To:
SPECIF
[ SPEC No. ) C
C
11 9 0
0 6 1
ISSUE:
Sep. 30 1999
I CAT I ONS
Product Typk : Vi-type C&IS Color Area Sensor with 1lOk Pixels for CIF
Model No.
LZ37ClO
Xhis specifications contains 21 pages including the cover.
If you have any objections. p&e contact us before issuing purchasing order.
CUSTONERS ACCEPTANCE
DATE :
DV.
PRESENTED
BY: K. MISAWA
Dept. General Manager
REYIETED BY: PREP.\RED BY:
Image Device Engineering Department 1
System LSI Development Center
Integrated Circuits Group
SHARP CORPOR.XTION
SHARP
0 Handle this document carefully for it contains material protected by international
copyright law. Any reproduction. full or in part. of this material is prohibited
without the express written permission of the company.
0 Rhen using the products covered herein. please observe the conditions written herein
and the precautions outlined in the following paragraphs. In no event shall the
company be liable for any damages resulting from failure to st:ictly adhere to these
condi tions and precautions.
(1) The products covered herein are designed and manufactured for the following
application areas. ifhen using the products covered herein for the equipment
listed in Paragraph (2). even for the following application areas. be sure
to observe the precautions given in Paragraph (2). Never use the products
for the equipment listed in Paragraph (3).
*Office electronics
*Instrumentation and measuring equipstent
*#achine tools
*Audiovisual equipment
.Home appliances
*Communication equipment other than for trunk lines
(2) Those contemplating using the products covered herein for the following
equipment which demands high reliability. should first contact a sales
representative of the company and then accept responsibility for incorporating
into the design fail-safe operation. redundancy, and other appropriate
measures for ensuring reliability and safety of the equipment and the overall
sys tern.
Xontrol and safety devices for airplanes, trains. automobiles. and other
transportation equipment
*Mainframe computers
*Traffic control systems
Gas leak detectors and automatic cutoff devices
-Rescue and security equipment
-Other safety devices and safety equipment. etc.
(3) Do not use the products covered herein for the following equipment which
demands extremely high performance in terms of functionality. reliability. or
accuracy.
-Aerospace equipment
*Communications equipment for trunk lines
*Control equipment for the nuclear power industry
-Medical equipment related to life support. etc.
(4) Please direct all queries and comments regarding the interpretation of the
above three Paragraphs to a sales representative OF the company.
0 Please direct al! queries regarding the products covered herein to a sales
representative of the company.
CONTENTS
SHARP
1. GENERAL DESCRIPTION
..................................... P. 2
2. ARRANGElENT OF PIXELS AND COLOR FILTORS -~~~-~-~--~-**-~- P. 3
3. BLOCK DJ.%R.\I ........................................... P.
4
4. PIN CONFIGUR,\TION
....................................... P. 5
5. PIN DESCRIPTION
......................................... P. 6
6. ELECTRIC CHARACTERISTICS
................................ P. 7
7. IlAGING CHARACTERISTICS
................................. P.
8
8.
TIMING DIAGRAM
........................ . ................. P.
9
9. DESCRIPTION OF SERIAL DATA .............................. P. 12
10. EXAMPLE OF OPERATING CIRCUIT ............................ P. I.5
11. CAUTIONS FOR USE ........................................ P. 16
12. PACKAGE OUTLINE ........................................ P. 18
SHARP
LZ37ClO
l 2
l.GEIUER.4L DESCRIPTIOX
LZ3iClO is a l/i-type(2.55mm) solid-state image sensor consists of PN photodiodes and
CJIOS (Complementary Yetal-Oxide-Semiconductor) devices. The sensor further includes
a timing generator (TG). a correlated double sampling (CDS) circuit. an auto gain
control (XC) circuit and an analog-to-digital converter (ADC) circuit. All the
circuits of the sensor can be driven by 3.3V single power
SuPPlY.
Having approxi-
mately 110.000 pixels (horizontal 393 x vertical 299). the sensor provides a stable
digital color image with extremry low power consumption.
I
Features
.
1) Progressive scan
2) Square pixel
3) Compatible with CIF Format
4) Number of image pixels : Horizontal 367 x vertical 291
Pixel pitch : Horizontal 5.6 IIU x vertical 5.6 urn
Number of optical black pixels : Horizontal: front 13 and rear 13
Vertical : front 4 and rear 4
5) Primary color mosaic filter composed of B. G. B
6) Variable electronic shutter (l/30 to l/10000)
7) Image inversion function (horizontally and/or vertically)
8) Avairable for two types of low power mode
(i > Serial data can select the AGC and AD power-off node
(ii) STBY terminal can select all circuits pomer-off mode
9) Variable gain control (3 to 30 dB)
10) Analog output and g-bit digital output
11) 3.3V single power supply
12) P-type silicon substrate. CMOS process
13) 36-pin LCC (leadless chip carrier) package
14) Not designed or rated as radiation hardened
Applications
1) Cellular phone camera
2) Game camera
3) Toy camera
4) Pattern recognition
SHARP
LZ37CiO 3
2 ARRANGEMEST OF PIXELS AND COLOR FILTORS
Optical black
(13
Pixels)
Optical black
(4 Pixels)
Optical black
(13
Pixels)
Optical black
(4 Pixels)
(1.291) (1.291)
,_-.
__._ . . . .
R G R G R
I I ,
G
G G B B G B G G
B G
I
G B I I
G B G
(367.291)
(367.1)
0
-I
&.I
I
s
I
,”
Y
Y
k
0
SHARP
LZ3TClO
6
5. PI5 DESCRIPTION
r Pin No I
--. .-- ,
Symbol 1 I/O 1 A:D )
Description
11
tic
- I -
I No Connection
2 I B I A S 1 1 - 1 A 1 Analog Bias Voltage
1
for Image Sensor
3 1 ADL t -
1 A 1 Bottom ADC Reference Voltage
4 1 AGCOgTl
0 ( A j ,\GC Output
5
ADH 1 - 1 A ( Top
ADC Reference Voitage
6
1 CKI 1 I 1 D 1 Input for Oscillator
7 1 CKO / 0
I Output for Oscillator
8 1 STBY ) - I i I Stand-by control signal (*I
9
I SC I ! I - ) No Connection
10
DVDD - D 1 Digital Power Supply
11
DGND -
( Digital Ground
12
DO
0 1 ; 1 ADC Output (LSB)
13 I Dl I i 1 D
1 ADC Output
14
D2
D ) ADC Output
15
D3 0
D
( I\DC Output
16 D4 I 0
D 1 ADC Output
17 1 D5 I 0 D 1 ADC Output
18 Pic(- -
(
No
Connection
19 D6 0
D 1 ADC Output
20
DVDD - 1 D Digital Power Supply
21 D7 1 0 D
ADC Output (!dSB)
22
CLK 0 D I Clock output (9. OMHz)
23
DGND '
- ( D. ( Digital Ground
24 ( HD
i I D 1 Horizontal Drive Pulse Input
25
1 VD I I D ) Vertical Drive Pulse Input
26
SD1 1 I j D 1 Data Input (AGC Gain, Offset. Shutter
I I I
control. Image Inversion. etc. >
27 ) NC 1 - 1 -
) No Connection
28
( SCLK ( 1 D ( Shift Clock for Data
29
( CLP / ! A 1 Analog Bias Voltage 1 for Clamp Circuit
30
OFS I -
I
A
) Offset Bias Voltage for ACC
31
/ BAIS2 - A
32
SIGOUTI 0 1 A / dnalog Image Signal Output
33 1 SIGIN A
34
( AGND ! I A I Ana!og Image Signal Input
1 Analog Ground
35
1 AVDD -
I
A
( ,\na!og Power Supply
136 1 !V c I - I -
/ tie Connection
(*> H : Stand-by mode (311 circuits power-oFfi.
L or Open : Normal mode (.411 circuits active!
SHARP
LLdiLlU 7
6. ELECTRIC CH.4R.4CTERISTICS
6-1. ABSOLUTE kI.4XIML’M RATINGS
I
Parameter 1 SymboI 1 Rating 1 Unit
Power Supply Voltage 1 V D D 1 -0.3 - 4.6 V
Input Signal Voltage 1 -
;,“,r I -0.3 - VDD+O. 3 V
Storage Temperature 1 I -40 - 80 T
6-2. RECOMENDED OPERATING COtYDITIONS
, 1 PAX
1 Unit
Cornmen,
3*o I 3-3 1 G”b” ~bo;Hz~
0.2VD D[ V 1
Voltage 1 High Level 1 V# H i 0. 8 VDD i i YDD!V
Analog Input Voltage (Connect to Terminal through I 1 2
Capaci tar)
Analog Bias Voltage I I (Connect to GND through I I3
I I I
Capaci tar) I I
Comment 1. Apply to input pins HD. VD. SD1 and SCLK.
Comment 2. Apply to input pin SIGIN. Do not connect to DC directly.
Comment 3. Apply to pins BIdSl. BIASZ. OFS. ADL. DAL. CLP.
Do not connect to GtiD directly.
SHARP
LZ37ClO a
7. IM.aGIbG CH.AR.ACTERISTICS
Readout mode : l/30 sec. Normal mode
Ambient temperature : 25 T
Driving voltage : 3.3 V
Color temperature of light source : 3200K,/IR cut-off filter (C1(500. lmmt) is used.
: * Measurement point : Analog image signal output (pin no.321 before AGC and AD.
I
No.
1 Parameter 1 Symbol 1 Note 1 Pin. I
TYP.
/ Max. ( Unit
1 Standard output voltage I k-0 l(a) I 1501 I mV
2 Photo response non-uniformity 1 PRNVl(b) I %
3 Saturation output voltage ( Vsat 1 (c> ) 8001 mV
4 ] Dark output voltage 1 Vdark 1 Cd> 1
I
m V
5 Dark signal non-uniformity (DS?iUl(e>l 1 1 m V
6 Sensitivity (Green channel) I R (G) l(f) 1 3001 mV
7 Current dissipation 1 I VDD 1 (g) I 1 5 I- m A
8 Vertical line Fixed Pattern Noise / V F P N I (h > 0.5 I
I. mVpp
a> Vo is the average output voltage of Green channel under uniform illumination.
Standard exposure condition is defined when Vo is 150 mV.
b) Image area is divided into 10 x 10 segments under the standard exposure condition.
Segment voltage is defined as average output voltage of all pixels within the segment.
PRNU is defined by (Vmax - Vmin)/Vo. where Vmax and Vmin are the maximumm and minimum
values of all the segments voltage, respectively.
c> Image area is divided into 10 x 10 segments under 10 times of the standard exposure
condition. Vsat is the minimum segment voltage of all the segments voltage.
d> Vdark is the difference between average output voltage of the effective area and that of
the OB area, under non-exposure condition.
2) Image area is divided into 10 x 10 segments under non-exposure condition. DSNU is
defined by (Vdmax - Vdmin). where Vdmax and Vdmin are the maximum and minimum values of
a!1 the segments voltage. respectively.
f) R(G) is the average output voltage of Green channel when a 1000 lux light source on a
9006 reflector is imaged by a lens of F:4 and f=jO mm.
!> IVDD is the total current of analog and digital power supply in the dark and on the
standard load condition.
11 One mean horizontal line signal <bi> is obtained by adding all the horizontal line
signals <aij> verticalIy and dividing them by the line number. <xi? is the deviation of
the center pixel from the average of successive S pixels in <bi>. V-FPN is the maximum
absolute value of <xi>.
8. TIMIKG DIAGRAM
SHARP
9
8 - 2. Phase Relations between Digital Output (ADOUT) and Clock (CLK).
ADOUT
(DO-D7)
8 - 3. Vertical Pulse Timing
SD I. SCLK
Forl)iclden period
ii
VD :It j! :
+-
---I/ II
!I i’i
:ral ‘I”‘1 ‘I’111 j I
. *’ ” : 2 I’
:I .I 5 Ii 7 1 H !I II) II I2 I3 111 15 Ill I7 Ill IO ?I) ?I /I
2:’ ?3 2’4 25 26 27 2U 2U :lfl :II 18 XI :I4 Xi :I11 :I7 :lR :IIl
II D
JIJUIJUIJI~ n n n-u-u-u n,n n-n n n n-n n n n n_nn
Symbol Yin.
JYD.
Max.
Unit
- at ‘f R D ns
I :I ;! l Oll 011 Ill1 Ml QU 00
.
Tlle rising edge and falling edge of VD pulse must be in high period of IID pulses,
.
8 - 4. Serial Data Timing (SDt, SCLK)
r Offset -1 r Shutter ‘~1
DlO D20 D30 D38
* Data in SDI are taken at the rising edge of SCLK.
* Clock frequency of SCLK should be less than l/2 of that of CLK.
l
Do nnt irrsert the pulses SDr and SCLK between 3611 and 3711, that is described in section 8-3.
*The cnntents of serial data from DO to D38 are refered to “Section !I.Description of Serial Data”,
SHARP
LZ37ClO 12
-- -- - -_
9. DESCRIPTIOY OF SERIAL DATA
1
Address I Symbol I Function
DO 1
No use
Dl t
(Fix to
Low Level)
D2 / AGC6 (hISB) Auto
gain control
D3 1 AGC5 (0 to 20 dB)
D4 1 AGC4
D5 1
.4GC3
D6 1 AGC2
P7
1 AGCl
D8 .4GCO. (LSB)
D9 No use
DlO (FIX to Low Level)
Dll
D12 (
D13 ( OFS7 (MSB)
Offset level control of AK OUtPut
D14 1 OFS6 1 (0.9 to 1.5 V)
D15 1 OFS5
D16 1 OFS4
D17 1 OFS3
D18 1 OFS2
D19 1 OFSl
D20 1 OFSO (LSB)
D21 1 [ No use
(Fix to Low Level)
D22 ( SHTB (MSB) Shutter speed
control
D23 / SHT7 (Exposure time is
1 to l/330
frame period)
D.24 1 SHT6
D25 1 SHT5
D26 ( SHT4
D27 ( SHT3
D28 ( SHTZ
D29 1 SHTl
D30 ) SHTO (LSB)
D31 ( hIIRH ( H:Horizontal mirror inversion
image. L:Normal image _
D32 1 MIRV
1 H:Vertical mirror inversion image.
L:Normal image
D33 1 SAD1 (MSB)
] Phase select of AD clock
D31 I S.qDO (LSB) 1 (Fix to Low Level)
D 3 5 1 hIr\X2 (MS B) 1 Fixed gain select
D 3 6 I M .‘r X 1 1 (3
to 10
dB)
D37 I hI.-\SO (LSB) (
D38 I LPXID j H: Pea-er save mode (AGC and AD off).. L: All active
SHA=p
LZ37ClO
r 9-l.SETTIFG OF
AUTO G.413 COSTROL
. One LS8 of the gain code represents approximately 0.078dB.
. Nominal gain values at typical codes are shown below.
AutoGainControl
(d B) 1 D21
D3/ D41 DSI
D6/ D7( D8
0 ! L) L) L)
L) LILIL
1 1
2 I
Ll LI L) Ll HI ;I;
Ll Ll Ll HI HI
3 1 L] LI
H) LI Li HI H
4 I
5
I
I-1 LI HI HI LI ;I;
Lt HI Lt LI Ll
6 I Ll HI L L) HI HI L>
7. HI Ll L
8 lLlH!L ; L H H.
I Ll HI H
9
IL)H(H H LI LI I-I
10 I H/ LI L L( L/ LIL
11 (H) Ll LI Li Hi HI L,
12 I
13
I
H( LI L(
H( Ht ii;
H) LI H\ Li Li
.
14 I HI
15 j ;I fI 51 1 HI ;I Li H
HI H 1, H
16 L( Hi HI L
17
I H
HI L) HI HI Li L.
18
19 )H H "/"I;;;/;
HI HI
ZO j {I :j Hj HI HI
HI H
9--2.SETTING OF OFFSET LEVEL
.
One LSB of the offset code represents approximately 0. OOZY.
n -
Ll JJI Ia
u.
1. i i Li yLj ;I/ 1
LI ii L\ HI H-
1. 1 I LIHI
1. 2 1 HI L( “Li 1 HI Ll HI Ll ;.
1. 3
I
Ll Ll Ll;
1. 4
I
HI Lt Hi Ll HI ;I I, !-
HI HI I-1 HI LI
Jl I-I
I I
7H 1
7 - 1 UI
u’ H HI HI HI H
13
-e shown below.
-. -*AI --I
_ . ml m q n, i7 r) nl
SHARP
LZ37ClO 14
9-3.SETTING
OF
SHUTTER SPEED
.
One
LSB
of the shutter speed code represents lli. where iH
is HD pulse period.
- Shutter speed values at typical codes are shown below.
Shutter Speed
026 D27!D28 D29 D3C
(Exposure Time Unit
: 1H) I i I
330
ILILIL)L}L)LlL L L
329 LjL)LjL)L LIL L H
328
L]L)LjL L L)L H L
.
I I I I I
300
LI L
LIL
H H(H H L
.
I I I
.
200
-
I
LIH L)L L LI LI Hi L
. I I I t
.
I I I
100 (LiH H H(L L( HI Hi L
. I I
1'0 I I I
(HIL(H(LIL LI LI L) L
.
I I I I I I I l
3
2
HI L( H( LI LI L/ ;i HI H
H)LjH)LIL HI L L
1 IH~L/HILJL.HILIL H
-4.SETTII’JG OF FIXED GAIV
* One LSB of the gain code represents
1dB.
Fixed Gain Fixed Gain I
D35 D35 1 036 036 ( D37 D37
Cd
B)
Cd
B) I
3 3
I I .L .L L L L L
4 4 I L I L
L L H H
5
5
L L
6 6
H H
7 7 I HI L I HI L
L L
8 8 H ! H ! L I L I H H
9 9 I I
H H H 1 H 1
10
10
!
!
H
H
! I-I
! I-I
L L
H
H
i
i
SHARP
LZ37ClO
r
.O. EX.4XIPLE OF OPERATING CIRCUIT :
2
<-- 8
l- f:
z
.+--5
V
- I
/
SHARP
1. Package Breakage
En order to prevent the package from being broken. observe the following instructions:
1) The CMOS iaager is a precise optical component and the
package material is ceramic.
Therefore.
l
Take care not to drop the device when wxlnting. handling, or transporting.
. Avoid giving a shock to the package. Especially when the package are fixed to the
socket and the circuit board small shock could break the package more easily than
ahen the package isn’ t fixed
.
2 > Ehen mounting the package on the housing, be sure that the package is not bent.
- If a bent package is forced into place between a hard plate
or the like.
the package may be broken.
3
> If any damage or breakage occur on the surface of the glass cap. its characteristics
could deteriorate.
Therefore.
* Do not hit the glass cap.
* Do not give a shock large enough to cause distortion.
l
Do not scrub or scratch the glass surface.
- Even a soft cloth or applicator, if
dry. could cause flaws to scratch the glass.
2. Electrostatic damage
Please take the following anti-static measures when handling the CSIOS imager:
1) Always discharge static electricity by grounding the human body and the instrument
to be used To ground the human body. provide resistance of about1 Beg ohm between
the human body and the ground to be on the safe side.
21 Vhen directly handling the device with fingers, hold the part without terminal and
do not touch any terminals.
3)
To avoid generating static electricity,
a. do not scrub the glass surface with cloth or plastic
b. do not attach any tape or labels
c. do not clean the glass surface with dust-cleaning tape
4) %hen storing or transporting the device. put it in a container of conductive
material.
17
3. Dust and contamination
Dust or contamination on the glass surface could deteriorate the output characteristic
or cause a scar. In order to ainimize dust or contamination on the glass surface.
take the following precautions:
1) Handle C.YOS imager in a clean environment such as a cleaned booth.
( The cleanliness level should be. if possible. class 1000 at least. )
2 > Do not touch the glass surface with fingers If dust or contamination gets on
the glass surface. the following cleaning lethod is recommended:
. Dust from static electricity should be blown off with an ionized air blower.
For anti-electrostatic measures, however. ground all the leads on the device
before blowing off the dust.
l
The contamination on the glass surface should be wiped off with a clean
applicator soaked in Isopropyl alcohol. lipe slowly and gently in one
direction only.
-- Frequently replace the applicator and do not use the same applicator
to clean more than one device.
% Note: In most cases, dust and contamination are unavoidable. even before the
device is first used. It is. therefore. recommended that the above
procedures should be taken to wipe out dust and contamination before
using the device.
4. Other
1) Soldering should be manually performed within 2 seconds per terminal at 400°C
maximum at soldering iron.
21 Avoid using or storing the CYOS imager at high temperature or high humidity as it is
a precise optical component. Do not give a mechanical shock to the CMOS imager.
3) Do not expose the device to strong light. For the color device. long exposure to
strong light will fade the color of the color filters.
SHARP
r Reiracwe inaex : n d= i .S
UN I
?- :
R O.:j>?/
mm1
TIC I 17
runs
- Llr I I I Let-,v
Nb.ME
Package Outline Specitrcarlon
. . . . :
,-F i:::....::::. : : : :
t . . . : ; ; . : : *
. . a- __. _- -“--iE?lNG OE?T. 2 COOE ; ; ; ; i ; : : ; : , , :
TS (IC) GROUP . . ..I.. : : :. :