS EDCA/PCF multiple access categories traffic scheduling

• Advanced IEEE 802.11n features:

– Transmission and reception of aggregated MPDUs (A-MPDU)

– Transmission and reception of aggregated MSDUs (A-MSDU)

– Immediate Block Acknowledgment

– Reduced Interframe Spacing (RIFS)

ATWINC15x0

WLAN Subsystem

• Support for IEEE802.11i and WFA security with key management:

– WEP 64/128

– WPA-TKIP

– 128-bit WPA2 CCMP (AES)

• Advanced power management:

– Standard 802.11 Power Save Mode

• RTS-CTS and CTS-self support

• Supports either STA or AP mode in the infrastructure basic service set mode

6.2 PHY

6.2.1 Description

The ATWINC1500B WLAN PHY is designed to achieve reliable and power-efficient physical layer

communication specified by IEEE 802.11 b/g/n in single stream mode with 20MHz bandwidth. Advanced

algorithms have been employed to achieve maximum throughput in a real world communication

environment with impairments and interference. The PHY implements all the required functions that

include FFT, filtering, FEC (Viterbi decoder), frequency, timing acquisition and tracking, channel

estimation and equalization, carrier sensing, clear channel assessment, and automatic gain control.

6.2.2 Features

The ATWINC1500B IEEE802.11 PHY supports the following functions:

• Single antenna 1x1 stream in 20MHz channels

• Supports IEEE 802.11b DSSS-CCK modulation: 1, 2, 5.5, 11Mbps

• Supports IEEE 802.11g OFDM modulation: 6, 9, 12,18, 24, 36, 48, 54Mbps

• Supports IEEE 802.11n HT modulations MCS0-7, 20MHz, 800 and 400ns guard interval: 6.5, 7.2,

13.0, 14.4, 19.5, 21.7, 26.0, 28.9, 39.0, 43.3, 52.0, 57.8, 58.5, 65.0, 72.2Mbps

• IEEE 802.11n mixed mode operation

• Per packet TX power control

• Advanced channel estimation/equalization, automatic gain control, CCA, carrier/symbol recovery,

and frame detection

6.3 Radio

This section presents information describing the properties and characteristics of the ATWINC15x0-

MR210xB and Wi-Fi radio transmit and receive performance capabilities of the device.

The performance measurements are taken at the RF pin assuming 50Ω impedance; the RF performance

is guaranteed for room temperature of 25oC with a derating of 2-3dB at boundary conditions.

Measurements were taken under typical conditions: VBATT=3.3V; VDDIO=3.3V; temperature: +25ºC

Table 6-1. Features and Properties

Feature Description

Part Number ATWINC15x0-MR210xB

WLAN Standard IEEE 802.11 b/g/n, Wi-Fi compliant

ATWINC15x0

WLAN Subsystem

Feature Description

Host Interface SPI

Dimension 21.7 x 14.7 x 2.1 mm

Frequency Range 2.412GHz ~ 2.472GHz (2.4GHz ISM Band)

Number of Channels 11 for North America, and 13 for Europe

Modulation 802.11b: DQPSK, DBPSK, CCK

802.11g/n: OFDM /64-QAM,16-QAM, QPSK, BPSK

Data Rate 802.11b: 1, 2, 5.5, 11Mbps

802.11g: 6, 9, 12, 18, 24, 36, 48, 54Mbps

Data Rate

(20MHz, normal GI, 800ns)

802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps

Data Rate

(20MHz, short GI, 400ns)

802.11n: 7.2, 14.4, 21.7, 28.9, 43.3, 57.8,

65,72.2Mbps

Operating temperature -40 to +85oC

Storage temperature -40 to +125 oC

Humidity Operating Humidity 10% to 95% Non-Condensing

Storage Humidity 5% to 95% Non-Condensing

6.3.1 Receiver Performance

Table 6-2. Receiver Performance

Parameter Description Minimum Typical Maximum Unit

Frequency 2,412 2,472 MHz

Sensitivity

802.11b

1Mbps DSS -95

dBm

2Mbps DSS -90

5.5Mbps DSS -92

11Mbps DSS -86

Sensitivity

802.11g

6Mbps OFDM -90

9Mbps OFDM -89

12Mbps OFDM -88

18Mbps OFDM -85

24Mbps OFDM -83

36Mbps OFDM -80

48Mbps OFDM -76

54Mbps OFDM -74

ATWINC15x0

WLAN Subsystem

Parameter Description Minimum Typical Maximum Unit

Sensitivity

802.11n

(BW=20MHz)

MCS 0 -89

MCS 1 -87

MCS 2 -85

MCS 3 -82

MCS 4 -77

MCS 5 -74

MCS 6 -72

MCS 7 -70.5

Maximum Receive

Signal Level

1-11Mbps DSS 0

6-54Mbps OFDM 0

MCS 0 – 7 0

Adjacent Channel

Rejection

1Mbps DSS (30MHz offset) 50

11Mbps DSS (25MHz offset) 43

6Mbps OFDM (25MHz offset) 40

54Mbps OFDM (25MHz offset) 25

MCS 0 – 20MHz BW (25MHz offset) 40

MCS 7 – 20MHz BW (25MHz offset) 20

Cellular Blocker

Immunity

776-794MHz CDMA -14

dBm

824-849MHz GSM -10

880-915MHz GSM -10

1710-1785MHz GSM -15

1850-1910MHz GSM -15

1850-1910MHz WCDMA -24

1920-1980MHz WCDMA -24

6.3.2 Transmitter Performance

Table 6-3. Transmitter Performance

Parameter Description Minimum Typical Maximum Unit

Frequency — 2,412 — 2,472 MHz

Output Power1-2

ON_Transmit

802.11b 1Mbps — 17.5 —

dBm

802.11b 11Mbps — 18.5 —

802.11g 6Mbps — 17.5 —

802.11g 54Mbps — 16 —

ATWINC15x0

WLAN Subsystem

Parameter Description Minimum Typical Maximum Unit

802.11n MCS 0 — 17.0 —

802.11n MCS 7 — 14.5 —

TX Power Accuracy — — ±1.5 2— dB

Carrier Suppression — — 30.0 — dBc

Harmonic Output Power

2nd — -41

dBm/MHz

3rd — — -41

Note:

1. Measured at 802.11 spec compliant EVM/Spectral Mask.

2. Measured after RF matching network.

3. Operating temperature range is -40°C to +85°C. RF performance guaranteed at room temperature

of 25°C with a 2-3dB change at boundary conditions.

4. With respect to TX power, different (higher/lower) RF output power settings may be used for

specific antennas and/or enclosures, in which case recertification may be required.

5. The availability of some specific channels and/or operational frequency bands are country

dependent and should be programmed at the Host product factory to match the intended

destination. Regulatory bodies prohibit exposing the settings to the end user. This requirement

needs to be taken care of via Host implementation.

ATWINC15x0

WLAN Subsystem

7. External Interfaces

7.1 Interfacing with the Host Microcontroller

This section describes interfacing the ATWINC15x0-MR210xB module with the host microcontroller. The

interface is comprised of a slave SPI and additional control signals, as shown in the following figure. For

more information on SPI interface specification and timing, refer to the SPI Interface. Additional control

signals are connected to the GPIO/IRQ interface of the microcontroller.

Figure 7-1. Interfacing with Host Microcontroller

Host

Microcontroller

CHIP_EN

RESET

WAKE

IRQN

SPI

Wi-Fi Controller

Module

Table 7-1. Host Microcontroller Interface Pins

Pin Number Function

4 RESET_N

11 WAKE

13 IRQ_N

22 CHIP_EN

16 SPI_SSN

15 SPI_MOSI

17 SPI_MISO

18 SPI_SCK

Related Links

Programmable Pull Up Resistors

7.2.2 SPI Timing

The SPI Slave interface supports four standard modes as determined by the Clock Polarity (CPOL) and

Clock Phase (CPHA) settings. These modes are illustrated in the following table and figure.

Table 7-3. SPI Slave Modes

Mode CPOL CPHA

0 0 0

1 0 1

2 1 0

3 1 1

The red lines in the following figure correspond to Clock Phase = 0 and the blue lines correspond to Clock

Phase = 1.

ATWINC15x0

External Interfaces

Figure 7-2. SPI Slave Clock Polarity and Clock Phase Timing

z z

SCK

CPOL = 0

CPOL = 1

SSN

RXD/TXD

(MOSI/MISO)

CPHA = 0

CPHA = 1

2 3 4 5 6 7 8

1 2 3 4 5 6 7

The SPI timing is provided in the following figure and table.

Figure 7-3. SPI Timing Diagram (SPI Mode CPOL=0, CPHA=0)

tLH

SCK

TXD

RXD

tWH

tHL

tWL

tODLY

tISU tIHD

fSCK

SSN

tSUSSN tHDSSN

Table 7-4. SPI Slave Timing Parameters1

Parameter Symbol Min. Max. Units

Clock Input Frequency2fSCK — 48 MHz

Clock Low Pulse Width tWL 4 —

Clock High Pulse Width tWH 5 —

Clock Rise Time tLH 0 7

Clock Fall Time tHL 0 7

ATWINC15x0

External Interfaces

Parameter Symbol Min. Max. Units

TXD Output Delay3tODLY 4 9 from SCK fall

12.5 from SCK

rise

RXD Input Setup Time tISU 1 —

RXD Input Hold Time tIHD 5 —

SSN Input Setup Time tSUSSN 3 —

SSN Input Hold Time tHDSSN 5.5 —

Note:

1. Timing is applicable to all SPI modes

2. Maximum clock frequency specified is limited by the SPI Slave interface internal design, actual

maximum clock frequency can be lower and depends on the specific PCB layout

3. Timing based on 15pF output loading

7.3 UART Interface

The ATWINC15x0-MR210xB supports the Universal Asynchronous Receiver/Transmitter (UART)

interface. This interface should be used for debug purposes only. The UART is available on pins 14 and

19. The UART is compatible with the RS-232 standard, and the ATWINC15x0-MR210xB operates as

Data Terminal Equipment (DTE). It has a two-pin RXD/TXD interface.

The default configuration for accessing the UART interface of ATWINC15x0-MR210xB is mentioned

below:

• Baud rate: 115200

• Data: 8 bit

• Parity: None

• Stop bit: 1 bit

• Flow control: None

It also has RX and TX FIFOs, which ensure reliable high-speed reception and low software overhead

transmission. FIFO size is 4 x 8 for both RX and TX direction. The UART also has status registers

showing the number of received characters available in the FIFO and various error conditions, as well the

ability to generate interrupts based on these status bits.

An example of the UART receiving or transmitting a single packet is shown in the following figure. This

example shows 7-bit data (0x45), odd parity, and two stop bits.

Important: UART2 supports RTS and CTS flow control. The UART RTS and UART CTS

MUST be connected to the host MCU UART and enabled for the UART interface to be

functional.

ATWINC15x0

External Interfaces

Figure 7-4. Example of UART RX of TX Packet

Packets or

Leading

Idle Bits

Current Packet

Data

Start

Bit

Parity

Bit Stop Bits

Packet

ATWINC15x0

External Interfaces

8. Power Consumption

8.1 Description of Device States

The ATWINC15x0-MR210xB has several device states:

• ON_Transmit – Device is actively transmitting an 802.11 signal. Highest output power and nominal

current consumption.

• ON_Receive – Device is actively receiving an 802.11 signal. Lowest sensitivity and nominal current

consumption.

• ON_Doze – Device is ON but is neither transmitting nor receiving

• Power_Down – Device core supply off (Leakage)

• IDLE connect – Device is connected with 1 DTIM beacon interval

The following pins are used to switch between the ON and Power_Down states:

• CHIP_EN – Device pin (pin #22) used to enable DC/DC Converter

• VDDIO – I/O supply voltage from external supply

In the ON states, VDDIO is on and CHIP_EN is high (at VDDIO voltage level). To switch between

the ON states and Power_Down state CHIP_EN has to change between high and low (GND)

voltage. When VDDIO is off and CHIP_EN is low, the chip is powered off with no leakage (also see

Restrictions for Power States).

8.2 Current Consumption in Various Device States

Table 8-1. Current Consumption

Device State Code Rate Output

power, dBm

Current Consumption 1

IVBATT IVDDIO

ON_Transmit

802.11b 1Mbps 17.5 268mA 22mA

802.11b 11Mbps 18.5 264mA 22mA

802.11g 6Mbps 17.5 269mA 22mA

802.11g 54Mbps 16.0 266mA 22mA

802.11n MCS 0 17.0 268mA 22mA

802.11n MCS 7 14.5 265mA 22mA

ON_Receive

802.11b 1Mbps N/A 61mA 22mA

802.11b 11Mbps N/A 61mA 22mA

802.11g 6Mbps N/A 61mA 22mA

802.11g 54Mbps N/A 61mA 22mA

802.11n MCS 0 N/A 61mA 22mA

802.11n MCS 7 N/A 61mA 22mA

ATWINC15x0

Power Consumption

Device State Code Rate Output

power, dBm

Current Consumption 1

IVBATT IVDDIO

ON_Doze N/A N/A 380µA <10µA

Power_Down N/A N/A <0.5µA <3.5µA

Note:

1. Measured conditions: VBATT @ 3.3V, VDDIO@ 3.3V, temp. 25°C.

8.3 Restrictions for Power States

When no power is supplied to the device, for example, the DC/DC Converter output and VDDIO are both

off (at ground potential), a voltage cannot be applied to the device pins because each pin contains an

ESD diode from the pin to supply. This diode will turn on when a voltage higher than one diode drop is

supplied to the pin.

If a voltage must be applied to the signal pads while the chip is in a low-power state, the VDDIO supply

must be on, so the SLEEP or Power_Down state must be used.

Similarly, to prevent the pin-to-ground diode from turning on, do not apply a voltage that is more than one

diode drop below ground to any pin.

8.4 Power-up/down Sequence

The power-up/down sequence for ATWINC15x0-MR210xB is shown in the Following Figure. The timing

parameters are provided in following the table.

Figure 8-1. Power Up/Down Sequence

VBATT

VDDIO

CHIP_EN

RESETN

XO Clock

tB'

tA'

tC'

Table 8-2. Power-up/down Sequence Timing

Parameter Min. Max. Units Description Notes

0 ms VBATT rise to VDDIO

rise

VBATT and VDDIO can rise

simultaneously or can be tied

ATWINC15x0

Power Consumption

Parameter Min. Max. Units Description Notes

together. VDDIO must not rise

before VBATT.

0 ms VDDIO rise to CHIP_EN

rise

CHIP_EN must not rise before

VDDIO. CHIP_EN must be driven

high or low, not left floating.

5 ms CHIP_EN rise to

RESETN rise

This delay is needed because the

XO clock must stabilize before

RESETN removal. RESETN must

be driven high or low, not left

floating.

tA’

0 ms VDDIO fall to VBATT fall VBATT and VDDIO can fall

simultaneously or can be tied

together. VBATT must not fall

before VDDIO.

tB’

0 ms CHIP_EN fall to VDDIO

fall

VDDIO must not fall before

CHIP_EN. CHIP_EN and RESETN

can fall simultaneously.

tC’

0 ms RESETN fall to VDDIO

fall

VDDIO must not fall before

RESETN. RESETN and CHIP_EN

can fall simultaneously.

8.5 Digital I/O Pin Behavior During Power-up Sequences

The following table represents digital I/O Pin states corresponding to device power modes.

Table 8-3. Digital I/O Pin Behavior in Different Device States

Device state VDDIO CHIP_EN RESETN Output

driver

Input

driver

Pull up/down

resistor (96kΩ)

Power-Down:

core supply off

High Low Low Disabled (Hi-Z) Disabled Disabled

Power-on Reset:

core supply on, hard reset

High High Low Disabled (Hi-Z) Disabled Enabled

Power-On Default:

core supply on, the device

is out of reset but not

programmed yet

High High High Disabled (Hi-Z) Enabled Enabled

On Sleep/

On Transmit/

On Receive:

core supply on, device

programmed by firmware

High High High Programmed by

firmware for

each pin:

Enabled or

Disabled

Opposite

of Output

Driver

state

Programmed by

firmware for

each pin:

Enabled or

Disabled

ATWINC15x0

Power Consumption

8.6 Module Reset

If a module reset is performed, the RESETN pin must be pulsed low for a minimum of 1µ second.

ATWINC15x0

Power Consumption

9. Notes On Interfacing to the ATWINC15x0-MR210xB

9.1 Programmable Pull Up Resistors

The ATWINC15x0-MR210xB provides programmable pull up resistors on various pins. The purpose of

these resistors is to keep any unused input pins from floating, which can cause excess current to flow

through the input buffer from the VDDIO supply. Any unused module pin on the ATWINC15x0-MR210xB

should leave these pull up resistors enabled so the pin will not float. The default state at power-up is for

the pull up resistor to be enabled. However, any pin that is used should have the pull up resistor disabled.

The reason for this is that if any pins are driven to a low level while the ATWINC15x0-MR210xB is in the

low power sleep state, current will flow from the VDDIO supply through the pull up resistors, increasing

the current consumption of the module. Since the value of the pull up resistor is approximately 100KΩ,

the current through any pull up resistor that is being driven low will be VDDIO/100K. For VDDIO = 3.3V,

the current through each pull up resistor that is driven low would be approximately 3.3V/100K = 33µA.

Pins which are used and have had the programmable pull up resistor disabled should always be actively

driven to either a high or low level and not be allowed to float.

ATWINC15x0

Notes On Interfacing to the ATWINC15x0-MR210xB

10. Schematic Design Information

This section provides schematic information for reference. Application schematics for SPI are provided in

the following figure. Module design information such as module schematics can be obtained under an

NDA from Microchip. These schematics are applicable to the ATWINC1500-MR210PB, ATWINC1510-

MR210PB and the ATWINC1500-MR210UB modules.

10.1 Application Schematic

Figure 10-1. SPI Application Schematic

Resistors R2-R1 are recommended

As placeholders in case filtering

of noisy signals is required. They

also allow disconnecting of module

For debug purposes.

Note: Add 10uF and 0.01uF decoupling capacitors between the pin 24 (1P3V_TP) and GND.

ATWINC15x0

Schematic Design Information

11. Module Drawing

This section provides information about the module package outline drawings.

Figure 11-1. Module Drawing - ATWINC15x0-MR210PB (unit = mm)

MODULE TOP VIEW

Metal

Shield

Metal

Shield

PCB

MODULE SIDE VIEW MODULE BOTTOM VIEW

NOTE: THIS PAD MUST

BE SOLDERED TO GND.

NOT TO SCA LE

ATWINC15x0

Module Drawing

Figure 11-2. Module Drawings – ATWINC15x0-MR210UB (unit = mm)

MODULE TOP VIEW

Metal

Shield

Metal

Shield

PCB

MODULE SIDE VIEW MODULE BOTTOM VIEW

NOTE: THIS PAD MUST

BE SOLDERED TO GND.

NOT TO SCA LE Rev. 2

11.1 Module Footprint

This section provides the outline drawing for the recommended footprint for the ATWINC15x0-MR210xB

module. It is imperative that the center Ground Pad is provided, with an array of vias to provide for a good

ground and thermal transfer for the ATWINC15x0-MR210xB module.

This footprint is applicable to the ATWINC15x0-MR210xB module devices.

ATWINC15x0

Module Drawing

Figure 11-3. Module Solder Pad Footprint (unit = mm).

NOTE: THIS PAD MUST BE

TIED TO GND.

1.016 Pitch

14.73

1.9

0.8

1.016 Pitch

4.064

2.67

6.00

1.016 Pitch

3.70

1.016 Pitch

1.9 3.048

3.68

21.72 2.032

4.42

SOLDER PAD FOOTPRINT

Drawing not to scale.

Untoleranced dimensions.

Units=mm.

ATWINC15x0

Module Drawing

12. Design Considerations

This section provides the guidelines on placement and routing to achieve the best performance.

12.1 ATWINC15x0-MR210PB Placement and Routing Guidelines

• The module must be placed on the main board – the printed antenna area must overlap with the

carrier board. The portion of the module containing the antenna should not go outside the edge of

the main board. The antenna is designed to work properly when it is sitting directly on top of a

1.5mm thick printed circuit board.

• If the module is placed at the edge of the main board, a minimum 22mm by 5mm area directly

under the antenna must be clear of all metal on all layers of the board. “In-land” placement is

acceptable; however deepness of keep-out area must grove to: module edge to main board edge

plus 5mm. DO NOT PLACE THE MODULE IN THE MIDDLE OF THE MAIN BOARD OR FAR

AWAY FROM THE MAIN BOARD EDGE.

• Keep away from the antenna, as far as possible, large metal objects to avoid electromagnetic field

blocking

• Do not enclose the antenna within a metal shield

• Keep any components which may radiate noise or signals within the 2.4GHz-2.5GHz frequency

band as far away from the antenna as possible, or better yet, shield those components. Any noise

radiated from the main board in this frequency band will degrade the sensitivity of the module.

Figure 12-1. ATWINC15x0-MR210PB Placement Reference

Best Case

Worst Case

System Ground Plane

(a)

(b)

Keep out area.

Microchip

12.2 Printed PCB Antenna Performance of ATWINC15x0-MR210PB

The printed PCB antenna on the ATWINC15x0-MR210PB is a meandered Inverted F Antenna (IFA). The

antenna is fed via matching network, which is matched for the module installed on a 1.5mm thick main

ATWINC15x0

Design Considerations

board. Main board thickness deviation by ±1mm changes RX/TX performance by ±1dB maximum,

referring to RX/TX performance with a default antenna matching network and installed on 1.5mm thick

main board.

Measured peak antenna gain is -0.3dBi.

Antenna Radiation Pattern

Following figures illustrate the Antenna Radiation Patterns.

Figure 12-2. Antenna Radiation Pattern when Phi = 0 degree

ATWINC15x0

Design Considerations

Figure 12-3. Antenna Radiation Pattern when Phi = 90 degree

ATWINC15x0

Design Considerations

Figure 12-4. Antenna Radiation Pattern when Theta = 90 degree

12.3 ATWINC15x0-MR210UB Placement and Routing Guidelines

The ATWINC15x0-MR210UB module has an Ultra Small Miniature RF Connector (u.FL) for the external

antenna.

The choice of antenna is limited to the antenna types for which the module was tested and approved. For

a list of tested and approved antennas that may be used with the module, refer to the respective country

in Regulatory Approval.

An approved and tested antenna type is shown in the following table.

Table 12-1. Tested External Antenna Type

Antenna Type Gain

Whip Antenna 2.2dBi

ATWINC15x0

Design Considerations

12.3.1 Recommended External Antenna for ATWINC15x0-MR210UB

Whip Antenna (Part number: RN-SMA-4) along with a 10cm length RF cable assembly (u.FL to SMA) has

been used for the certification of ATWINC15x0-MR210UB. It is recommended to use the same or similar

external antenna in design.

12.4 Module Assembly Considerations

The ATWINC15x0-MR210xB modules are assembled with an EMI Shield to ensure compliance with EMI

emission and immunity rules. The EMI shield is made of a tin-plated steel (SPTE) and is not hermetically

sealed. Solutions like IPA and similar solvents can be used to clean the ATWINC15x0-MR210xB module.

However, cleaning solutions that contain acid should never be used on the module.

The ATWINC15x0-MR210xB modules are manufactured without any conformal coating applied. It is the

customer’s responsibility if a conformal coating is specified and/or applied to the ATWINC15x0-MR210xB

module.

ATWINC15x0

Design Considerations

13. Reflow Profile Information

This chapter provides guidelines for reflow processes in getting the Microchip module soldered to the

customer’s design.

13.1 Storage Condition

13.1.1 Moisture Barrier Bag Before Opening

A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85% RH.

The calculated shelf life for the dry-packed product shall be 12 months from the date the bag is sealed.

13.1.2 Moisture Barrier Bag Open

Humidity indicator cards must be blue, <30%.

13.2 Solder Paste

Sn-Ag-Cu eutectic solder with melting temperature of 217°C is most commonly used for lead-free solder

reflow application. This alloy is widely accepted in the semiconductor industry due to its low cost,

relatively low melting temperature, and good thermal fatigue resistance. Some recommended pastes

include NC-SMQ® 230 flux and Indalloy® 241 solder paste made up of 95.5 Sn/3.8 Ag/0.7 Cu or SENJU

N705-GRN3360-K2-V Type 3, no clean paste.

13.3 Stencil Design

The recommended stencil is laser-cut, stainless steel type with a thickness of 100µm to 130µm and

approximately a 1:1 ratio of stencil opening to pad dimension. To improve paste release, a positive taper

with bottom opening 25µm larger than the top can be utilized. Local manufacturing experience may find

other combinations of stencil thickness and aperture size to get good results.

13.4 Printing Process

The printing process requires no significant changes compared to Sn/Pb solder. Any guidelines

recommended by the paste manufacturers to accommodate paste specific characteristics should be

followed. Post-print inspection and paste volume measurement is very critical to ensure good print quality

and uniform paste.

13.5 Baking Conditions

This module is rated at MSL level 3. After a sealed bag is opened, no baking is required within 168 hours

so long as the devices are held at ≤30°C/60% RH or stored at <10% RH.

The module will require baking before mounting if:

• The sealed bag has been open for >168 hours

• Humidity Indicator Card reads >10%

• SIPs need to be baked for 8 hours at 125°C

ATWINC15x0

Reflow Profile Information

13.6 Soldering and Reflow Condition

The optimization of the reflow process is the most critical factor to be considered for lead-free soldering.

The development of an optimal profile should take into account the paste characteristics, the size of the

board, the density of the components, the mix of the larger and smaller components, and the peak

temperature requirements of the components. An optimized reflow process is the key to ensuring a

successful lead-free assembly and achieves high yield and long term solder joint reliability.

Temperature Profiling

Temperature profiling should be performed for all new board designs by attaching thermocouples at the

solder joints, on the top surface of the larger components, and at multiple locations of the boards. This is

to ensure that all components are heated to a temperature above the minimum reflow temperatures and

the smaller components do not exceed maximum temperature limit. The SnAgCu solder alloy melts at

~217°C, so the reflow temperature peak at joint level should be 15 to 20°C higher than melting

temperature. The targeted solder joint temperature for the Sn-Ag-Cu solder should be ~235°C. For larger

or sophisticated boards with a large mix of components, it is also important to ensure that the

temperature difference across the board is less than 10 degrees to minimize board warpage. The

maximum temperature at the component body should not exceed the MSL3 qualification specification.

13.6.1 Reflow Oven

It is strongly recommended that a reflow oven equipped with more heating zones and Nitrogen

atmosphere should be used for lead-free assembly. Nitrogen atmosphere has shown to improve the wet-

ability and reduce temperature gradient across the board. It can also enhance the appearance of the

solder joints by reducing the effects of oxidation.

The following items should also be observed in the reflow process:

1. Some recommended pastes include:

– NC-SMQ® 230 flux and Indalloy® 241 solder paste made up of 95.5 Sn/3.8 Ag/0.7 Cu

– SENJU N705-GRN3360-K2-V Type 3, no clean paste.

2. Allowable reflow soldering iterations:

– Three times based on the following reflow soldering profile (refer following Figure).

3. Temperature profile:

– Reflow soldering shall be done according to the following temperature profile (refer to the

following figure).

– Peak temperature: 250°C.

ATWINC15x0

Reflow Profile Information

Figure 13-1. Solder Reflow Profile

25oC

Slope: 1~2oC/sec max.

(217oC to peak) (Peak: 250oC)

Ramp down rate:

Max. 2.5oC/sec.

Time (sec)

40 ~ 70 sec.

60 ~ 120 sec.

Ramp up rate:

Max. 2.5oC/sec.

Preheat:150 ~ 200oC

217oC

Cleaning

The exposed ground paddle helps to self-align the module, avoiding pad misalignment. The use of no

clean solder pastes is recommended. Full drying of no-clean paste fluxes as a result of the reflow process

must be ensured. This may require longer reflow profiles and/or peak temperatures toward the high end

of the process window as recommended by the solder paste vendor. It is believed that uncured flux

residues could lead to corrosion and/or shorting in accelerated testing and possibly the field.

Rework

Rework is to remove the mounted SIP package and replace with a new unit. It is recommended that once

an ATWINC15x0-MR210xB Module has been removed it should never be reused. During the rework

process, the mounted module and PCB are heated partially, and the module is removed. It is

recommended to pay attention to heat-proof the proximity of the mounted parts and junctions and use the

best nozzle for rework that is suited to the module size.

ATWINC15x0

Reflow Profile Information

14. Regulatory Approval

Regulatory Approvals received.

ATWINC1500-MR210PB

• United States/FCC ID: 2ADHKATWINC1500

• Canada

– IC: 20266-WINC1500PB

– HVIN: ATWINC1500-MR210PB

• Europe - CE

ATWINC1510-MR210PB

• United States/FCC ID: 2ADHKATWINC1510

• Canada

– IC: 20266-ATWINC1510

– HVIN: ATWINC1510-MR210PB

• Europe - CE

ATWINC1500-MR210UB

• United States/FCC ID: 2ADHKATWINC1500U

• Canada

– IC: 20266-WINC1500UB

– HVIN: ATWINC1500-MR210UB

14.1 United States

The ATWINC1500-MR210PB, ATWINC1510-MR210PB and ATWINC1500-MR210UB modules have

received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C

“Intentional Radiators” single-modular approval in accordance with Part 15.212 Modular Transmitter

approval. Single-modular transmitter approval is defined as a complete RF transmission sub-assembly,

designed to be incorporated into another device, that must demonstrate compliance with FCC rules and

policies independent of any host. A transmitter with a modular grant can be installed in different end-use

products (referred to as a host, host product, or host device) by the grantee or other equipment

manufacturer, then the host product may not require additional testing or equipment authorization for the

transmitter function provided by that specific module or limited module device.

The user must comply with all of the instructions provided by the Grantee, which indicate installation

and/or operating conditions necessary for compliance.

A host product itself is required to comply with all other applicable FCC equipment authorization

regulations, requirements, and equipment functions that are not associated with the transmitter module

portion. For example, compliance must be demonstrated: to regulations for other transmitter components

within a host product; to requirements for unintentional radiators (Part 15 Subpart B), such as digital

devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the

non-transmitter functions on the transmitter module (i.e., Verification or Declaration of Conformity) as

appropriate (e.g., Bluetooth and Wi-Fi transmitter modules may also contain digital logic functions).

14.1.1 Labeling And User Information Requirements

The ATWINC1500-MR210PB, ATWINC1510-MR210PB and ATWINC1500-MR210UB modules have

been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed

ATWINC15x0

Regulatory Approval

inside another device, then the outside of the finished product into which the module is installed must

display a label referring to the enclosed module. This exterior label should use the following wording:

For the ATWINC1500-MR210PB:

Contains Transmitter Module FCC ID: 2ADHKATWINC1500

Contains FCC ID: 2ADHKATWINC1500

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two

conditions: (1) this device may not cause harmful interference, and (2) this device must accept

any interference received, including interference that may cause undesired operation.

For the ATWINC1510-MR210PB:

Contains Transmitter Module FCC ID: 2ADHKATWINC1510

Contains FCC ID: 2ADHKATWINC1510

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two

conditions: (1) this device may not cause harmful interference, and (2) this device must accept

any interference received, including interference that may cause undesired operation.

For the ATWINC1500-MR210UB:

Contains Transmitter Module FCC ID: 2ADHKATWINC1500U

Contains FCC ID: 2ADHKATWINC1500U

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two

conditions: (1) this device may not cause harmful interference, and (2) this device must accept

any interference received, including interference that may cause undesired operation.

The user's manual for the finished product should include the following statement:

This equipment has been tested and found to comply with the limits for a Class B digital device,

pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection

against harmful interference in a residential installation. This equipment generates, uses and can radiate

radio frequency energy, and if not installed and used in accordance with the instructions, may cause

harmful interference to radio communications. However, there is no guarantee that interference will not

occur in a particular installation. If this equipment does cause harmful interference to radio or television

reception, which can be determined by turning the equipment off and on, the user is encouraged to try

to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna

• Increase the separation between the equipment and receiver

• Connect the equipment into an outlet on a circuit different from that to which the receiver is

connected

• Consult the dealer or an experienced radio/TV technician for help

ATWINC15x0

Regulatory Approval

Additional information on labeling and user information requirements for Part 15 devices can be found in

KDB Publication 784748, which is available at the FCC Office of Engineering and Technology (OET)

Laboratory Division Knowledge Database (KDB) https://apps.fcc.gov/oetcf/kdb/index.cfm.

14.1.2 RF Exposure

All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF

Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities,

operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by

the Federal Communications Commission (FCC).

From the FCC Grant: Output power listed is conducted. This transmitter is restricted for use with the

specific antenna(s) tested in this application for Certification.

In the end product, the antenna(s) used with this transmitter must be installed to provide a separation

distance of at least 6.5 cm from all persons and must not be co-located or operation in conjunction with

any other antenna or transmitter. User and installers must be provided with antenna installation

instructions and transmitter operating conditions for satisfying the RF exposure compliance.

14.1.3 Approved Antenna Types

To maintain modular approval in the United States, only the antenna types that have been tested shall be

used. It is permissible to use different antenna provided the same antenna type and antenna gain (equal

to or less than) is used. An antenna type comprises antennas having similar in-band and out-of-band

radiation patterns.

Testing the ATWINC1500-MR210UB module was performed with the antenna types listed in Table 12-1.

14.1.4 Helpful Web Sites

Federal Communications Commission (FCC): http://www.fcc.gov

FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB)

https://apps.fcc.gov/oetcf/kdb/index.cfm

14.2 Canada

The ATWINC1500-MR210PB, ATWINC1510-MR210PB and ATWINC1500-MR210UB modules have

been certified for use in Canada under Innovation, Science, and Economic Development Canada (ISED,

formerly Industry Canada) Radio Standards Procedure (RSP) RSP-100, Radio Standards Specification

(RSS) RSS-Gen and RSS-247. Modular approval permits the installation of a module in a host device

without the need to recertify the device.

14.2.1 Labeling and User Information Requirements

Labeling Requirements (from RSP-100 - Issue 11, Section 3): The host product shall be properly labeled

to identify the module within the host device.

The Innovation, Science and Economic Development Canada certification label of a module shall be

clearly visible at all times when installed in the host device; otherwise, the host product must be labeled to

display the Innovation, Science and Economic Development Canada certification number of the module,

preceded by the word “Contains” or similar wording expressing the same meaning, as follows:

For the ATWINC1500-MR210PB:

Contains IC: 20266-WINC1500PB

ATWINC15x0

Regulatory Approval

For the ATWINC1510-MR210PB:

Contains IC: 20266-ATWINC1510

For the ATWINC1500-MR210UB module:

Contains IC: 20266-WINC1500UB

User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4 RSS-Gen, Issue 4,

November 2014): User manuals for license-exempt radio apparatus shall contain the following or

equivalent notice in a conspicuous location in the user manual or alternatively on the device or both:

This device complies with Industry Canada's license exempt RSS standard(s). Operation is

subject to the following two conditions:

(1) This device may not cause interference, and

(2) This device must accept any interference, including interference that may cause undesired

operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio

exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:

(1) l'appareil ne doit pas produire de brouillage, et

(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le

brouillage est susceptible d'en compromettre le fonctionnement.

Guidelines on Transmitter Antenna for License Exempt Radio Apparatus:

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of

a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce

potential radio interference to other users, the antenna type and its gain should be so chosen

that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for

successful communication.

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut

fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour

l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique

à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la

puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à

l'établisse-ment d'une communication satisfaisante.

Immediately following the above notice, the manufacturer shall provide a list of all antenna types

approved for use with the transmitter, indicating the maximum permissible antenna gain (in dBi) and

required impedance for each.

14.2.2 Transmitter Antenna (From Section 8.3 RSS-GEN, Issue 4, November 2014)

User manuals for transmitters equipped with detachable antennas shall also contain the following notice

in a conspicuous location:

This radio transmitter (identify the device by certification number, or model number if Category

II) has been approved by Industry Canada to operate with the antenna types listed below with the

maximum permissible gain and required antenna impedance for each antenna type indicated.

ATWINC15x0

Regulatory Approval

Antenna types not included in this list, having a gain greater than the maximum gain indicated

for that type, are strictly prohibited for use with this device.

Le présent émetteur radio (identifier le dispositif par son numéro de certification) a été approuvé

par Industrie Canada pour fonctionner avec les types d'antenne énumérés ci‑dessous et ayant

un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est

supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.

14.2.3 RF Exposure

All transmitters regulated by Innovation, Science and Economic Development Canada (ISED) must

comply with RF exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance

of Radiocommunication Apparatus (All Frequency Bands).

This transmitter is restricted for use with a specific antenna tested in this application for certification, and

must not be co-located or operating in conjunction with any other antenna or transmitters within a host

device, except in accordance with Canada multi-transmitter product procedures.

The installation of the transmitter must ensure that the antenna has a separation distance of at least 6.5

cm from all persons or compliance must be demonstrated according to the ISED SAR procedures.

14.2.4 Helpful Web Sites

Innovation, Science and Economic Development Canada (ISED): http://www.ic.gc.ca/

14.3 Europe

The ATWINC15x0-MR210PB module is a Radio Equipment Directive (RED) assessed radio module that

is CE marked and has been manufactured and tested with the intention of being integrated into a final

product.

The ATWINC15x0-MR210PB module has been tested to RED 2014/53/EU Essential Requirements for

Health and Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC) (Article 3.1(b)), and Radio

(Article 3.2), which is summarized in the following European Compliance Testing table.

The ETSI provides guidance on modular devices in the “Guide to the application of harmonised standards

covering articles 3.1b and 3.2 of the RED 2014/53/EU (RED) to multi-radio and combined radio and non-

radio equipment” document available at http://www.etsi.org/deliver/etsi_eg/203300_203399/20

3367/01.01.01_60/eg_203367v010101p.pdf.

Note: To maintain conformance to the testing listed in the following European Compliance Testing table

the module shall be installed in accordance with the installation instructions in this data sheet and shall

not be modified. When integrating a radio module into a completed product, the integrator becomes the

manufacturer of the final product and is therefore responsible for demonstrating compliance of the final

product with the essential requirements against the RED.

14.3.1 Labeling and User Information Requirements

The label on the final product that contains the ATWINC15x0-MR210PB module must follow CE marking

requirements.

ATWINC15x0

Regulatory Approval

Table 14-1. European Compliance Testing (ATWINC15x0-MR210PB)

Certification Standards Article Laboratory Report

Number

Date

Safety EN60950-1:2006/A11:2009/

A1:2010/ A12:2011/A2:2013

[3.1(a)]

TUV

Rheinland,

Taiwan

10059657

001 2017-02-20

Health EN300328 V1.9.1/

EN62311:2008

50068130

002

2017-02-20

EMC

EN301489-1 V1.9.2

[3.1(b)]

10058459

002 2017-02-20

EN301489-17 V2.2.1

EN301489-1 V2.1.1

EN301489-1 V2.2.0 10058459

003 2017-05-25

EN301489-17 V3.1.1

EN301489-17 V3.2.0

Radio EN300328 V1.9.1

(3.2)

50068130

002

2017-02-20

EN300328 V2.1.1 50068130

003 2017-05-26

14.3.2 Conformity Assessment

From ETSI Guidance Note EG 203367, section 6.1, when non-radio products are combined with a radio

product:

If the manufacturer of the combined equipment installs the radio product in a host non-radio product in

equivalent assessment conditions (i.e. host equivalent to the one used for the assessment of the radio

product) and according to the installation instructions for the radio product, then no additional assessment

of the combined equipment against article 3.2 of the RED is required.

The European Compliance Testing listed in the preceeding table was performed using the integral chip

antenna.

14.3.2.1 Simplified EU Declaration of Conformity

Hereby, Microchip Technology Inc. declares that the radio equipment type ATWINC15x0-MR210PB is in

compliance with Directive 2014/53/EU.

The full text of the EU declaration of conformity for this product is available at http://www.microchip.com/

design-centers/wireless-connectivity/.

14.3.3 Helpful Websites

A document that can be used as a starting point in understanding the use of Short Range Devices (SRD)

in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which

can be downloaded from the European Communications Committee (ECC) at: http://www.ecodocdb.dk/.

Additional helpful web sites are:

• Radio Equipment Directive (2014/53/EU):

https://ec.europa.eu/growth/single-market/european-standards/harmonised-standards/red_en

• European Conference of Postal and Telecommunications Administrations (CEPT):

http://www.cept.org

ATWINC15x0

Regulatory Approval

• European Telecommunications Standards Institute (ETSI):

http://www.etsi.org

• The Radio Equipment Directive Compliance Association (REDCA):

http://www.redca.eu/

14.4 Other Regulatory Information

• For information about other countries' jurisdictions not covered here, refer to http://

www.microchip.com/design-centers/wireless-connectivity

• Should other regulatory jurisdiction certification be required by the customer, or the customer needs

to recertify the module for other reasons, contact Microchip for the required utilities and

documentation

ATWINC15x0

Regulatory Approval

15. Reference Documentation and Support

15.1 Reference Documents

The following table provides the set of collateral documents to ease integration and device ramp.

Table 15-1. Reference Documents

Title Content

ATWINC1500 MU Device

Datasheet

Datasheet for the ATWINC1500 SmartConnect Wi-Fi component.

For more details, contact a Microchip sales representative.

Platform Getting Started Guide Details on how to evaluate the WINC15X0 Network Controller

Module.

Flash Memory Download

Procedure

Details the download procedures of firmware, root certificate, gain

table values, etc.

ATWINC1500 Wi-Fi Network

Controller Software Design Guide

Integration guide with a clear description of High-level Arch, an

overview on how to write a networking application, list all APIs,

parameters, and structures.

Features of the device, SPI/handshake protocol between device

and host MCU, with flow/sequence/state diagram, and timing.

Software Programming Guide

(ATWINC15x0)

Details the flow chart and how to use each API to implement all

generic use cases (for example, start AP, start STA, provisioning,

UDP, TCP, HTTP, TLS, p2p, errors management, connection/

transfer recovery mechanism/state diagram) - usage and sample

application note.

Note: A Design Files Package is available under NDA. For more details, contact a Microchip sales

representative.

For a complete listing of development-support tools and documentation, visit www.microchip.com, or refer

to the customer support section on options to locate the nearest Microchip field representative.

ATWINC15x0

Reference Documentation and Support

16. Document Revision History

Note: The datasheet revision is independent of the die revision (Revision bit in the Device Identification

number).

Rev B - 12/2017

Section Changes

Introduction Editorial updates.

Features Editorial updates.

Regulatory Approvals Revised the content of certifications.

Reference Documents Updated Table 15-1.

Rev A - 02/2017

Section Changes

Document • Change of document style.

• Change the name to incorporate all the

ATWINC15x0-MR210xB module family.

• New Microchip document number. Previous

version was Atmel document 42502 rev. B.

Product Description • Added description information indicating that

the document content is relevant to all

WINC1500 Module models unless noted.

• Changed SSL references to TLS.

• Removed WAPI security.

• Removed UART as host interface.

• Editorial updates.

Product Features • Removed WAPI security.

• Removed UART and I2C as host interfaces.

• Removed Bluetooth coexistance interface.

• Replaced SSL with TLS.

• Added 26 MHz crystal.

• Removed: (4KB flash – less than 1KB RAM).

Order Information and Module Marking • Revised Ordering table.

• Revised Marking information. Figure.

Block Diagram • Revised Block Diagram figure.

Pin Description • Revised Pin Description drawing.

• Editorial updates.

ATWINC15x0

Document Revision History

Section Changes

Electrical Specifications • Revised VDDIO maximum voltage in table

4.1 and added max temperatures.

• Revised table 4-2 to include Recommended

operating temperature.

CPU and Memory Subsystems • Editorial update.

WLAN Subsystem RADIO • Added text regarding performance derating

at cold temperature.

• Features table revisions and changes:

– Corrected the package height

– Revised Storage temperature

• Added performance test conditions to the

performance tables.

• Revised the Receive performance in table

6-2.

• Revised the 802.11b mode Transmit

performance numbers in table 6-3.

• Revised Transmit performance Footnotes.

• Changed max frequency to 2.472GHz.

• Editorial updates.

External Interfaces • Revised SPI timing information in table 7-3.

• Removed Bluetooth Coexistance section.

• Removed SDIO.

• Editorial updates.

Power Consumption • Added Module Reset section for reset

duration.

• Editorial updates.

ATWINC15x0-MR210PB Placement and Routing

Guidelines

• Added text for antenna types used in test

and an associated table.

• Revised Co-Ax connector type.

Schematic Design Information • Removed SDIO schematic.

• Editorial updates.

Module Drawings • Updated module drawing figures and figure

titles.

• Added section with footprint drawing.

Design Considerations • Added sections for Module design and

assembly considerations, and module PCB

placement.

Reflow Profile Information • Revised reflow profile picture to be clearer.

ATWINC15x0

Document Revision History

Section Changes

• Editorial updates.

Certification Notices • Added section for Agency Certification

notices (now under Regulatory Approvals

with Rev. B).

Agency Regulatory Approvals • Added back Agency Approval section.

• Revised content of certifications.

Reference Documents • Moved Design File Package to a separate

paragraph below the table to remove web

availability aspect and to contact sales.

Rev B - 02/2016

• Updated footers.

Module Outline Drawing • Revised Module outline drawings to show

Ground pad to be soldered.

• Pulled out Footprint drawing as this is

covered in the Module drawing.

WLAN Subsystem Radio • Revised Transmit Performance Table 6-3.

Power Consumption • Revised current table references in Table

8-1.

Schematic Design Information • Updated Schematics Section 11 text and

figures Figure 11-1 and Figure 11-2.

Reflow Profile Information • Revised section 12 Reflow Profile

Information.

Reference Documents • Updated Document Reference table to

include the ATWINC1500-MU datasheet.

Rev A - 07/2015

Document Updated due to changes in the ATWINC1500 from

Rev A to Rev B.

Description • Updated model revisions to rev B.

• Corrected Package dimensions.

Features • Added Hardware Accelerator content to

features list.

Pinout Information • Updated reference schematic.

ATWINC15x0

Document Revision History

• New pin list adds GPIO's 3,4,5 and 6.

CPU and Memory Subsystems • Increased Memory from 182KB to 160KB.

External Interfaces • Improved and corrected description of

Coexistence interface.

• Editorial updates.

Power Consumption • Updated power numbers and description,

added high-power and low-power modes.

WLAN Subsystem Radio • Updated Performance numbers.

ATWINC15x0

Document Revision History

The Microchip Web Site

Microchip provides online support via our web site at http://www.microchip.com/. This web site is used as

a means to make files and information easily available to customers. Accessible by using your favorite

Internet browser, the web site contains the following information:

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resources, user’s guides and hardware support documents, latest software releases and archived

software

•General Technical Support – Frequently Asked Questions (FAQ), technical support requests,

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Microchip’s customer notification service helps keep customers current on Microchip products.

Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata

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To register, access the Microchip web site at http://www.microchip.com/. Under “Support”, click on

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Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

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• Technical Support

Customers should contact their distributor, representative or Field Application Engineer (FAE) for support.

Local sales offices are also available to help customers. A listing of sales offices and locations is included

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Technical support is available through the web site at: http://www.microchip.com/support

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Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the

market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of

these methods, to our knowledge, require using the Microchip products in a manner outside the

operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is

engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

ATWINC15x0

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the

code protection features of our products. Attempts to break Microchip’s code protection feature may be a

violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software

or other copyrighted work, you may have a right to sue for relief under that Act.

Legal Notice

Information contained in this publication regarding device applications and the like is provided only for

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application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR

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Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,

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Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom,

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trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

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GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of

Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their respective companies.

ATWINC15x0

ISBN: 978-1-5224-2512-0

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systems is ISO 9001:2000 certified.

ATWINC15x0

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