[ SPEC No. ) C C 11 9 0 0 6 ISSUE: Sep. 30 1999 To: SPECIF Product Typk : Vi-type Model No. I CAT I ONS C&IS Color Area Sensor with 1lOk Pixels for CIF LZ37ClO Xhis specifications contains 21 pages including the cover. If you have any objections. p&e contact us before issuing purchasing order. CUSTONERSACCEPTANCE DATE: DV. PRESENTED BY: K. MISAWA Dept. General Manager REYIETED BY: PREP.\RED BY: Image Device Engineering Department System LSI Development Center Integrated Circuits Group SHARP CORPOR.XTION 1 1 SHARP 0 Handle this document carefully for it contains material protected by international copyright law. Any reproduction. full or in part. of this material is prohibited without the express written permission of the company. 0 Rhen using the products covered herein. please observe the conditions written herein and the precautions outlined in the following paragraphs. In no event shall the company be liable for any damages resulting from failure to st:ictly adhere to these condi tions and precautions. (1) The products covered herein are designed and manufactured for the following application areas. ifhen using the products covered herein for the equipment listed in Paragraph (2). even for the following application areas. be sure to observe the precautions given in Paragraph (2). Never use the products for the equipment listed in Paragraph (3). *Office electronics *Instrumentation and measuring equipstent *#achine tools *Audiovisual equipment .Home appliances *Communication equipment other than for trunk lines (2) Those contemplating using the products covered herein for the following equipment which demands high reliability. should first contact a sales representative of the company and then accept responsibility for incorporating into the design fail-safe operation. redundancy, and other appropriate measures for ensuring reliability and safety of the equipment and the overall sys tern. Xontrol and safety devices for airplanes, trains. automobiles. and other transportation equipment *Mainframe computers *Traffic control systems Gas leak detectors and automatic cutoff devices -Rescue and security equipment -Other safety devices and safety equipment. etc. (3) Do not use the products covered herein for the following equipment which demands extremely high performance in terms of functionality. reliability. accuracy. -Aerospace equipment *Communications equipment for trunk lines *Control equipment for the nuclear power industry -Medical equipment related to life support. etc. (4) Please direct all queries and comments regarding above three Paragraphs to a sales representative 0 Please direct representative al! queries regarding of the company. the interpretation OF the company. the products covered herein to a sales of the or SHARP CONTENTS 1. GENERAL DESCRIPTION..................................... P. 2 2. ARRANGElENT OF PIXELS ANDCOLOR FILTORS-~~~-~-~--~-**-~- P. 3 3. BLOCKDJ.%R.\I ........................................... P. 4 ....................................... 4. PIN CONFIGUR,\TION P. 5 5. PIN DESCRIPTION......................................... P. 6 ................................ 6. ELECTRIC CHARACTERISTICS P. 7 ................................. 7. IlAGING CHARACTERISTICS P. 8 8. TIMINGDIAGRAM........................ . ................. P. 9 9. DESCRIPTION OFSERIALDATA .............................. P. 12 10. EXAMPLE OFOPERATING CIRCUIT ............................ P. I.5 11. CAUTIONS FORUSE ........................................ P. 16 12. PACKAGE OUTLINE ........................................ P. 18 LZ37ClO SHARP l.GEIUER.4L l 2 DESCRIPTIOX LZ3iClO is a l/i-type(2.55mm) solid-state image sensor consists of PN photodiodes and CJIOS (Complementary Yetal-Oxide-Semiconductor) devices. The sensor further includes a timing generator (TG). a correlated double sampling (CDS) circuit. an auto gain All the control (XC) circuit and an analog-to-digital converter (ADC) circuit. Having approxicircuits of the sensor can be driven by 3.3V single power SuPPlY. mately 110.000 pixels (horizontal 393 x vertical 299). the sensor provides a stable digital color image with extremry low power consumption. I Features . 1) 2) 3) 4) Progressive scan Square pixel Compatible with CIF Format Number of image pixels Pixel pitch Number of optical black pixels : Horizontal 367 x vertical 291 : Horizontal 5.6 IIU x vertical 5.6 urn : Horizontal: front 13 and rear 13 Vertical : front 4 and rear 4 5) Primary color mosaic filter composed of B. G. B 6) Variable electronic shutter (l/30 to l/10000) 7) Image inversion function (horizontally and/or vertically) 8) Avairable for two types of low power mode (i > Serial data can select the AGC and AD power-off node (ii) STBY terminal can select all circuits pomer-off mode 9) Variable gain control (3 to 30 dB) 10) Analog output and g-bit digital output 11) 3.3V single power supply 12) P-type silicon substrate. CMOS process 13) 36-pin LCC (leadless chip carrier) package 14) Not designed or rated as radiation hardened Applications 1) 2) 3) 4) Cellular phone camera Game camera Toy camera Pattern recognition LZ37CiO SHARP 2 ARRANGEMEST OF PIXELS 3 AND COLOR FILTORS Optical black (4 Pixels) Optical black (13 Pixels) Optical black (13 Pixels) Optical black (4 Pixels) (1.291) R ,_-. __._ .... G R G I (367.291) R I , G G B G B G B B G G B G I G I I (367.1) LZ37C10 SHARF= 3. BLOCK 4 DIAGRAM F 3 0 + r 1 I V w < 0 -I Y &.I Is I," k 0 Y 5. PI5 DESCRIPTION r Pin--. No .-- I, Symbol 11 tic 2 I 3 4 5 6 7 1 ADL 1 AGCOgTl 8 (*> 1 1 A D / 0 ) I ! I 1 STBY SC DVDD DO Dl D2 D3 D4 0 1 ; I i 1 D I 0 0 D5 I 0 D7 D HD VD SD1 ) NC SCLK CLP OFS D D D 0 - 1 1 D ' 0 - ( 1 I I I j D D. D D D i I I 1 - ( / ! I - BAIS2 SIGOUTI 0 I 1 - 1 D A I A 1 1 SIGIN ( 1 AGND AVDD 1 !V c D D 0 CLK DGND / i D - DVDD 1 I I - Pic(D6 ( - DGND ( ( 35 136 A A A CKO 27 34 0 1 1 ( - 1 28 32 33 - t I 16 30 31 - 1 1 14 29 A:D ) I ADH CKI 15 18 19 20 21 22 23 24 25 26 1 - 1 12 13 1 I/O B I A S 1 1 1 I 9 10 11 17 6 LZ3TClO SHARP A A A I ! - I - I I A A - Description I No Connection 1 Analog Bias Voltage 1 for Image Sensor 1 Bottom ADC Reference Voltage j ,\GC Output ( Top ADC Reference Voitage 1 Input for Oscillator I Output for Oscillator I Stand-by control signal (*I ) No Connection 1 Digital Power Supply ( Digital Ground 1 ADC Output (LSB) 1 ADC Output ) ADC Output ( I\DC Output 1 ADC Output 1 ADC Output ( No Connection 1 ADC Output Digital Power Supply ADC Output (!dSB) I Clock output (9. OMHz) ( Digital Ground 1 Horizontal Drive Pulse Input ) Vertical Drive Pulse Input 1 Data Input (AGC Gain, Offset. I control. Shutter Image Inversion. ) No Connection ( Shift Clock for Data 1 Analog Bias Voltage 1 for Clamp Circuit ) Offset Bias Voltage for ACC / dnalog Image Signal Output I Ana!og Image Signal Input 1 Analog Ground ( ,\na!og Power Supply / tie Connection H : Stand-by mode (311 circuits power-oFfi. L or Open : Normal mode (.411 circuits active! etc. > LLdiLlU SHARP 6. ELECTRIC 6-1. I CH.4R.4CTERISTICS ABSOLUTE kI.4XIML'M Parameter Power Supply Voltage Input Signal Voltage Storage Temperature 6-2. 7 1 1 1 1 RECOMENDED RATINGS SymboI VDD ;,",r 1 1 I I Rating 4.6 VDD+O. 80 -0.3 -0.3 -40 OPERATING 1 Unit V V T 3 COtYDITIONS , 3*o Voltage Analog Input 1 High Level Voltage Analog Bias Voltage I I 3-3 1 PAX 1 Unit 1 G"b" ~bo;Hz~ 0.2VD D[ i YDD!V 1 V# H i 0. 8 VDD i (Connect to Terminal through Capaci tar) I I (Connect to GND through I I Capaci tar) I I I Comment 1. Apply to input pins HD. VD. SD1 and SCLK. Comment 2. Apply to input pin SIGIN. Do not connect to DC directly. Comment 3. Apply to pins BIdSl. BIASZ. OFS. ADL. DAL. CLP. Do not connect to GtiD directly. Cornmen, V 1 2 1 I3 I LZ37ClO SHARP 7. IM.aGIbG a CH.AR.ACTERISTICS Readout mode : l/30 sec. Normal mode Ambient temperature : 25 T Driving voltage : 3.3 V Color temperature of light source : 3200K,/IR cut-off filter (C1(500. lmmt) is used. : * Measurement point : Analog image signal output (pin no.321 before AGC and AD. No. 1 1 2 3 4 5 6 7 8 Parameter Standard output voltage Photo response non-uniformity Saturation output voltage ] Dark output voltage Dark signal non-uniformity Sensitivity (Green channel) Current dissipation Vertical line Fixed Pattern 1 Symbol I k-0 1 PRNVl(b) ( Vsat 1 Vdark (DS?iUl(e>l I R (G) 1 I VDD Noise / V F P N 1 Note 1 Pin. l(a) 1 (c> 1 Cd> 1 l(f) 1 (g) I (h > I I I ) TYP. / Max. 1501 8001 I 1 1 I 1 3001 1 5 I0.5 I ( Unit I mV % mV mV mV mV mA I.mVpp a> Vo is the average output voltage of Green channel under uniform illumination. Standard exposure condition is defined when Vo is 150 mV. b) Image area is divided into 10 x 10 segments under the standard exposure condition. Segment voltage is defined as average output voltage of all pixels within the segment. PRNU is defined by (Vmax - Vmin)/Vo. where Vmax and Vmin are the maximumm and minimum values of all the segments voltage, respectively. c> Image area is divided into 10 x 10 segments under 10 times of the standard exposure condition. Vsat is the minimum segment voltage of all the segments voltage. d> Vdark is the difference between average output voltage of the effective area and that of the OB area, under non-exposure condition. 2) Image area is divided into 10 x 10 segments under non-exposure condition. DSNU is defined by (Vdmax - Vdmin). where Vdmax and Vdmin are the maximum and minimum values of a!1 the segments voltage. respectively. f) R(G) is the average output voltage of Green channel when a 1000 lux light source on a 9006 reflector is imaged by a lens of F:4 and f=jO mm. !> IVDD is the total current of analog and digital power supply in the dark and on the standard load condition. 11 One mean horizontal line signal <bi> is obtained by adding all the horizontal line signals <aij> verticalIy and dividing them by the line number. <xi? is the deviation of the center pixel from the average of successive S pixels in <bi>. V-FPN is the maximum absolute value of <xi>. I 9 SHARP 8. TIMIKG DIAGRAM II D VD (DO-D7) ADOUT 2 :I .I 5 Ii 7 I' 1H i'i j!: ii Vertical !I II) II I2 I3 111 15 Ill between Digital Pulse Timing Phase Relations I7 Ill IO ?I) Output ?I - 2:' at :I . Tlle rising I l Oll 011 Ill1 Ml edge and falling ;! . edge of VD pulse must be in high period of IID pulses, `f R D JYD. (CLK). 26 27 2U 2U :lfl Yin. ?3 2'4 25 Symbol (ADOUT) and Clock JIJUIJUIJI~n nn-u-u-un,nn-nn nn-nn n n n_nn !I :ral `I"`1 `I'111j I . *' " : ---I/ :It 8 - 3. 8 - 2. :II 18 Max. XI I. :I4 Xi Forl)iclden SD ns Unit +- QU 00 :I11/I :I7 :lR :IIl II period SCLK l *The cnntents the pulses data Offset be less than of CLK. D20 (SDt, Shutter SCLK) !I.Description is described r to "Section 3611 and 3711, that of that from DO to D38 are refered l/2 -1 Data Timing edge of SCLK. r Serial SDr and SCLK between of SCLK should of serial frequency Do nnt irrsert * Clock * Data in SDI are taken at the rising DlO 8 - 4. 8-3. D30 of Serial in section `~1 Data", D38 SHARP --9. LZ37ClO - DESCRIPTIOY Address DO I 1 OF Symbol SERIAL DATA 1 Function I No use Dl D2 D3 D4 D5 D6 t / 1 1 1 1 P7 1 AGCl .4GCO. (LSB) D8 12 -_ AGC6 AGC5 AGC4 (hISB) (Fix to Low Level) Auto gain control (0 to 20 dB) .4GC3 AGC2 No use (FIX to Low Level) D9 DlO Dll D12 D13 D14 D15 D16 ( ( 1 1 1 D17 D18 1 OFS3 1 OFS2 D19 D20 D21 1 OFSl 1 OFSO 1 D22 D23 D.24 D25 D26 D27 D28 D29 D30 D31 ( / 1 1 ( ( ( 1 ) ( D32 D33 D31 1 MIRV 1 SAD1 I S.qDO D 3 5 D3 6 D37 D38 1 I I I OFS7 OFS6 OFS5 OFS4 SHTB SHT7 SHT6 SHT5 SHT4 SHT3 SHTZ SHTl SHTO hIIRH (MSB) Offset level control of AK OUtPut 1 (0.9 to 1.5 V) (LSB) (MSB) [ No use (Fix to Low Level) Shutter speed control (Exposure time is 1 to l/330 frame period) (LSB) (MSB) (LSB) hIr\X2 (MS B) M .`r X 1 hI.-\SO (LSB) LPXID ( H:Horizontal mirror inversion image. L:Normal image _ 1 H:Vertical mirror inversion image. L:Normal image ] Phase select of AD clock 1 (Fix to Low Level) 1 Fixed gain select 1 (3 to 10 dB) ( j H: Pea-er save mode (AGC and AD off).. L: All active LZ37ClO SHA=p 13 r G.413 COSTROL OF AUTO . One LS8 of the gain code represents approximately 0.078dB. . Nominal gain values at typical codes are shown below. 1 D21 D3/ D41 DSI D6/ D7( AutoGainControl (d B) L) L) L) LILIL ! L) 0 9-l.SETTIFG 1 1 Ll LI L) Ll HI 2 3 4 5 6 7. 8 9 I 1 I Ll L] I-1 Ll LI LI Ll HI HI H) LI Li HI HI HI LI ;I; I Lt HI Lt LI Ll I Ll lLlH!L I Ll HI L L) HI HI L HI Ll H L> L H. LI L/ Hi Ht Li ;I LI LIL HI ii; I-I 10 11 12 13 14 15 16 17 18 19 ZO n u. I 7H ; HI IL)H(H I H/ (H) LI Ll I H( LI I I j H) HI ;I LI fI I H HI H j :j )H {I 9--2.SETTING OF OFFSET . One LSB of the offset code represents I D8 H H L( L LI Li L( H( Li H\. 1 HI HI 51 L( L) HI "/"I;;;/; HI HI Hj HI L, Hi HI HI HI H LEVEL ;I/ Ll JJI Ia L\ HI H- HI Ll Ll Ll HI Ll; Ll ;. ;I I, !- Jl I-I HI H i I Li LIHI yLj 1. 1. 2 3 1 HI L( "Li I HI Lt Hi Ll HI 1. 7 4 - I HI HI u' I-1 H HI LI HI LI 1 _ . ml m q n, i7 r) nl ii 1 1. i 1. 1 UI H Li H H 1, H HI L Li L. approximately 0. OOZY. -e shown below. -. -*AI --I - 1 ;I; 1 HI SHARP LZ37ClO 14 9-3.SETTING OF SHUTTER SPEED . OneLSB of the shutter speed code represents lli. where iH is HDpulse period. - Shutter speed values at typical codes are shownbelow. Shutter Speed 026 (Exposure Time Unit ILILIL)L}L)LlL LjL)LjL)L L]L)LjL 330 329 328 . I I LI 300 . I I LIL L . . 100 . LIH - 1'0 . 3 2 1 L)L (LiH H I I (HIL(H(LIL I I I I LI L( I LI I LI I L/ HI I GAIV I .L 4 5 6 7 I L 1 036 ( I I HI I H H H H L L L ! ! L H I-I I-I I 1 D37 L H L H L H L H D3C I L L H L H L H L I LI HI Hi I LI 1dB. 3 ! I I I H(L I D29 i I LI D35 10 10 H(H I I HI L( H( H)LjH)LIL IH~L/HILJL.HILIL 8 i H I I 9 LIL L)L L I -4.SETTII'JG OF FIXED * One LSB of the gain code represents Fixed Gain Cd B) L I . 200 D27!D28 I : 1H) ;i l L t Hi I L L) L HI L H L H LZ37ClO SHARP r .O. EX.4XIPLE <-- OF OPERATING 8 f: z l.+--5 V - I/ CIRCUIT : 2 SHARP 1. Package Breakage En order to prevent the package from being broken. observe the following 1) The CMOSiaager is a precise optical instructions: component and the package material is ceramic. Therefore. Take care not to drop the device when wxlnting. handling, or transporting. . Avoid giving a shock to the package. Especially when the package are fixed to the socket and the circuit board small shock could break the package more easily than ahen the package isn' t fixed . 2 > Ehen mounting the package on the housing, be sure that the package is not bent. - If a bent package is forced into place between a hard plate or the like. the package may be broken. 3 > If any damage or breakage occur on the surface of the glass cap. its characteristics could deteriorate. Therefore. * Do not hit the glass cap. * Do not give a shock large enough to cause distortion. Do not scrub or scratch the glass surface. Even a soft cloth or applicator, if dry. could cause flaws to scratch the glass. l l 2. Electrostatic damage Please take the following anti-static measures when handling the CSIOS imager: 1) Always discharge static electricity by grounding the human body and the instrument to be used To ground the human body. provide resistance of about1 Beg ohm between the human body and the ground to be on the safe side. 21 Vhen directly handling the device with fingers, hold the part without terminal and do not touch any terminals. 3) To avoid generating static electricity, a. do not scrub the glass surface with cloth or plastic b. do not attach any tape or labels c. do not clean the glass surface with dust-cleaning tape 4) %hen storing or transporting the device. put it in a container of conductive material. 17 3. Dust and contamination Dust or contamination on the glass surface could deteriorate or cause a scar. In order to ainimize dust or contamination take the following precautions: the output characteristic on the glass surface. 1) Handle C.YOSimager in a clean environment such as a cleaned booth. ( The cleanliness level should be. if possible. class 1000 at least. ) 2 > Do not touch the glass surface with fingers If dust or contamination gets on the glass surface. the following cleaning lethod is recommended: . Dust from static electricity should be blown off with an ionized air blower. For anti-electrostatic measures, however. ground all the leads on the device before blowing off the dust. The contamination on the glass surface should be wiped off with a clean applicator soaked in Isopropyl alcohol. lipe slowly and gently in one direction only. -- Frequently replace the applicator and do not use the same applicator to clean more than one device. l % Note: In most cases, dust and contamination are unavoidable. even before the device is first used. It is. therefore. recommended that the above procedures should be taken to wipe out dust and contamination before using the device. 4. Other 1) Soldering should be manually performed within 2 seconds per terminal at 400C maximum at soldering iron. 21 Avoid using or storing the CYOS imager at high temperature or high humidity as it a precise optical component. Do not give a mechanical shock to the CMOS imager. 3) Do not expose the device to strong light. For the color device. long exposure to strong light will fade the color of the color filters. is SHARP r Reiracwe inaex : n d= i .S R O.:j>?/ UN I ?- : mm1 TIC Llr Nb.ME t . . a- __. _- -"--iE?lNG OE?T. 2 TS (IC) GROUP Package ,-F i:::....::::. . . COOE ; ; ; . . ; . I runs Let-,v I I17 I Outline : : : i ; ..I.. : : Specitrcarlon : . . . . : ; : * : ; ; . : : : , : : , :. :