BIPOLAR ANALOG INTEGRATED CIRCUIT
PC8182TB
3 V, 2.9 GHz SILICON MMIC
MEDIUM OUTPUT POWER AMPLIFIER
FOR MOBILE COMMUNICATIONS
Document No. PU10206EJ01V0DS (1st edition)
(Previous No. P14543EJ2V0DS00)
Date Published December 2002 CP (K)
DESCRIPTION
The
PC8182TB is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This
IC operates at 3 V. The medium output power is suitable for RF-TX of mobile communications system.
This IC is manufactured using our 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. This
process uses direct silicon nitride passivation film and gold electrodes. These materials can protect the chip surface
from pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
•Supply voltage: VCC = 2.7 to 3.3 V
•Circuit current: ICC = 30 mA TYP. @ VCC = 3.0 V
•Medium output power: PO (1dB) = +9.5 dBm TYP. @ f = 0.9 GHz
PO (1dB) = +9.0 dBm TYP. @ f = 1.9 GHz
PO (1dB) = +8.0 dBm TYP. @ f = 2.4 GHz
•Power gain: GP = 21.5 dB TYP. @ f = 0.9 GHz
GP = 20.5 dB TYP. @ f = 1.9 GHz
GP = 20.5 dB TYP. @ f = 2.4 GHz
•Upper limit operating frequency: fu = 2.9 GHz TYP. @ 3 dB bandwidth
•High-density surface mounting: 6-pin super minimold package (2.0 1.25 0.9 mm)
APPLICAION
•Buffer amplifiers on 1.9 to 2.4 GHz mobile communications system
ORDERING INFORMATION (Solder Contains Lead)
Part Number
Package
Marking
Supplying Form
PC8182TB-E3
6-pin super minimold
C3F
• Embossed tape 8 mm wide
• Pin 1, 2, 3 face the perforation side of the tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, contact you’re nearby sales office. Part number for sample order:
PC8182TB-AZ
ORDERING INFORMATION (Pb-Free)
Part Number
Package
Marking
Supplying Form
PC8182TB-E3-AZ*
6-pin super minimold
C3F
• Embossed tape 8 mm wide
• Pin 1, 2, 3 face the perforation side of the tape
• Qty 3 kpcs/reel
*NOTE: Please refer to the last page of this data sheet, “Compliance with EU Directives” for Pb-Free RoHS
Compliance Information.
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Data Sheet PU10206EJ01V0DS
2
PC8182TB
PIN CONNECTIONS
Pin No.
Pin Name
1
INPUT
2
GND
3
GND
4
OUTPUT
5
GND
6
VCC
PRODUCT LINE-UP (TA = +25°C, VCC = Vout = 3.0 V, ZS = ZL = 50 )
Part No.
fu
(GHz)
PO (1 dB)
(dBm)
GP
(dB)
ICC
(mA)
Package
Marking
PC8182TB
2.9
+9.5 @ f = 0.9 GHz
21.5 @ f = 0.9 GHz
30.0
6-pin super minimold
C3F
+9.0 @ f = 1.9 GHz
20.5 @ f = 1.9 GHz
+8.0 @ f = 2.4 GHz
20.5 @ f = 2.4 GHz
PC2762T
2.9
+8.0 @ f = 0.9 GHz
13.0 @ f = 0.9 GHz
26.5
6-pin minimold
C1Z
PC2762TB
+7.0 @ f = 1.9 GHz
15.5 @ f = 1.9 GHz
6-pin super minimold
PC2763T
2.7
+9.5 @ f = 0.9 GHz
20.0 @ f = 0.9 GHz
27.0
6-pin minimold
C2A
PC2763TB
+6.5 @ f = 1.9 GHz
21.0 @ f = 1.9 GHz
6-pin super minimold
PC2771T
2.2
+11.5 @ f = 0.9 GHz
21.0 @ f = 0.9 GHz
36.0
6-pin minimold
C2H
PC2771TB
+9.5 @ f = 1.5 GHz
21.0 @ f = 1.5 GHz
6-pin super minimold
PC8181TB
4.0
+8.0 @ f = 0.9 GHz
19.0 @ f = 0.9 GHz
23.0
6-pin super minimold
C3E
+7.0 @ f = 1.9 GHz
21.0 @ f = 1.9 GHz
+7.0 @ f = 2.4 GHz
22.0 @ f = 2.4 GHz
Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
Caution The package size distinguishes between minimold and super minimold.
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Data Sheet PU10206EJ01V0DS
3
PC8182TB
SYSTEM APPLICATION EXAMPLE
Digital cellular telephone
Caution The insertion point is different due to the specifications of conjunct devices.
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Data Sheet PU10206EJ01V0DS
4
PC8182TB
PIN EXPLANATION
Pin No.
Pin Name
Applied
Voltage
(V)
Pin
Voltage
(V) Note
Function and Applications
Internal Equivalent Circuit
1
INPUT
–
0.99
Signal input pin. A internal
matching circuit, configured with
resistors, enables 50 connection
over a wide band.
A multi-feedback circuit is designed
to cancel the deviations of hFE and
resistance.
This pin must be coupled to signal
source with capacitor for DC cut.
4
OUTPUT
Voltage
as same as
VCC through
external
inductor
–
Signal output pin. The inductor
must be attached between VCC and
output pins to supply current to the
internal output transistors.
6
VCC
2.7 to 3.3
–
Power supply pin, which biases the
internal input transistor.
This pin should be externally
equipped with bypass capacitor to
minimize its impedance.
2
3
5
GND
0
–
Ground pin. This pin should be
connected to system ground with
minimum inductance. Ground
pattern on the board should be
formed as wide as possible.
All the ground pins must be
connected together with wide
ground pattern to decrease
impedance difference.
Note Pin voltage is measured at VCC = 3.0 V.
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Data Sheet PU10206EJ01V0DS
5
PC8182TB
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Test Conditions
Ratings
Unit
Supply Voltage
VCC
TA = +25C, pin 4 and pin 6
3.6
V
Total Circuit Current
ICC
TA = +25C
60
mA
Power Dissipation
PD
TA = +85°C Note
270
mW
Operating Ambient Temperature
TA
40 to +85
C
Storage Temperature
Tstg
55 to +150
C
Input Power
Pin
TA = +25C
+10
dBm
Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Remarks
Supply Voltage
VCC
2.7
3.0
3.3
V
Same voltage should be applied
to pin 4 and pin 6.
Operating Ambient Temperature
TA
40
+25
+85
C
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Data Sheet PU10206EJ01V0DS
6
PC8182TB
ELECTRICAL CHARACTERISTICS
(TA = +25C, VCC = Vout = 3.0 V, ZS = ZL = 50 , unless otherwise specified)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Circuit Current
ICC
No signal
30.0
38.0
mA
Power Gain
GP
f = 0.9 GHz
f = 1.9 GHz
f = 2.4 GHz
19.0
18.0
18.0
21.5
20.5
20.5
25.0
24.0
24.0
dB
Noise Figure
NF
f = 0.9 GHz
f = 1.9 GHz
f = 2.4 GHz
4.5
4.5
5.0
6.0
6.0
6.5
dB
Upper Limit Operating Frequency
fu
3 dB down below from gain at f = 0.1 GHz
2.6
2.9
GHz
Isolation
ISL
f = 0.9 GHz
f = 1.9 GHz
f = 2.4 GHz
28
27
26
33
32
31
dB
Input Return Loss
RLin
f = 0.9 GHz
f = 1.9 GHz
f = 2.4 GHz
5
7
9
8
10
12
dB
Output Return Loss
RLout
f = 0.9 GHz
f = 1.9 GHz
f = 2.4 GHz
7
8
11
10
11
14
dB
Gain 1 dB Compression Output
Power
PO(1dB)
f = 0.9 GHz
f = 1.9 GHz
f = 2.4 GHz
+7.0
+6.5
+5.5
+9.5
+9.0
+8.0
dBm
Saturated Output Power
PO(sat)
f = 0.9 GHz, Pin = 5 dBm
f = 1.9 GHz, Pin = 5 dBm
f = 2.4 GHz, Pin = 5 dBm
+11.0
+10.5
+10.0
dBm
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Data Sheet PU10206EJ01V0DS
7
PC8182TB
TEST CIRCUITS
COMPONENTS OF TEST CIRCUIT EXAMPLE OF ACTUAL APPLICATION COMPONENTS
FOR MEASURING ELECTRICAL
CHARACTERISTICS
Type
Value
Type
Value
Operating Frequency
C1, C2
Bias Tee
1 000 pF
C1 to C3
Chip capacitor
1 000 pF
100 MHz or higher
C3
Capacitor
1 000 pF
L
Chip inductor
100 nH
100 MHz or higher
L
Bias Tee
1 000 nH
10 nH
2.0 GHz or higher
INDUCTOR FOR THE OUTPUT PIN
The internal output transistor of this IC consumes 20 mA, to output medium power. To supply current for output
transistor, connect an inductor between the Vcc pin (pin 6) and output pin (pin 4). Select large value inductance, as
listed above.
The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum
voltage drop to output enable high level. In terms of AC, the inductor makes output-port-impedance higher to get
enough gain. In this case, large inductance and Q is suitable.
For above reason, select an inductance of 100 or over impedance in the operating frequency. The gain is a
peak in the operating frequency band, and suppressed at lower frequencies.
The recommendable inductance can be chosen from example of actual application components list as shown
above.
CAPACITORS FOR THE VCC, INPUT, AND OUTPUT PINS
Capacitors of 1 000 pF are recommendable as the bypass capacitor for the Vcc pin and the coupling capacitors
for the input and output pins.
The bypass capacitor connected to the Vcc pin is used to minimize ground impedance of Vcc pin. So, stable bias
can be supplied against Vcc fluctuation.
The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial
impedance. Their capacitance are therefore selected as lower impedance against a 50 load. The capacitors thus
perform as high pass filters, suppressing low frequencies to DC.
To obtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit. In the case of under
10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are
determined by equation, C = 1/(2Rfc).
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Data Sheet PU10206EJ01V0DS
8
PC8182TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
COMPONENT LIST
Value
C
1 000 pF
L
Example: 10 nH
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Data Sheet PU10206EJ01V0DS
9
PC8182TB
TYPICAL CHARACTERISTICS (TA = +25C, unless otherwise specified)
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Data Sheet PU10206EJ01V0DS
10
PC8182TB
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Data Sheet PU10206EJ01V0DS
11
PC8182TB
Remark The graphs indicate nominal characteristics.
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Data Sheet PU10206EJ01V0DS
12
PC8182TB
SMITH CHART (VCC = Vout = 3.0 V)
S11-FREQUENCY
S22-FREQUENCY
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Data Sheet PU10206EJ01V0DS
13
PC8182TB
S-PARAMETERS
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Data Sheet PU10206EJ01V0DS
14
PC8182TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
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Data Sheet PU10206EJ01V0DS 15
PC8182TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired
oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to the VCC pin.
(4) The inductor must be attached between VCC and output pins. The inductance value should be determined in
accordance with desired frequency.
(5) The DC cut capacitor must be attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature) : 260C or below
Time at peak temperature : 10 seconds or less
Time at temperature of 220C or higher : 60 seconds or less
Preheating time at 120 to 180C : 12030 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
IR260
VPS
Peak temperature (package surface temperature) : 215C or below
Time at temperature of 200C or higher : 25 to 40 seconds
Preheating time at 120 to 150C : 30 to 60 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
VP215
Wave Soldering
Peak temperature (molten solder temperature) : 260C or below
Time at peak temperature : 10 seconds or less
Preheating temperature (package surface temperature) : 120C or below
Maximum number of flow processes : 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (pin temperature) : 350C or below
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
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