(0,50 mm) .0197"
BSH SERIES
BSH–060–01–F–D–RA–WT
BSH–090–01–L–D–A
BSH–060–01–F–D–A
BSH–030–01–L–D–RA–WT
WWW.SAMTEC.COM
MATED HEIGHT
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?BSH
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
1.25A per contact
@ 80°C ambient
Flammability Rating:
UL 94 VO
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
125 VAC
Max Cycles: 100
RoHS Compliant: Ye s
Processing:
Lead-Free Solderable:
Ye s
SMT Lead Coplanarity:
(0,10 mm) .004" max (030-090)
(0,15 mm) .006" max (120-150)
Board Stacking:
For applications requiring
more than two connectors per
board or 90 positions or higher,
contact ipg@samtec.com
APPLICATION
SPECIFIC
• 30µ" (0,76 µm) Gold
• Edge Mount Capability
• 8 mm, 11 mm, 16 mm,
19 mm and 22 mm Stack
Height (Caution: Some
automatic placement/
inspection machines may
have component height
restrictions. Please consult
machinery specifi cations.)
(11 mm, 16 mm, 19 mm
and 22 mm not available
with 50 positions)
Call Samtec.
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
SPECIFICATIONS
–01 (5,00) .197
LEAD
STYLE MATED
HEIGHT*
*Processing conditions will
affect mated height.
Mates with:
BTH
Mates with:
BTH
BSH NO. OF POSITIONS
PER ROW
NO. OF POSITIONS
PER ROW
D
DWT
PLATING
OPTION
PLATING
OPTION
–030, –050, –060,
–090, –120, –150
–030, –060, –090
OTHER
OPTION
OTHER
OPTION
A
RA
–TR
= Tape & Reel
(120 positions
maximum)
–GP
= Guide Post
01
01BSH
No. of Positions x (0,50) .01969
+ (6,27) .247
(6,22)
.245 (3,81)
.150
(7,24)
.285
(0,89)
.035
DIA
(0,15)
.006
(3,05)
.120 (0,76)
.030
(3,25)
.128
02
01 (0,50)
.01969
–F
= Gold Flash on contact, Matte Tin on tail
–L
= 10µ" (0,25 µm) Gold on contact,
Matte Tin on tail
–C*
= Electro-Polished Selective
50µ" (1,27 µm) min Au over 150µ" (3,81 µm)
Ni on Signal Pins in contact area,
10µ" (0,25 µm) min Au over 50µ" (1,27 µm)
Ni on Ground Plane in contact area,
Matte Tin over 50µ" (1,27 µm) min
Ni on all solder tails
–F
= Gold Flash on contact, Matte Tin on tail
–L
= 10µ" (0,25 µm) Gold on contact, Matte Tin on tail
AGILENT LOGIC
ANALYZER TEST POINT
CONNECTOR
Specify: ASP-65067-01
F-213
BASIC BLADE & BEAM SOCKET
No. of Positions x (0,50) .01969 + (10,88) .428
(13,59)
.535
(7,24)
.285 (8,82)
.347
(0,64)
.025
SQ
(1,32)
.052
DIA
x
(1,32) (1,10)
.052 .043
01
02
(0,15)
.006 (0,50)
.01969
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 50µ" Gold
TM
Call Samtec for maximum cycles
